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ES2195546T3 - Junta emi compatible con tecnologia de montaje en superficie y un procedimiento de instalacion de una junta emi en una pista de tierra. - Google Patents

Junta emi compatible con tecnologia de montaje en superficie y un procedimiento de instalacion de una junta emi en una pista de tierra.

Info

Publication number
ES2195546T3
ES2195546T3 ES99909514T ES99909514T ES2195546T3 ES 2195546 T3 ES2195546 T3 ES 2195546T3 ES 99909514 T ES99909514 T ES 99909514T ES 99909514 T ES99909514 T ES 99909514T ES 2195546 T3 ES2195546 T3 ES 2195546T3
Authority
ES
Spain
Prior art keywords
emi gasket
compatible
procedure
installation
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99909514T
Other languages
English (en)
Inventor
Bradley E Reis
David R King
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gore Enterprise Holdings Inc
Original Assignee
Gore Enterprise Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21975333&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2195546(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gore Enterprise Holdings Inc filed Critical Gore Enterprise Holdings Inc
Application granted granted Critical
Publication of ES2195546T3 publication Critical patent/ES2195546T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Una tecnología (SMT) de montura de superficie compatible con un montaje de junta de interferencia electromagnética (EMI) que comprende: un material (22) de junta eléctricamente conductor; una capa (24) de soporte eléctricamente conductora que puede ser soldada; y medios (26) para adherir el material de junta eléctricamente conductor a la capa de soporte eléctricamente conductora que puede ser soldada.
ES99909514T 1998-03-31 1999-02-19 Junta emi compatible con tecnologia de montaje en superficie y un procedimiento de instalacion de una junta emi en una pista de tierra. Expired - Lifetime ES2195546T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/052,080 US6255581B1 (en) 1998-03-31 1998-03-31 Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace

Publications (1)

Publication Number Publication Date
ES2195546T3 true ES2195546T3 (es) 2003-12-01

Family

ID=21975333

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99909514T Expired - Lifetime ES2195546T3 (es) 1998-03-31 1999-02-19 Junta emi compatible con tecnologia de montaje en superficie y un procedimiento de instalacion de una junta emi en una pista de tierra.

Country Status (15)

Country Link
US (2) US6255581B1 (es)
EP (1) EP1090538B1 (es)
JP (1) JP4249391B2 (es)
KR (1) KR100680015B1 (es)
CN (1) CN1206896C (es)
AT (1) ATE242591T1 (es)
AU (1) AU749275B2 (es)
BR (1) BR9909228B1 (es)
CA (1) CA2325141C (es)
DE (1) DE69908594T2 (es)
DK (1) DK1090538T3 (es)
ES (1) ES2195546T3 (es)
HU (1) HUP0102258A3 (es)
IL (1) IL138641A (es)
WO (1) WO1999051074A1 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9131616B2 (en) 2012-07-28 2015-09-08 Laird Technologies, Inc. Metallized film-over-foam contacts

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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
HK1035630A1 (en) 2001-11-30
DE69908594D1 (de) 2003-07-10
IL138641A (en) 2004-07-25
HUP0102258A3 (en) 2001-11-28
KR100680015B1 (ko) 2007-02-09
KR20010042299A (ko) 2001-05-25
AU749275B2 (en) 2002-06-20
IL138641A0 (en) 2001-10-31
CN1295782A (zh) 2001-05-16
DK1090538T3 (da) 2003-09-29
JP4249391B2 (ja) 2009-04-02
DE69908594T2 (de) 2004-04-29
WO1999051074A1 (en) 1999-10-07
EP1090538B1 (en) 2003-06-04
JP2002510873A (ja) 2002-04-09
AU2870299A (en) 1999-10-18
CN1206896C (zh) 2005-06-15
US6235986B1 (en) 2001-05-22
HUP0102258A2 (hu) 2001-09-28
EP1090538A1 (en) 2001-04-11
BR9909228A (pt) 2000-11-28
BR9909228B1 (pt) 2013-09-17
CA2325141A1 (en) 1999-10-07
US6255581B1 (en) 2001-07-03
ATE242591T1 (de) 2003-06-15
CA2325141C (en) 2004-05-04

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