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ES2188723T3 - Condensador de pelicula de plastico protegido contra rayos infrarrojos. - Google Patents

Condensador de pelicula de plastico protegido contra rayos infrarrojos.

Info

Publication number
ES2188723T3
ES2188723T3 ES96304532T ES96304532T ES2188723T3 ES 2188723 T3 ES2188723 T3 ES 2188723T3 ES 96304532 T ES96304532 T ES 96304532T ES 96304532 T ES96304532 T ES 96304532T ES 2188723 T3 ES2188723 T3 ES 2188723T3
Authority
ES
Spain
Prior art keywords
capacitor
shield
plastic film
securing
film capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96304532T
Other languages
English (en)
Inventor
Rick A Price
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Application granted granted Critical
Publication of ES2188723T3 publication Critical patent/ES2188723T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16D—COUPLINGS FOR TRANSMITTING ROTATION; CLUTCHES; BRAKES
    • F16D3/00—Yielding couplings, i.e. with means permitting movement between the connected parts during the drive
    • F16D3/16—Universal joints in which flexibility is produced by means of pivots or sliding or rolling connecting parts
    • F16D3/26—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected
    • F16D3/38—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another
    • F16D3/382—Hooke's joints or other joints with an equivalent intermediate member to which each coupling part is pivotally or slidably connected with a single intermediate member with trunnions or bearings arranged on two axes perpendicular to one another constructional details of other than the intermediate member
    • F16D3/387—Fork construction; Mounting of fork on shaft; Adapting shaft for mounting of fork
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulated Conductors (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

UN CONDENSADOR DE PELICULA DE PLASTICO (12) TIENE UN BLINDAJE (10) ASEGURADO A UNA SUPERFICIE EXTERIOR DEL MISMO. EL BLINDAJE (10) ES SUFICIENTE PARA PROTEGER EL CONDENSADOR DE PELICULA DE PLASTICO (12) DE EXCESIVA ENERGIA DE INFRARROJOS RADIANTE DURANTE LA SOLDADURA DE REFLUJO DE INFRARROJOS QUE DE OTRA FORMA DAÑARIA EL CONDENSADOR DE PELICULA DE PLASTICO (12). EL BLINDAJE DEL CONDENSADOR DE PELICULA DE PLASTICO (10) PUEDE ESTAR COMPUESTO DE MUCHOS MATERIALES DIFERENTES COMO CINTA DE GRADO ELECTRICO, PLASTICO DE GRADO ELECTRICO, CINTA DE METAL, O EPOXIDO. EL BLINDAJE (10) PUEDE ESTAR UNIDO AL CONDENSADOR (12) DE DIFERENTES MODOS, INCLUYENDO: ASEGURAR UN BLINDAJE A UNA SUPERFICIE SUPERIOR DEL CONDENSADOR CON UN BLINDAJE EN UNA SUPERFICIE SUPERIOR Y UNA INFERIOR DEL CONDENSADOR, CUBRIR Y ASEGURAR UN BLINDAJE AL CONDENSADOR DE PELICULA DE PLASTICO EN CUATRO LADOS DEL CONDENSADOR; ASEGURAR UN BLINDAJE EN TODOS LOS LADOS DEL CONDENSADOR; Y ASEGURAR UNA COMBINACION DE DIFERENTES BLINDAJES A LA SUPERFICIE EXTERIOR DEL CONDENSADOR.
ES96304532T 1995-06-21 1996-06-18 Condensador de pelicula de plastico protegido contra rayos infrarrojos. Expired - Lifetime ES2188723T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49350495A 1995-06-21 1995-06-21

Publications (1)

Publication Number Publication Date
ES2188723T3 true ES2188723T3 (es) 2003-07-01

Family

ID=23960496

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96304532T Expired - Lifetime ES2188723T3 (es) 1995-06-21 1996-06-18 Condensador de pelicula de plastico protegido contra rayos infrarrojos.

Country Status (15)

Country Link
US (1) US6278601B1 (es)
EP (1) EP0750325B1 (es)
JP (2) JP3902262B2 (es)
KR (1) KR970003883A (es)
CN (1) CN100390909C (es)
AT (1) ATE230516T1 (es)
AU (1) AU695731B2 (es)
BR (1) BR9601868A (es)
CA (1) CA2176441C (es)
DE (1) DE69625548T2 (es)
DK (1) DK0750325T3 (es)
ES (1) ES2188723T3 (es)
NO (1) NO962618L (es)
NZ (1) NZ286847A (es)
TW (1) TW304271B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10112355C1 (de) 2001-03-13 2002-06-13 Daimler Chrysler Ag Verfahren und Schutzvorrichtung zur Montage eines temperaturempfindlichen elektronischen Bauteils
US6681771B2 (en) * 2002-03-22 2004-01-27 Jean-Francois Durette Organ shields for medical procedures
DE10337441A1 (de) * 2003-08-14 2005-03-10 Bsh Bosch Siemens Hausgeraete Blende für ein Gerätegehäuse und Verfahren zu dessen Herstellung
DE102014100469A1 (de) * 2013-11-29 2015-06-03 Epcos Ag Elektronisches Bauelement und Verwendung desselben
DE102017206386A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
US11153976B2 (en) 2018-05-24 2021-10-19 International Business Machines Corporation Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper
CN110858514A (zh) * 2018-08-24 2020-03-03 南通三鑫电子科技股份有限公司 一种反光电容器
CN113012940A (zh) * 2021-02-26 2021-06-22 宁波央腾汽车电子有限公司 一种集成屏蔽功能的薄膜电容结构
US20220319776A1 (en) * 2021-03-31 2022-10-06 Kemet Electronics Corporation Electronic Component Having Improved Heat Resistance

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3718800A (en) 1968-03-05 1973-02-27 Argus Eng Co Infrared heating apparatus
US3592992A (en) 1969-03-13 1971-07-13 Argus Eng Co Soldering method and apparatus
US3612963A (en) 1970-03-11 1971-10-12 Union Carbide Corp Multilayer ceramic capacitor and process
US4123309A (en) * 1973-11-29 1978-10-31 Minnesota Mining And Manufacturing Company Transfer letter system
US4462062A (en) 1981-02-27 1984-07-24 Illinois Tool Works Inc. Capacitive structure
US4481708A (en) 1982-01-18 1984-11-13 Analog Devices, Inc. Reduced internal temperature technique for hermetic sealing of enclosures
ATE29616T1 (de) 1983-06-03 1987-09-15 Wolfgang Westermann Kunststoffolien-wickelkondensator.
US4516187A (en) 1983-07-13 1985-05-07 Electronic Concepts, Inc. Outer wrapping and planar terminations for a metallized wound capacitor and method therefor
US4603373A (en) * 1983-07-13 1986-07-29 Electronic Concepts, Inc. Outer wrapping for a metallized wound capacitor
JPH0656826B2 (ja) 1984-06-04 1994-07-27 東レ株式会社 コンデンサ
US4580190A (en) 1984-12-07 1986-04-01 Illinois Tool Works Inc. Surface mountable electrical package
DE3505888C1 (de) 1985-02-20 1986-08-14 Wolfgang Dipl.-Ing. 6800 Mannheim Westermann Kunststoffolien-Wickelkondensator in Chipbauweise
JPS61241949A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体装置
DE3737457A1 (de) 1987-11-04 1989-05-18 Peter Gammelin Loetvorrichtung
US4838475A (en) 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
JPS6469038A (en) * 1987-09-10 1989-03-15 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS6489501A (en) * 1987-09-30 1989-04-04 Nec Corp Chiplike resin-covered electronic component
JPH0677830B2 (ja) 1987-12-25 1994-10-05 松下電器産業株式会社 基板加熱方法
US5268051A (en) * 1988-11-09 1993-12-07 Polysar Rubber Corporation Self-bonding tapes
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
JPH07142624A (ja) * 1993-11-17 1995-06-02 Nec Corp 半導体装置
US5371650A (en) * 1994-02-15 1994-12-06 Electronic Concepts, Inc. Hermetically sealed capacitor and method for making the same
DE4415950A1 (de) * 1994-05-05 1995-11-09 Siemens Matsushita Components Elektrisches Bauelement

Also Published As

Publication number Publication date
CN100390909C (zh) 2008-05-28
AU695731B2 (en) 1998-08-20
JP3902262B2 (ja) 2007-04-04
JP4012236B2 (ja) 2007-11-21
JPH097886A (ja) 1997-01-10
CA2176441A1 (en) 1996-12-22
CA2176441C (en) 2000-07-11
NZ286847A (en) 1997-04-24
BR9601868A (pt) 1999-01-12
US6278601B1 (en) 2001-08-21
NO962618L (no) 1996-12-23
EP0750325B1 (en) 2003-01-02
DE69625548D1 (de) 2003-02-06
EP0750325A1 (en) 1996-12-27
NO962618D0 (no) 1996-06-20
DK0750325T3 (da) 2003-04-22
JP2006310892A (ja) 2006-11-09
AU5213096A (en) 1997-01-09
CN1148723A (zh) 1997-04-30
MX9602108A (es) 1997-09-30
ATE230516T1 (de) 2003-01-15
TW304271B (es) 1997-05-01
KR970003883A (ko) 1997-01-29
DE69625548T2 (de) 2009-09-17

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