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ES2186613T3 - Procedimiento para mejorarla adherencia de polimeros con superficies metalicas. - Google Patents

Procedimiento para mejorarla adherencia de polimeros con superficies metalicas.

Info

Publication number
ES2186613T3
ES2186613T3 ES00300183T ES00300183T ES2186613T3 ES 2186613 T3 ES2186613 T3 ES 2186613T3 ES 00300183 T ES00300183 T ES 00300183T ES 00300183 T ES00300183 T ES 00300183T ES 2186613 T3 ES2186613 T3 ES 2186613T3
Authority
ES
Spain
Prior art keywords
adherence
polymers
procedure
improve
metal surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00300183T
Other languages
English (en)
Inventor
Donald Ferrier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of ES2186613T3 publication Critical patent/ES2186613T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Un procedimiento para aumentar la adherencia de un material polimérico a una superficie metálica, comprendiendo el citado procedimiento un contacto de la superficie metálica con una composición de promoción de la adherencia que comprende un oxidante.
ES00300183T 1999-01-12 2000-01-12 Procedimiento para mejorarla adherencia de polimeros con superficies metalicas. Expired - Lifetime ES2186613T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/229,019 US6146701A (en) 1997-06-12 1999-01-12 Process for improving the adhension of polymeric materials to metal surfaces

Publications (1)

Publication Number Publication Date
ES2186613T3 true ES2186613T3 (es) 2003-05-16

Family

ID=22859510

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00300183T Expired - Lifetime ES2186613T3 (es) 1999-01-12 2000-01-12 Procedimiento para mejorarla adherencia de polimeros con superficies metalicas.

Country Status (6)

Country Link
US (1) US6146701A (es)
EP (1) EP1020503B1 (es)
JP (1) JP3798593B2 (es)
DE (1) DE60000696T2 (es)
ES (1) ES2186613T3 (es)
TW (1) TW577914B (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9691951B2 (en) 2013-10-17 2017-06-27 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351353B1 (en) * 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
EP1158843B1 (en) * 2000-05-22 2006-09-13 Macdermid Incorporated Process for improving adhesion of polymeric materials to metal surfaces.
JP3387893B2 (ja) 2000-05-26 2003-03-17 マクダーミッド インコーポレーテッド 金属表面へのポリマー材料の接着性改良方法
US6383272B1 (en) * 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6521139B1 (en) 2000-08-04 2003-02-18 Shipley Company L.L.C. Composition for circuit board manufacture
JP4687852B2 (ja) * 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 銅および銅合金の表面処理剤
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US6716281B2 (en) 2002-05-10 2004-04-06 Electrochemicals, Inc. Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US7214304B2 (en) * 2004-10-13 2007-05-08 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
US7645393B2 (en) * 2007-04-27 2010-01-12 Kesheng Feng Metal surface treatment composition
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin

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SE400575B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
JPS52150104A (en) * 1976-06-07 1977-12-13 Fuji Photo Film Co Ltd Photoosensitive lithographic press plate material
JPS57116775A (en) * 1981-01-14 1982-07-20 Toshiba Corp Etching solution for nickel
US4409037A (en) * 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
US4844981A (en) * 1982-04-05 1989-07-04 Macdermid, Incorporated Adhesion promoter for printed circuits
US4512818A (en) * 1983-05-23 1985-04-23 Shipley Company Inc. Solution for formation of black oxide
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4775444A (en) * 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
JPH01246393A (ja) * 1988-03-25 1989-10-02 Fukuda Metal Foil & Powder Co Ltd 内層用銅箔または銅張積層板の表面処理方法
US4997722A (en) * 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US4997516A (en) * 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
JPH0379778A (ja) * 1989-08-21 1991-04-04 Sanshin Chem Ind Co Ltd 銅のエッチング液組成物およびエッチング方法
US5037482A (en) * 1990-02-16 1991-08-06 Macdermid, Incorporated Composition and method for improving adhesion of coatings to copper surfaces
US5289630A (en) * 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
JP3079778B2 (ja) 1992-06-11 2000-08-21 株式会社デンソー 内燃機関のバルブタイミング調整装置
JP3387528B2 (ja) * 1992-08-07 2003-03-17 朝日化学工業株式会社 銅または銅合金のエッチング用組成物およびそのエッチング方法
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FI953377L (fi) * 1993-01-11 1995-07-10 Macdermid Inc Fosfatointikoostumuksia ja -menetelmiä, erityisesti käytettäviksi painettujen piirien valmistuksessa, jossa hyödynnetään orgaanisia resistejä
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9691951B2 (en) 2013-10-17 2017-06-27 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device

Also Published As

Publication number Publication date
JP2000234084A (ja) 2000-08-29
US6146701A (en) 2000-11-14
DE60000696D1 (de) 2002-12-12
EP1020503B1 (en) 2002-11-06
DE60000696T2 (de) 2003-07-31
EP1020503A1 (en) 2000-07-19
JP3798593B2 (ja) 2006-07-19
TW577914B (en) 2004-03-01

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