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ES2167174B1 - COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H". - Google Patents

COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Info

Publication number
ES2167174B1
ES2167174B1 ES9902233A ES9902233A ES2167174B1 ES 2167174 B1 ES2167174 B1 ES 2167174B1 ES 9902233 A ES9902233 A ES 9902233A ES 9902233 A ES9902233 A ES 9902233A ES 2167174 B1 ES2167174 B1 ES 2167174B1
Authority
ES
Spain
Prior art keywords
epoxy resin
composition
thermal class
class epoxy
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES9902233A
Other languages
Spanish (es)
Other versions
ES2167174A1 (en
Inventor
La Fuente Garcia Ana Maria De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to ES9902233A priority Critical patent/ES2167174B1/en
Publication of ES2167174A1 publication Critical patent/ES2167174A1/en
Application granted granted Critical
Publication of ES2167174B1 publication Critical patent/ES2167174B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Composición de una resina epoxi de clase térmica "H" que comprende utilizar: resina epoxi 55,5% en peso. Endurecedor 44,4% en peso. Catalizador 0,1% en peso.Composition of a thermal class "H" epoxy resin which comprises using: 55.5% by weight epoxy resin. Hardener 44.4% by weight. Catalyst 0.1% by weight.

ES9902233A 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H". Expired - Fee Related ES2167174B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES9902233A ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES9902233A ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Publications (2)

Publication Number Publication Date
ES2167174A1 ES2167174A1 (en) 2002-05-01
ES2167174B1 true ES2167174B1 (en) 2003-10-16

Family

ID=8310211

Family Applications (1)

Application Number Title Priority Date Filing Date
ES9902233A Expired - Fee Related ES2167174B1 (en) 1999-10-08 1999-10-08 COMPOSITION OF A THERMAL CLASS EPOXY RESIN "H".

Country Status (1)

Country Link
ES (1) ES2167174B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113791A (en) * 1977-03-03 1978-09-12 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators
US4224541A (en) * 1978-05-26 1980-09-23 Westinghouse Electric Corp. Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member
CA1269792A (en) * 1984-05-29 1990-05-29 Russell M. Luck Highly reactive concentrated irradiated catalytic complexes as low temperature curing agents for organic resins
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils

Also Published As

Publication number Publication date
ES2167174A1 (en) 2002-05-01

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