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ES2039403T3 - Metodo para depositar sin electricidad cobre de alta calidad. - Google Patents

Metodo para depositar sin electricidad cobre de alta calidad.

Info

Publication number
ES2039403T3
ES2039403T3 ES198787115705T ES87115705T ES2039403T3 ES 2039403 T3 ES2039403 T3 ES 2039403T3 ES 198787115705 T ES198787115705 T ES 198787115705T ES 87115705 T ES87115705 T ES 87115705T ES 2039403 T3 ES2039403 T3 ES 2039403T3
Authority
ES
Spain
Prior art keywords
degrees
high quality
depositing
printed circuit
anodic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787115705T
Other languages
English (en)
Inventor
Rowan Hughes
Milan Paunovic
Rudolf J. Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Original Assignee
AMP Akzo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp filed Critical AMP Akzo Corp
Application granted granted Critical
Publication of ES2039403T3 publication Critical patent/ES2039403T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

SOLUCIONES PARA DEPOSITAR METAL POR VIA NO ELECTROLITICA QUE SE FORMULAN Y SE CONTROLAN PARA PROPORCIONAR DEPOSITOS METALICOS DE ALTA CALIDAD ESTABLECIENDO LA VELOCIDAD INTRINSECA DE REACCION CATODICA DE LA SOLUCION EN MENOS DEL 110% DELA VELOCIDAD INTRINSECA DE REACCION ANODICA. SE PRESENTAN METODOS PARA FORMULAR SOLUCIONES PARA RECUBRIMIENTO DE COBRE POR VIA NO ELECTROLITICA QUE PUEDEN DEPOSITAR COBRE EN CUADROS DE CIRCUITOS IMPRESOS DE CALIDAD SUFICIENTE PARA PASAR UNA TENSION TERMICA DE 10 SEGUNDOS DE CONTACTO CONALEACION DE SOLDADURA FUNDIDA A 288 GRADOS C SIN ROMPER LOS DEPOSITOS DE COBRE DE LA SUPERFICIE O DE LOS AGUJEROS DE LOS CUADROS DE CIRCUITOS IMPRESOS. LA RELACION ENTRE LAS VELOCIDADES DE REACCION ANODICA O CATODICA PUEDE DETERMINARSE POR MEDICIONES ELECTROMECANICAS, O PUEDE ESTIMARSE VARIANDO LA CONCENTRACION DE LOS REACTIVOS Y MIDIENDO LAS VELOCIDADES DE DEPOSITO.
ES198787115705T 1986-10-31 1987-10-27 Metodo para depositar sin electricidad cobre de alta calidad. Expired - Lifetime ES2039403T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92636386A 1986-10-31 1986-10-31

Publications (1)

Publication Number Publication Date
ES2039403T3 true ES2039403T3 (es) 1993-10-01

Family

ID=25453111

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787115705T Expired - Lifetime ES2039403T3 (es) 1986-10-31 1987-10-27 Metodo para depositar sin electricidad cobre de alta calidad.

Country Status (13)

Country Link
EP (1) EP0265895B1 (es)
JP (1) JPH01501326A (es)
KR (1) KR880701791A (es)
AU (1) AU604284B2 (es)
BR (1) BR8707516A (es)
CA (1) CA1269573A (es)
CH (1) CH674020A5 (es)
DE (1) DE3736465A1 (es)
ES (1) ES2039403T3 (es)
FR (1) FR2607152B1 (es)
GB (1) GB2198750B (es)
NL (1) NL8702593A (es)
WO (1) WO1988003181A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
DE19932749B4 (de) 1998-07-23 2006-05-04 Robert Bosch Gmbh Schichtsystem und Verfahren zu dessen Herstellung sowie dessen Verwendung
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP6344269B2 (ja) * 2015-03-06 2018-06-20 豊田合成株式会社 めっき方法
CN113966090B (zh) * 2021-10-27 2024-01-23 中国联合网络通信集团有限公司 沉铜厚度控制方法、装置、生产系统、设备及介质
WO2025202112A1 (en) * 2024-03-28 2025-10-02 Basf Se Non-acidic composition for copper electroplating comprising an alkanolamine complexing agent

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
FR1551275A (es) * 1966-12-19 1968-12-27
US3645749A (en) * 1970-06-04 1972-02-29 Kollmorgen Corp Electroless plating baths with improved deposition rates
JPS5627594B2 (es) * 1975-03-14 1981-06-25
GB1585057A (en) * 1976-06-28 1981-02-25 Ici Ltd Sensing concentration of coating solution
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
US4336111A (en) * 1978-11-02 1982-06-22 The Boeing Company Method for determining the strength of a metal processing solution
JPS5926660B2 (ja) * 1979-03-07 1984-06-29 株式会社東芝 無電解メツキ反応の測定方法
GB2064377B (en) * 1979-10-12 1984-03-21 Imperial College Magnetic separators
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
US4499852A (en) * 1980-07-15 1985-02-19 Shipley Company Inc. Apparatus for regulating plating solution in a plating bath
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
US4479980A (en) * 1983-12-16 1984-10-30 International Business Machines Corporation Plating rate monitor
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4626446A (en) * 1985-06-03 1986-12-02 International Business Machines Corporation Electroless plating bath monitor
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths

Also Published As

Publication number Publication date
FR2607152A1 (fr) 1988-05-27
EP0265895B1 (en) 1993-02-10
FR2607152B1 (fr) 1990-03-02
GB2198750A (en) 1988-06-22
GB8725398D0 (en) 1987-12-02
AU8322087A (en) 1988-05-25
BR8707516A (pt) 1989-02-21
CH674020A5 (es) 1990-04-30
WO1988003181A1 (en) 1988-05-05
DE3736465C2 (es) 1990-02-08
JPH01501326A (ja) 1989-05-11
DE3736465A1 (de) 1988-05-19
NL8702593A (nl) 1988-05-16
AU604284B2 (en) 1990-12-13
GB2198750B (en) 1991-01-02
EP0265895A3 (en) 1989-04-05
KR880701791A (ko) 1988-11-05
EP0265895A2 (en) 1988-05-04
CA1269573A (en) 1990-05-29

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