ES2024494B3 - PROCESS AND APPARATUS FOR THE DEPOSITION OF ANTI-FRICTION ALLOYS. - Google Patents
PROCESS AND APPARATUS FOR THE DEPOSITION OF ANTI-FRICTION ALLOYS.Info
- Publication number
- ES2024494B3 ES2024494B3 ES87201324T ES87201324T ES2024494B3 ES 2024494 B3 ES2024494 B3 ES 2024494B3 ES 87201324 T ES87201324 T ES 87201324T ES 87201324 T ES87201324 T ES 87201324T ES 2024494 B3 ES2024494 B3 ES 2024494B3
- Authority
- ES
- Spain
- Prior art keywords
- deposition
- porous pad
- overlay
- providing
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/10—Bearings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Sliding-Contact Bearings (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A process and apparatus is described for the electro-deposition of an overlay alloy onto a bearing alloy surface (14). The process comprises the steps of cleaning the surface, providing relative motion between the surface to be plated and a porous pad (52) in contact with said surface, providing a flow of plating solution to the porous pad and said surface whilst applying a voltage difference between said surface which is cathodic during overlay deposition and an anode (51) connected to the porous pad. An example of the deposition of a tin-based overlay alloy containing cobalt is described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB868617675A GB8617675D0 (en) | 1986-07-19 | 1986-07-19 | Deposition of bearing alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2024494B3 true ES2024494B3 (en) | 1992-03-01 |
Family
ID=10601361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES87201324T Expired - Lifetime ES2024494B3 (en) | 1986-07-19 | 1987-07-13 | PROCESS AND APPARATUS FOR THE DEPOSITION OF ANTI-FRICTION ALLOYS. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0257670B1 (en) |
| JP (1) | JPS6328896A (en) |
| AT (1) | ATE67528T1 (en) |
| DE (1) | DE3773088D1 (en) |
| ES (1) | ES2024494B3 (en) |
| GB (2) | GB8617675D0 (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19500727C1 (en) * | 1995-01-12 | 1996-05-23 | Fraunhofer Ges Forschung | Electrodeposition appts. for plating rotationally symmetrical component |
| JPH08209384A (en) * | 1995-02-02 | 1996-08-13 | Yamaha Motor Co Ltd | Surface-treating device |
| DE19754221A1 (en) * | 1997-12-06 | 1999-06-17 | Federal Mogul Wiesbaden Gmbh | Layered composite material for plain bearings with lead-free sliding layer |
| EP1055020A2 (en) * | 1998-02-12 | 2000-11-29 | ACM Research, Inc. | Plating apparatus and method |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| GB2336161B (en) * | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| US6447668B1 (en) | 1998-07-09 | 2002-09-10 | Acm Research, Inc. | Methods and apparatus for end-point detection |
| US7136173B2 (en) | 1998-07-09 | 2006-11-14 | Acm Research, Inc. | Method and apparatus for end-point detection |
| US6395152B1 (en) | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6248222B1 (en) | 1998-09-08 | 2001-06-19 | Acm Research, Inc. | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| CN1296524C (en) | 1999-04-13 | 2007-01-24 | 塞米用具公司 | System for electrochemically processing workpiece |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| GB0216331D0 (en) * | 2002-07-13 | 2002-08-21 | Dana Corp | Bearings |
| CN110813657A (en) * | 2019-11-14 | 2020-02-21 | 昌河飞机工业(集团)有限责任公司 | Oxidation brushing device and method for hole parts |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB760016A (en) * | 1953-09-11 | 1956-10-31 | Glacier Co Ltd | Improvements in or relating to electroplating |
| GB1186357A (en) * | 1966-09-15 | 1970-04-02 | Metadalic Ltd | Methods and Apparatus for Electrolytic Treatment of Continuous Strand Materials |
| GB1257541A (en) * | 1968-04-03 | 1971-12-22 | ||
| US3616285A (en) * | 1969-12-31 | 1971-10-26 | Sifco Ind Inc | Repair of chromium plated surfaces |
| US3751343A (en) * | 1971-06-14 | 1973-08-07 | A Macula | Brush electroplating metal at increased rates of deposition |
| GB1551212A (en) * | 1976-06-11 | 1979-08-22 | Owen S G Ltd | Selective electro-plating |
| EP0003680A1 (en) * | 1978-02-09 | 1979-08-22 | Weldex A.G. | Method for brush electroplating, electrode and electrolyte therefor |
| US4399019A (en) * | 1981-07-21 | 1983-08-16 | Imperial Clevite Inc. | Ultra-high current density electroplating cell |
| US4452684A (en) * | 1983-03-11 | 1984-06-05 | The Carolinch Company | Apparatus for selective electrolytic plating |
| DE3312905C2 (en) * | 1983-04-11 | 1986-03-27 | Battelle-Institut E.V., 6000 Frankfurt | Device for galvanic internal coating of hollow parts |
| US4610772A (en) * | 1985-07-22 | 1986-09-09 | The Carolinch Company | Electrolytic plating apparatus |
-
1986
- 1986-07-19 GB GB868617675A patent/GB8617675D0/en active Pending
-
1987
- 1987-07-13 ES ES87201324T patent/ES2024494B3/en not_active Expired - Lifetime
- 1987-07-13 EP EP87201324A patent/EP0257670B1/en not_active Expired - Lifetime
- 1987-07-13 AT AT87201324T patent/ATE67528T1/en not_active IP Right Cessation
- 1987-07-13 GB GB8716477A patent/GB2192642B/en not_active Expired - Fee Related
- 1987-07-13 DE DE8787201324T patent/DE3773088D1/en not_active Expired - Lifetime
- 1987-07-17 JP JP62177387A patent/JPS6328896A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2192642B (en) | 1990-12-19 |
| GB2192642A (en) | 1988-01-20 |
| GB8617675D0 (en) | 1986-08-28 |
| DE3773088D1 (en) | 1991-10-24 |
| JPS6328896A (en) | 1988-02-06 |
| GB8716477D0 (en) | 1987-08-19 |
| ATE67528T1 (en) | 1991-10-15 |
| EP0257670A1 (en) | 1988-03-02 |
| EP0257670B1 (en) | 1991-09-18 |
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