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ES2075729T3 - Polvo de aleacion de soldar revestido con parileno. - Google Patents

Polvo de aleacion de soldar revestido con parileno.

Info

Publication number
ES2075729T3
ES2075729T3 ES93102754T ES93102754T ES2075729T3 ES 2075729 T3 ES2075729 T3 ES 2075729T3 ES 93102754 T ES93102754 T ES 93102754T ES 93102754 T ES93102754 T ES 93102754T ES 2075729 T3 ES2075729 T3 ES 2075729T3
Authority
ES
Spain
Prior art keywords
parylene
solder
alloy powder
powder coated
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93102754T
Other languages
English (en)
Inventor
Richard Day Jenkinson
Michael William Sowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LONDON CHEMICAL Co Inc
Original Assignee
LONDON CHEMICAL Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LONDON CHEMICAL Co Inc filed Critical LONDON CHEMICAL Co Inc
Application granted granted Critical
Publication of ES2075729T3 publication Critical patent/ES2075729T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dental Preparations (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Powder Metallurgy (AREA)

Abstract

SE PRESENTAN POLVOS PARA SOLDADURA RECUBIERTOS CON UNA FINA CAPA DE PARILENO Y PASTAS DE SOLDADURA QUE CONTIENEN LOS POLVOS DE SOLDADURA RECUBIERTOS. LOS POLVOS DE SOLDADURA RECUBIERTOS PUEDEN EXHIBIR UN ALTO GRADO DE RESISTENCIA A LA OXIDACION Y A LAS REACCIONES CON EL FLUJO CONTENIDO EN LA PASTA DE SOLDADURA SIN INTERFERIR SUBSTANCIALMENTE CON LAS CARACTERISTICAS DE REFLUJO DE LA SOLDADURA.
ES93102754T 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno. Expired - Lifetime ES2075729T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/839,581 US5272007A (en) 1992-02-21 1992-02-21 Solder powder coated with parylene

Publications (1)

Publication Number Publication Date
ES2075729T3 true ES2075729T3 (es) 1995-10-01

Family

ID=25280134

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93102754T Expired - Lifetime ES2075729T3 (es) 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno.

Country Status (13)

Country Link
US (2) US5272007A (es)
EP (1) EP0556864B1 (es)
JP (1) JP3110582B2 (es)
KR (1) KR930017663A (es)
CN (1) CN1035363C (es)
AT (1) ATE126114T1 (es)
CA (1) CA2090072A1 (es)
DE (1) DE69300337T2 (es)
DK (1) DK0556864T3 (es)
ES (1) ES2075729T3 (es)
GR (1) GR3017675T3 (es)
MX (1) MX9300914A (es)
TW (1) TW279844B (es)

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GB9312328D0 (en) * 1993-06-15 1993-07-28 Lexor Technology Limited A method of brazing
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5674326A (en) * 1994-09-21 1997-10-07 Motorola, Inc. Solder paste
US5593504A (en) * 1995-04-26 1997-01-14 Church & Dwight Co., Inc. Method of cleaning solder pastes from a substrate with an aqueous cleaner
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
JPH11514300A (ja) 1995-10-06 1999-12-07 ブラウン ユニバーシティ リサーチ ファウンデーション はんだ付けの方法及び配合物
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
JP3493101B2 (ja) * 1996-08-15 2004-02-03 三井金属鉱業株式会社 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト
DE19731151C1 (de) 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
DE19826756C2 (de) * 1998-06-15 2002-04-18 Juergen Schulze Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
JP4138965B2 (ja) * 1998-10-01 2008-08-27 三井金属鉱業株式会社 無鉛ハンダ粉及びその製造方法
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
EP1232524A1 (en) * 1999-06-01 2002-08-21 Alpha Metals, Inc. Method of protective coating bga solder alloy spheres
US6488992B1 (en) 1999-08-18 2002-12-03 University Of Cincinnati Product having a thin film polymer coating and method of making
JP3910878B2 (ja) * 2002-05-13 2007-04-25 新光電気工業株式会社 導電性粉末付着装置及び導電性粉末付着方法
EP1658157B1 (de) 2003-06-25 2016-03-23 MAHLE Behr GmbH & Co. KG Flussmittel zum löten von metallbauteilen
US7413771B2 (en) * 2003-07-09 2008-08-19 Fry's Metals, Inc. Coating solder metal particles with a charge director medium
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
DE10343655B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
DE10343652B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
US7163586B2 (en) * 2003-11-12 2007-01-16 Specialty Coating Systems, Inc. Vapor deposition apparatus
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
DE102004034815A1 (de) * 2004-07-19 2006-03-16 Behr Gmbh & Co. Kg Verfahren zur Herstellung von gefügten Werkstücken
JPWO2006030665A1 (ja) * 2004-09-13 2008-05-15 松下電器産業株式会社 半田ペーストおよびそれを用いた電子機器
US7455106B2 (en) * 2005-09-07 2008-11-25 Schlumberger Technology Corporation Polymer protective coated polymeric components for oilfield applications
EP2017031B1 (en) * 2006-04-26 2017-09-13 Senju Metal Industry Co., Ltd Solder paste
WO2010059924A2 (en) 2008-11-21 2010-05-27 Henkel Corporation Thermally decomposable polymer coated metal powders
US9682447B2 (en) * 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
CN103945961B (zh) * 2011-09-06 2017-01-18 汉高知识产权控股有限责任公司 用于焊膏的涂覆有二官能或多官能缺电子烯烃的金属粉末
US8816371B2 (en) 2011-11-30 2014-08-26 Micron Technology, Inc. Coated color-converting particles and associated devices, systems, and methods
EP2886244A1 (de) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Verfahren zur Befestigung eines Bauteils auf einem Substrat
WO2015146999A1 (ja) 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
JP5790862B1 (ja) 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
US10730150B2 (en) * 2017-08-07 2020-08-04 Honeywell International Inc. Flowable brazing compositions and methods of brazing metal articles together using the same

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DE449016C (de) * 1927-09-03 Duplex Printing Press Company Maschine zum Giessen von Stereotypplatten
DE448016C (de) * 1925-02-05 1927-08-02 Pathe Cinema Anciens Etablisse Aufwickelvorrichtung fuer Kinematographenfilme
US3300332A (en) * 1966-02-07 1967-01-24 Union Carbide Corp Coated particulate material and method for producing same
US4225647B1 (en) * 1977-12-02 1995-05-09 Richard A Parent Articles having thin, continuous, impervious coatings
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
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US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4818614A (en) * 1985-07-29 1989-04-04 Shiseido Company Ltd. Modified powder
US4758288A (en) * 1987-06-08 1988-07-19 Ronald T. Dodge Co. Encapsulated lithium granules and method of manufacture
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US5069972A (en) * 1988-09-12 1991-12-03 Versic Ronald J Moldable microcapsule that contains a high percentage of solid core material, and method of manufacture thereof
JPH04224683A (ja) * 1990-03-19 1992-08-13 Union Carbide Chem & Plast Co Inc 被覆基体の防食性を最適化する方法

Also Published As

Publication number Publication date
US5272007A (en) 1993-12-21
EP0556864A1 (en) 1993-08-25
CN1035363C (zh) 1997-07-09
EP0556864B1 (en) 1995-08-09
DK0556864T3 (da) 1995-09-25
TW279844B (es) 1996-07-01
CN1079929A (zh) 1993-12-29
DE69300337D1 (de) 1995-09-14
JPH067993A (ja) 1994-01-18
DE69300337T2 (de) 1996-02-01
JP3110582B2 (ja) 2000-11-20
US5328522A (en) 1994-07-12
MX9300914A (es) 1993-09-01
KR930017663A (ko) 1993-09-20
CA2090072A1 (en) 1993-08-22
ATE126114T1 (de) 1995-08-15
GR3017675T3 (en) 1996-01-31

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