[go: up one dir, main page]

EP4224229A1 - Silicon photonic edge coupled connector via collimation - Google Patents

Silicon photonic edge coupled connector via collimation Download PDF

Info

Publication number
EP4224229A1
EP4224229A1 EP23155062.5A EP23155062A EP4224229A1 EP 4224229 A1 EP4224229 A1 EP 4224229A1 EP 23155062 A EP23155062 A EP 23155062A EP 4224229 A1 EP4224229 A1 EP 4224229A1
Authority
EP
European Patent Office
Prior art keywords
connector
alignment
optic
lenses
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23155062.5A
Other languages
German (de)
French (fr)
Inventor
Rebecca Schaevitz
Near Margalit
Vivek Raghunathan
Dicky Lee
Hari Potluri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies International Sales Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies International Sales Pte Ltd filed Critical Avago Technologies International Sales Pte Ltd
Publication of EP4224229A1 publication Critical patent/EP4224229A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/32Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G02B6/322Optical coupling means having lens focusing means positioned between opposed fibre ends and having centering means being part of the lens for the self-positioning of the lightguide at the focal point, e.g. holes, wells, indents, nibs
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • Co-Packaged Optics is an advanced heterogeneous integration of optics and electronics in a single package aimed at addressing next generation bandwidth and power challenges.
  • Photonic Integrated Circuits have a light input and a light output.
  • the input on the transmitter side of the PIC is continuous wave (CW) light which is modulated and sent into the output.
  • the input on the receiver side of the PIC is modulated light which is then converted into electrical signals.
  • CW continuous wave
  • PICs photonics integrated circuits
  • Pigtailed fiber optic cables may become unwieldy and hard to manage. Further, if one of the pigtailed fiber optic cables is damaged the whole structure may become useless and may need to be scrapped. This can be costly.
  • CPO switch integrated circuits ICs
  • BGA Ball Grid Array
  • PCB printed circuit board
  • embodiments of the inventive concepts disclosed herein are directed to optic systems and optical connectors with collimation.
  • an optic system comprising:
  • the shelf is configured to accept a coupling of an optical connector, the optical connector configured to be removably couplable with the optic system.
  • the one or more interface lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • the one or more optic alignment surfaces are one or more groove surfaces.
  • At least one of the one or more optic alignment surfaces on opposite sides of a middle portion the middle portion configured to accept an optical connector, and the one or more optic alignment surfaces configured to allow for alignment within 20 microns relative to an X-direction and/or a Y-direction, wherein the Z-direction is parallel to an optical axis of the one or more interface lenses.
  • the optic system is at least one of:
  • an optical connector comprising:
  • the one or more connector alignment surfaces are one or more alignment rods.
  • the one or more connector alignment surfaces are parallel to an optical axis of the one or more connector lenses.
  • the one or more connector lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • the optical connector is configured to be optically aligned to 20 or fewer microns in an X direction and/or a Y direction via at least the one or more connector alignment surfaces.
  • the optical connector has a Z-direction alignment tolerance of at least 25 microns, and an X direction and/or Y direction of alignment tolerance of at least 5 microns.
  • the optical connector further comprises one or more single mode polarization maintaining optical fibers.
  • a coupled optic system comprises:
  • the one or more connector lenses are configured to be collimating.
  • the coupled optic system configured to be compatible with single mode (SM) and polarization maintaining (PM) fiber.
  • SM single mode
  • PM polarization maintaining
  • the optic system being configured to be soldered to at least one of a CPO system or a package.
  • the optic system is configured to be edge coupled with the optical connector.
  • the one or more connector alignment surfaces are parallel to an optical axis of the one or more connector lenses.
  • inventive concepts are not limited in their application to the details of construction and the arrangement of the components or steps or methodologies set forth in the following description or illustrated in the drawings.
  • inventive concepts disclosed herein may be practiced without these specific details.
  • well-known features may not be described in detail to avoid unnecessarily complicating the instant disclosure.
  • inventive concepts disclosed herein are capable of other embodiments or of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting.
  • a letter following a reference numeral is intended to reference an embodiment of the feature or element that may be similar, but not necessarily identical, to a previously described element or feature bearing the same reference numeral (e.g., 1, 1a, 1b).
  • reference numeral e.g. 1, 1a, 1b
  • Such shorthand notations are used for purposes of convenience only, and should not be construed to limit the inventive concepts disclosed herein in any way unless expressly stated to the contrary.
  • any two components capable of being so associated can also be viewed as being “couplable,” to each other to achieve the desired functionality.
  • Specific examples of couplable include but are not limited to physically mateable, physically fixed relative to another component, and/or physically interacting components.
  • Other examples include being optically coupled, such as being optically aligned and configured to direct an optical signal being two components.
  • various components may be depicted as being connected or coupled directly, direct connection or direct coupling is not a requirement.
  • components may be indirectly coupled (e.g., couplable) through some interface, device, or intermediate component whether physically (e.g., physically mated), optically, mechanically (e.g., via dynamically movable and physically interactable components), electrically, or otherwise.
  • components may be in data communication (e.g., optical signal communication) with intervening components that are not illustrated or described. It may be appreciated that "data communication" refers to both direct and indirect data communication (e.g., there may be intervening components).
  • being coupled is permanent (e.g., two components epoxied, fused, and/or the like).
  • being coupled is reversible (e.g., being "removably" coupled/couplable).
  • removably coupled/couplable may mean being capable of being coupled and uncoupled repeatedly and/or non-destructively (e.g., such as by being coupled by being temporarily held, clamped, pinned, latched, positioned, and/or the like in place).
  • an optical connector of the present disclosure in at least some embodiments, may be removably coupled (e.g., couplable) to the optic system.
  • edge coupled may mean being in (and/or configured to be in) an edge coupling to an edge (e.g., such as an edge of a chip and/or PIC).
  • edge e.g., such as an edge of a chip and/or PIC.
  • edge couplings there are mainly two types of optical fiber-to-chip optical couplings used: off-plane (vertical, out of plane, and the like) coupling and in-plane (butt) coupling.
  • off-plane vertical, out of plane, and the like
  • in-plane butt
  • grating couplings provide for off-plane coupling of light onto PICs utilizing an optical fiber positioned above a substrate/wafer surface (e.g., a portion of a length of the optical fiber being above and parallel to the substrate surface).
  • the substrate may utilize narrow etched areas around the edge of a die to facilitate access to edge couplers.
  • alignment may mean any alignment, such as structural and/or optical alignment.
  • components may be optically aligned such that an optical axis of a first component is orientated relative to an optical axis of a second component (e.g., to within a given tolerance such that efficiency losses of an optical signal between the optical axes of the two components are minimized).
  • structural alignment may mean that one component is orientated (e.g., and/or configured to be orientated) relative to another component (e.g., via one or more degrees of freedom and/or to within one or more alignment tolerances of such degrees of freedom).
  • one component may be aligned to another component to within a tolerance in regards to six degrees of freedom, such as to within a quantity of a unit of translation (e.g., 1 micron) in an X, Y, and Z direction and a quantity of a unit of rotation about the X, Y, and Z direction.
  • a unit of translation e.g. 1 micron
  • an alignment is provided for by one or more alignment surfaces.
  • an alignment surface may be a physically mateable and/or guidable surface that is configured to mate with and/or guide a different alignment surface of a different component, thereby providing for the alignment of the different component via such mateable (and/or guiding) alignment surfaces.
  • such an alignment surface e.g., comprising multiple alignment surfaces in different orientations
  • active alignment is alignment performed in a well-controlled environment compared to passive alignment. Active alignment processes are typically much more costly and more time consuming to perform than passive alignment processes and are less practical to perform in the field.
  • active alignment being “actively” aligned, and the like may mean that active alignment techniques are required and/or conducive for such an alignment, and/or that a system is configured for being made/coupled using active alignment techniques (e.g., actively placed to within specific alignment tolerances).
  • active alignment techniques may be viewed as an alignment (e.g., permanent alignment) provided for using well-controlled alignment processes and/or precision tools.
  • Precision tools may mean tools that are not necessarily available when an aligned component is in the field (e.g., away from its location of manufacture, in a practical and/or natural use case).
  • an active alignment means using an imaging measurement system to align optical fibers with respective light sources and test equipment to test the optical signal launched into the optical fiber by the light source as the optical signal passes out of the opposite end of the fiber.
  • an imaging measurement system to align optical fibers with respective light sources and test equipment to test the optical signal launched into the optical fiber by the light source as the optical signal passes out of the opposite end of the fiber.
  • active alignment processes and active alignment equipment a determination can be made as to whether the light source and the optical fiber are in precise alignment with one another. For instance, mechanical robotic grippers with precisely controllable degrees of freedom may grip one or more optical fibers until a desired alignment tolerance is met and hold the optical fibers while they are then permanently fixed in place (e.g., epoxied).
  • passive alignment being passively aligned, and the like may mean that passive alignment techniques are required and/or conducive for such an alignment, and/or that a system is configured for being made/coupled using passive alignment techniques (e.g., to within specific alignment tolerances).
  • passive alignment may mean placing an optical connector by hand or with minimal tools (e.g., hand-operated tool such as tweezers).
  • Such passive alignment may further mean utilizing the aide of passive guidance of one or more alignment surfaces (e.g., vertical pins, horizontal grooves).
  • Passive guidance may mean guidance using little to no external tools (e.g., using just a user's hand and the alignment surfaces of the system itself).
  • one or more initial alignment surfaces may initially keep a component constrained (passively) to a relatively rough tolerance
  • one or more second alignment surfaces e.g., as mateable surfaces, v-grooves
  • passive alignment surfaces and passive alignment processes may be used.
  • any reference to "one embodiment,” or “some embodiments” means that a particular element, feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the inventive concepts disclosed herein.
  • the appearances of the phrase “in at least one embodiment” in the specification does not necessarily refer to the same embodiment.
  • Embodiments of the inventive concepts disclosed may include one or more of the features expressly described or inherently present herein, or any combination or sub-combination of two or more such features.
  • some embodiments of the inventive concepts disclosed herein are directed to coupled optic systems configured for collimation of light.
  • this disclosure relates to, but is not necessarily limited to, passively aligning and securing an optical connector to the inputs and outputs of a silicon Photonic Integrated Circuit (PIC) utilizing collimated light.
  • PIC silicon Photonic Integrated Circuit
  • this disclosure includes at least one embodiment directed to co-packaged optics (CPO) next to a switch ASIC with an edge coupled optical connector utilizing collimated light.
  • CPO co-packaged optics
  • silicon photonics are located on the same package as other silicon integrated circuits (IC), such as a switch application specific integrated circuit (ASIC).
  • IC silicon integrated circuits
  • ASIC switch application specific integrated circuit
  • optical fibers relies on butting up (pigtailing) optical fibers to silicon photonics, and permanently fixing the optical fibers in place.
  • the optical fibers may be aligned (actively) and fixed in place by an adhesive (e.g., epoxy).
  • an end of the optical fibers may, in a sense, be permanently attached to the silicon photonics and the other end may use standard optical connectors (e.g., multi-fiber push-on (MPO) or LC connectors).
  • MPO multi-fiber push-on
  • LC connectors e.g., multi-fiber push-on
  • a challenge of such a configuration is that the fiber block (e.g., fiber array unit (FAU)) may typically be small, translucent, delicate, and hard to handle and locate. Further challenges include requiring optical fiber alignment tolerances as low as sub-micron precision for typical solutions.
  • FAU fiber array unit
  • At least one embodiment of the present disclosure addresses at least some of these challenges.
  • at least one embodiment of the present disclosure allows for a system where an array of optical fibers is much easier to locate/align (e.g., optically align) and is not permanently attached (e.g., rather, may be removably coupled).
  • FIGS. 1A and 1B views of a schematic representation of a fiber coupling are shown. While FIGS. 1A and 1B may illustrate an example pigtail coupling, at least some of the elements shown and related descriptions may apply to (and/or be included in) one or more embodiments of the present disclosure.
  • a coupled optic system 212 includes silicon photonics 106 (e.g., a silicon photonics block 106 as shown).
  • the coupled optic system 212 includes optical fibers 104. However, it should be noted that at least in some embodiments, the optical fibers of coupled optic system 212 are not permanently pigtailed relative to the silicon photonics 106.
  • the coupled optic system 212 includes a fiber block 102.
  • the coupled optic system 212 includes one or more optical waveguides 108 or is couplable to one or more optical waveguides 108.
  • the coupled optic system 212 includes grooves 112.
  • an optical connector of the coupled optic system 212 may include grooves 112.
  • the coupled optic system 212 (e.g., an optical connector of the coupled optic system 212) includes connectors on an end of the optical fibers 104 (e.g., multi-fiber push-on (MPO) or LC connectors).
  • MPO multi-fiber push-on
  • the coupled optic system 212 does not include a socket (not shown) for coupling the optic system 216 (e.g., PIC) to a CPO system (e.g., CPO system 400 of FIG. 4 ), package (e.g., package 402), substrate, and/or the like.
  • the optic system is configured to be soldered to at least one of a CPO system or a package.
  • Removing sockets that are typically used to attach the silicon photonics 106 to the same package (e.g., package 402) as a silicon integrated circuit (IC) (not shown) may present other challenges. Sockets may be able to withstand solder reflow conditions but may induce electrical loss and occupy a large area, thus exacerbating some of the challenges that silicon photonics in general are attempting to relieve.
  • the silicon photonics 106 are soldered onto and/or configured to be soldered onto the same package as the silicon IC (e.g., helping to reduce occupied area and improve speed and bandwidth performance), then the optical fibers 104 that are attached to the silicon photonics 106 may be subjected to harsh solder reflow conditions (e.g., high heat).
  • harsh solder reflow conditions e.g., high heat.
  • a Z-direction may be parallel with an optical axis as shown in FIG. 2A
  • a Y-direction may be normal to a plane containing interface lens surfaces 306 shown in FIG. 3B (e.g., vertical)
  • an X-direction orthogonal thereto e.g., within the plane containing the interface lens surfaces 306).
  • a block diagram 200 of a fiber coupling with collimated light 202, (e.g., collimated light coupling), aligned in a Z-direction is shown, in accordance with one or more embodiments of the present disclosure.
  • a first lens 204 may be aligned with a second lens 206 and may be configured such that the light 202 directed between the lenses is collimated.
  • the first lens 204 may be a lens coupled to (e.g., connected to, associated with, and/or fixed relative to) a shelf (e.g., shelf 208 of FIG. 2B ) and the second lens 206 may be a lens coupled to a connector (e.g., connector 210 of FIG. 2B ).
  • such a collimated light coupling may be used to alleviate (relax) typical alignment tolerances.
  • a typical (non-collimated) fiber coupling may require sub-micron alignment tolerances (e.g., in at least some single modal systems).
  • using a collimated light coupling may allow for larger alignment tolerances of at least 5, 10, 15 or up to 20 microns in the X and/or Y direction, and/or at least 25, 50, or up to 100 microns in the Z-direction.
  • a third part e.g., shelf 208) having alignment surfaces (e.g., optic alignment surfaces 302 of FIG. 3A ) may be utilized to act as a guide to align the optic system 216 to the optical connector 210.
  • the coupled optic system 212 may include an optic system 216 and an optical connector 210.
  • the optic system 212 may be configured to be passively aligned/coupled (e.g., optically and/or physically) with the optical connector 210 (e.g., via a pin-in-groove design).
  • the optic system 216 includes a shelf 208 (described in more detail below) and one or more interface lenses 218.
  • the shelf may be coupled (e.g., attached) to the one or more interface lenses 218 (i.e., one or more PIC lenses, and the like).
  • the shelf 208 is attached to a structure 214 (e.g., photonic integrated circuit (PIC), structure of a package, and the like).
  • PIC photonic integrated circuit
  • the optical connector 210 includes one or more connector lenses 220 corresponding to the one or more interface lenses 218.
  • the optical connector may be an array unit (e.g., Fiber Array Unit (FAU)) and/or include one or more optical fibers 222.
  • the coupled optic system 212 includes optical fibers 222 at a 127um pitch (e.g., spacing).
  • the coupled optic system 212 includes up to 40 optical fibers 222 per optical connector 210. It should be noted, however, that any number of optical fibers 222 may be included (e.g., hundreds).
  • a shelf 208 is shown, in accordance with one or more embodiments of the present disclosure.
  • the shelf 208 is configured to accept a coupling of an optical connector 210, the optical connector 210 configured to be removably couplable with the optic system 216.
  • the shelf 208 is configured to accept a passive optical coupling and structural alignment of an optical connector 210.
  • the shelf 208 is configured to be edge-coupled (e.g., to a PIC).
  • shelf 208 is shown as a single body with one optic alignment surface 302 on each side of a middle portion 304 (e.g., recess), the shelf 208 is not limited to such an embodiment and the shelf 208 may, for example, include a variety of numbers, locations, shapes, and/or the like of optic alignment surfaces 304, middle portions 304, and any other element/limitation depicted or described.
  • the shelf 208 may have optic alignment surfaces 302 of various sizes (e.g., relatively larger sizes for a rough initial alignment in one direction and smaller sizes for a final precise alignment in a different direction), of a variety of shapes (grooves such as a V-shaped groove, trenches, rectangular notches, U-shaped grooves, pyramid-shaped surfaces, cone-shaped surfaces, vertical pins, and/or any other shape conducive to alignment), and/or in a variety of locations of the shelf 208 (e.g., on a surface of the middle portion 304, on a top surface (as shown), on a bottom surface, on one or more outside side surfaces, on a front surface, on a back surface, and/or the like).
  • optic alignment surfaces 302 of various sizes (e.g., relatively larger sizes for a rough initial alignment in one direction and smaller sizes for a final precise alignment in a different direction), of a variety of shapes (grooves such as a V-shaped groove, trenches, rectangular notches, U-shaped groove
  • any of the surfaces/elements/limitations of the optical connector 210 are not limited to what is described and depicted and may likewise vary in number, size, location, and/or the like.
  • the shelf 208 includes one or more optic alignment surfaces 302.
  • the one or more optic alignment surfaces 302 may be two or more optic alignment surfaces 302.
  • the optic alignment surfaces 302 may be groove surfaces (e.g., v-shaped notches, and the like).
  • the shelf 208 may utilize groove depth (e.g., of optic alignment surfaces 302 shown in FIG. 3A ) and/or epoxy thickness to the structure 214 (e.g., PIC) to ensure good dimensional tolerance in the optical Y-direction for optical fiber-to-PIC waveguide alignment within collimated beam alignment requirements.
  • optic alignment surfaces 302 may also control (e.g., constrain within a set tolerance) the optical X-direction alignment via the angle of a groove (e.g., V-shaped groove) of the optic alignment surfaces 302 being well controlled/designed/manufactured.
  • alignment tolerances in the Z-direction may be larger than the X-direction and Y-direction alignment requirements.
  • embodiments of the present disclosure allow for 50-100um tolerances in the Z-direction (e.g., which external mechanical piece parts may be utilized to hold such tolerances), wherein the Z-direction is parallel to an optical axis of the one or more interface lenses 218.
  • optic alignment surfaces 302 may be configured to allow for alignment within 20 microns relative to an X-direction and/or a Y-direction. Such larger tolerances may be a result of the collimation of lightbeam(s).
  • the shelf 208 is configured to be actively aligned with the one or more interface lenses 218; or the shelf 208 is actively aligned with the one or more interface lenses 218. In some embodiments, at least one of: the shelf 208 being configured to be fixed in place relative to the one or more interface lenses 218; or the shelf 208 being fixed in place relative to the one or more interface lenses 218.
  • the shelf 208 may be fixed (e.g., epoxied) in place relative to the one or more interface lenses 218 (and, e.g., one or more optical waveguides or other components of silicon photonics) (e.g., in a controlled assembly procedure).
  • the shelf 208 may be actively aligned relative to the one or more interface lenses 218 such that an element passively aligned (or removably couplable) to the shelf may be passively aligned (or removably couplable) to the one or more interface lenses 218 (and, e.g., optical waveguides).
  • the shelf 208 includes a middle portion 304 (e.g., recess, void, and/or the like) with at least one optic alignment surface 302 on opposite sides of the middle portion 304 and the middle portion 304 configured to accept (receive) an optical connector 210.
  • a middle portion 304 e.g., recess, void, and/or the like
  • optic alignment surface 302 on opposite sides of the middle portion 304 and the middle portion 304 configured to accept (receive) an optical connector 210.
  • a material of the shelf 208 includes at least one of glass, silicon, or metal.
  • the shelf 208 may be a glass.
  • the shelf 208 is silicon.
  • the shelf 208 is relatively delicate and thin.
  • an optic system 216 including one or more interface lenses 218 is shown, in accordance with one or more embodiments of the present disclosure.
  • the one or more interface lenses 218 include one or more interface lens surfaces 306, as shown, wherein each lens surface 306 corresponds to a different optical axis.
  • each optical axis may be configured to be aligned with a corresponding optical axis of a connector lens surface of a connector lens 220 of an optical connector 210.
  • the one or more interface lenses 218 may be configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • a lens e.g., interface lens 218, connector lens 220, lens surface 306, and the like
  • a lens is a component/element comprising at least partially transparent material configured to (e.g., shaped to) direct an electromagnetic beam.
  • a lens may be configured to collimate, disperse, and/or concentrate one or more portions of a beam (or multiple beams).
  • a lens may mean a single structure used to direct multiple beams (e.g., corresponding to multiple optical fibers 222).
  • the one or more interface lens surfaces 306 may be part of one interface lens structure 218 as shown or may be separate lens structures. In one nonlimiting example, as shown, the one or more interface lens surfaces 306 may be aligned in a row. It is noted that the example and descriptions above are merely illustrative and any number of interface lenses 218 with any number of interface lens surfaces 306 and optical axes may be used in any configuration with any number of rows or patterns (e.g., likewise for corresponding connector lenses 220).
  • the optic system 216 may include multiple shelves 208 (e.g., four) on at least one side of a co-packaged optics (CPO) system 400 including a package 402.
  • CPO co-packaged optics
  • the coupled optic system 212 includes one or more elements from U.S. Provisional Patent Application Serial No. 63/306,808, filed February 4, 2022 , which is hereby incorporated by reference in its entirety.
  • the optical connector 210 includes a fiber block 506, one or more connector lenses 220, optical fibers 222, and/or one or more connector alignment surfaces 504.
  • the one or more connector alignment surfaces 504 may correspond to the optic alignment surfaces 302 of the optic system 216 (e.g., allowing for precise passive alignment).
  • the one or more connector alignment surfaces 504 may be coupled to the optical connector 210.
  • the one or more connector alignment surfaces 504 may be parallel to an optical axis of the one or more connector lenses 220 (as shown, for example, a distance measured along a length of a long narrow alignment surface may be parallel in the sense that the surface may be generally aligned/parallel in the direction of the optical axis such that a component mateable to the surface may slide parallel to the optical axis).
  • the one or more connector alignment surfaces 504 may be one or more alignment rods 504 (e.g., pins).
  • the optical fibers 222 may include, but are not limited to, single mode polarization maintaining optical fibers.
  • the optical fibers 222 may be fixed relative to (e.g., actively aligned, and/or epoxied) to the one or more connector lenses 220 (and the one or more connector alignment surfaces 504).
  • the optic system 216 is configured to be used with an optical connector 210 having one or more of the limitations described above (and vice versa). In at least one embodiment, the optic system 216 is at least one of: configured to be edge coupled with the optical connector 210; or configured to be used with collimating lenses (e.g., collimating connector lenses 220 and collimating interface lenses 218) of the optical connector 210. In at least one embodiment, the optical connector 210 is configured to be optically aligned to 20 or fewer microns in an X direction and/or a Y direction (the X-direction and Y-direction of FIG. 2A such that the Z-direction is aligned with an optical axis). In at least one embodiment, the optical connector 210 is operationally connected to the optic system 216.
  • the one or more connector lenses 220 may be configured to at least one of: receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • the optical connector 210 has a Z-direction alignment tolerance (e.g., allows for misalignment) of (up to) at least 25 microns, and an X direction and/or Y direction of alignment tolerance of (upto) at least 5 microns.
  • a Z-direction alignment tolerance e.g., allows for misalignment
  • optical connector may be configured to be optically coupled and removably coupled to the optic system.
  • At least one of the: optic system 216, optical connector 210, or coupled optic system 212 is configured to be compatible with single mode (SM) and polarization maintaining (PM) optical fiber.
  • SM single mode
  • PM polarization maintaining
  • one or more alignment rods 504 may correspond to and be aligned with one or more optic alignment surfaces 302 (e.g., precision V-shaped grooves).
  • the coupled optic system 212 is configured for use in a silicon photonics-based transceiver/communication technology. In at least one embodiment, the coupled optic system 212 is configured for use in a silicon photonic transceiver and co-packaged optics (CPO) based system.
  • CPO co-packaged optics

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A coupled optic system (212) configured for collimation of light. The coupled optic system (212) includes an optic system (216). The optic system (216) includes a shelf (208). The shelf (208) includes one or more optic alignment surfaces (302). The optic system (216) includes one or more interface lenses (218) coupled to the shelf (208). The coupled optic system (212) includes an optical connector (210). The optical connector (210) includes one or more connector lenses (220). The optical connector (210) includes one or more connector alignment surfaces (504).

Description

  • The present disclosure claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application Serial No. 63/306,870, filed February 4, 2022 , entitled SILICON PHOTONIC EDGE COUPLED CONNECTOR VIA COLLIMATION, naming Rebecca Schaevitz, Near Margalit, Vivek Raghunathan, Dicky Lee, and Hari Potluri as inventors, which is incorporated herein by reference in the entirety.
  • The present disclosure claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application Serial No. 63/306,808, filed February 4, 2022 , entitled VERTICAL PLACEMENT SILICON PHOTONICS OPTICAL CONNECTOR HOLDER & MOUNT, naming David John Kenneth Meadowcroft as inventor, which is incorporated herein by reference in the entirety.
  • Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and electronics in a single package aimed at addressing next generation bandwidth and power challenges.
  • As data rates increase there is a strong trend to move high-speed signals of a transceiver closer to the switch silicon. This is giving rise to co-packaged optics (e.g., the mounting of transceiver optics proximate to switch silicon).
  • Generally, Photonic Integrated Circuits (PICs) have a light input and a light output. Typically, the input on the transmitter side of the PIC is continuous wave (CW) light which is modulated and sent into the output. The input on the receiver side of the PIC is modulated light which is then converted into electrical signals.
  • The typical solution for inputting and outputting light from photonics integrated circuits (PICs) is to actively align a block of optical fibers (e.g., fiber block) and glue (e.g., epoxy) the optical fibers in place. This is known as pigtailing.
  • Pigtailed fiber optic cables may become unwieldy and hard to manage. Further, if one of the pigtailed fiber optic cables is damaged the whole structure may become useless and may need to be scrapped. This can be costly. In addition, CPO switch integrated circuits (ICs) may need to be Ball Grid Array (BGA) attached to another printed circuit board (PCB), or substrate. Such a configuration requires the structure to undergo solder reflow at high temperatures which may be damaging to the fiber optic cable coatings.
  • The following disclosure addresses at least some of the drawbacks of previous techniques.
  • In one aspect, embodiments of the inventive concepts disclosed herein are directed to optic systems and optical connectors with collimation.
  • According to an aspect, an optic system is provided comprising:
    • a shelf; and
    • one or more interface lenses coupled to the shelf,
    • wherein the shelf comprises one or more optic alignment surfaces.
  • Advantageously, at least one of:
    • the shelf being configured to be fixed in place relative to the one or more interface lenses; or
    • the shelf being fixed in place relative to the one or more interface lenses.
  • Advantageously, the shelf is configured to accept a coupling of an optical connector, the optical connector configured to be removably couplable with the optic system.
  • Advantageously, the one or more interface lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • Advantageously, the one or more optic alignment surfaces are one or more groove surfaces.
  • Advantageously, at least one of the one or more optic alignment surfaces on opposite sides of a middle portion, the middle portion configured to accept an optical connector, and the one or more optic alignment surfaces configured to allow for alignment within 20 microns relative to an X-direction and/or a Y-direction, wherein the Z-direction is parallel to an optical axis of the one or more interface lenses.
  • Advantageously, the optic system is at least one of:
    • configured to be edge coupled with an optical connector; or
    • configured to be used with collimating connector lenses of the optical connector.
  • According to an aspect, an optical connector is provided comprising:
    • one or more connector lenses; and
    • one or more connector alignment surfaces coupled relative to the one or more connector lenses.
  • Advantageously, the one or more connector alignment surfaces are one or more alignment rods.
  • Advantageously, the one or more connector alignment surfaces are parallel to an optical axis of the one or more connector lenses.
  • Advantageously, the one or more connector lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • Advantageously, the optical connector is configured to be optically aligned to 20 or fewer microns in an X direction and/or a Y direction via at least the one or more connector alignment surfaces.
  • Advantageously, the optical connector has a Z-direction alignment tolerance of at least 25 microns, and an X direction and/or Y direction of alignment tolerance of at least 5 microns.
  • Advantageously, the optical connector further comprises one or more single mode polarization maintaining optical fibers.
  • According to an aspect, a coupled optic system comprises:
    • an optic system comprising:
      • a shelf; and
      • one or more interface lenses coupled to the shelf, the shelf comprising one or more optic alignment surfaces; and
    • an optical connector comprising:
      • one or more connector lenses; and
      • one or more connector alignment surfaces coupled relative to the one or more connector lenses and corresponding to the one or more optic alignment surfaces,
    • the optical connector configured to be aligned respective to the optic system via the one or more connector alignment surfaces and the one or more optic alignment surfaces,
    • the optical connector configured to be optically coupled and removably couplable to the optic system.
  • Advantageously, the one or more connector lenses are configured to be collimating.
  • Advantageously, the coupled optic system configured to be compatible with single mode (SM) and polarization maintaining (PM) fiber.
  • Advantageously, the optic system being configured to be soldered to at least one of a CPO system or a package.
  • Advantageously, the optic system is configured to be edge coupled with the optical connector.
  • Advantageously, the one or more connector alignment surfaces are parallel to an optical axis of the one or more connector lenses.
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and should not restrict the scope of the claims. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments of the inventive concepts disclosed herein and together with the general description, serve to explain the principles.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The numerous advantages of the embodiments of the inventive concepts disclosed herein may be better understood by those skilled in the art by reference to the accompanying figures in which:
    • FIG. 1A shows a top view of a schematic representation of a fiber coupling according to an exemplary embodiment;
    • FIG. 1B shows a cross sectional side view of a schematic representation of a fiber coupling according to an exemplary embodiment;
    • FIG. 2A shows a block diagram of a fiber coupling with collimated light according to an exemplary embodiment;
    • FIG. 2B shows an optical connector system according to an exemplary embodiment;
    • FIG. 3A shows a shelf according to an exemplary embodiment;
    • FIG. 3B shows an optical connector system according to an exemplary embodiment;
    • FIG. 4 shows an optic system according to an exemplary embodiment;
    • FIG. 5A shows an optical connector according to an exemplary embodiment; and
    • FIG. 5B shows a passive optical coupling of a coupled optic system according to an exemplary embodiment.
    DETAILED DESCRIPTION
  • Before explaining at least one embodiment of the inventive concepts disclosed herein in detail, it is to be understood that the inventive concepts are not limited in their application to the details of construction and the arrangement of the components or steps or methodologies set forth in the following description or illustrated in the drawings. In the following detailed description of embodiments of the instant inventive concepts, numerous specific details are set forth in order to provide a more thorough understanding of the inventive concepts. However, it will be apparent to one of ordinary skill in the art having the benefit of the instant disclosure that the inventive concepts disclosed herein may be practiced without these specific details. In other instances, well-known features may not be described in detail to avoid unnecessarily complicating the instant disclosure. The inventive concepts disclosed herein are capable of other embodiments or of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting.
  • As used herein a letter following a reference numeral is intended to reference an embodiment of the feature or element that may be similar, but not necessarily identical, to a previously described element or feature bearing the same reference numeral (e.g., 1, 1a, 1b). Such shorthand notations are used for purposes of convenience only, and should not be construed to limit the inventive concepts disclosed herein in any way unless expressly stated to the contrary.
  • Further, unless expressly stated to the contrary, "or" refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by anyone of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
  • In addition, use of the "a" or "an" are employed to describe elements and components of embodiments of the instant inventive concepts. This is done merely for convenience and to give a general sense of the inventive concepts, and "a" and "an" are intended to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.
  • Moreover, while various components may be described or depicted as being "coupled" or "connected", any two components capable of being so associated can also be viewed as being "couplable," to each other to achieve the desired functionality. Specific examples of couplable include but are not limited to physically mateable, physically fixed relative to another component, and/or physically interacting components. Other examples include being optically coupled, such as being optically aligned and configured to direct an optical signal being two components. Also, while various components may be depicted as being connected or coupled directly, direct connection or direct coupling is not a requirement. For example, components may be indirectly coupled (e.g., couplable) through some interface, device, or intermediate component whether physically (e.g., physically mated), optically, mechanically (e.g., via dynamically movable and physically interactable components), electrically, or otherwise. For example, components may be in data communication (e.g., optical signal communication) with intervening components that are not illustrated or described. It may be appreciated that "data communication" refers to both direct and indirect data communication (e.g., there may be intervening components). In one example, being coupled is permanent (e.g., two components epoxied, fused, and/or the like). In another example, being coupled is reversible (e.g., being "removably" coupled/couplable). For example, "removably" coupled/couplable may mean being capable of being coupled and uncoupled repeatedly and/or non-destructively (e.g., such as by being coupled by being temporarily held, clamped, pinned, latched, positioned, and/or the like in place). For example, an optical connector of the present disclosure, in at least some embodiments, may be removably coupled (e.g., couplable) to the optic system.
  • In addition, "edge" coupled, "edge" couplable, and the like may mean being in (and/or configured to be in) an edge coupling to an edge (e.g., such as an edge of a chip and/or PIC). Generally, there are mainly two types of optical fiber-to-chip optical couplings used: off-plane (vertical, out of plane, and the like) coupling and in-plane (butt) coupling. The former typically uses grating couplings and edge couplings are used with the latter. For example, grating couplings provide for off-plane coupling of light onto PICs utilizing an optical fiber positioned above a substrate/wafer surface (e.g., a portion of a length of the optical fiber being above and parallel to the substrate surface). On the other hand, for example, the substrate may utilize narrow etched areas around the edge of a die to facilitate access to edge couplers.
  • Further, "alignment" may mean any alignment, such as structural and/or optical alignment. For example, components may be optically aligned such that an optical axis of a first component is orientated relative to an optical axis of a second component (e.g., to within a given tolerance such that efficiency losses of an optical signal between the optical axes of the two components are minimized). In another example, structural alignment may mean that one component is orientated (e.g., and/or configured to be orientated) relative to another component (e.g., via one or more degrees of freedom and/or to within one or more alignment tolerances of such degrees of freedom). For instance, one component may be aligned to another component to within a tolerance in regards to six degrees of freedom, such as to within a quantity of a unit of translation (e.g., 1 micron) in an X, Y, and Z direction and a quantity of a unit of rotation about the X, Y, and Z direction.
  • In at least some embodiments, an alignment is provided for by one or more alignment surfaces. For example, an alignment surface may be a physically mateable and/or guidable surface that is configured to mate with and/or guide a different alignment surface of a different component, thereby providing for the alignment of the different component via such mateable (and/or guiding) alignment surfaces. For instance, such an alignment surface (e.g., comprising multiple alignment surfaces in different orientations) may be configured to constrain one or more degrees of freedom of the different component (e.g., due to the shape and orientation of such alignment surfaces).
  • Generally, active alignment is alignment performed in a well-controlled environment compared to passive alignment. Active alignment processes are typically much more costly and more time consuming to perform than passive alignment processes and are less practical to perform in the field.
  • For example, "active" alignment, being "actively" aligned, and the like may mean that active alignment techniques are required and/or conducive for such an alignment, and/or that a system is configured for being made/coupled using active alignment techniques (e.g., actively placed to within specific alignment tolerances). For example, active alignment techniques may be viewed as an alignment (e.g., permanent alignment) provided for using well-controlled alignment processes and/or precision tools. Precision tools may mean tools that are not necessarily available when an aligned component is in the field (e.g., away from its location of manufacture, in a practical and/or natural use case). In one example, an active alignment means using an imaging measurement system to align optical fibers with respective light sources and test equipment to test the optical signal launched into the optical fiber by the light source as the optical signal passes out of the opposite end of the fiber. By using these active alignment processes and active alignment equipment, a determination can be made as to whether the light source and the optical fiber are in precise alignment with one another. For instance, mechanical robotic grippers with precisely controllable degrees of freedom may grip one or more optical fibers until a desired alignment tolerance is met and hold the optical fibers while they are then permanently fixed in place (e.g., epoxied).
  • On the other hand, passive alignment, being passively aligned, and the like may mean that passive alignment techniques are required and/or conducive for such an alignment, and/or that a system is configured for being made/coupled using passive alignment techniques (e.g., to within specific alignment tolerances). For example, passive alignment may mean placing an optical connector by hand or with minimal tools (e.g., hand-operated tool such as tweezers). Such passive alignment may further mean utilizing the aide of passive guidance of one or more alignment surfaces (e.g., vertical pins, horizontal grooves). Passive guidance may mean guidance using little to no external tools (e.g., using just a user's hand and the alignment surfaces of the system itself). For example, one or more initial alignment surfaces (e.g., vertical pins) may initially keep a component constrained (passively) to a relatively rough tolerance, while one or more second alignment surfaces (e.g., as mateable surfaces, v-grooves) may provide for the ultimate (passive) alignment to a more precise tolerance. Such an example is for illustrative purposes and any combination and configuration of passive alignment surfaces and passive alignment processes may be used.
  • Finally, as used herein any reference to "one embodiment," or "some embodiments" means that a particular element, feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the inventive concepts disclosed herein. The appearances of the phrase "in at least one embodiment" in the specification does not necessarily refer to the same embodiment. Embodiments of the inventive concepts disclosed may include one or more of the features expressly described or inherently present herein, or any combination or sub-combination of two or more such features.
  • Broadly, some embodiments of the inventive concepts disclosed herein are directed to coupled optic systems configured for collimation of light. In some embodiments, this disclosure relates to, but is not necessarily limited to, passively aligning and securing an optical connector to the inputs and outputs of a silicon Photonic Integrated Circuit (PIC) utilizing collimated light. For example, this disclosure includes at least one embodiment directed to co-packaged optics (CPO) next to a switch ASIC with an edge coupled optical connector utilizing collimated light.
  • One of the challenges in silicon photonics is getting the light on and off the silicon in a low cost, high volume manufacturable way. In co-packaged optics (CPO), silicon photonics are located on the same package as other silicon integrated circuits (IC), such as a switch application specific integrated circuit (ASIC).
  • One approach to coupling optical fibers to CPO relies on butting up (pigtailing) optical fibers to silicon photonics, and permanently fixing the optical fibers in place. For example, in an overlapping configuration where the fiber block overlaps the silicon photonics block and the optical fibers are aligned utilizing grooves (as shown in FIG. 1B). Further, the optical fibers may be aligned (actively) and fixed in place by an adhesive (e.g., epoxy). In this regard, an end of the optical fibers may, in a sense, be permanently attached to the silicon photonics and the other end may use standard optical connectors (e.g., multi-fiber push-on (MPO) or LC connectors). It is contemplated herein that such a configuration may work reasonably well in transceiver-based technologies, where the solution is typically fully packaged and the alignment of the entire assembly well controlled, but may present challenges in CPO applications.
  • A challenge of such a configuration is that the fiber block (e.g., fiber array unit (FAU)) may typically be small, translucent, delicate, and hard to handle and locate. Further challenges include requiring optical fiber alignment tolerances as low as sub-micron precision for typical solutions.
  • Some embodiments of the present disclosure address at least some of these challenges. For example, at least one embodiment of the present disclosure allows for a system where an array of optical fibers is much easier to locate/align (e.g., optically align) and is not permanently attached (e.g., rather, may be removably coupled).
  • Referring to FIGS. 1A and 1B, views of a schematic representation of a fiber coupling are shown. While FIGS. 1A and 1B may illustrate an example pigtail coupling, at least some of the elements shown and related descriptions may apply to (and/or be included in) one or more embodiments of the present disclosure.
  • In at least some embodiments, a coupled optic system 212 includes silicon photonics 106 (e.g., a silicon photonics block 106 as shown).
  • In at least some embodiments, the coupled optic system 212 includes optical fibers 104. However, it should be noted that at least in some embodiments, the optical fibers of coupled optic system 212 are not permanently pigtailed relative to the silicon photonics 106.
  • In at least some embodiments, the coupled optic system 212 includes a fiber block 102.
  • In at least some embodiments, the coupled optic system 212 includes one or more optical waveguides 108 or is couplable to one or more optical waveguides 108.
  • In at least some embodiments, the coupled optic system 212 includes grooves 112. For example, an optical connector of the coupled optic system 212 may include grooves 112.
  • In at least some embodiments, the coupled optic system 212 (e.g., an optical connector of the coupled optic system 212) includes connectors on an end of the optical fibers 104 (e.g., multi-fiber push-on (MPO) or LC connectors).
  • In at least one embodiment the coupled optic system 212 does not include a socket (not shown) for coupling the optic system 216 (e.g., PIC) to a CPO system (e.g., CPO system 400 of FIG. 4), package (e.g., package 402), substrate, and/or the like. For example, in at least one embodiment, the optic system is configured to be soldered to at least one of a CPO system or a package.
  • Removing sockets (not shown) that are typically used to attach the silicon photonics 106 to the same package (e.g., package 402) as a silicon integrated circuit (IC) (not shown) may present other challenges. Sockets may be able to withstand solder reflow conditions but may induce electrical loss and occupy a large area, thus exacerbating some of the challenges that silicon photonics in general are attempting to relieve. It is contemplated that if, instead of using sockets, the silicon photonics 106 are soldered onto and/or configured to be soldered onto the same package as the silicon IC (e.g., helping to reduce occupied area and improve speed and bandwidth performance), then the optical fibers 104 that are attached to the silicon photonics 106 may be subjected to harsh solder reflow conditions (e.g., high heat). Therein lies some of the challenges of using typical pigtailed optical fibers 104 in such a configuration without sockets. At least some of the embodiments of the present disclosure do not use pigtailed optical fibers 104 and may instead, for example, use a passive, removably couplable optical connector 210.
  • For purposes of the present disclosure, in at least some embodiments, it is noted that a Z-direction may be parallel with an optical axis as shown in FIG. 2A, a Y-direction may be normal to a plane containing interface lens surfaces 306 shown in FIG. 3B (e.g., vertical), and an X-direction orthogonal thereto (e.g., within the plane containing the interface lens surfaces 306).
  • Referring to FIG. 2A, a block diagram 200 of a fiber coupling with collimated light 202, (e.g., collimated light coupling), aligned in a Z-direction is shown, in accordance with one or more embodiments of the present disclosure. In at least one embodiment, a first lens 204 may be aligned with a second lens 206 and may be configured such that the light 202 directed between the lenses is collimated. For example, the first lens 204 may be a lens coupled to (e.g., connected to, associated with, and/or fixed relative to) a shelf (e.g., shelf 208 of FIG. 2B) and the second lens 206 may be a lens coupled to a connector (e.g., connector 210 of FIG. 2B).
  • In at least one embodiment, such a collimated light coupling may be used to alleviate (relax) typical alignment tolerances. In a non-limiting example, as noted, a typical (non-collimated) fiber coupling may require sub-micron alignment tolerances (e.g., in at least some single modal systems). In at least one embodiment of the present disclosure, using a collimated light coupling may allow for larger alignment tolerances of at least 5, 10, 15 or up to 20 microns in the X and/or Y direction, and/or at least 25, 50, or up to 100 microns in the Z-direction. Further, a third part (e.g., shelf 208) having alignment surfaces (e.g., optic alignment surfaces 302 of FIG. 3A) may be utilized to act as a guide to align the optic system 216 to the optical connector 210.
  • Referring to FIG. 2B, a coupled optic system 212 is shown, in accordance with one or more embodiments of the present disclosure. The coupled optic system 212 may include an optic system 216 and an optical connector 210. In at least one embodiment, as shown, the optic system 212 may be configured to be passively aligned/coupled (e.g., optically and/or physically) with the optical connector 210 (e.g., via a pin-in-groove design).
  • In at least one embodiment, the optic system 216 includes a shelf 208 (described in more detail below) and one or more interface lenses 218. The shelf may be coupled (e.g., attached) to the one or more interface lenses 218 (i.e., one or more PIC lenses, and the like). In at least one example, the shelf 208 is attached to a structure 214 (e.g., photonic integrated circuit (PIC), structure of a package, and the like).
  • In at least one embodiment, the optical connector 210 includes one or more connector lenses 220 corresponding to the one or more interface lenses 218. In a non-limiting example, the optical connector may be an array unit (e.g., Fiber Array Unit (FAU)) and/or include one or more optical fibers 222. In at least one embodiment, the coupled optic system 212 includes optical fibers 222 at a 127um pitch (e.g., spacing). In at least one embodiment, the coupled optic system 212 includes up to 40 optical fibers 222 per optical connector 210. It should be noted, however, that any number of optical fibers 222 may be included (e.g., hundreds).
  • Referring to FIG. 3A, a shelf 208 is shown, in accordance with one or more embodiments of the present disclosure. In at least one embodiment, the shelf 208 is configured to accept a coupling of an optical connector 210, the optical connector 210 configured to be removably couplable with the optic system 216. In at least one embodiment, the shelf 208 is configured to accept a passive optical coupling and structural alignment of an optical connector 210. In at least one embodiment, the shelf 208 is configured to be edge-coupled (e.g., to a PIC).
  • While the shelf 208 is shown as a single body with one optic alignment surface 302 on each side of a middle portion 304 (e.g., recess), the shelf 208 is not limited to such an embodiment and the shelf 208 may, for example, include a variety of numbers, locations, shapes, and/or the like of optic alignment surfaces 304, middle portions 304, and any other element/limitation depicted or described. For example, the shelf 208 may have optic alignment surfaces 302 of various sizes (e.g., relatively larger sizes for a rough initial alignment in one direction and smaller sizes for a final precise alignment in a different direction), of a variety of shapes (grooves such as a V-shaped groove, trenches, rectangular notches, U-shaped grooves, pyramid-shaped surfaces, cone-shaped surfaces, vertical pins, and/or any other shape conducive to alignment), and/or in a variety of locations of the shelf 208 (e.g., on a surface of the middle portion 304, on a top surface (as shown), on a bottom surface, on one or more outside side surfaces, on a front surface, on a back surface, and/or the like). Similarly, any of the surfaces/elements/limitations of the optical connector 210 (e.g., the connector alignment surfaces 504) that are described and depicted in the present disclosure are not limited to what is described and depicted and may likewise vary in number, size, location, and/or the like.
  • In at least one embodiment, the shelf 208 includes one or more optic alignment surfaces 302. For example, the one or more optic alignment surfaces 302 may be two or more optic alignment surfaces 302. For example, in at least one embodiment, the optic alignment surfaces 302 may be groove surfaces (e.g., v-shaped notches, and the like).
  • For example, the shelf 208 may utilize groove depth (e.g., of optic alignment surfaces 302 shown in FIG. 3A) and/or epoxy thickness to the structure 214 (e.g., PIC) to ensure good dimensional tolerance in the optical Y-direction for optical fiber-to-PIC waveguide alignment within collimated beam alignment requirements. In at least one example, optic alignment surfaces 302 may also control (e.g., constrain within a set tolerance) the optical X-direction alignment via the angle of a groove (e.g., V-shaped groove) of the optic alignment surfaces 302 being well controlled/designed/manufactured. Moreover, alignment tolerances in the Z-direction (e.g., along optical axis) may be larger than the X-direction and Y-direction alignment requirements. For example, embodiments of the present disclosure allow for 50-100um tolerances in the Z-direction (e.g., which external mechanical piece parts may be utilized to hold such tolerances), wherein the Z-direction is parallel to an optical axis of the one or more interface lenses 218. For example, optic alignment surfaces 302 may be configured to allow for alignment within 20 microns relative to an X-direction and/or a Y-direction. Such larger tolerances may be a result of the collimation of lightbeam(s).
  • In at least one embodiment, at least one of: the shelf 208 is configured to be actively aligned with the one or more interface lenses 218; or the shelf 208 is actively aligned with the one or more interface lenses 218. In some embodiments, at least one of: the shelf 208 being configured to be fixed in place relative to the one or more interface lenses 218; or the shelf 208 being fixed in place relative to the one or more interface lenses 218.
  • For example, the shelf 208 may be fixed (e.g., epoxied) in place relative to the one or more interface lenses 218 (and, e.g., one or more optical waveguides or other components of silicon photonics) (e.g., in a controlled assembly procedure). In this regard, the shelf 208 may be actively aligned relative to the one or more interface lenses 218 such that an element passively aligned (or removably couplable) to the shelf may be passively aligned (or removably couplable) to the one or more interface lenses 218 (and, e.g., optical waveguides).
  • In at least one embodiment, the shelf 208 includes a middle portion 304 (e.g., recess, void, and/or the like) with at least one optic alignment surface 302 on opposite sides of the middle portion 304 and the middle portion 304 configured to accept (receive) an optical connector 210.
  • In at least one embodiment, a material of the shelf 208 includes at least one of glass, silicon, or metal. For example, the shelf 208 may be a glass. In another example, the shelf 208 is silicon. In at least some examples, the shelf 208 is relatively delicate and thin.
  • Referring to FIG. 3B, an optic system 216 including one or more interface lenses 218 is shown, in accordance with one or more embodiments of the present disclosure. In at least one embodiment, the one or more interface lenses 218 include one or more interface lens surfaces 306, as shown, wherein each lens surface 306 corresponds to a different optical axis. For example, each optical axis may be configured to be aligned with a corresponding optical axis of a connector lens surface of a connector lens 220 of an optical connector 210. For example, the one or more interface lenses 218 may be configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • Generally, a lens (e.g., interface lens 218, connector lens 220, lens surface 306, and the like) is a component/element comprising at least partially transparent material configured to (e.g., shaped to) direct an electromagnetic beam. For example, a lens may be configured to collimate, disperse, and/or concentrate one or more portions of a beam (or multiple beams). For example, a lens may mean a single structure used to direct multiple beams (e.g., corresponding to multiple optical fibers 222).
  • The one or more interface lens surfaces 306 may be part of one interface lens structure 218 as shown or may be separate lens structures. In one nonlimiting example, as shown, the one or more interface lens surfaces 306 may be aligned in a row. It is noted that the example and descriptions above are merely illustrative and any number of interface lenses 218 with any number of interface lens surfaces 306 and optical axes may be used in any configuration with any number of rows or patterns (e.g., likewise for corresponding connector lenses 220).
  • Referring to FIG. 4, a nonlimiting example of an optic system 216 is shown, in accordance with one or more embodiments of the present disclosure. In at least one embodiment, the optic system 216 may include multiple shelves 208 (e.g., four) on at least one side of a co-packaged optics (CPO) system 400 including a package 402.
  • In at least one embodiment, the coupled optic system 212 includes one or more elements from U.S. Provisional Patent Application Serial No. 63/306,808, filed February 4, 2022 , which is hereby incorporated by reference in its entirety.
  • Referring to FIG. 5A, an optical connector 210 is shown, in accordance with one or more embodiments of the present disclosure. In at least some embodiments, the optical connector 210 includes a fiber block 506, one or more connector lenses 220, optical fibers 222, and/or one or more connector alignment surfaces 504.
  • The one or more connector alignment surfaces 504 may correspond to the optic alignment surfaces 302 of the optic system 216 (e.g., allowing for precise passive alignment). For example, the one or more connector alignment surfaces 504 may be coupled to the optical connector 210. In at least one example, the one or more connector alignment surfaces 504 may be parallel to an optical axis of the one or more connector lenses 220 (as shown, for example, a distance measured along a length of a long narrow alignment surface may be parallel in the sense that the surface may be generally aligned/parallel in the direction of the optical axis such that a component mateable to the surface may slide parallel to the optical axis). For example, the one or more connector alignment surfaces 504 may be one or more alignment rods 504 (e.g., pins).
  • The optical fibers 222 may include, but are not limited to, single mode polarization maintaining optical fibers. The optical fibers 222 may be fixed relative to (e.g., actively aligned, and/or epoxied) to the one or more connector lenses 220 (and the one or more connector alignment surfaces 504).
  • In at least one embodiment, the optic system 216 is configured to be used with an optical connector 210 having one or more of the limitations described above (and vice versa). In at least one embodiment, the optic system 216 is at least one of: configured to be edge coupled with the optical connector 210; or configured to be used with collimating lenses (e.g., collimating connector lenses 220 and collimating interface lenses 218) of the optical connector 210. In at least one embodiment, the optical connector 210 is configured to be optically aligned to 20 or fewer microns in an X direction and/or a Y direction (the X-direction and Y-direction of FIG. 2A such that the Z-direction is aligned with an optical axis). In at least one embodiment, the optical connector 210 is operationally connected to the optic system 216.
  • In at least one embodiment, the one or more connector lenses 220 may be configured to at least one of: receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  • In at least one embodiment, by virtue of the optical connector 210 being configured to be used with a collimating lightbeam, the optical connector 210 has a Z-direction alignment tolerance (e.g., allows for misalignment) of (up to) at least 25 microns, and an X direction and/or Y direction of alignment tolerance of (upto) at least 5 microns.
  • It should be understood that the optical connector may be configured to be optically coupled and removably coupled to the optic system.
  • In at least one embodiment, at least one of the: optic system 216, optical connector 210, or coupled optic system 212 is configured to be compatible with single mode (SM) and polarization maintaining (PM) optical fiber.
  • Referring to FIG. 5B, a passive optical coupling of a coupled optic system 212 is shown where at least some elements are partially cutaway for improved clarity, in accordance with one or more embodiments of the present disclosure. In at least one embodiment, as shown, one or more alignment rods 504 may correspond to and be aligned with one or more optic alignment surfaces 302 (e.g., precision V-shaped grooves).
  • In at least one embodiment, the coupled optic system 212 is configured for use in a silicon photonics-based transceiver/communication technology. In at least one embodiment, the coupled optic system 212 is configured for use in a silicon photonic transceiver and co-packaged optics (CPO) based system.
  • It is believed that the inventive concepts disclosed herein and many of their attendant advantages will be understood by the foregoing description of embodiments of the inventive concepts disclosed, and it will be apparent that various changes may be made in the form, construction, and arrangement of the components thereof without departing from the broad scope of the inventive concepts disclosed herein or without sacrificing all of their material advantages; and individual features from various embodiments may be combined to arrive at other embodiments. The form herein before described being merely an explanatory embodiment thereof, it is the intention of the following claims to encompass and include such changes. Furthermore, any of the features disclosed in relation to any of the individual embodiments may be incorporated into any other embodiment.

Claims (15)

  1. An optic system comprising:
    a shelf; and
    one or more interface lenses coupled to the shelf,
    wherein the shelf comprises one or more optic alignment surfaces.
  2. The system of claim 1, wherein at least one of:
    the shelf being configured to be fixed in place relative to the one or more interface lenses; or
    the shelf being fixed in place relative to the one or more interface lenses.
  3. The system of claim 1, wherein the shelf is configured to accept a coupling of an optical connector, the optical connector configured to be removably couplable with the optic system.
  4. The system of claim 1, wherein the one or more interface lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  5. The system of claim 1, wherein the one or more optic alignment surfaces are one or more groove surfaces.
  6. The system of claim 1, at least one of the one or more optic alignment surfaces on opposite sides of a middle portion, the middle portion configured to accept an optical connector, and the one or more optic alignment surfaces configured to allow for alignment within 20 microns relative to an X-direction and/or a Y-direction, wherein the Z-direction is parallel to an optical axis of the one or more interface lenses.
  7. The system of claim 1, wherein the optic system is at least one of:
    configured to be edge coupled with an optical connector; or
    configured to be used with collimating connector lenses of the optical connector.
  8. An optical connector comprising:
    one or more connector lenses; and
    one or more connector alignment surfaces coupled relative to the one or more connector lenses.
  9. The optical connector of claim 8, wherein the one or more connector alignment surfaces are one or more alignment rods.
  10. The optical connector of claim 8, wherein the one or more connector alignment surfaces are parallel to an optical axis of the one or more connector lenses.
  11. The optical connector of claim 8, wherein the one or more connector lenses are configured to at least one of, receive and/or transmit a collimated lightbeam, or at least partially collimate a lightbeam.
  12. The optical connector of claim 8, wherein the optical connector is configured to be optically aligned to 20 or fewer microns in an X direction and/or a Y direction via at least the one or more connector alignment surfaces.
  13. The optical connector of claim 8, wherein the optical connector has a Z-direction alignment tolerance of at least 25 microns, and an X direction and/or Y direction of alignment tolerance of at least 5 microns.
  14. The optical connector of claim 8, further comprising one or more single mode polarization maintaining optical fibers.
  15. A coupled optic system comprising:
    an optic system comprising:
    a shelf; and
    one or more interface lenses coupled to the shelf, the shelf comprising one or more optic alignment surfaces; and
    an optical connector comprising:
    one or more connector lenses; and
    one or more connector alignment surfaces coupled relative to the one or more connector lenses and corresponding to the one or more optic alignment surfaces,
    the optical connector configured to be aligned respective to the optic system via the one or more connector alignment surfaces and the one or more optic alignment surfaces,
    the optical connector configured to be optically coupled and removably couplable to the optic system.
EP23155062.5A 2022-02-04 2023-02-06 Silicon photonic edge coupled connector via collimation Pending EP4224229A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263306870P 2022-02-04 2022-02-04
US202263306808P 2022-02-04 2022-02-04
US17/732,002 US12216313B2 (en) 2022-02-04 2022-04-28 Silicon photonic edge coupled connector via collimation

Publications (1)

Publication Number Publication Date
EP4224229A1 true EP4224229A1 (en) 2023-08-09

Family

ID=85175756

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23155062.5A Pending EP4224229A1 (en) 2022-02-04 2023-02-06 Silicon photonic edge coupled connector via collimation

Country Status (2)

Country Link
US (1) US12216313B2 (en)
EP (1) EP4224229A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM636164U (en) * 2022-09-14 2023-01-01 上詮光纖通信股份有限公司 Optical Component Assembly Alignment Structure
US12242116B2 (en) 2023-07-10 2025-03-04 Twinstar Technologies Co. Ltd. Optical fiber connector device and method
US20250164723A1 (en) * 2023-11-17 2025-05-22 Avago Technologies International Sales Pte. Limited Apparatus and method for supporting optical aligner
US20250164697A1 (en) * 2023-11-17 2025-05-22 Avago Technologies International Sales Pte. Limited Alignment structure and method for copackaged optical connector

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089879A (en) * 2006-09-29 2008-04-17 Sony Corp Optical coupler, optical connector, and receptacle type optical transmission module
WO2013158990A1 (en) * 2012-04-20 2013-10-24 Corning Cable Systems Llc Fiber optic modules having a fiber tray, optical-to-optical fiber optic connectors, and methods thereof
US20140185988A1 (en) * 2012-12-28 2014-07-03 Qi Qi Datacenter optics (dco) edge mount transciever assembly and plug connector
US20150063755A1 (en) * 2013-08-27 2015-03-05 International Business Machines Corporation Multicore fiber waveguide coupler
US20150277066A1 (en) * 2014-03-26 2015-10-01 International Business Machines Corporation Optical device, optical connector assembly, and optical connecting method
US20190086618A1 (en) * 2017-09-20 2019-03-21 Aayuna Inc. High Density Opto-Electronic Interconnection Configuration Utilizing Passive Alignment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001174671A (en) * 1999-12-16 2001-06-29 Japan Aviation Electronics Industry Ltd Optical element module
US6768844B2 (en) * 2001-03-30 2004-07-27 Raytheon Company Method and apparatus for effecting alignment in an optical apparatus
JP3960330B2 (en) * 2004-11-12 2007-08-15 セイコーエプソン株式会社 Optical device connection structure, optical device, electronic equipment
US9229169B2 (en) 2011-08-16 2016-01-05 International Business Machines Corporation Lens array optical coupling to photonic chip
JP5737254B2 (en) 2012-09-26 2015-06-17 日立金属株式会社 Optical communication module
TWI578044B (en) * 2013-01-14 2017-04-11 鴻海精密工業股份有限公司 Optical communication module
US10146009B2 (en) 2013-07-04 2018-12-04 Mellanox Technologies, Ltd. Silicon photonics connector
JP6090127B2 (en) * 2013-11-21 2017-03-08 ソニー株式会社 Optical communication device, transmission device, reception device, and transmission / reception system
JP6481381B2 (en) 2015-01-21 2019-03-13 富士通株式会社 Lens adjustment method and photoelectric mixed substrate
US10551569B2 (en) * 2017-02-02 2020-02-04 Alliance Fiber Optic Products, Inc. Wavelength-division multiplexing optical assembly with multiple collimator sets
CN108845393A (en) * 2018-06-27 2018-11-20 东莞市蓝光塑胶模具有限公司 A kind of optical fiber connector
CN110568569A (en) 2019-09-18 2019-12-13 杭州耀芯科技有限公司 integrated packaged optical engine and signal transmitting and receiving method thereof
US11782225B2 (en) 2019-11-19 2023-10-10 Corning Research & Development Corporation Multi-fiber interface apparatus for photonic integrated circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089879A (en) * 2006-09-29 2008-04-17 Sony Corp Optical coupler, optical connector, and receptacle type optical transmission module
WO2013158990A1 (en) * 2012-04-20 2013-10-24 Corning Cable Systems Llc Fiber optic modules having a fiber tray, optical-to-optical fiber optic connectors, and methods thereof
US20140185988A1 (en) * 2012-12-28 2014-07-03 Qi Qi Datacenter optics (dco) edge mount transciever assembly and plug connector
US20150063755A1 (en) * 2013-08-27 2015-03-05 International Business Machines Corporation Multicore fiber waveguide coupler
US20150277066A1 (en) * 2014-03-26 2015-10-01 International Business Machines Corporation Optical device, optical connector assembly, and optical connecting method
US20190086618A1 (en) * 2017-09-20 2019-03-21 Aayuna Inc. High Density Opto-Electronic Interconnection Configuration Utilizing Passive Alignment

Also Published As

Publication number Publication date
US12216313B2 (en) 2025-02-04
US20230251428A1 (en) 2023-08-10

Similar Documents

Publication Publication Date Title
EP4224229A1 (en) Silicon photonic edge coupled connector via collimation
US10684419B2 (en) Waveguide connector elements and optical assemblies incorporating the same
US10429597B2 (en) Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device
US20230076055A1 (en) Elastic averaging coupling
US7021833B2 (en) Waveguide based optical coupling of a fiber optic cable and an optoelectronic device
EP3593185B1 (en) Integrated electrical and optoelectronic package
US11782225B2 (en) Multi-fiber interface apparatus for photonic integrated circuit
TWI498615B (en) Integrated silicon photonic active optical cable components, sub-assemblies and assemblies
CN104508528B (en) Fiber optic carrier, fiber optic module, and method of handling optical fibers
US20050281507A1 (en) Coupling device for coupling light between a planar optical component and an optical assembly
US8500342B2 (en) Opto-electronic communication module having retainer for aligning optical ports
EP4224230A2 (en) Vertical placement silicon photonics optical connector holder & mount
EP3776035B1 (en) Waveguide substrates and waveguide substrate connector assemblies having waveguides and alignment features and methods of fabricating the same
EP2338075B1 (en) Multi-fiber interface to photonic subassembly
WO2004015474A2 (en) Optical connector assembly, coupling device and method for aligning such a coupling device and a waveguide structure
US20140294339A1 (en) Compact optical fiber splitters
JP6481381B2 (en) Lens adjustment method and photoelectric mixed substrate
TW201445208A (en) An optics system for use in a parallel optical communications module
EP2546688A1 (en) Right Angled Optical Interconnect System
CN116560015A (en) Edge coupling connectors via collimated silicon photons
Brusberg et al. Slim push-pull fiber array connector for optical chips
Kurata Mass production techniques for optical modules
WO2017102517A1 (en) Optical connector assembly
WO2005010570A2 (en) Packaging for a fiber-coupled optical device
US20020131717A1 (en) Precision optical centering device and method

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20240209

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20250915