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EP4131296A1 - Dispositif de génération d'une tension élevée - Google Patents

Dispositif de génération d'une tension élevée Download PDF

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Publication number
EP4131296A1
EP4131296A1 EP22185979.6A EP22185979A EP4131296A1 EP 4131296 A1 EP4131296 A1 EP 4131296A1 EP 22185979 A EP22185979 A EP 22185979A EP 4131296 A1 EP4131296 A1 EP 4131296A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
circuit boards
arrangement according
voltage
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP22185979.6A
Other languages
German (de)
English (en)
Inventor
Heiner Friedrich
Jens Kessler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R&r Beth GmbH
Original Assignee
R&r Beth GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&r Beth GmbH filed Critical R&r Beth GmbH
Publication of EP4131296A1 publication Critical patent/EP4131296A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/10—Single-phase transformers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
    • H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
    • H02M7/06—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
    • H02M7/10—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode arranged for operation in series, e.g. for multiplication of voltage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0064—Magnetic structures combining different functions, e.g. storage, filtering or transformation
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection

Definitions

  • the present invention relates to an arrangement for generating a high voltage in the form of a DC voltage.
  • the arrangement can be used, for example, in an electrostatic precipitator, with which particles can be charged, transported and separated.
  • the EP 1 211 701 A1 shows a planar coil formed on a printed circuit board having a substrate of electrically insulating material.
  • the planar coil includes first and second planar turns located on opposite sides of the substrate and each having an outer end and an inner end.
  • the printed circuit board carries a flat magnetic core on which the first and second windings are located.
  • a plated through hole in the substrate electrically connects the inner ends of the first and second planar windings.
  • the DE 199 01 172 C2 shows a high-voltage transformer having a plurality of laminated base plates each having a surface on which a first winding pattern and a second winding pattern are separately formed.
  • a magnetic core projects through the plurality of base plates in a through hole.
  • a transformer for a high-voltage generator tank which comprises an inner and an outer insulating sleeve and a winding wound on the inner insulating sleeve and an iron core.
  • a high voltage winding is formed on stacked circuit boards.
  • the DE 690 22 599 T2 teaches an extra high voltage power supply with a step-up transformer connected to the input of a voltage multiplier.
  • Capacitors of the voltage multiplier of each stage are formed by areas of conductive material bordering at least one layer of dielectric material on each side. The layers are formed as an integral part in a mechanical structure of the multiplier and support the rectifier diodes of the multiplier.
  • the multiplier can be formed as an arrangement of cascaded mica sheets, each mica sheet comprising a multiplier stage of two capacitors and two diodes.
  • a high-voltage generator for high DC voltages in which secondary windings are applied to printed circuit boards using printed technology.
  • Several of these printed circuit boards are stacked parallel to one another and are held together on a further printed circuit board arranged perpendicular thereto.
  • the printed circuit boards having the turns are electrically connected in series on the further printed circuit board.
  • the common further printed circuit board carries further electrical components which are interconnected with the windings on the printed circuit board. Further components on the high-voltage side are applied to the circuit boards with the secondary windings and interconnected with the high-voltage windings using printed technology.
  • high-voltage diodes and high-voltage capacitors can be arranged on the individual circuit boards.
  • every second printed circuit board can only contain diodes or capacitors.
  • the electronic ones Components can be constructed using SMD technology.
  • the windings can be designed using multilayer technology.
  • the U.S. 5,166,965 shows a high voltage direct current source for high power.
  • This high voltage DC power source includes a magnetic flux pole structure that is responsive to a relatively low voltage inductively coupled high frequency source.
  • Several rectifiers inductively coupled thereto are connected in series and stacked to dissipate the output power with a high DC voltage.
  • Each stage includes a pair of oppositely wound planar coils on opposite sides of a printed circuit board. The printed circuits of the different stages are shifted against each other and controlled by the high-frequency source via a coil.
  • the EP 3 876 683 A1 shows a heat dissipation mechanism for stack-based electronic devices, which include, for example, a stack of printed circuit boards.
  • a power conversion circuit having a multi-layer transformer and a plurality of rectifier transistors coupled to secondary windings of the multi-layer transformer.
  • the multilayer transformer is formed by multiple layers within a conductor plate stack, with primary winding conductors and secondary winding conductors being vertically aligned and stacked.
  • the US 10,381,914 B2 shows a device with an integrated transformer.
  • the device includes a power conversion system with primary-side transistors and a series combination of a transformer primary winding, a capacitor and an inductor.
  • FIG. 12 shows a power conversion device including an input unit, a conversion unit for converting a DC input voltage into a multi-phase AC voltage, a resonance unit having a single resonance inductor, and an output unit for rectifying the multi-phase AC voltage.
  • the GB 2517015A shows a planar flyback transformer with a core made of a magnetic material and with several printed circuit boards. Conductive traces on the circuit boards form at least a primary coil and a secondary coil, each spiraling around a portion of the core.
  • Mains-frequency high-voltage transformers with rectification are known from the prior art, which are large, heavy and expensive due to a special winding technique and oil filling.
  • the use of switched-mode power supply technologies in the high-voltage range not only fails because of the lack of suitable voltage-resistant semiconductors, but also because parasitic effects due to the unavoidable winding capacitances increase with the square of the voltage and linearly with the frequency.
  • the object of the present invention is to provide a comparatively small and inexpensive arrangement for generating a high voltage in the form of a DC voltage, which requires a relatively low AC voltage on the input side.
  • the arrangement according to the invention serves to generate a high voltage in the form of a DC voltage or a pulsating DC voltage.
  • the arrangement serves in particular to convert an AC voltage into a DC voltage that is several times larger in the high-voltage range.
  • the arrangement preferably forms a component of an electrostatic precipitator, which is designed for charging, for transporting and/or for separating particles, such as dust particles.
  • This electrostatic precipitator preferably also includes a generator for generating the AC voltage, which is converted by the arrangement into a DC voltage that is several times larger in the high-voltage range.
  • the arrangement is preferably designed to generate a high voltage which is in a range from 10 kV to 100 kV.
  • the high-voltage power that can be output by the arrangement is preferably in the range from 1 kW to 10 kW.
  • the arrangement is preferably designed to be supplied with an AC voltage which is in a range from 100 V to 1000 V.
  • the arrangement is preferably designed to be fed by an AC voltage which has a frequency in a range from 20 kHz to 200 kHz.
  • the arrangement includes at least one magnetic core for a transformer.
  • the magnetic core can also be referred to as an iron core or ferrite core and consists of a soft magnetic material such as a ferromagnetic metal alloy or ferrite.
  • the arrangement also includes at least one primary winding surrounding the magnet core.
  • the primary winding is wound around the magnetic core.
  • the primary winding forms an input for the AC voltage feeding the arrangement.
  • the arrangement also includes a multiplicity of printed circuit boards stacked one on top of the other.
  • the printed circuit boards can also be referred to as printed circuit boards, boards or printed circuits.
  • the circuit boards stacked on top of each other form a stack.
  • At least one secondary winding surrounding the magnet core is formed in the form of a conductor track on each of the individual printed circuit boards.
  • the conductor tracks are preferably made of copper and are preferably formed as a thin layer on an electrically insulating substrate of the respective printed circuit board. A thickness of this layer is preferably less than 100 ⁇ m.
  • the secondary windings are wound around the magnetic core.
  • the at least one primary winding thus forms a transformer with the magnetic core and with each of the secondary windings.
  • the stack can also include other printed circuit boards, for example printed circuit boards on which the primary winding is formed and/or printed circuit boards for carrying the high voltage.
  • Electronic components for rectifying an AC voltage that can be generated by the respective secondary winding are arranged on the individual printed circuit boards.
  • the electronic components for rectification can be present multiple times on the respective printed circuit board.
  • the individual secondary windings and the respective electronic components for rectification each form a high-voltage stage Generation of a rectified high voltage.
  • the high-voltage stages are preferably designed to generate a rectified high voltage in a range between 1 kV and 10 kV.
  • the high-voltage stages are electrically connected in series on the output side, so that the high voltages that can be generated by the individual high-voltage stages add up, with the sum of the individual high voltages representing the high voltage to be generated by the arrangement.
  • the individual printed circuit boards each have at least one recess into which at least some of the electronic components located on the adjacent printed circuit board protrude.
  • the printed circuit boards can be stacked one on top of the other without a gap, so that only an adhesive and/or an insulating material or the like is located between the printed circuit boards.
  • All of the electronic components located on the adjacent printed circuit board preferably protrude into the cutout.
  • the recesses are preferably each formed in an edge area of the respective printed circuit board.
  • An advantage of the arrangement according to the invention is that the AC voltage feeding the arrangement can be kept as small as possible and the DC voltage to be generated is obtained with comparatively little effort by multiplication.
  • the arrangement according to the invention can also be referred to as a split transformer.
  • a further advantage of the arrangement is that it can be made compact and that the high field strengths that occur can be avoided by a suitable choice of the materials of the components of the arrangement and further measures for field control can be controlled and so partial discharges can be avoided.
  • the circuit boards are stacked one on top of the other with no free space between the circuit boards.
  • the printed circuit boards are connected or glued to one another in a vacuum casting process.
  • the adjacent printed circuit boards each have a distance between their surfaces which is smaller than a height of the electronic components, since the printed circuit boards each have the recess into which the electronic components located on the respective adjacent printed circuit board protrude.
  • Said distance between the surfaces of two adjacent printed circuit boards is preferably equal to zero or it is preferably filled with an adhesive and/or an insulating material.
  • Said distance between the surfaces of two adjacent circuit boards is preferably less than 1 mm and more preferably less than 0.1 mm.
  • the individual printed circuit boards preferably each have an assembly area in which at least the majority of the electronic components of the respective printed circuit board are arranged.
  • the assembly areas and the cutouts preferably alternate in a sequence of printed circuit boards stacked one on top of the other.
  • the assembly areas and thus also the cutouts are preferably arranged on the printed circuit boards in a section which is spaced apart from the at least one secondary winding.
  • the printed circuit boards preferably each have a through opening through which the magnetic core is passed and which is surrounded by the respective at least one secondary winding.
  • the through-openings are preferably arranged in alignment one above the other.
  • the through openings are preferably rectangular with preferably rounded corners.
  • the at least one magnet core preferably has a U-shape with two legs. One of the legs of the U-shape is passed through the through openings, while another of the legs of the U-shape is arranged next to the circuit boards stacked on top of one another.
  • the two legs of the U-shape are preferably arranged perpendicular to the printed circuit boards.
  • the arrangement preferably comprises two of the U-shaped magnetic cores, which are passed through the through-openings together.
  • the printed circuit boards each have a multi-layer design.
  • the individual printed circuit boards preferably have between two and six layers.
  • the at least one secondary winding is preferably formed on an inner one of the multiple layers of the respective printed circuit board.
  • the individual printed circuit boards have a thickness which is preferably at least 1.5 mm and more preferably at least 2 mm.
  • the thickness of the respective circuit board is equal to the height of the recess into which the electronic components of the adjacent circuit board protrude.
  • the number of printed circuit boards carrying the secondary windings is preferably between 5 and 50.
  • the number of secondary windings in the arrangement is preferably between 10 and 100.
  • the electronic components arranged on one of the printed circuit boards each include at least one diode for rectifying the AC voltage that can be induced in the at least one secondary winding.
  • the at least one diode arranged on the respective circuit board is connected in a one-way circuit.
  • the plurality of diodes arranged on the respective printed circuit boards are preferably connected up as a Graetz bridge, as a Greinacher circuit or as a Delon circuit.
  • the electronic components arranged on one of the printed circuit boards include at least one capacitor.
  • the at least one capacitor arranged on the respective printed circuit board is preferably connected up as a smoothing capacitor for smoothing the rectified voltage.
  • the electronic components arranged on one of the printed circuit boards each include divider resistors for dividing an output voltage. Dividing the output voltage makes it easier to measure the output voltage at a base point.
  • the electronic components arranged on one of the printed circuit boards include at least one fuse resistor, which is located between the respective secondary winding and the respective Rectifier circuit is connected.
  • the safety resistor opens in the event of a short circuit, which can be caused by a defect in one of the respective diodes, for example.
  • the electronic components arranged on one of the printed circuit boards include at least one LED for checking the function, so that during operation it can be seen from the outside whether the high-voltage stage is functional.
  • the electronic components arranged on the printed circuit boards are designed as SMD components.
  • the SMD components have a height which is preferably at most 2 mm and more preferably at most 1.4 mm. Since the printed circuit boards are preferably at least 2 mm thick, the SMD components can be arranged completely in the recesses.
  • each circuit board has at least four of the secondary windings.
  • the at least four secondary windings are preferably distributed over the multiple layers of the respective multi-layer printed circuit board, preferably on the inner layers of the respective printed circuit board.
  • the flat secondary windings preferably have a round or an oval shape.
  • the secondary windings each have an outer turn which has a minimum radius of curvature, which is preferably at least 30 mm.
  • the individual printed circuit boards each have an inner conductor track in the form of a conductor track, which is arranged in an interior of the respective at least one secondary winding and encloses the respective through-opening except for an interruption.
  • the inner conductor preferably has the same electrical potential as the magnet core, which is preferably formed by a potential of a protective conductor, i. This means that the inner conductor track is preferably electrically connected to the protective conductor.
  • the inner conductor run arranged on the respective printed circuit board has the effect that high electric field strengths only occur in an area between the inner conductor run and the at least one secondary winding on the respective printed circuit board. Hardly any electric field strengths can occur at the magnetic core, which avoids corona discharges.
  • the inner conductor track has a minimum radius of curvature, which is preferably at least 15 mm.
  • the individual printed circuit boards each have at least one outer conductor track, which is arranged outside of the respective at least one secondary winding; in particular on an outer edge of the respective printed circuit board.
  • the at least one outer conductor run preferably has the same electrical potential as the magnet core, which is preferably formed by a potential of a protective conductor, ie the at least one outer conductor run is preferably electrically connected to the protective conductor.
  • the at least one outer conductor run is not designed as a closed winding and therefore preferably has interruptions.
  • the at least one outer conductor track is preferably between the respective at least arranged a secondary winding and the second leg of the at least one U-shaped magnetic core. More of the outer conductor tracks are preferably each formed as an outer delimitation of the respective assembly area and/or the respective recess.
  • the inner conductor tracks and/or the outer conductor tracks are preferably each designed as a primary auxiliary winding.
  • the printed circuit boards and the secondary windings located thereon, with the inner and/or outer conductor tracks if applicable, are preferably designed in such a way that a potential occurring during operation increases from an outer edge of the respective printed circuit board to a center point of the respective printed circuit board.
  • the printed circuit boards preferably have the same external shape.
  • the outer shape is preferably formed by a rectangle.
  • the circuit boards preferably have rounded corners.
  • the printed circuit boards are preferably arranged in alignment one above the other.
  • the plurality of circuit boards includes a first group of like circuit boards and a second group of like circuit boards.
  • the printed circuit boards of the two groups preferably only differ in the mutual arrangement of the assembly area and the recess.
  • One of the printed circuit boards in the first group and one of the printed circuit boards in the second group are arranged one above the other in alternation.
  • Preferred embodiments of the arrangement further include at least one primary circuit board on which the at least a primary winding is in the form of a conductor track.
  • the at least one primary printed circuit board and the plurality of printed circuit boards carrying the secondary windings are stacked one on top of the other.
  • the at least one primary printed circuit board and the multiplicity of printed circuit boards carrying the secondary windings thus together form a stack.
  • the at least one primary printed circuit board preferably has the same external shape as the printed circuit boards carrying the secondary windings.
  • the at least one primary printed circuit board preferably has, in the same way as the printed circuit boards carrying the secondary windings, a through opening through which the at least one magnetic core is passed and which is surrounded by the respective primary winding.
  • electronic components for control and/or measurement are preferably arranged on the at least one primary printed circuit board.
  • the multiplicity of printed circuit boards carrying the secondary windings and preferably also the at least one primary printed circuit board are preferably cast and/or impregnated, which is preferably carried out under a technical vacuum.
  • the multiplicity of printed circuit boards carrying the secondary windings and the at least one primary printed circuit board are preferably not cast or impregnated together with the magnet core.
  • the printed circuit boards carrying the secondary windings are electrically connected to one another by jumpers, spring contacts, soldered connections and/or conductive adhesive connections To switch high-voltage stages electrically in series on the output side.
  • the printed circuit boards of the high-voltage stages connected in series are preferably arranged in the stack in such a way that the high voltage, which increases in stages as a result of the series connection, rises on both sides from a top and a bottom of the stack towards a middle of the stack, so that the highest potential is in the middle of the stack of the series circuit where the high voltage to be generated is tapped.
  • the arrangement of the high-voltage stages is symmetrical with respect to the center of the stack.
  • FIG. 1 shows a sectional view of a preferred embodiment of an arrangement according to the invention for generating a high voltage.
  • the sectional view shows, in particular, a printed circuit board 01, which sits on two magnetic cores 02 as a stack together with several other stacked printed circuit boards (not shown).
  • the magnetic cores 02 each have a U-shape, where one leg 03 of the U-shaped magnetic cores 02 is passed through a through-opening 04 formed in the printed circuit board 01, while another leg 06 of the U-shaped magnetic cores 02 is guided outside the printed circuit board 01.
  • the printed circuit board 01 has a multi-layer design, with two secondary windings 07 each being formed as conductor tracks on two inner layers.
  • a primary winding (not shown) of the arrangement surrounding the leg 03 forms a transformer with the magnetic cores 02 and the individual secondary windings 07 in each case.
  • the printed circuit board 01 has an assembly area 08 in which electronic components such as diodes 09 (shown in 2 ), capacitors 11 (shown in 2 ) and fuse resistors 12 (shown in 2 ) are arranged.
  • the printed circuit board 01 also has a recess 13 into which the electronic components 09, 11, 12 (shown in 2 ) of an adjacent printed circuit board (not shown) of the stack.
  • an inner conductor track 14 is also formed as a conductor track, which surrounds the through-opening 04 inside the secondary windings 07 and is interrupted by an interruption 16.
  • an interrupted first outer conductor track 17, a second outer conductor track 18 and a third outer conductor track 19 are also formed as conductor tracks in edge regions of the printed circuit board 01.
  • Each of the secondary windings 07, together with the associated electronic components 09, 11, 12 (shown in 2 ) a high-voltage stage, which is configured to generate a direct voltage of 1 kV, for example, so that a direct voltage of 4 kV can be generated for each printed circuit board 01.
  • the arrangement includes, for example, a total of 15 printed circuit boards 01, so that a total direct voltage of 60 kV can be generated, with the power being 3 kW, for example. Since the DC voltage to be generated by the individual high-voltage stages is only 1 kV, proven and inexpensive components can be used.
  • FIG. 2 shows a circuit diagram of electrical components of the in 1 arrangement shown.
  • the electrical components are the secondary windings 07, the diodes 09, the capacitors 11 and the fuse resistors 12, the ones on one of the printed circuit boards 01 (shown in Fig 1 ) shown four high-voltage levels are shown.
  • Four of the diodes 09 are connected as a Graetz bridge to rectify the AC voltage generated in the individual secondary windings 07 .
  • One of the capacitors 11 is arranged as a smoothing capacitor at the outputs of the Graetz bridges.
  • One of the safety resistors 12 is connected between the individual secondary windings 07 and the respective diodes 09 in order to open a possible short circuit.
  • the high voltage stages are connected in series.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
EP22185979.6A 2021-08-06 2022-07-20 Dispositif de génération d'une tension élevée Withdrawn EP4131296A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102021120473.9A DE102021120473B3 (de) 2021-08-06 2021-08-06 Anordnung zur Erzeugung einer Hochspannung

Publications (1)

Publication Number Publication Date
EP4131296A1 true EP4131296A1 (fr) 2023-02-08

Family

ID=82656489

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22185979.6A Withdrawn EP4131296A1 (fr) 2021-08-06 2022-07-20 Dispositif de génération d'une tension élevée

Country Status (2)

Country Link
EP (1) EP4131296A1 (fr)
DE (1) DE102021120473B3 (fr)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332362A (ja) * 1989-06-26 1991-02-12 Fuji Electric Co Ltd 高電圧発生回路
US5166965A (en) 1991-04-11 1992-11-24 Varian Associates, Inc. High voltage dc source including magnetic flux pole and multiple stacked ac to dc converter stages with planar coils
DE69022599T2 (de) 1989-11-03 1996-03-21 Secr Defence Brit Hochspannungsleistungsversorgung.
DE19538488C1 (de) 1995-10-16 1996-11-28 Siemens Ag Transformator für eine Gleichrichterschaltung
DE19901172C2 (de) 1998-07-15 2001-04-26 Mitsubishi Electric Corp Hochspannungstransformator und Verfahren zum Herstellen des Hochspannungstransformators
EP1177614A1 (fr) * 1998-12-21 2002-02-06 Ruanduff Electrical Limited Alimentation electrique modulaire permettant de generer une sortie en courant continu haute tension
EP1211701A1 (fr) 2000-12-04 2002-06-05 C.R.F. Società Consortile per Azioni Inducteur plan à noyau ferromagnétique et son procédé de fabrication
GB2517015A (en) 2013-08-08 2015-02-11 Megger Instr Ltd Transformer
US8963676B1 (en) * 2013-03-12 2015-02-24 XP Power Limited Configurable transformer module
EP3159902A1 (fr) 2014-06-23 2017-04-26 Shanghai United Imaging Healthcare Co., Ltd. Procédé et dispositif d'isolation pour réservoir d'huile de générateur haute tension
US20180152108A1 (en) 2016-11-30 2018-05-31 Lg Electronics Inc. Apparatus for converting dc power
US10381914B2 (en) 2017-07-19 2019-08-13 Texas Instruments Incorporated Integrated transformer
US20200335255A1 (en) 2019-04-17 2020-10-22 Flex Ltd. Multilayer transformer structure comprising multiple rectification elements
EP3876683A1 (fr) 2020-03-05 2021-09-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Mécanisme d'élimination de chaleur pour dispositif électronique basé sur un empilement avec composant de commande de processus et composants de traitement

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332362A (ja) * 1989-06-26 1991-02-12 Fuji Electric Co Ltd 高電圧発生回路
DE69022599T2 (de) 1989-11-03 1996-03-21 Secr Defence Brit Hochspannungsleistungsversorgung.
US5166965A (en) 1991-04-11 1992-11-24 Varian Associates, Inc. High voltage dc source including magnetic flux pole and multiple stacked ac to dc converter stages with planar coils
DE19538488C1 (de) 1995-10-16 1996-11-28 Siemens Ag Transformator für eine Gleichrichterschaltung
DE19901172C2 (de) 1998-07-15 2001-04-26 Mitsubishi Electric Corp Hochspannungstransformator und Verfahren zum Herstellen des Hochspannungstransformators
EP1177614A1 (fr) * 1998-12-21 2002-02-06 Ruanduff Electrical Limited Alimentation electrique modulaire permettant de generer une sortie en courant continu haute tension
EP1211701A1 (fr) 2000-12-04 2002-06-05 C.R.F. Società Consortile per Azioni Inducteur plan à noyau ferromagnétique et son procédé de fabrication
US8963676B1 (en) * 2013-03-12 2015-02-24 XP Power Limited Configurable transformer module
GB2517015A (en) 2013-08-08 2015-02-11 Megger Instr Ltd Transformer
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