[go: up one dir, main page]

EP4115718A4 - Boîtier de télécommunications à gestion de charge thermique améliorée - Google Patents

Boîtier de télécommunications à gestion de charge thermique améliorée Download PDF

Info

Publication number
EP4115718A4
EP4115718A4 EP21763717.2A EP21763717A EP4115718A4 EP 4115718 A4 EP4115718 A4 EP 4115718A4 EP 21763717 A EP21763717 A EP 21763717A EP 4115718 A4 EP4115718 A4 EP 4115718A4
Authority
EP
European Patent Office
Prior art keywords
thermal load
improved thermal
load management
telecommunications housing
telecommunications
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21763717.2A
Other languages
German (de)
English (en)
Other versions
EP4115718A1 (fr
Inventor
James Lau
Paul Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Netcomm Wireless Pty Ltd
Original Assignee
Netcomm Wireless Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2020900704A external-priority patent/AU2020900704A0/en
Application filed by Netcomm Wireless Pty Ltd filed Critical Netcomm Wireless Pty Ltd
Publication of EP4115718A1 publication Critical patent/EP4115718A1/fr
Publication of EP4115718A4 publication Critical patent/EP4115718A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Transmitters (AREA)
EP21763717.2A 2020-03-06 2021-03-05 Boîtier de télécommunications à gestion de charge thermique améliorée Pending EP4115718A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AU2020900704A AU2020900704A0 (en) 2020-03-06 Antenna modem with improved thermal load management
AU2020903220A AU2020903220A0 (en) 2020-09-08 Antenna housing with improved thermal load management and mounting arrangement thereof
PCT/AU2021/050202 WO2021174319A1 (fr) 2020-03-06 2021-03-05 Boîtier de télécommunications à gestion de charge thermique améliorée

Publications (2)

Publication Number Publication Date
EP4115718A1 EP4115718A1 (fr) 2023-01-11
EP4115718A4 true EP4115718A4 (fr) 2024-04-03

Family

ID=77612510

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21763717.2A Pending EP4115718A4 (fr) 2020-03-06 2021-03-05 Boîtier de télécommunications à gestion de charge thermique améliorée

Country Status (6)

Country Link
US (1) US20230007808A1 (fr)
EP (1) EP4115718A4 (fr)
CN (1) CN115380637A (fr)
AU (1) AU2021230415A1 (fr)
CA (1) CA3174501A1 (fr)
WO (1) WO2021174319A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102726336B1 (ko) 2021-01-05 2024-11-04 엘지전자 주식회사 제어박스 및 이를 구비하는 디스플레이 디바이스
CN219614746U (zh) * 2021-09-24 2023-09-01 深圳由莱智能电子有限公司 皮肤保养组件和接触式皮肤保养设备
EP4160823B1 (fr) * 2021-10-04 2024-08-07 Mirach SAS di Annamaria Saveri & C. Réseau d'antennes colinéaire
US20250008682A1 (en) * 2021-11-15 2025-01-02 Telefonaktiebolaget Lm Ericsson (Publ) Cooling module assembly for pole-mounted network node
TWI784830B (zh) * 2021-12-07 2022-11-21 啓碁科技股份有限公司 通訊裝置
CN114302629A (zh) * 2022-01-11 2022-04-08 Oppo广东移动通信有限公司 客户前置设备及其控制方法
WO2024019371A1 (fr) * 2022-07-18 2024-01-25 삼성전자 주식회사 Structure de rayonnement thermique et dispositif électronique la comprenant
US20240063523A1 (en) * 2022-08-19 2024-02-22 viaPhoton, Inc. Data aggregation and compute module
EP4531249A1 (fr) * 2023-09-29 2025-04-02 Siemens Aktiengesellschaft Élément couvercle pour flasque de moteur électrique et moteur électrique
CN118336338B (zh) * 2024-06-12 2024-10-22 中交第二公路工程局有限公司 一种智慧公路用路侧5g天线挂杆
US12439548B1 (en) * 2024-12-20 2025-10-07 Righ, Inc. Systems and methods for cooling circuit board components in a compact signal hub

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018128661A2 (fr) * 2016-10-17 2018-07-12 Waymo Llc Liaison rotative thermique
EP3314784B1 (fr) * 2015-06-25 2019-03-27 Airspan Networks Inc. Appareil d'antenne rotative

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877551B2 (en) * 2002-07-11 2005-04-12 Avaya Technology Corp. Systems and methods for weatherproof cabinets with variably cooled compartments
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
US7836939B2 (en) * 2007-08-01 2010-11-23 Harris Corporation Non-contacting thermal rotary joint
WO2009113818A2 (fr) * 2008-03-12 2009-09-17 Kmw Inc. Dispositif destiné à contenir un appareil de communication sans fil
WO2011068259A1 (fr) * 2009-12-02 2011-06-09 한국과학기술원 Puits de chaleur
WO2015027004A1 (fr) * 2013-08-21 2015-02-26 CoolChip Technologies, Inc. Dissipateur thermique cinétique comportant des ailettes de transfert thermique interdigitées
EP3281080B1 (fr) * 2015-04-10 2019-02-27 Phoenix Contact Development and Manufacturing, Inc. Enceinte comprenant de multiples surfaces de dissipation de chaleur
US9768513B2 (en) * 2015-05-08 2017-09-19 Google Inc. Wireless access point
US10260723B1 (en) * 2015-09-22 2019-04-16 Eaton Intelligent Power Limited High-lumen fixture thermal management
US9970643B2 (en) * 2016-05-12 2018-05-15 Christie Digital Systems Usa, Inc. Rotatable heat sink with internal convection
US11417585B2 (en) * 2016-11-30 2022-08-16 Whirlpool Corporation System for cooling components in an electronic module
CN107087377B (zh) * 2017-04-28 2019-04-26 华为技术有限公司 散热装置、散热器、电子设备及散热控制的方法
CN110830062A (zh) * 2019-11-08 2020-02-21 Oppo广东移动通信有限公司 网络设备

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3314784B1 (fr) * 2015-06-25 2019-03-27 Airspan Networks Inc. Appareil d'antenne rotative
WO2018128661A2 (fr) * 2016-10-17 2018-07-12 Waymo Llc Liaison rotative thermique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021174319A1 *

Also Published As

Publication number Publication date
CN115380637A (zh) 2022-11-22
WO2021174319A1 (fr) 2021-09-10
EP4115718A1 (fr) 2023-01-11
CA3174501A1 (fr) 2021-09-10
AU2021230415A1 (en) 2022-11-03
US20230007808A1 (en) 2023-01-05

Similar Documents

Publication Publication Date Title
EP4115718A4 (fr) Boîtier de télécommunications à gestion de charge thermique améliorée
CA231241S (en) Combined earpiece with case
MX2011012238A (es) Sistema de gestion termica accionado por bateria electrica.
PH12017500553B1 (en) Unified frame structure
EP4190607A4 (fr) Composant de gestion thermique
EP4127856A4 (fr) Circuits de gestion de puissance
EP4098069A4 (fr) Gestion de connexions dans des réseaux à sauts multiples
EP3977236A4 (fr) Système de gestion de puissance
EP3948488A4 (fr) Gestion d'énergie prédictive
EP4048546A4 (fr) Système de gestion de batterie à double messagerie can
EP4211635A4 (fr) Système de gestion de poids basé sur une stimulation électrique
AU2021358444A9 (en) Electrical power transmission
AR066541A1 (es) Conjunto para telecomunicaciones con un armazon interno y un armazon externo
EP4139986A4 (fr) Système de gestion thermique de batterie
TWI800157B (zh) 電能管理系統
HK40075465B (zh) 电池热管理构件
TWI800880B (zh) 具有改良連線負載的電路模組
GB202017700D0 (en) Fibre management enclosure with mounting arrangement
IL287978A (en) Power amplifier system with internal optical communication link
GB202100726D0 (en) Power management
EP4156216A4 (fr) Élément de stockage électrique
JP1710027S (ja) 統合脅威管理機能付き電話交換機
EP3990874A4 (fr) Ensemble cellule de charge planaire
AU2020900704A0 (en) Antenna modem with improved thermal load management
HK40063739A (en) Fuel cell power management

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20221006

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20240306

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/433 20060101ALI20240229BHEP

Ipc: H01L 23/427 20060101ALI20240229BHEP

Ipc: H01L 23/367 20060101ALI20240229BHEP

Ipc: F28D 21/00 20060101ALI20240229BHEP

Ipc: H05K 1/02 20060101ALI20240229BHEP

Ipc: H05K 7/20 20060101AFI20240229BHEP