EP4011542A4 - PROCESSING DEVICE - Google Patents

PROCESSING DEVICE Download PDF

Info

Publication number: EP4011542A4
Authority: EP; European Patent Office
Prior art keywords: processing device; processing
Prior art date: 2019-08-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

EP20850290.6A

Other languages

German (de)

French (fr)

Other versions

EP4011542A1 (en

Inventor

Shinji Sato

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nikon Corp

Original Assignee

Nikon Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-08-08

Filing date

2020-08-06

Publication date

2023-09-20

2020-08-06 Application filed by Nikon Corp filed Critical Nikon Corp

2022-06-15 Publication of EP4011542A1 publication Critical patent/EP4011542A1/en

2023-09-20 Publication of EP4011542A4 publication Critical patent/EP4011542A4/en

Status Pending legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)
Length Measuring Devices By Optical Means (AREA)

EP20850290.6A 2019-08-08 2020-08-06 PROCESSING DEVICE Pending EP4011542A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
PCT/JP2019/031480 WO2021024480A1 (en)	2019-08-08	2019-08-08	Processing apparatus
PCT/JP2020/030204 WO2021025119A1 (en)	2019-08-08	2020-08-06	Processing device

Publications (2)

Publication Number	Publication Date
EP4011542A1 EP4011542A1 (en)	2022-06-15
EP4011542A4 true EP4011542A4 (en)	2023-09-20

Family

ID=74502798

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20850290.6A Pending EP4011542A4 (en)	2019-08-08	2020-08-06	PROCESSING DEVICE

Country Status (6)

Country	Link
US (1)	US20220355412A1 (en)
EP (1)	EP4011542A4 (en)
JP (4)	JP7416069B2 (en)
CN (3)	CN118595591A (en)
TW (1)	TW202115975A (en)
WO (2)	WO2021024480A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7270216B2 (en) *	2019-08-23	2023-05-10	パナソニックＩｐマネジメント株式会社	LASER PROCESSING DEVICE, LASER PROCESSING METHOD, AND CORRECTION DATA GENERATION METHOD
JP7464055B2 (en) *	2019-08-30	2024-04-09	株式会社ニコン	Processing system and robot system
US11969823B2 (en)	2020-04-16	2024-04-30	Panasonic Intellectual Property Management Co., Ltd.	Laser processing apparatus and laser processing method
US20240416449A1 (en)	2021-10-27	2024-12-19	Nikon Corporation	Data generation method, cloud system, processing apparatus, computer program, and recording medium
DE102022116927A1 (en)	2022-07-07	2024-01-18	Trumpf Laser Gmbh	Laser processing machine with frequency comb-based distance sensor and associated method with frequency comb-based distance measurement
WO2024042681A1 (en) *	2022-08-25	2024-02-29	株式会社ニコン	Machining system
FR3146078B1 (en) *	2023-02-23	2025-02-14	Irt Antoine De Saint Exupery	LASER surface treatment device and method
JP2024164367A (en) *	2023-05-15	2024-11-27	タツモ株式会社	Bonding Repair Method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10207535A1 (en) *	2002-02-22	2003-09-11	Zeiss Carl	Device for machining and measurement of an object using laser ablation comprises a radiation source, circuit and guiding elements and has a simple design that enables simple handling
US20160039045A1 (en) *	2013-03-13	2016-02-11	Queen's University At Kingston	Methods and Systems for Characterizing Laser Machining Properties by Measuring Keyhole Dynamics Using Interferometry
JP2016048188A (en) *	2014-08-27	2016-04-07	国立大学法人電気通信大学	Distance measuring device
DE102016001661B3 (en) *	2016-02-12	2017-04-13	Lessmüller Lasertechnik GmbH	Measuring device and method for determining a relative inclination of a workpiece by means of optical coherence tomography during processing

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5512349B2 (en) *	1973-08-01	1980-04-01
GB2226970B (en)	1989-01-11	1992-10-21	British Aerospace	Methods of manufacture and surface treatment using laser radiation
US5001324A (en) *	1989-09-14	1991-03-19	General Electric Company	Precision joint tracking laser welding system
JP3174473B2 (en) *	1995-03-13	2001-06-11	キヤノン株式会社	Manufacturing method and processing apparatus for electron-emitting device
JP3980289B2 (en) *	2001-03-27	2007-09-26	住友重機械工業株式会社	Laser processing equipment
JP2004243383A (en) *	2003-02-14	2004-09-02	Sumitomo Heavy Ind Ltd	Laser beam machine, and laser beam machining method
JP4334290B2 (en) *	2003-07-24	2009-09-30	株式会社東芝	Laser irradiation device
JP2005161387A (en)	2003-12-05	2005-06-23	Nissan Motor Co Ltd	Laser processing apparatus and laser processing method
JP5120814B2 (en)	2008-03-28	2013-01-16	株式会社ブイ・テクノロジー	Pattern forming method and pattern forming apparatus
JP2010082663A (en)	2008-09-30	2010-04-15	Sunx Ltd	Laser beam machine
JP5238451B2 (en) *	2008-10-22	2013-07-17	本田技研工業株式会社	Laser processing apparatus and position detection method thereof
JP2011196785A (en)	2010-03-18	2011-10-06	Disco Corp	Measurement apparatus and laser processing machine of to-be-processed object held on chuck table
JP2011237348A (en)	2010-05-12	2011-11-24	Disco Abrasive Syst Ltd	Height position measuring device for workpiece held by chuck table and laser processing apparatus
HUE065575T2 (en)	2010-09-25	2024-06-28	Ipg Photonics Canada Inc	Method of coherent imaging and feedback control for modification of materials
US9174304B2 (en)	2011-10-25	2015-11-03	Eisuke Minehara	Laser decontamination device
JP6148075B2 (en) *	2013-05-31	2017-06-14	株式会社ディスコ	Laser processing equipment
DE102013015656B4 (en) *	2013-09-23	2016-02-18	Precitec Optronik Gmbh	Method for measuring the penetration depth of a laser beam into a workpiece, method for machining a workpiece and laser processing device
WO2015163365A1 (en)	2014-04-23	2015-10-29	独立行政法人科学技術振興機構	Combined-blade-type open flow path device and joined body thereof
JP6327525B2 (en)	2015-01-28	2018-05-23	株式会社東京精密	Laser dicing equipment
JP2018153842A (en) *	2017-03-17	2018-10-04	トヨタ自動車株式会社	Measuring device and laser welding device
JP6341325B2 (en) *	2017-07-07	2018-06-13	株式会社東京精密	Stage position control device
JP6579400B2 (en) *	2017-10-26	2019-09-25	パナソニックＩｐマネジメント株式会社	Laser welding apparatus and laser welding method
US10744539B2 (en)	2017-10-27	2020-08-18	The Boeing Company	Optimized-coverage selective laser ablation systems and methods
JP7115973B2 (en) *	2018-12-28	2022-08-09	株式会社キーエンス	Laser processing equipment

2019
- 2019-08-08 WO PCT/JP2019/031480 patent/WO2021024480A1/en not_active Ceased
- 2019-08-08 JP JP2021537539A patent/JP7416069B2/en active Active
2020
- 2020-08-06 WO PCT/JP2020/030204 patent/WO2021025119A1/en not_active Ceased
- 2020-08-06 TW TW109126720A patent/TW202115975A/en unknown
- 2020-08-06 EP EP20850290.6A patent/EP4011542A4/en active Pending
- 2020-08-06 CN CN202410867617.7A patent/CN118595591A/en active Pending
- 2020-08-06 CN CN202080056385.7A patent/CN114206538B/en active Active
- 2020-08-06 US US17/632,900 patent/US20220355412A1/en active Pending
- 2020-08-06 CN CN202410867490.9A patent/CN118635656A/en active Pending
- 2020-08-06 JP JP2021537381A patent/JPWO2021025119A1/ja active Pending
2023
- 2023-12-27 JP JP2023220760A patent/JP7666576B2/en active Active
2025
- 2025-04-04 JP JP2025062332A patent/JP2025106404A/en active Pending

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10207535A1 (en) *	2002-02-22	2003-09-11	Zeiss Carl	Device for machining and measurement of an object using laser ablation comprises a radiation source, circuit and guiding elements and has a simple design that enables simple handling
US20160039045A1 (en) *	2013-03-13	2016-02-11	Queen's University At Kingston	Methods and Systems for Characterizing Laser Machining Properties by Measuring Keyhole Dynamics Using Interferometry
JP2016048188A (en) *	2014-08-27	2016-04-07	国立大学法人電気通信大学	Distance measuring device
DE102016001661B3 (en) *	2016-02-12	2017-04-13	Lessmüller Lasertechnik GmbH	Measuring device and method for determining a relative inclination of a workpiece by means of optical coherence tomography during processing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021025119A1 *

Also Published As

Publication number	Publication date
JPWO2021025119A1 (en)	2021-02-11
US20220355412A1 (en)	2022-11-10
CN114206538B (en)	2024-07-19
WO2021024480A1 (en)	2021-02-11
JP7666576B2 (en)	2025-04-22
JP2024045133A (en)	2024-04-02
TW202115975A (en)	2021-04-16
WO2021025119A1 (en)	2021-02-11
CN114206538A (en)	2022-03-18
JP2025106404A (en)	2025-07-15
EP4011542A1 (en)	2022-06-15
CN118595591A (en)	2024-09-06
JPWO2021024480A1 (en)	2021-02-11
JP7416069B2 (en)	2024-01-17
CN118635656A (en)	2024-09-13

Publication	Publication Date	Title
DK3582514T3 (en)	2023-03-06	SOUND PROCESSING DEVICE
EP3855384C0 (en)	2024-05-01	INFORMATION PROCESSING DEVICE
EP4011542A4 (en)	2023-09-20	PROCESSING DEVICE
EP3866101A4 (en)	2021-10-20	INFORMATION PROCESSING DEVICE
DK3930878T3 (en)	2025-08-25	CROSS-FILTERING DEVICE
EP4036334A4 (en)	2023-12-06	DETERMINATION DEVICE
EP3984061A4 (en)	2023-08-16	SUBSTRATE PROCESSING DEVICE
EP3904161A4 (en)	2022-09-07	INFORMATION PROCESSING DEVICE
EP3741839C0 (en)	2024-03-20	REACTION PROCESSING DEVICE
TWI799472B (en)	2023-04-21	processing device
PL3773144T3 (en)	2024-02-26	OPHTHOLOGICAL DEVICE
DK4008500T3 (en)	2023-03-13	Processing device
KR102670124B9 (en)	2024-12-20	Substrate processing device
LT4021677T (en)	2024-12-27	LASER PROCESSING DEVICE
EP4027106A4 (en)	2023-09-06	IMAGE PROCESSING DEVICE
EP3806573A4 (en)	2021-08-04	INFORMATION PROCESSING DEVICE
KR102535194B9 (en)	2024-12-20	Substrate processing device
EP3858534A4 (en)	2022-05-04	LASER PROCESSING DEVICE
TWI800128B (en)	2023-04-21	Processing device
EP3964278A4 (en)	2022-07-20	EXHAUST PROCESSING DEVICE
EP3907789A4 (en)	2022-04-20	PRELITHIATION DEVICE
EP4163047A4 (en)	2024-03-13	PROCESSING DEVICE
EP3785872A4 (en)	2021-12-22	SCRING DEVICE
KR102599410B9 (en)	2024-12-20	Substrate processing device
KR102461199B9 (en)	2024-12-20	Substrate processing device

Legal Events

Date	Code	Title	Description
2021-02-12	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2022-05-13	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2022-05-13	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2022-06-15	17P	Request for examination filed	Effective date: 20220225
2022-06-15	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2022-11-16	DAV	Request for validation of the european patent (deleted)
2022-11-16	DAX	Request for extension of the european patent (deleted)
2022-11-16	RIN1	Information on inventor provided before grant (corrected)	Inventor name: SATO, SHINJI
2023-06-21	P01	Opt-out of the competence of the unified patent court (upc) registered	Effective date: 20230517
2023-09-20	A4	Supplementary search report drawn up and despatched	Effective date: 20230818
2023-09-20	RIC1	Information provided on ipc code assigned before grant	Ipc: B23K 26/08 20140101ALI20230811BHEP Ipc: B23K 26/00 20140101AFI20230811BHEP