EP4083139A4 - THERMALLY CONDUCTIVE SILICONE COMPOSITION - Google Patents
THERMALLY CONDUCTIVE SILICONE COMPOSITION Download PDFInfo
- Publication number
- EP4083139A4 EP4083139A4 EP20905400.6A EP20905400A EP4083139A4 EP 4083139 A4 EP4083139 A4 EP 4083139A4 EP 20905400 A EP20905400 A EP 20905400A EP 4083139 A4 EP4083139 A4 EP 4083139A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thermally conductive
- silicone composition
- conductive silicone
- composition
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019231199A JP7325324B2 (en) | 2019-12-23 | 2019-12-23 | Thermally conductive silicone composition |
| PCT/JP2020/037190 WO2021131212A1 (en) | 2019-12-23 | 2020-09-30 | Heat-conductive silicone composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP4083139A1 EP4083139A1 (en) | 2022-11-02 |
| EP4083139A4 true EP4083139A4 (en) | 2024-07-10 |
Family
ID=76540869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20905400.6A Pending EP4083139A4 (en) | 2019-12-23 | 2020-09-30 | THERMALLY CONDUCTIVE SILICONE COMPOSITION |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12391860B2 (en) |
| EP (1) | EP4083139A4 (en) |
| JP (1) | JP7325324B2 (en) |
| KR (1) | KR102860043B1 (en) |
| CN (1) | CN114846084A (en) |
| TW (1) | TW202126752A (en) |
| WO (1) | WO2021131212A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3831908A1 (en) * | 2018-08-01 | 2021-06-09 | Shin-Etsu Chemical Co., Ltd. | Silicone adhesive agent composition, and adhesive tape or adhesive film using same |
| JP7562490B2 (en) * | 2021-08-16 | 2024-10-07 | 信越化学工業株式会社 | Thermally conductive silicone composition |
| US20250115784A1 (en) * | 2022-02-02 | 2025-04-10 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition and production method therefor |
| JPWO2024024498A1 (en) * | 2022-07-29 | 2024-02-01 | ||
| JP7771898B2 (en) * | 2022-09-02 | 2025-11-18 | 信越化学工業株式会社 | Thermally conductive silicone composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3489305A1 (en) * | 2016-07-22 | 2019-05-29 | Momentive Performance Materials Japan LLC | Thermally conductive polysiloxane composition |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933094B1 (en) | 1968-12-31 | 1974-09-04 | ||
| JPS4913874B1 (en) | 1969-08-29 | 1974-04-03 | ||
| JPS4917380B1 (en) | 1970-07-06 | 1974-04-30 | ||
| JPS58366B2 (en) | 1973-10-06 | 1983-01-06 | ソニー株式会社 | Surface material attachment method |
| JPS58366A (en) | 1981-06-23 | 1983-01-05 | Nippon Steel Corp | Detection of sand burning of continuous casting steel in mold |
| JP2938428B1 (en) | 1998-02-27 | 1999-08-23 | 信越化学工業株式会社 | Thermal conductive grease composition |
| JP2938429B1 (en) | 1998-02-27 | 1999-08-23 | 信越化学工業株式会社 | Thermal conductive silicone composition |
| JP3836320B2 (en) | 2000-12-19 | 2006-10-25 | ジーイー東芝シリコーン株式会社 | Addition reaction curable polyorganosiloxane composition |
| JP4796704B2 (en) * | 2001-03-30 | 2011-10-19 | 株式会社タイカ | Manufacturing method of containers filled and sealed with extrudable grease-like heat dissipation material |
| JP3580366B2 (en) | 2001-05-01 | 2004-10-20 | 信越化学工業株式会社 | Thermal conductive silicone composition and semiconductor device |
| JP3952184B2 (en) | 2002-10-10 | 2007-08-01 | 信越化学工業株式会社 | Thermally conductive sheet |
| JP4933094B2 (en) | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| EP1878767A1 (en) | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
| JP4917380B2 (en) | 2006-07-31 | 2012-04-18 | 信越化学工業株式会社 | Silicone grease composition for heat dissipation and method for producing the same |
| JP5283346B2 (en) | 2007-04-10 | 2013-09-04 | 信越化学工業株式会社 | Thermally conductive cured product and method for producing the same |
| JP5233325B2 (en) | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | Thermally conductive cured product and method for producing the same |
| JP4656340B2 (en) | 2008-03-03 | 2011-03-23 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
| JP4572243B2 (en) | 2008-03-27 | 2010-11-04 | 信越化学工業株式会社 | Thermally conductive laminate and method for producing the same |
| CA2770719C (en) * | 2009-08-12 | 2017-12-12 | Jonathan Bergin | Fully-cured thermally or electrically-conductive form-in-place gap filler |
| JP4913874B2 (en) | 2010-01-18 | 2012-04-11 | 信越化学工業株式会社 | Curable organopolysiloxane composition and semiconductor device |
| JP5365572B2 (en) | 2010-04-13 | 2013-12-11 | 信越化学工業株式会社 | Room temperature moisture thickening type thermally conductive silicone grease composition |
| JP5783128B2 (en) * | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | Heat curing type heat conductive silicone grease composition |
| JP5832983B2 (en) | 2012-10-18 | 2015-12-16 | 信越化学工業株式会社 | Silicone composition |
| CN104854176B (en) * | 2012-12-20 | 2017-06-06 | 道康宁公司 | Curable silicone compositions, conductive silicone adhesives, methods of making and using them, and electrical devices incorporating them |
| JP5947267B2 (en) | 2013-09-20 | 2016-07-06 | 信越化学工業株式会社 | Silicone composition and method for producing thermally conductive silicone composition |
| JP6261287B2 (en) | 2013-11-05 | 2018-01-17 | 東京エレクトロン株式会社 | Plasma processing equipment |
| US10150902B2 (en) | 2014-04-09 | 2018-12-11 | Dow Corning Toray Co., Ltd. | Thermally conductive silicone composition and electrical/electronic apparatus |
| US20180161266A1 (en) * | 2015-09-02 | 2018-06-14 | Dow Corning Corporation | Silicones for heat protection |
| US20190002694A1 (en) * | 2016-03-18 | 2019-01-03 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition and semiconductor device |
| JP6708005B2 (en) | 2016-06-20 | 2020-06-10 | 信越化学工業株式会社 | Thermally conductive silicone putty composition |
| WO2018150806A1 (en) * | 2017-02-17 | 2018-08-23 | 東レ・ダウコーニング株式会社 | Oil mist inhibitor, lubricant containing same, and oil mist reduction method |
| CN110291848B (en) | 2017-03-22 | 2022-09-02 | 电化株式会社 | Resin composition for circuit board and metal-base circuit board using same |
| JP6769384B2 (en) | 2017-04-17 | 2020-10-14 | 信越化学工業株式会社 | Thermally conductive silicone grease composition and its cured product |
| JP6959950B2 (en) * | 2019-03-04 | 2021-11-05 | 信越化学工業株式会社 | Non-curable thermally conductive silicone composition |
| EP3950845A4 (en) * | 2019-03-29 | 2023-01-25 | Dow Toray Co., Ltd. | CURING SILICONE COMPOSITION, CURED PRODUCT BASED THEREOF AND METHOD FOR PRODUCTION |
| JP7027368B2 (en) * | 2019-04-01 | 2022-03-01 | 信越化学工業株式会社 | Thermally conductive silicone composition, its manufacturing method and semiconductor device |
| WO2020241369A1 (en) * | 2019-05-31 | 2020-12-03 | ダウ・東レ株式会社 | Curable organopolysiloxane composition, and optical member formed from cured product of same |
| CN113993956B (en) * | 2019-05-31 | 2023-11-07 | 陶氏东丽株式会社 | Curable polyorganosiloxane composition and optical member formed from cured product of the curable polyorganosiloxane composition |
| CN114641538B (en) * | 2019-10-24 | 2023-10-31 | 信越化学工业株式会社 | Thermal conductive silicone composition and manufacturing method thereof |
| JP7606439B2 (en) * | 2021-10-19 | 2024-12-25 | 信越化学工業株式会社 | Thermally conductive silicone composition |
-
2019
- 2019-12-23 JP JP2019231199A patent/JP7325324B2/en active Active
-
2020
- 2020-09-30 EP EP20905400.6A patent/EP4083139A4/en active Pending
- 2020-09-30 US US17/786,665 patent/US12391860B2/en active Active
- 2020-09-30 CN CN202080089488.3A patent/CN114846084A/en not_active Withdrawn
- 2020-09-30 WO PCT/JP2020/037190 patent/WO2021131212A1/en not_active Ceased
- 2020-09-30 KR KR1020227020863A patent/KR102860043B1/en active Active
- 2020-10-14 TW TW109135419A patent/TW202126752A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3489305A1 (en) * | 2016-07-22 | 2019-05-29 | Momentive Performance Materials Japan LLC | Thermally conductive polysiloxane composition |
Also Published As
| Publication number | Publication date |
|---|---|
| US12391860B2 (en) | 2025-08-19 |
| TW202126752A (en) | 2021-07-16 |
| US20230053865A1 (en) | 2023-02-23 |
| KR20220121805A (en) | 2022-09-01 |
| JP7325324B2 (en) | 2023-08-14 |
| CN114846084A (en) | 2022-08-02 |
| EP4083139A1 (en) | 2022-11-02 |
| JP2021098804A (en) | 2021-07-01 |
| KR102860043B1 (en) | 2025-09-15 |
| WO2021131212A1 (en) | 2021-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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| 17P | Request for examination filed |
Effective date: 20220620 |
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| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20240606 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/36 20060101ALI20240531BHEP Ipc: C08L 83/06 20060101ALI20240531BHEP Ipc: C08L 83/05 20060101ALI20240531BHEP Ipc: C08K 3/28 20060101ALI20240531BHEP Ipc: C08L 83/07 20060101AFI20240531BHEP |