[go: up one dir, main page]

EP4083139A4 - THERMALLY CONDUCTIVE SILICONE COMPOSITION - Google Patents

THERMALLY CONDUCTIVE SILICONE COMPOSITION Download PDF

Info

Publication number
EP4083139A4
EP4083139A4 EP20905400.6A EP20905400A EP4083139A4 EP 4083139 A4 EP4083139 A4 EP 4083139A4 EP 20905400 A EP20905400 A EP 20905400A EP 4083139 A4 EP4083139 A4 EP 4083139A4
Authority
EP
European Patent Office
Prior art keywords
thermally conductive
silicone composition
conductive silicone
composition
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20905400.6A
Other languages
German (de)
French (fr)
Other versions
EP4083139A1 (en
Inventor
Keita Kitazawa
Wataru Toya
Ayako Yamaguchi
Koji Nakanishi
Ryo Miyazaki
Masataka Deguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP4083139A1 publication Critical patent/EP4083139A1/en
Publication of EP4083139A4 publication Critical patent/EP4083139A4/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP20905400.6A 2019-12-23 2020-09-30 THERMALLY CONDUCTIVE SILICONE COMPOSITION Pending EP4083139A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019231199A JP7325324B2 (en) 2019-12-23 2019-12-23 Thermally conductive silicone composition
PCT/JP2020/037190 WO2021131212A1 (en) 2019-12-23 2020-09-30 Heat-conductive silicone composition

Publications (2)

Publication Number Publication Date
EP4083139A1 EP4083139A1 (en) 2022-11-02
EP4083139A4 true EP4083139A4 (en) 2024-07-10

Family

ID=76540869

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20905400.6A Pending EP4083139A4 (en) 2019-12-23 2020-09-30 THERMALLY CONDUCTIVE SILICONE COMPOSITION

Country Status (7)

Country Link
US (1) US12391860B2 (en)
EP (1) EP4083139A4 (en)
JP (1) JP7325324B2 (en)
KR (1) KR102860043B1 (en)
CN (1) CN114846084A (en)
TW (1) TW202126752A (en)
WO (1) WO2021131212A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3831908A1 (en) * 2018-08-01 2021-06-09 Shin-Etsu Chemical Co., Ltd. Silicone adhesive agent composition, and adhesive tape or adhesive film using same
JP7562490B2 (en) * 2021-08-16 2024-10-07 信越化学工業株式会社 Thermally conductive silicone composition
US20250115784A1 (en) * 2022-02-02 2025-04-10 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition and production method therefor
JPWO2024024498A1 (en) * 2022-07-29 2024-02-01
JP7771898B2 (en) * 2022-09-02 2025-11-18 信越化学工業株式会社 Thermally conductive silicone composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3489305A1 (en) * 2016-07-22 2019-05-29 Momentive Performance Materials Japan LLC Thermally conductive polysiloxane composition

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933094B1 (en) 1968-12-31 1974-09-04
JPS4913874B1 (en) 1969-08-29 1974-04-03
JPS4917380B1 (en) 1970-07-06 1974-04-30
JPS58366B2 (en) 1973-10-06 1983-01-06 ソニー株式会社 Surface material attachment method
JPS58366A (en) 1981-06-23 1983-01-05 Nippon Steel Corp Detection of sand burning of continuous casting steel in mold
JP2938428B1 (en) 1998-02-27 1999-08-23 信越化学工業株式会社 Thermal conductive grease composition
JP2938429B1 (en) 1998-02-27 1999-08-23 信越化学工業株式会社 Thermal conductive silicone composition
JP3836320B2 (en) 2000-12-19 2006-10-25 ジーイー東芝シリコーン株式会社 Addition reaction curable polyorganosiloxane composition
JP4796704B2 (en) * 2001-03-30 2011-10-19 株式会社タイカ Manufacturing method of containers filled and sealed with extrudable grease-like heat dissipation material
JP3580366B2 (en) 2001-05-01 2004-10-20 信越化学工業株式会社 Thermal conductive silicone composition and semiconductor device
JP3952184B2 (en) 2002-10-10 2007-08-01 信越化学工業株式会社 Thermally conductive sheet
JP4933094B2 (en) 2005-12-27 2012-05-16 信越化学工業株式会社 Thermally conductive silicone grease composition
EP1878767A1 (en) 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
JP4917380B2 (en) 2006-07-31 2012-04-18 信越化学工業株式会社 Silicone grease composition for heat dissipation and method for producing the same
JP5283346B2 (en) 2007-04-10 2013-09-04 信越化学工業株式会社 Thermally conductive cured product and method for producing the same
JP5233325B2 (en) 2008-02-29 2013-07-10 信越化学工業株式会社 Thermally conductive cured product and method for producing the same
JP4656340B2 (en) 2008-03-03 2011-03-23 信越化学工業株式会社 Thermally conductive silicone grease composition
JP4572243B2 (en) 2008-03-27 2010-11-04 信越化学工業株式会社 Thermally conductive laminate and method for producing the same
CA2770719C (en) * 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
JP4913874B2 (en) 2010-01-18 2012-04-11 信越化学工業株式会社 Curable organopolysiloxane composition and semiconductor device
JP5365572B2 (en) 2010-04-13 2013-12-11 信越化学工業株式会社 Room temperature moisture thickening type thermally conductive silicone grease composition
JP5783128B2 (en) * 2012-04-24 2015-09-24 信越化学工業株式会社 Heat curing type heat conductive silicone grease composition
JP5832983B2 (en) 2012-10-18 2015-12-16 信越化学工業株式会社 Silicone composition
CN104854176B (en) * 2012-12-20 2017-06-06 道康宁公司 Curable silicone compositions, conductive silicone adhesives, methods of making and using them, and electrical devices incorporating them
JP5947267B2 (en) 2013-09-20 2016-07-06 信越化学工業株式会社 Silicone composition and method for producing thermally conductive silicone composition
JP6261287B2 (en) 2013-11-05 2018-01-17 東京エレクトロン株式会社 Plasma processing equipment
US10150902B2 (en) 2014-04-09 2018-12-11 Dow Corning Toray Co., Ltd. Thermally conductive silicone composition and electrical/electronic apparatus
US20180161266A1 (en) * 2015-09-02 2018-06-14 Dow Corning Corporation Silicones for heat protection
US20190002694A1 (en) * 2016-03-18 2019-01-03 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition and semiconductor device
JP6708005B2 (en) 2016-06-20 2020-06-10 信越化学工業株式会社 Thermally conductive silicone putty composition
WO2018150806A1 (en) * 2017-02-17 2018-08-23 東レ・ダウコーニング株式会社 Oil mist inhibitor, lubricant containing same, and oil mist reduction method
CN110291848B (en) 2017-03-22 2022-09-02 电化株式会社 Resin composition for circuit board and metal-base circuit board using same
JP6769384B2 (en) 2017-04-17 2020-10-14 信越化学工業株式会社 Thermally conductive silicone grease composition and its cured product
JP6959950B2 (en) * 2019-03-04 2021-11-05 信越化学工業株式会社 Non-curable thermally conductive silicone composition
EP3950845A4 (en) * 2019-03-29 2023-01-25 Dow Toray Co., Ltd. CURING SILICONE COMPOSITION, CURED PRODUCT BASED THEREOF AND METHOD FOR PRODUCTION
JP7027368B2 (en) * 2019-04-01 2022-03-01 信越化学工業株式会社 Thermally conductive silicone composition, its manufacturing method and semiconductor device
WO2020241369A1 (en) * 2019-05-31 2020-12-03 ダウ・東レ株式会社 Curable organopolysiloxane composition, and optical member formed from cured product of same
CN113993956B (en) * 2019-05-31 2023-11-07 陶氏东丽株式会社 Curable polyorganosiloxane composition and optical member formed from cured product of the curable polyorganosiloxane composition
CN114641538B (en) * 2019-10-24 2023-10-31 信越化学工业株式会社 Thermal conductive silicone composition and manufacturing method thereof
JP7606439B2 (en) * 2021-10-19 2024-12-25 信越化学工業株式会社 Thermally conductive silicone composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3489305A1 (en) * 2016-07-22 2019-05-29 Momentive Performance Materials Japan LLC Thermally conductive polysiloxane composition

Also Published As

Publication number Publication date
US12391860B2 (en) 2025-08-19
TW202126752A (en) 2021-07-16
US20230053865A1 (en) 2023-02-23
KR20220121805A (en) 2022-09-01
JP7325324B2 (en) 2023-08-14
CN114846084A (en) 2022-08-02
EP4083139A1 (en) 2022-11-02
JP2021098804A (en) 2021-07-01
KR102860043B1 (en) 2025-09-15
WO2021131212A1 (en) 2021-07-01

Similar Documents

Publication Publication Date Title
EP3953420A4 (en) THERMALLY CONDUCTIVE SILICONE POTING COMPOSITION
EP3530702A4 (en) THERMALLY CONDUCTIVE SILICONE COMPOSITION
EP3708613A4 (en) THERMAL CONDUCTIVE SILICONE LUBRICATING COMPOSITION
EP3992250A4 (en) THERMALLY CONDUCTIVE POLYSILOXA COMPOSITION
EP3489305A4 (en) THERMAL CONDUCTIVE POLYSILOXANE COMPOSITION
EP3632987A4 (en) THERMAL CONDUCTIVE POLYSILOXANE COMPOSITION
EP3741810A4 (en) SILICONE COMPOSITION
EP3575365A4 (en) THERMAL CONDUCTIVE POLYORGANOSILOXANE COMPOSITION
EP4083139A4 (en) THERMALLY CONDUCTIVE SILICONE COMPOSITION
EP3688069A4 (en) SILICONE COMPOSITIONS
EP3584285A4 (en) ADDITION HARDENED SILICONE COMPOSITION
EP3533839A4 (en) THERMALLY CONDUCTIVE SILICONE COMPOSITION
EP3882323A4 (en) COMPOSITION
DK3700978T3 (en) POLYSILOXANE COMPOSITION
IL281992B (en) High temperature conductive magnet
EP4137544A4 (en) THERMALLY CONDUCTIVE SILICONE COMPOSITION
EP4082970A4 (en) THERMALLY CONDUCTIVE SILICONE RESIN COMPOSITION
EP3817914A4 (en) CURING SILICONE COMPOSITION
EP3910026A4 (en) THERMOCONDUCTIVE SILICONE COMPOSITION
DK3801656T3 (en) Skin compatible silicone composition
DK3796358T3 (en) Temperature dependent switch
EP4119615A4 (en) THERMALLY CONDUCTIVE COMPOSITION
DK3840596T3 (en) COMPOSITION
EP3897866C0 (en) ANTIMMICROBIAL COMPOSITION
DK3828912T3 (en) TEMPERATURE DEPENDENT SWITCH

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220620

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20240606

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/36 20060101ALI20240531BHEP

Ipc: C08L 83/06 20060101ALI20240531BHEP

Ipc: C08L 83/05 20060101ALI20240531BHEP

Ipc: C08K 3/28 20060101ALI20240531BHEP

Ipc: C08L 83/07 20060101AFI20240531BHEP