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EP4044220A4 - Feuille composite et son procédé de fabrication, et stratifié et son procédé de fabrication - Google Patents

Feuille composite et son procédé de fabrication, et stratifié et son procédé de fabrication Download PDF

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Publication number
EP4044220A4
EP4044220A4 EP20879180.6A EP20879180A EP4044220A4 EP 4044220 A4 EP4044220 A4 EP 4044220A4 EP 20879180 A EP20879180 A EP 20879180A EP 4044220 A4 EP4044220 A4 EP 4044220A4
Authority
EP
European Patent Office
Prior art keywords
making
laminate
composite sheet
composite
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20879180.6A
Other languages
German (de)
English (en)
Other versions
EP4044220B1 (fr
EP4044220A1 (fr
Inventor
Yoshitaka MINAKATA
Tomoya Yamaguchi
Saori INOUE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of EP4044220A1 publication Critical patent/EP4044220A1/fr
Publication of EP4044220A4 publication Critical patent/EP4044220A4/fr
Application granted granted Critical
Publication of EP4044220B1 publication Critical patent/EP4044220B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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    • C08J5/18—Manufacture of films or sheets
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    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K7/24—Expanded, porous or hollow particles inorganic

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EP20879180.6A 2019-10-23 2020-10-21 Feuille composite et son procédé de fabrication, et stratifié et son procédé de fabrication Active EP4044220B1 (fr)

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CN116097431A (zh) * 2020-09-29 2023-05-09 电化株式会社 复合片材及其制造方法、以及层叠体及其制造方法
EP4207267A4 (fr) * 2020-09-29 2024-05-15 Denka Company Limited Feuille composite, stratifié et procédé d'évaluation pour estimer l'adhésivité d'une feuille composite
JP2023042918A (ja) * 2021-09-15 2023-03-28 デンカ株式会社 半硬化物複合体の製造方法、硬化物複合体の製造方法、及び半硬化物複合体

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JPH0891960A (ja) * 1994-09-16 1996-04-09 Toshiba Corp 回路基板用基材
JP3518109B2 (ja) * 1994-11-30 2004-04-12 三菱瓦斯化学株式会社 金属箔張複合セラミックス板及びその製造法
JP2003037382A (ja) * 2001-07-25 2003-02-07 Mitsubishi Gas Chem Co Inc 熱伝導性接着シート
JP2006206393A (ja) * 2005-01-28 2006-08-10 Mitsui Chemicals Inc 球状窒化アルミニウム焼結粉およびその製造方法並びにその用途
JP2007173338A (ja) * 2005-12-20 2007-07-05 Mitsubishi Gas Chem Co Inc 高熱伝導性接着シート及びその使用方法
JP5465874B2 (ja) * 2008-12-25 2014-04-09 タツタ電線株式会社 銅ボンディングワイヤの製造方法および該製造方法を用いた銅ボンディングワイヤ
JP2010153538A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd 放熱材料とその製法
JP5340202B2 (ja) * 2010-02-23 2013-11-13 三菱電機株式会社 熱硬化性樹脂組成物、ｂステージ熱伝導性シート及びパワーモジュール
JP6351585B2 (ja) * 2013-06-03 2018-07-04 デンカ株式会社 樹脂含浸窒化ホウ素焼結体およびその用途
JP6189822B2 (ja) 2014-11-28 2017-08-30 デンカ株式会社 窒化ホウ素樹脂複合体回路基板
KR102306153B1 (ko) * 2016-03-10 2021-09-27 덴카 주식회사 세라믹 수지 복합체
KR102438540B1 (ko) * 2017-03-29 2022-08-30 덴카 주식회사 전열 부재 및 이것을 포함하는 방열 구조체

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EP4044220B1 (fr) 2024-02-21
EP4044220A1 (fr) 2022-08-17
US11912011B2 (en) 2024-02-27
CN114466899B (zh) 2024-11-12
WO2021079918A1 (fr) 2021-04-29
US20220410530A1 (en) 2022-12-29
JPWO2021079918A1 (fr) 2021-04-29
CN114466899A (zh) 2022-05-10

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