EP3977492A4 - SURFACE MOUNTED MAGNETIC COMPONENT MODULE - Google Patents

SURFACE MOUNTED MAGNETIC COMPONENT MODULE Download PDF

Info

Publication number: EP3977492A4
Authority: EP; European Patent Office
Prior art keywords: magnetic component; surface mounted; component module; mounted magnetic; module
Prior art date: 2019-07-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

EP20836917.3A

Other languages

German (de)

French (fr)

Other versions

EP3977492A1 (en

Inventor

Lee Francis

William Jarvis

Takayuki TANGE

Scott Parish

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Murata Manufacturing Co Ltd

Original Assignee

Murata Manufacturing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-07-09

Filing date

2020-07-09

Publication date

2022-08-10

2020-07-09 Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd

2022-04-06 Publication of EP3977492A1 publication Critical patent/EP3977492A1/en

2022-08-10 Publication of EP3977492A4 publication Critical patent/EP3977492A4/en

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2895—Windings disposed upon ring cores
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Coils Or Transformers For Communication (AREA)

EP20836917.3A 2019-07-09 2020-07-09 SURFACE MOUNTED MAGNETIC COMPONENT MODULE Pending EP3977492A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201962871847P	2019-07-09	2019-07-09
PCT/US2020/041351 WO2021007404A1 (en)	2019-07-09	2020-07-09	Surface-mounted magnetic-component module

Publications (2)

Publication Number	Publication Date
EP3977492A1 EP3977492A1 (en)	2022-04-06
EP3977492A4 true EP3977492A4 (en)	2022-08-10

Family

ID=74114991

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20836917.3A Pending EP3977492A4 (en)	2019-07-09	2020-07-09	SURFACE MOUNTED MAGNETIC COMPONENT MODULE

Country Status (3)

Country	Link
EP (1)	EP3977492A4 (en)
CN (1)	CN114097049B (en)
WO (1)	WO2021007404A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20250182948A1 (en) *	2023-11-30	2025-06-05	Allegro Microsystems, Llc	Leadless transformer packages

Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4524342A (en) *	1981-12-28	1985-06-18	Allied Corporation	Toroidal core electromagnetic device
US20070290783A1 (en) *	2004-12-07	2007-12-20	Multi-Fineline Electronix, Inc.	Miniature circuitry and inductive components and methods for manufacturing same
WO2011149523A1 (en) *	2010-05-26	2011-12-01	Tyco Electronics Corporation	Planar inductor devices
US20110291785A1 (en) *	2010-05-27	2011-12-01	Advanced Semiconductor Engineering, Inc.	Power inductor structure
US20140085033A1 (en) *	2012-12-03	2014-03-27	Shanghai Zhuo Kai Electronic Technology Co., Ltd	Planar magnetic component and method for manufacturing the same
WO2016100987A1 (en) *	2014-12-19	2016-06-23	Texas Instruments Incorporated	Embedded coil assembly and production method
WO2016100988A1 (en) *	2014-12-19	2016-06-23	Texas Instruments Incorporated	Embedded coil assembly and method of making
US20170222563A1 (en) *	2014-11-12	2017-08-03	Murata Manufacturing Co., Ltd.	Power supply module and mounting structure therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH097844A (en) *	1995-06-15	1997-01-10	Murata Mfg Co Ltd	Composite component and dc-dc converter using that
JP4030028B2 (en) *	1996-12-26	2008-01-09	シチズン電子株式会社	SMD type circuit device and manufacturing method thereof
JP4910826B2 (en) *	2007-03-28	2012-04-04	Ｆｄｋ株式会社	Winding parts
US7868431B2 (en) *	2007-11-23	2011-01-11	Alpha And Omega Semiconductor Incorporated	Compact power semiconductor package and method with stacked inductor and integrated circuit die
CN101587769A (en) *	2008-05-21	2009-11-25	台达电子工业股份有限公司	Magnetic element
US7982572B2 (en) *	2008-07-17	2011-07-19	Pulse Engineering, Inc.	Substrate inductive devices and methods
CN101814485B (en) *	2009-02-23	2012-08-22	万国半导体股份有限公司	Packaging and fabricating method for mini power semiconductor with stacked inductance IC chip
CN103367331B (en) *	2012-03-27	2016-12-14	南亚科技股份有限公司	Package structure
DE102012216101B4 (en) *	2012-09-12	2016-03-24	Festo Ag & Co. Kg	Method for producing a coil integrated in a substrate, method for producing a multilayer printed circuit board and electronic device
CN103021889A (en) *	2012-12-17	2013-04-03	北京工业大学	Manufacture method of once-again wiring AAQFN packaging devices
CN203536199U (en) *	2013-09-26	2014-04-09	特通科技有限公司	Gold wire type transformer structure
CN103915235A (en) *	2014-03-21	2014-07-09	华为技术有限公司	Planar magnetic element and manufacturing method thereof
CN208570297U (en) *	2018-04-29	2019-03-01	深南电路股份有限公司	Transformer and electromagnetic device

2020
- 2020-07-09 EP EP20836917.3A patent/EP3977492A4/en active Pending
- 2020-07-09 CN CN202080049986.5A patent/CN114097049B/en active Active
- 2020-07-09 WO PCT/US2020/041351 patent/WO2021007404A1/en not_active Ceased

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4524342A (en) *	1981-12-28	1985-06-18	Allied Corporation	Toroidal core electromagnetic device
US20070290783A1 (en) *	2004-12-07	2007-12-20	Multi-Fineline Electronix, Inc.	Miniature circuitry and inductive components and methods for manufacturing same
WO2011149523A1 (en) *	2010-05-26	2011-12-01	Tyco Electronics Corporation	Planar inductor devices
US20110291785A1 (en) *	2010-05-27	2011-12-01	Advanced Semiconductor Engineering, Inc.	Power inductor structure
US20140085033A1 (en) *	2012-12-03	2014-03-27	Shanghai Zhuo Kai Electronic Technology Co., Ltd	Planar magnetic component and method for manufacturing the same
US20170222563A1 (en) *	2014-11-12	2017-08-03	Murata Manufacturing Co., Ltd.	Power supply module and mounting structure therefor
WO2016100987A1 (en) *	2014-12-19	2016-06-23	Texas Instruments Incorporated	Embedded coil assembly and production method
WO2016100988A1 (en) *	2014-12-19	2016-06-23	Texas Instruments Incorporated	Embedded coil assembly and method of making

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021007404A1 *

Also Published As

Publication number	Publication date
WO2021007404A1 (en)	2021-01-14
CN114097049A (en)	2022-02-25
CN114097049B (en)	2025-04-22
EP3977492A1 (en)	2022-04-06

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DK3575617T3 (en)	2021-06-07	MOUNTING KIT
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EP3683811C0 (en)	2025-06-25	INTEGRATED MAGNETIC COMPONENT
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EP3598856C0 (en)	2024-09-18	WIRING SUBSTRATE
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EP3812667A4 (en)	2022-03-23	MAGNETIC COOLING MODULE
EP3820263A4 (en)	2021-09-15	ELECTRONIC COMPONENT MODULE
EP3850168C0 (en)	2024-04-24	COMPONENT
EP3888920C0 (en)	2024-11-20	COMMUNICATED PRINTED COMPONENT
EP3753651A4 (en)	2021-12-15	MAGNETIC STRUCTURE
EP4046230A4 (en)	2024-04-10	ELECTRONIC ASSEMBLY
SG11202011684VA (en)	2021-01-28	Laser diode surface mounting structure
FR3040532B1 (en)	2017-10-13	SURFACE MOUNTING CHIP
EP4075598A4 (en)	2023-12-27	ANTENNA MODULE
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EP3829866A4 (en)	2022-04-27	COMPONENT
EP3806614A4 (en)	2021-06-16	COMPONENT MOUNTING SYSTEM
EP3798135C0 (en)	2024-10-02	MOUNTING DEVICE
EP3977492A4 (en)	2022-08-10	SURFACE MOUNTED MAGNETIC COMPONENT MODULE
EP3897972C0 (en)	2024-10-02	LIGAND-LINKER SUBSTRATE
DE112020001972A5 (en)	2021-12-30	Optoelectronic semiconductor component

Legal Events

Date	Code	Title	Description
2021-01-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2022-03-04	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2022-03-04	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2022-04-06	17P	Request for examination filed	Effective date: 20211231
2022-04-06	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2022-08-10	A4	Supplementary search report drawn up and despatched	Effective date: 20220707
2022-08-10	RIC1	Information provided on ipc code assigned before grant	Ipc: H01F 27/06 20060101ALI20220701BHEP Ipc: H01F 27/02 20060101ALI20220701BHEP Ipc: H01F 27/28 20060101ALI20220701BHEP Ipc: H01F 17/06 20060101ALI20220701BHEP Ipc: H01F 27/26 20060101AFI20220701BHEP
2022-10-19	DAV	Request for validation of the european patent (deleted)
2022-10-19	DAX	Request for extension of the european patent (deleted)
2025-02-28	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2025-04-02	17Q	First examination report despatched	Effective date: 20250303