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EP3815127A2 - Reconfigurable sequentially-packed ion (spion) transfer device - Google Patents

Reconfigurable sequentially-packed ion (spion) transfer device

Info

Publication number
EP3815127A2
EP3815127A2 EP19816034.3A EP19816034A EP3815127A2 EP 3815127 A2 EP3815127 A2 EP 3815127A2 EP 19816034 A EP19816034 A EP 19816034A EP 3815127 A2 EP3815127 A2 EP 3815127A2
Authority
EP
European Patent Office
Prior art keywords
ion
transfer device
electrodes
ions
ion transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19816034.3A
Other languages
German (de)
French (fr)
Inventor
Mazdak Taghioskoui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trace Matters Scientific LLC
Original Assignee
Trace Matters Scientific LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trace Matters Scientific LLC filed Critical Trace Matters Scientific LLC
Publication of EP3815127A2 publication Critical patent/EP3815127A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00Particle spectrometers or separator tubes
    • H01J49/02Details
    • H01J49/04Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
    • H01J49/0404Capillaries used for transferring samples or ions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00Particle spectrometers or separator tubes
    • H01J49/02Details
    • H01J49/06Electron- or ion-optical arrangements
    • H01J49/062Ion guides

Definitions

  • the atent disclosure relates to ion transfer evice.
  • fe artiadsp the present disclosure ate to Im transfer device t»M k f!e ibfe or re- eonllgirrable and may be bent or e-oo fi ired from one shape to another shape while traMfemng i ns poduce ffero a sample in a first location using an ion. source (such as an ionization probe) to an ion analyzer (such ns a ass spectrometer or M ion mobility analyzer) in the second location.
  • Tie inns ma he transferred l: «sidc the fi ansfer evice in sc ne iaH - acke i on packets.
  • Mass spocraaietry en ion mobility speotrostiery are Malytfeal techfegues for chemical analysis to etect nd rdemify analytes of tetetm in wkm application*.
  • their applications and the variet of applications have Increased, However, their size still remains large, hindering their applications in poin of cate/aeticai/heed application*, w ere size and portability is limiting.
  • a mass spectrometer i eornpte syste compose of vaious com ponents as shown i n FIB.1.
  • the eritical coniponents of a typical mass s ectometer consist
  • the ess analyzer 4, which h 0 derived by volia e su ly systems 4 separates ions based on their m.3 ⁇ 4.
  • the date aaptsitiotv systems 8 receive the eleeirieal signal fro the detector 5, typically in the form of starte current ctr voltge and produce an ecto speem..
  • 1A shows sa ple introductfonfiooizefion block 1 outside t e vMwun regfofi, rothsatlon of te ples ay cceur in a wide range of ressures, iksm atmospheric resure to high vacuum.
  • the sample0 Itttrotfuchotfoontza ett ) Is attached to the «upifog relet 2
  • Mass spec o etes require high vacuu for proper operation because, iditeilly, ions oust travel inside a ass spectromete wit out colliding with background s efeute, The efore,, the vacuum in the ass .analysisr 4 of a mass spectrometer must be maintained at a pressure that correlates with ats mean5 path length longe (Meaty m folds) than the length of the ass analyzer.
  • the mesa free path L (in ro) is given by: lAkT/t2 peg where k h the B tmann a stent, T is the tem permute K i. p is the ress re (in Pa), so o is the coll ision cross-section Cm m*).
  • n a i3 ⁇ 4 45 c K) 3 ⁇ 4!
  • ESI dtwe p ent ofe!settospray lofoation
  • MALDI atrix-asisted laser esorptlosdloKieation
  • ESI sources are best suied for direct hfom !eeoks.
  • ESI may fteetiuts as a liquid sam le introdu ion syste ® (typically a
  • Lsrgernferoeter orifices may improve the efficiency of ion transfer but allow more neutrals to ertter tbs vaekrom region, tiros rciplrio lettr, higher- speed pomps to maintain the desired vacuum. Therefore, the pumpi ng cpacity of the vcuu system Indirectly determines the Ion transfer efficiency,b$mm the size an dimensi ns of the sampling; inlet must he designed saw ng to the u pin capacity of the vac u system.
  • Finding the right halsnce between the pumping capacity and the ion tra $tet efficiency is a ch&il egging design consl er ioo for ass, spectrometers if a limited pumping capacity Is available.
  • Various sampling mes niisms are developed to a dress the aboveutoMs challenges, such m the keoafmuaos ⁇ atmospheric rases® interface (DAM) and the pulse inhole atmospheric pressu interface (FP-AFl).
  • the couiauows atmospheric pressure interface enabl ed by diiisrenii al pumping i s another sampling mechanism ial uses »telksta ⁇ e vacuu pumps for differential pumping, to wide gra ual pressure re ued m. transport tons 3 ⁇ 4»n tmos heric pressure to high vacuum , The mu t to which the motion of tons may he control ted in different vacuum sta es det rmines the overall ism transmission effi iency of de mass s ectro ete Recently im founds have attracted significant interest in atmospheric pressure sampling in a tion to the e vmtttonl midtipole ion guides.
  • Ion funnels enable die manipuliaioa and fbeusrag uf ions in a pressureregime (0.01 to 3 Totr), providing mm peater km Pinsmiisaoo ei
  • loci funnels are located rght after heated ea l&ry inlets m a mass spectrometer.
  • Ion fu nels arc rigid structures that g ides iotas in mi -v&osum l ev of iOl to 30 Terr.
  • Mass t yoefs are the core «om stmt of mass speoltOte uts a d a typically ahteactorize by tfeek ass range and resolution.
  • esa range is the axi ummass resol able mass by the analyser.
  • Resolution is ms indicator of b w selective a ass ⁇ filter is In distinpi sfeittg tons with mf* that ere osein value.
  • Titus fer, vario s ass analyzers with different mechanisms have been developed. Genera! nmss s ectrometry handbooks povide detailed scriptions of various ass analyzers. Mass naly ers may be categorized into bea .analyzers, sued as gus mp te and TOP analyzers, and trapping analyzers* such as ion traps.
  • Faraday cu s so icro channel plate (MCF) detectors are the t o most widely used ion detectors in mass spectrometry.
  • Faraday cups may operate at high ressures (up to st ospbc c pressure), but are sensitive an are not compatible with highresdution mass spectrometry due to slow response ti es.
  • MCFs su ot high mass resolution* dynamic range*, and detection sensitivity.
  • a bient ioaiz ii desorption toefrn iss tts&y he u ed in homds d security to monito cargo and passengers at security shock points for ⁇ xpfosives.
  • Three iffeent sce arios have been use thus fhr for such appti cations.
  • the sa pl s are brught close to- a mass spectrometer for ionization anti analyses. Its. this approach, samples are directly place m froth of a mass spectromeler.
  • samples are ionizedusing an ion source that Is detached from a mass spectromete an tfte produced ions ere hmsf «d via the haretube 19 to a ass s ete setor f r analysis
  • Alt of t ose a proaches have tsa Mte m
  • placing a sample directly m front of a mass spectrometer may not he praef aj In many app!!eatb pmt ukriy when the mp! ⁇ is bulky r immobile.
  • One or more e bodi ents of to resent disclosure retoea to A flexible ion transfer e re tot may totoerions fern a is Ic to to a secon location, 3 ⁇ 4eb that to i3 ⁇ 4t location ay be n a roxi ity of w ere sa ples to be analysed are locate and the secon Joe&tto A hee a met spectrometer k located ass spectro eters are still bulk bet the growing demand of mass af»etromete« in oint tdocedCgir iohoa, such as e ical and.
  • the present disclos re aims to ovide on improvement over the sta ofThe-art by providing a flexible i trersfer de ice that ay he connecte between an ambient l o source (which ay bo cmstmcted as an application-specific or neai-purpose tooiaarion prebe) in first location and a ass s etro eter m a second location such to.t to ions produced by to ion source may be efficiently imt d to a mass spectrometer via the todbte ion h3 ⁇ 4osl device.
  • the tteible ion transfer devic provides an advantage tot m operator/urer may easily move to ⁇ m m M XMIK! the sa ple and ay pro uce tons for ass spectrometry anal
  • n i on transfer device transfers Ions from at least one ion into to at Imt mm Ion ootler o the too t nsfer device
  • an the ton transfer device includes an enclosure coni gored to Mai tain reduced pressure; sad a plurality of eiecOosles disposed at least in part inside the enclosure arch that the Ion transfer device is configure to be fl xible or raroonilprabk.
  • the ton transfer device is eontlgure to be bmi i1 ⁇ 4m two or more bend ash loro to form a plurality of airvaturas while actively and efffefendy transferring fee ions.
  • the pluralit of electrodes are flexibly co tracted to each other to make the too transfer device ⁇ -config rable while actively transferring th Ions from a ftrat location to a second lucauon.
  • dm i n transfer device Is emilguted; to be Smnsfeonabito between two or more different physical shapes, and the ion transfer deice Is e figntod to tansfer the loos in the two or ae difiereni hysios! shapes fimn t e at lest one o infef to the M mm e outlet
  • the reduced ressure In which « ion t nslfer device Is reclatafee st Is between 0,00! to 1 0 Tore
  • the Ion taesfer device is eHsasifigyrnfeie &ud !t sfo talde between at least a first ettofigunhfen and a second ct>nSgm3 ⁇ 4tfen such that the Ion transfer device, in the first e figu lon, trensfers Ions from a first location to a secon teeMiom an t e fen tansfer device, in the second configuration, transfers the Ions from the first location to a third location, the third location being different from she second location.
  • At least two of the plurality of deetfodes are eooflgnred to be flexibly Sadhed to each other asiug electrically mauJating aterial
  • a first group of electrodes include a first number of' she piutalty of electrodes arc abashed to s elt other In a ao -ffaiy e anner, a secon grou of -electrodes Including a scond number of the plurality of electrodes arc attache to each other in a noiwieaiMe tnanug and the first group of electrodes and the seco group of electrodes are a ire to smelt other m a il sibiiemauucFto allow bending of the first group of electrodes or the second group of efeettsefes crenn me or more ases with respect to eac other.
  • the plurality of electrodes are ring-shaped decirodes shat form art elongated ton funnel sttoch to: * the plurality of etoetrocte mo wiresn feel-osl form
  • RF voltage applied to each of tie plurality of deetftxfcs k ut of phase wi th toe E.F dhm a l ied to ajaoeat electrodes in one or mere embodiments, the PC vdfege esoses the fens to move axially rail to m axis of the km tmmfer evice, tod the IF voltage e oses too tons to move radially around the so s of the k® transfer device.
  • the too transfer devce is conect to an ion source that is eonttpred to he freely movable in 3-tometofeoto s e to bring it hi dose to a sample trader teat to roduce the ions from the sample trader teal.
  • Ion source configured to produce ions from a sample; at least one Ion transfer device having an enclosure, and a jpferaluv of etoefrotfcs dl spose at toast In et insMe too OTGIMIM such that the ion transfer evice; is configured to be flexible or re- configurable; and a trsum body having at least one analyser eotfe tod to soparaio the tm$ bae m mobility or mass to char e «do; an at least on detector configured to detect the separated Ions..
  • FIG, 1 A shows a Week diagram of a eonmonyonal ass spectr eter
  • FIG.1 B sho s a bl ck diagram of a coovemiood ass spectro sfer.
  • FIG.1C sho ws a bl ock diagram of a eonvemioal ass spectrometer mak that the im souce 1 ⁇ 2 detached from the tors grade and the fees are tr&nsferrod to to® guide of & mass s eetro eer via a bite trite
  • FIG, ID s e s a block: diagam of a ronventioml m ss spectro eter such that the sample is located at a distance from the too roraee an the tons arc i «si3 ⁇ 4tro to Ion source of a m ss sp;cttonteMt via a hare tribe.
  • FIG.2A shows a block dksgrsm of a mass spectrometry system each that the JGA source detached from the top guide an t he ions are eildeutly transferred to ion guide via a iteihfe or re-cofrilfsi ble ion transfer device aceordmsce with one or moe etiibitolments of the present lsdosure,
  • FIG.2B shows a blac diagram of a a s spectrometry syste swell that the too source to form of &n Ion soy roe probe is detached from the tort guid d the i mis arc eild ctttl y transferred to- the ion gui e vis a flexible or reroonfi rattle ton transfer device to accordance with oe or more embodiments of the present irotoswe,
  • FIG.2C shows a block diagram of a mass spedroraery system such that the ton mm® to detadfet! feotn the mass spectrometer md the toes pro uced to.
  • mi kxtfcatien grob ⁇ are ell etffiy tsoostkrod to tie n»s s ea&ro -eter v a ftaifle orr ⁇ eoafi centreele k3 ⁇ 4n transfer deice 3 ⁇ 4 accordance with one or ore embodiments o the presort disclosure,
  • FIG.2D sho s a block diagram of a mass speeiro etsr such that the ion sooree detached torn the mass spectrometer anil the i ns produce lom iqn robe Me efildefdJy pmnffkred to the mass speeiromeioi: via a farbk crreeo»fl ⁇ i*ttfele ion itmisik deice n aecorfa ee th site or owe e todlm ts of the present disclosure.
  • FIG.2E shows a block diagram of a mass s ectrometry s stem such that the e source 1 ⁇ 4 detached fro the ion ude and the l tts are efficiently transferre to too guide via a flexible or ereonfsgos to on transfer evice in accordance with « or om embodiments of the resent dkcteute.
  • FIG.2F stows a Moc dagra of a mass speetomeiry system snets that the loo source is dehseM. o the i n guide md the Ions are efficiently tetssltaed to ioa -Lide via a flexible or rereonigerabie Ion transfe device ia accordance with e or more embodiments of the present disclosure.
  • FIG.3 A shows ablock diagram of a mass spectrometry system such that: three different ion sources are attached to ass spectrometry system via flexible or fe-ecMthg rabie ion transfer devices re accordance with erne or ute em o i ents of the present disclosure.
  • FIG.3B stows a bloc iagram of a mass spectrometry system such that three different ion mam are efScieafly transfer tors to two differani ass spectrometry s stems via flexible or re-eouigurahie loo transfer de ices in accordance ith one or ore emboiments of the present isclosure.
  • FIG 6A FIG.6B, FIG. #C Intel and FIG 61 show perspective views offlexible m re-cosigmtbie km ransfe devise m aeeatdtase with one or «ser rabodia fe of the rea at. diwkoure.
  • IB sho peripeeSvi iews effl&a&it o m €rmii rabfe n transfer device Is accordance with one or is3 ⁇ 4 e bodiments of die present discloaus ⁇ .
  • FIG, IA, FIG, IB, tod FIG, 1C show tent views of etetrotfes of flexi l or re-wooi gursble ion. transferdevice in scnorfance with one or more embodiments of the resen disclosure.
  • FIG.9A, FIG. OB, FIG.9 € s FIG.9D, an FIG.01 show eross ⁇ sectk>u views of electrodes of flexible or rwcmifigurahle Ion is fer device copoecmd to eac other in accor ant® with one or ore ernbrxllmems of the resent diclosur ,
  • FIG 10A and FIG. B show perspective views of etatode structure of fcdhb or t3 ⁇ 4-eonilgntihb Ion rasfer device in accordance with one or more emboiments of the present disclosure.
  • I IB, and FIG, I i € show erspecti ve ie s of falbb or remonSgurable ion transfer device including three electrode structures eonoeete to uadi other m ac or a ce with one or snore e hodtmenrs of the ocM disclosure
  • FIG. 12 A and F!G. 1 B show perspective views of flexible or re» ⁇ configurable ion transfer device including le en Gectrode iryetmes connecte to each other In accordance with one or more embodiments. of the present disclosure.
  • FIG.13- shows a pers ective view of flexible or re-eonfiptihle 1cm tmt fe evice including : t o electrode structures connected to each other accord nce with one or mom embodi ents of the presen t di dosure, FIG.1 A, FIG.. I4B, mi FIB I4C sho ers ective vie s e ek afe and electrode geometries of ffesfole or re-configurable Ion trsrfer device In accordance with one or matt em lMcnts of t e present direloMre,
  • FIG. SA, FIG-. I SB, and FIB. ISC show perspective views of flexible or e-config sbk loo transfer devices In accor ance with one or more emho bn fe of the present di reinsure.
  • FIB.16 shows perspective view of electrode a «etcy of Sedbi ⁇ or re- ronf!gurebte bn transfer de ice m accordance with one gr more embodiments of ill® pnese disclosure.
  • FIG.17 A an FIG 17® show two d® vfe s of ion trajectory fonihatlon In flexible or w-crefogurable i® transfr device In accordance with one or ore ensh ltnents of the present iselew®,
  • FIG. IS shows 13 ⁇ 4F anil DC voltage avefo s for flexible or re- eonfi mhle tort transfer evice m aoeor anco with one or morn «nhodtntcnts of th pesent dhe re
  • FIG 19 sho s EF mi DC voltge waveforms for flexible or .re eotfopttbie Ion ttmesfor de fee m acco ance ith one or mote OTbcall e ts of the preseM disclosure.
  • FIG.2Q allo s i flow chart of a method fo lOTifemog Ions wi th teMe or e «Sgu ble ion transfer device m accodance with one or more ®uho immts of the res t disclosure.
  • FIG.21 hows a block diagram of control unit for Ion transfer device upon which one or more e bodiments of the present disclosure may he implemented
  • embodiments of the present disci smir rel sited to a fl exible or re eonignnble ion transfer device sod methods for tn siemng fons with a flexible or rreonEgumbl ⁇ ion transfer deice.
  • 2A shows block diagram of a ass spectrometry system suc that: the ion source 21 is detached from the km guide D and the ons- ate eflciestily trauyfeed to loo guide via a falble re-cool gurable loo transfer device 21 m acoonlanee with one or raora embodiments of tiie present disclosue.
  • the mass spectrometry s im, as disclosed heeby stay include the km sourc 2L the Ion transfer device 20, the ion guide 13, the mass analyser IS, the det ctor 1 ?, and the corresponding vacuu system and etoctroni os (additional sub-systems) for proper operation an foil functionality. Additional sub-systms for a ass spectrometer are shown In P!D. I and omitted In this and other figures of the presorti application to av d obs iting the tiera ficu and rawings and for maintaining stmp!idty of illustration.
  • the ass x eofrome syste In oties an ion source 21 that Is detache fro an im guide 13 of the mass spectrcanetry system and the i ons are efficiently transferred front the ion source 21 to the l o guide 13 of the mass spectrometry yst through the km transf r device 20, which fiesihle or rw configurable.
  • the ion guide 13 may be one or more ion funnels, or one or more Muitl e Ions guides lisvfog a plurality of even nu ber of pdos used hi conventional it» spectrometers.
  • the ion source 21 ma he eieetrospray, lasma, glo discharge, laser, photo-iottfealfon, or a eomhfoahoe of the used
  • ambient fcmtatien tedtM ⁇ e& Id me or ore ettbo l rdy tie ten source 21 mtty use any ambient io&teabcBi techniques under cate oric ⁇ exfr&ctlorT (a solid o liquid extraction process s dynamically foil owed by spray or dhe kal lookat n), "pbs sT (thermal or chemical desorption with chemical ramztfion), ii *v ⁇ siep ' " (desor tion : r ablation fe!Jowed fey isi3 ⁇ 4atioo s ‘laser (laser desorption or ablation followed by bnl tloo),“M
  • the ioo souce 20 a be any of Ah How- ⁇ assisted iaru&aiiaa,, Air fiow-assisted desorption ei cte®spiaj ionization.
  • Direct probe deetrosp y ionization E eirodmzsriated desorption oietrosp y ionization. Easy ambient sunk-spay ionis tio . Extractive etearospray Ioni ation, Bbetraspoty laser deeerpt u ionization, Eleettospray- sssted pyrolysis ioelzation, Eieepostafic spray ionization, Flowing at spheric p ure akcrglow, Field induced droplet Ionization, fighwo!tage-sssi sled lase desorption ionization, LMiam atmospheric pressure glow db isr iomzaiion, h med laser ablation etastahledodneed che ical Ionization, let desorption e!eetrosprsy Ionization, Laser asslAed desorpties
  • the ion transfer device 20 ay have a plurality of bend poitions 12& tad 12b, so the ion transfer evice ay form one or more enrcaiures around the ben p sfoe in one or re embodi e ts, the 0 flexible or ⁇ co fi u ble km transfer device 20 ma hoi d or ids# anew shape or tern after chan ing the shape or form from an old shape to a new shap , for examle, by a force applied by hands of user or an operator in « or mote mh Imerds, the flexible or ⁇ -configurable ion transfer evice 2-0 ay be soft ari ay BOS retain or hold a ne s a e or form alter changn foe shape or form fromS an d shape to the new shpe.
  • flexible o re- configurable in the present di sclosur i s defined as foe capabi lity of being bent and Icing able to chan e from an old form or slope to a ste form or slo e h n foe ion transfer device 21 is actively fransfeotug the tons, to one or more embo iments, flexible or re-ecmflguraMe may be defined as the son transfer device 20 having aft plurality of bend positions soc!t that foe i n tnntfer evice 20 may fbm cumexre&
  • flexibility is defined ns foe achievable range of spofion or being at a heed position or a pkirallty ofbead poskions wii af!tain ion hrasssfer efficiency of the ion transfer
  • fatbiilty of the ton transfer device 0 may or may no man a from or a shape while being flexible or ra ⁇ onf!gurabfe.
  • flexibility may be defined as spacing between electrodes of the ion transferdevice ne tr toct e enfe imenkg being flexible a& feeing rereonllgwabfe may be used in an mtwtsngte anner.
  • Th ion trmsfer devise 20 h a diameter tod a lertffe
  • the fesmcter may fee tl3 ⁇ 43 ⁇ 4 ss e or if erent aioog the fen tra sfe device 20.
  • the fesmcter may fee any value betw en 0.2 to 2 fee1 ⁇ 2s or even u to 5 inches
  • the length of the : i Mmsfer device 20 may he any value between 0.5 to MtOO fe , or 1 to 500 f»t.
  • the length may he 2, S, ! ⁇ , 100 or even 1000 ti es of the diameter (or the largest or the smallest diameter if the di ameter varies long the length).
  • the lott inlet (illustrated in drawiup as dcms > and the Ion outlet (illustrated in drawing as Tons ⁇ oG in the present disclosure are deli tied as sides of Ion tunisfer device from which Ions respectively enter and exit the ten transfer device 20.
  • FIG. 2B shows a block diagram of a mass spectrometry syste such ha the lett sretroc pfobe 22 Is tietatfe from the ion gli e U and ke are eftkfent!y transferred to ion guide 13 via a flexible or rereeniigumbie i on transfer device 20 in aeeotslnnce will? « rnp i of t prerefe disclosure..
  • 2B Includes a flexible k t a sfe device 0, which may efficiently transfer ions from a and-held or portable ionization probe 22 to an ion goide 13 of a conventional mass speetromeier that als fed odes a mass analyzer 15 and a detector 17.
  • Tim loti lorn may be KSM by colliskttsof ions with the inner walls of the oo ttuife device 20 or by ⁇ oiidiog with structures dispose inside the m transfer tube 20.
  • $ m kn ansfer ay be JM tr nsfer wi th the ratio of km kng k km mtM of k im !rmvkr db ce 2 ⁇ to the km entering f km inM qfke km &ma$r devte# 29 being letter than 0,99, 0.95, 0.90, 0 S, 0/80, 0,5 * 0,2 orOJ,
  • effk wi may be defined as the percentage of Jons exiting the outlet ttf the tonransfer evice 20.
  • the efficiency may be geater than 90%, 5 %, or 10%
  • the number of ions entering the kn inlet or ediing the kn outlet of the ion itittsf device 20 ay he meatuted or guaMtikil, for example, by onitoring ion current at the kn inlet or kn outlet of the i on tansfer device 20 with krt «rat defector soeh as MI a meter, 3 ⁇ 43 ⁇ 4 d momeeg or an ekvhwn multiplier,
  • derive ka transfer or ⁇ ckmfy trmfecring ions hi the pres nt ii sciosura is defined s transfer of ions with aid of electric Helds or praeMals crested by «pplkatMu of voltages to lectrodes o the i t n ier device 20 or when various voltages (such as DC or RF or
  • the pressure Inside the ion transfer device may be in the r tge of 0.001 to 7bP Tott, this ressureregime,. the loos li»e a elati ey small meat* fee pair, (in the order of s few nanometers to- several ierarnete), so therefore,. collision o imis with backgrou d!
  • IF voltages (or alttmadrtg cur ent (AC) voltages) are used in conj nction with DC oltages to sli on ll y p.ii ds an ra sfer die ions nside tm transfer device 20.
  • RF voltages Miy push i ons tew&fds a central sods of the tel transfer evko 20 an malniafe loos in a central portion of the loo transfer device 20, thus preventing ions from colliding with inner walls and being lost.
  • the DC volt ge may provide * gradient ro franri3 ⁇ 4r and gni.de the km m direettea towards ten outlet of the im transfer device 20
  • the ten transfer evice 20 may bo in a shape of a fl etebl a t be or a fie ble bellow with a plurality of etetrodss disposed inride fee flexible tube or bellow toreceive : the loos from art ten inlet of the ion transfer tube 20 item M ioriisrariau i «ik ⁇ s ch as the andheld lonkatroa probe 22, and lira actively transfer the loos to an ion outlet of the ion transfer device 20, where ions then enter the ion gra e 13 of the mss s ciroroeie .
  • » ions are atoms or olecules with a not electric charge oe to the l ss or in of «on or re ekefransc ami the 3 ⁇ 4to « or m ecoles ay he the sa e or different:.
  • the iort tr nsfer de ice 20 ay fochnSe a tube a e to a sfogte pm suc as a plsstk etal t be or ma e from muMfsile l bes dial are cemt ded to each other,
  • the plastic tube may be a beat -shrink tubs.
  • ldest-fotmk tube may tse made of a y one of thermoplastics, in mlng pd Dleim, polyvkry! ehfohdle fPVC) Vltoii® ffor high erap and ooitosive eoviron eots), eopmoelP, dytet OoeTOeih lete CPTFI3 ⁇ 4 lluctrinaied ethylene pep lene (FEP) attd Kynsf®.
  • s eeial-applioatlon beat i t may al» mdude art a esive lining that ma help to bon the tubing is underl ing electrodes and connectors, forming stong seals that ay be erpreef or gas-tight aufiktait to mmmmn the eg tod pressure mslda the ion teofer tribe 20.
  • the heawstefek tubing may have conductive polymer thick film to provides efechicat conneetka® between the wo or more deetm s withoot foe nee to s ldering, to shMd the efe OTtageeik field pre ao by the RF vol tages of the i on transfer device 20 ⁇ .
  • the sam le may be any abitrary sam le i ler analysis or tost, which the ion source probe 22 produces ions from, such as a biological sa le, a human nr a it aTtisMis, or an sample of rntefs thatincl es trace amount of analyte of Interest, or a geological sa le.
  • the sample y be a human body part for exam le a human hand, for exa le, being screen for skin cancer.
  • the ion transfer evice 21) may have a plurality uffeend ositio :* I2a ; 12b, 12c.
  • a e ⁇ veatksaal ass spectrometer23 Is «ml an tire fenkittiM source of the mas sftectoriteter (which is directly attached to l3 ⁇ 43 ⁇ 4 mass «.peetramete ⁇ 23 in fii&ce of an adapter 24 ⁇ A replace will an ion transfer device I@ including the adapter 24 m m$ md it® ilia km outlet side) fi t is cosmecEed to the ass vpeeirametsr 23 an an ii feation obe 25 i.he odret end of the Ion trimsfer device 2d ( fhi ion inlet side).
  • Thetotizat as pole 26 may lean ambieist i nisation somtte, atmospherie pressure lonta fert soure, or a reduced pessure i nisati n s ee, which is laud-held, whi ch m y 6e easily held with a hand 25 of an operator and moved feely to different locations or parte of an ofejeet under test 27.
  • the ionization prob 26 may he freely moved to differosk parts of a uman body so that: the ionization probe 26 may become in contact with skin of different ots such as hand or leg of a person 2?
  • tie Imlteion prole 26 may produce ions from huma skin that is transferred to l e mass spectrometer 23 by tire Ion transfer device 20 ter analysis by tie mans spectrometer 23 Ube feibil csf the im b ifer devc 20 enables ns g & hand-leld. kaazatiait proto 26 and provi es several atoants es no?
  • the flexible km transfer device 20 snakes it ssible for the i o ⁇ at1 ⁇ 2 « probe 6 to tel ly sod feely mwe to dlf& rt bod part located away franc the mass spectrometer 23.
  • tie ass spetototaetet 23 may be pl ced
  • the ion transfer device 20 may transfer the ions using the km trmefor device 20 that is ssed through 3 ⁇ 4 wail ilia? scpaMcs the as spcetro eicf
  • Tie abject under test 27 may be a pabent that is going: through surge y on a bosphai le .
  • Tie ion transfer device 20 may have a plurality of bend positions l3 ⁇ 4 :2b, I2 « ? 1 lie around which the ⁇ tmns r device 20 ma form plurality of eurvatures.
  • FIG. :2P shows a block iagrm of a ass s ectro eter 23 such that the ton source is detached from the mass s ectro eter an the bans produced in an ioni tion probe 26 rc transferred to he ass spectrometer 23 v a re- config rable « transfer device 20 in aecordi ve with e m WW e adhneais of ill® prosem disclosure..
  • He iooi afion probe 26 may be held by t hind 25 of operator or a user (or for «am le by a robotic arm of a robot) a surface of interest 28 may bo anal se without having t e mass ectrometr 23 dose to the surface csf imprest 2S.
  • the lengh of the Im transfer device 20 may bo . ⁇ teater than lC sm, 50em, !Cfoem, IStfo ⁇ or :200cm.
  • die length of the ion transfer evice 20 may he greater than 2meters, 5 eter, or IQ metr, more.
  • the lmiaaiioa pobe 26 produces tons from the surface of i erest 2$, raid the prouced loos are transferred via the km transfer device 20 to the ass spectrometer 23 for anal sis.
  • this enables modifying the conventional « specbxmeter23 tepla ing foe original ion source (not shown) of the cnwemkmal m ss spectrometer 23 by an adapter 24 that connects the ion transfer device 20 to the ass spectrometer 23 an efficiently transfers the ions from the m transfer evce 2Q to the i « sfwctromerer 23.
  • FIG- 2E an FIG: 2F stow two block diagrams of a n s spectrometry system «1 that the son ource 1 k etache from tl® ion guide 1.3 ad the i ns are fe wf erred to ioo guide 13 via a re-Oonfi lraltle ion transfer devkc 20 m accrnttaec wild CM® or more ombedistieats oftto rescttt disclosure
  • the flexible n fomsfer device 20 may have m adapter 14 ⁇ Including: one or snoe deefoxba such as skimmer and sample cones disposed insi e, or conventional on funnels an ionpities) feat eon «eois to the fo a ifoo robe 21 and efficiently transfer tons from be ionlrsiioo probe 21 to the flexi le bn transfer device20
  • the adapter 14 may .also fedrete t e etelroni.es necessary to ⁇ peretethe ten ititisfof eice 20, mcloding direct mr iX ⁇ DQ, alternadog current (AC), radio tfegoeoe (RF) v l i for oper ton f tio ion teaistor device 20, M one Ion transfer device 20 may be connected to a secon adaptor 16 bat connects the ion transfer evte D to an ion pide 13 of a m speetrooMer Tie second adapte 16 may ho used to attach be ton transfer device 20 to fee mass spedremefer m a v&cuumfoght manner while efficiently transferring; the loos from fee i n transfer device 20 to fee w ipcet utetot ,
  • the sec nd a apter 16 may fecin e etamnfcc necessary to operate the i
  • PIG..3 A shows Mock dga of a ass speetro etry syste such that the thee e sourc s 21 a-e ore ataehd to o rmm speetrooietef via a reroo»fi ⁇ u ble ion transfer device 20 in accordance with one or om embodiments of the present is osure.
  • One o more ioni3 ⁇ 4tion souces 2la 2!b, 21o ay e connected to one or ore sample preparation devices 29 to pre are the sa les for kmfeat , fat exa le
  • the ioni3 ⁇ 4adoa sources 21a, 21b, 21c may be connote one or mee sample ro atbo o scpav fort m mmerits, such as e itigh-pressuro liquid chromatography s ste (IX at BFfC system) or a gss ebraroafography (GC) syste to separate analytes before analysis with the ass spectrometer
  • the ion sources 21 3 ⁇ 4 s 2 lb, 21 e are eated a rtml hpte ed
  • the combined» of the ion guide 13 the mass nal se I S ®d the detector 17 may be inferre as the mass spectrometer.
  • This nflgoratioti ovi es ⁇ the a vantage dint a single ass 3 ⁇ 4pesroroe»r may be us d to analyze different sample located in different places and co ing fro different separation or ssroplu r ⁇ mtkm iMtastents
  • M desorbed ubo ecause analysis by a wm$ spectrometer is performed in milllseooads to seconds, thus such multiplexing greatly uabaacea apltaal of mass spect eters by cont oou y and stecpettikUy providing ions to ifferent loosttoMfrns nnentsi or ionization sources 21 a, 21b, 2lc ? ⁇ the ma» spectrometer for analysis
  • FIG.3 sho s a !doek iagmtn of a mass speohymtotr 3 ⁇ 4 « « suc irtt the three k3 ⁇ 4tj satras 21s2!c are atached to fcwo mass spectrometers va re eoafip ble on transfer evices 20are m aecsrdax» with m® or moe eutorajlm ts.
  • T e ho ces j 30 (also referred to m dre too M&tof &boi device its the prereto disdusu ait ix&Mpli of which is escribed US. patent 3 ⁇ 4%6,244 for lossless too a i ulation (SLIM)) ay be «re to selectively transfer the loss received from three ioiifeatton we 21a, 21b, 21c espectivly cotmeeetl to three teible ion « «tier deices 2 fa, 21 h, 21 e to tire loti rocessor 30.
  • SLIM lossless too a i ulation
  • the toe processor 30- then selectively tr nsfers he ions via two tlmsibfe ion ttaitofer devices 2C3 ⁇ 4i 20e to two dltlereM mass speeitOTetets.: the first mass apectrmneter Including the ion guide Ba, he ass analyzer 15a and the detector 17a, and the seeoml one metodiog toe too gui e 13b, the ass analy er
  • the ton processor 30 may trap, store, rocess (for rereMpto se arate toes treses! m their raohilhyT and selectively transfer loo «kere into there two mass sectr meters.
  • FIG.4A shows a Mock dksran of m ion transfer device 20 in aocotdanee with one mote e.rttorktmems of toe present disclosure.
  • the ten transfer device 20 may include an electrode «nit 31 (each electrode «nit m compromise one or mote tod peuflvM ets u iv# toeetresies as dissitreed til# resent application) connected to one or ore voltages.
  • the ten transfer device 20 may include m im transfer etrekreere 21.
  • the ton transfer e cloMr# 21 may be a take made tore piastre or mctil corniected to a voltage or ground in ease tire tube made f m metal or conductive plastic.
  • the errels ire 21 may be & plurality of tubes 21.
  • the tube 21 may he emruptotl or m b tow form to allow f blc lending of the rube
  • l re pressure inside fee ion transfer device 20 may be fee same m !Jfereni at felfeent l cation reside fee enclosure 21 along fee ion transfer device 20.
  • the pressu e inside fee encl sure may be in a range from 0.01 to 30 Tore,
  • the electrode trait 31 may be itetble for flexible bending along wife fee im transfer enclosure 21.
  • the loo transfer device 20 Includes ma include ti e eieetrotfe omt 31 having two or more nlen rodei, whidt may be flexibl electrodes, sncb m fe e sho , and described lat in fee present: application, for ft «pl3 ⁇ 4 k FIG 14A, FIG. 140, FIG. I4C; FIG ISA, FIG; 1SB, FIT. I5C and FIG. Id other e bodiments, the one electrode unit feeindes a plural!
  • FIG. 4B and FIG 4C sho two block diagrams of embodiments of the ion transfer device 20 in aocordmree wife tre or more entbodl meats of fee present isclosure.
  • the ion transfer device 20 may include a plurality of electrode units 3 la-e in FIG . 4B or 3 la-j m FIG.
  • the plurality s# electrode tmite 3taj an the msdosure 21 may be ilesib! e or be lafefe or rs-eaeilgn from s first shape o cistiflgurbon to a secon iha e or e fi ststeri:, fit one «3 ⁇ 4 embodititoMs, She plurality of electrode unit 3!a ⁇ j ay t fl 3 ⁇ 4!e orre-eonfigurafefc bat flexibly c ⁇ ctod to each other, such as th se shown in FIG.7 , FIG ?B, FIG. I IB, FIG.
  • FIG 13 I IC, FIG 12 A * FIG 138, and FIG 13,
  • FIG.4D shows a bl ock diagam of an ism transfer device in accordance with on# aspect of the pteseM disclosure.
  • ⁇ sae «hodimen ⁇ a lumlit of connecting deetrades seg eots 4la ⁇ s which w ebclffcally is ated fern the plurality rf deetro e «nits 31a-
  • the pte&i!ty of connecting electrodes seg ents 4 land may be in form of skimmer cones or oondnct ce lumttog «te an si ilar structom used h dil etmlai pnto.pl.ng
  • the plurality of connecting etecire es raeois 41s-d, a be one or .more «tuc nce limiting ocillces or a plurality of capillary tubes.
  • FIG.5A, FIG SB, en FIG. SC show hroe block iagra s of dif&rcM ensboii eors of the sou transfer device 20 conneoiona to the mam spectrometers SO, $2, 55 in accordance with one or ore emttodimenis of the present disclosure.
  • the Ion t nsfer evice 20 tony include a p!m3 ⁇ 4li ty of electrode unite 31a-i, as described above, that are eormeeted to each other.
  • the plurality of tectocfe amts 31&»j d Hie en ostns 21 ma beet to have two o more ilfere&t. shapes o forms a i my be reecrf tMble o flexible.
  • the loti transfer devise 20 may e «mected t one end to die ion source probe 51 that may fteely move in 3 ⁇ imeatoMl s wre because of the flea3 ⁇ 4 of -the i « transfer device 2tX 11» iou WW probe Si may be flexibly oved ar nd to ring fee Inn saurne probe SI dose to a ple or object under test to be snalysed, Further, the im transfer device 20 ay be connected to inn ride so mass anal y ear of a ass spectrometer 50.
  • an ion processor 54 ay be included and the loo processor (as describes above septdinglfS , patent 9,966,244) may be conaected to the inn source probe S3 CM e end an the mass spent rometer 52 on the other end using t o different ton transfer de ices 20t and 20b so th «t tow or tue-separation of ions (base on their ion mobility in fee ton processor 54) may be controlled.
  • FIG. SB an ion processor 54 ay be included and the loo processor (as describes above septdinglfS , patent 9,966,244) may be conaected to the inn source probe S3 CM e end an the mass spent rometer 52 on the other end using t o different ton transfer de ices 20t and 20b so th «t tow or tue-separation of ions (base on their ion mobility in fee ton processor 54) may be controlled.
  • SC is simlar to FIG; 5B with the different that fee loo rocessor 59 is connected to two different Ion sources 56a33 ⁇ 4 and ai lti teea the ions receive from these two ion sourees. to the mass vpcelrometr 55,
  • FIG.6 A, FIG 6B S FIG, 6 € s » FIG.6D show perspective views of an emboiment of the flexible or r cooHg 3 ⁇ 4bk Ion tran sfer devi ce M in accor ance wife one or more embodimens of the present tiretosttre; In one or more erabfflii ents, fee plurality of electrodes €1 each having a central hole 65 (of fee sa e or different diameter.
  • etobodl tnent sseending or deseendlog feam terto which may also act as conductance limiting orifice to limit gas Sow between two adjacent electrode units and provide differential pressure m two adjacent eotrodd uni ts
  • each other usin flexible or elastic rods 6l « ⁇ d which go through a lurality of boles 62 provided on each of the plurality of feeelectrodes 63.
  • the plurality of dectro es ⁇ 3 ate isposed Inside a tosdMe tube or enclosure 67. (Thetobe or enclosure 67 is not shown in FIG 6 €, FIG.6D, FIG; 7 A, and FIG.
  • This 3 ⁇ 4M%ur3 ⁇ 4h «e allo s the plurality of fee ee xlte to ⁇ M one o more oarvatores aroun m to s 66 of fee n croler evice 23 ⁇ 4 as shown In FIG b € ami PIG.6D.
  • the plurality of electrodes 63 each amy have ne or more eleetr al eormeetk 68 to appl ifleteal voltages, such as RF voltages VRF1 nd VRF2, and DC ⁇ d3 ⁇ 4 3 ⁇ 4, VDCI an VDC2.
  • the lurality of oieetrodte 63 may o ma e ft®® My rusts! (stainless sled,nickd, copper, gold, or any ther metal wifh or with ut coatings) Of any c n uctive maeial such aa co uctive p!&stte.
  • the sp&efeg betweoo the electrodes may he di ffere® or m he the sa e sod ma be a val e between 0. ! to 10mm Tbe t ekoesa of electrodes may be different or ay he fee same and may be a value bet een 6.01 to 5mm .
  • F voltages may he applie by eonaecikg a plurality of otpi tora TOt Ofe In series t fee electrical.
  • ocK eet s 68 ich are eonneeied to electrodes 63., as shown m FIG 6A and FIG 6B.
  • the DC voltages may he applied by « «««eetlag rohstora m series with fee deeirkd e®M3 ⁇ 4tohoro 6 ⁇ * as shown m FIG 6.4,
  • the snsbtOf vaue nitty be 0.CMM to
  • the capacitors a resistors may bo eotvoectod by c nnector ⁇ sblderini, or speu-wedkg to the eloctrofe 63 or th eleeirieti iromeetkrro 68 bistros! of usi ng the electrical ccsnneclions 68.
  • fee esp&dors ?0a,70b sod resistors 6# may he assembled m a se arate iletatione or rigid printedroy hoard (FCB) and connected to fee electrodes, as shown in FIG.8 A, FIG. SB, and FIG. ⁇ € as described Met in the present a plication.
  • DC voltage m be to the fmt and last electrodes of the plurality of electrode 63 , as show in FIG6A by annotations VDCI and VDC2.
  • VDCI coniraliable and addressable DC voltage
  • the DC voltage may be any value from 1 to S0t> volts or greater thin S00V .
  • the RF voltages tmy he applie as two out of hase RF vohagro respectivel couoeotcd to odd an even ectodes (VRpl and ⁇ RF2), T e am litude of the IFwtege ay ⁇ be any value fen* 1 to SOD volts or greater than SCM ⁇ .
  • the frequency of the EF volage may he any fteqmme tra 50 H3 ⁇ 4 to 20M!fe
  • the RF an DC voltages should n t cause ps breakdown ai the pressure that the ion transfer device 20 is operating it.
  • foe plurality of electrodes 6-3 are eosmscted to each other is shown fo FIG 6A but instead of sing the flexble or elatic rods 63 a- d, a plurality of efeetriefoly fosu!afog streetoras (fo exa le alarik or rigid Vi ton or FIFE O-ring or any similar material) are placed bet een each two electrodes of the plurality ofelectrodes 63 (similar to the electrically kaalatlng structures shown by nnoations: 92a-'d m FIG. $A an FIG.98).
  • m4 may reform the sha e of eirasrie d1 ⁇ 4 e therefor ton taj ecories Therefore ⁇ the inner diameers of the electrically iosuladig structures etc larger than the dia ee -of the holes 65, 32, 13 or 94) so that if charge accumulation occurs (for example on foe efecfrieally insulating sructures sho n by annotations :2&-d in FIG.9A and FIG.9B), the harge accumulation on rwi ad ersel y affect the d-eetri c fields imite the Ion tra sfer device
  • the resistors and capacitors are directly connected to the rasrwfcs; 63 without the ecide emmeetk® OB, dMilar to those sho y l a FIG . SA, FIG:. SB, and FIG SC and the corresponding description later in if application.
  • FIG. 7A md FIG 71 show perspective views of the flexible or re- smfranrab!e ion transfer device 20 in accordance with one or more embodiments of the present tfedsMi A this exe lary embe !»» *
  • the ion transfer device 20 may Include electrode assemblies (or units) T?3 ⁇ 4 77b, 77c In which the electrodes 14 are rigidly attached!
  • Electrodes 74 each having a central hole 72 may be connecte to adjacent eetrodes «sing rigid reds 61 a-d, which go through a plurality of holes 72 provided on each of the plurality of the electrodes 74 tn other «nhodimettfe, the electrodes 74 may be fixed to each other with gl ue, epoxy, m w whilemaintaining s predeter i e S aekg in 3 ⁇ 4 o of 0.Q5 t® Smm between the egra es.74.
  • the eiaeirode asse lies ( « ts) 77a,.77b, 71® are flesafely t»ebed to «a «fe other sod proi e the flexb
  • FIG.8 A, FIG. SB, and FIG. SC sho front views af throe embodiments of tbs Asrtredes of At flexible or t-eenfi arabl t i n transfer eviee 20 in accor ance with me or more embodime ts of At present died enro, A one embodiment sho n in FIG.
  • a pdated eir bt beard (FCB) ojeeifo n 82 of fee plnra!iiy of electro es may he made with PCll Hie CB el ectrode &2 may include a pksrahty of holes t l. «d that provide a path for the .rods 61 awl A ⁇ enter h le 83
  • In hie PCB oo!rode 12 provides s fh for loos m the center area of the FCB rede M2,
  • a rneisl trac Si acts as a eonduebve eclrc e tbr application of voltages to pro uce electric fields in nod arou fee oa « bole 83 necessary for traasfmsf fens.
  • the metal track &4 which may he co pe, or gfedAmmersion electrodes used in PCB oianufectoong similar to through-bole asac bllea well known 1» PCB production bet wife much larger diameter.
  • the diameter of the hole 83 ay be s value bet een 8.2 inches to ID inehes.
  • a resistor S6a and e cepacMor S6fe may be assembled on the PCB electrode 82 to provide the necessary DC voltage an RF voltage, res ectivel
  • FCB eleetiode 82 lit one ernbodintenl sho n in FIG.8b, a FCB eleetiode 82 of the plurality of eledxotte 63 m y he circular sh e.
  • a FCB eleetiode 82 of the plurality of eledxotte 63 m y he circular sh e lit one ernbodintenl sho n in FIG.8b, a FCB eleetiode 82 of the plurality of eledxotte 63 m y he circular sh e.
  • fee electrodes may ho made in ay arbitrary sha e.
  • Theplurality of ectrkalfy insulated sr etwes iSa-tl is bn made with pogopins, or elasikt Wk, or O- m atached S the board.
  • a plurality of spacers 92&4 m be place in bet een tic decto es 91. to provide the seipiied s a sig between electrodes and also the re-
  • the electrodes 91 may a r sist r 95 an capacitor 93.
  • This rontlg ratiori provides flexibility for he foe transfe e ice 20.
  • the electrodes 91 each h ving an electrode axis 96a-c may he flexibly bend arm d the xis 90.
  • the degree of b nding is defined as the angle between the axis 6 and each electrode teas 96a-e correspondi g to t e i otmli ty of eloett les 91.
  • the egree of bending may be any value between 0.000 ! to S degrees for eac electrode 91.
  • a beat- shrink tube 99 may keep the electrodes 91 in place (electrically se arate fro each other) while mm at ng :fl Mlfy, li other embodiments, both the plumlity of spacers 234, and heatehriitk tube 99 may keep the electrode» 91 in place while rovi in flexibility
  • the ateten tube ma also- serve as the ottotosmo 21 to aintain the electrodes 91 in reduced pressure m disclosed earlier in tire present application
  • FIG 9C sho s only one layer of heat-sfmnk tube 99, bmt one or m re layer of heaGs rink tube 99 may be provided to adftm flexibility id the pressure inside the Ion transfer
  • a plurality of wires which may bo ispose ttaltle or i side the encl sue 21 (which may be fm example the heat-shrink tube 99) provide respired deeirktd radio frequency (RF), or di rect astro (DC) voltages ⁇ or c nstant v ltage)
  • RF radio frequency
  • DC di rect astro
  • the voltages may he provided
  • rnilliseeands ' Us® oised voltages may 1 ⁇ 2 periodic, having a period of 0.01, 0.1, 0 : I, r 2 seconds, or more than 2 seoarn Is, Id other embodments, a plurality of heatetek lute ay be provided, an l3 ⁇ 4e oteotrle ! wte may be disposed in between tbs l ayers of the hetehrmk fate
  • tile eloelrodes 01 may tee marching extrnstes ⁇ 1, 98 m two aides of the eleatee 91 hat re engaged wt corresponding matching exhitsi ems 97, 8 of adjacei eciredes 91, as shown m FIG P end FIG.91, to provide flexibility its dsclosed in the present application.
  • tins structure ay be anyteoreb by separae Geottees 91 flexibly era eefed to etdb other and having many egees of freedom such as those te d teake robots ' having many degrees of freedom or may be maoufhetote by rolling a structure having matching mstes 97, 9S si ilar to those use In conventional flexible Geetrical conduits.
  • FIG. lOA ud FIG, 10E show erspective views of indivttteii electrodes of the flexible or re ⁇ conflgu le ion transfe device 20 in accordance with one or more emb dime ts t € the present teio
  • the enclosure 21 is not shown in these figures.
  • 1DB show a niultlp le ion guide that include e a plurality of rods M3 connecte to DC and/or &F voltages
  • Multiple ion guides ay have any even number of teg such as four, sis, eight, etc th are hold In place with a plurality of rod holders 192, 104
  • Two conduct nce limitin plates 191, fOS haing an odiloe ⁇ &7 are attached at the two ends to the rod A ders 192, 104.
  • the conductance limiting: plates 101, 105 may be Kmeote to DC or RF voltages (for example at a flres m y of 9, IMIfe to lO Hte).
  • a plurality of electrically m l ing pieces 106 may he co noote to the conductance limiting rifices 105 o rovide fcMIty..
  • th# ion tramber device 20 may he constructe with multi pole too pidss (each acting as on electr de unit) SwdMy attached to each other.
  • a plurality of Individual deet des (each electrode including the components as shown ia FIG.10 am! FIG 10B) ay he eofm cted to each other as shown in FIG.
  • FIG 11 A, FIG t !B, an FIG 11C to provide a flexible ion transfer device 20.
  • the t o electrodes or multipole Ion splc!e sstmetimet may fee connected to each other with the structure shown in FIG 9A an FIG 9B to provide liability
  • GetiNshriuk tubes ma also be iii d as endosure 21 »d are not wa lor simplicity of Ilnsl t! n.
  • FIG. I2A and FIG.12B sho perspecti ve views of seven electrodes of tire ttoib or fc-ronigurtble ion tt n hr device 20 corMocted to «eh other in accordance with one or more entfeodi enis of the present disclosure.
  • e sbo l MF $ie elcebndes. may lav « a plurality of outvatorcs orfee s MOmst! an am 110 of the ion transfer de vice 20 :
  • the enclosure is not shown in this S ins for simplicity of illastraSon.
  • the ilwdhility of this structure may be similar io those shown in HO TA an FIG. ®.
  • FIG.13 shows a perspective view of two electrodes of the flexible or re coni rablcion ⁇ 3 ⁇ 4 «!1 ⁇ 2 de ice 20 commoted to each other In Mcowlffitce with one or more embodiments of the present disclosure.
  • the nmliipole Ion gui es may inelcde a luality o rods 130 diet ate hold in place with a red holder 131, To provide flexibility the od# 130 f die two adgeeent lectrodes are connected flexibly to eseh other as shows in PIG.
  • the plurality of connecting pieces 132 may he conductive o dectdesl!y insulating, whch may be M by, for example, eot eeting the rods with flexible epoxy is another embodment, the plurality of rod# 130 may be flexible while mai tains a etss!M or ssmdco ta dishme® bet een two adpeoit r d# mi electrode assembly to provide a flexible lo transfer evice 20,
  • FIG.14 A, FIG.1.4B overlap sod FIG.1.4C show perspective views of an enclosure
  • he enclosure 21 may be ade of a flexible tube 141 having m outer surface 142 as sh wn in FIG, 1 A.
  • FIG, 14B are connecte to a plurality of DC and RP voltage# (not shown far si plkity of illustration) may be disposed inside the flexibletube 1.41 to provide the ion transfer device 20, Faeb of the pforaiity o ring eetrodes 145 may include an inner sarlace 143 and an outer surface 144. The outer surface 144 ay be disposed on the inner surface 142 of the flexible tube 14 ! to rovide an loo transfer evice 20 as. shown in FIG, ISA.
  • FIG.1SB sho s an exa ple of the ion transfer device 21) according to this xem lar embodiment
  • the ring electrodes 145 and the elongated electrodes HI ane flexible and may deni hen the flexible 141 tube bends.
  • the flexible hits ⁇ 141 maybe made with a faeafeshrin tube that has a stick inner surf o 142 fo stic ing to the outer surface 144 of the ring electrodes 145 or fee outer 17 of fee plurality of elongated eteetradet I 1 to the Itmer surface 142 of the flexible tube 145 PIG.
  • ISC show a cross section of another e h dlmcui ft fexfole fort transfer device 20 hich may be «tide with bellow tube 151 sod a plurality of electrodes 152 may be lace inside ie belfew tube 151.
  • FIG.16 sho s a perspective view of electro t omet is « e hodimeot of he flexible or re-corafigurafete ion. tra fes:device 26 in accor ance with one or more «fotfointer® of the resent dfedtMtre,
  • the flexible ion transfer tu e 20 ay fee e isiructeii with two wi s MI, 162 lor a plurality of the two wires Id!, 162 ⁇ that a wonrad around an axis 163 into heli structu s having a dia eter with any value in the rang of 6.2 to 6 inches.
  • FIG.17 A am! FIG, 17B show fw side views of fora trajectory simulation in an erafeochmersi of the flexible or re-cooflgurafele ion transfer device ⁇ 20 in avetriaracc wife one or more emb diments of the prase® dudosum.
  • fora trajectory simulations were performed with SIMiON soft are and the results are shown in FIG, 1 ?A (ride view) sefo FIG, 178 (top vie ?), Tire rimfostfons were peiiormed m a pressure of I !
  • PIG. I S shows. RF an DC ol ge wavetbsiiis applied to die elesh fe of the flexible or ee-eoefi ira le ito to sfor device in accordance with 010 r m e boi ens of the esent scl sore. in l!ie five sequenii al grapiss shown m FIG.
  • the dotes are sho n by tl to t5, tl graph being tire ii wive form erf the sequence and t5 being the si e e far of the se uence.
  • the time peri between each graph may be the sa e or different
  • fire time dii3 ⁇ 4teo «hetw3 ⁇ 4eri tl aod t2 may he m the order of mdlseoi da s or seconds (ay and ay he any vaioi between 0, 1 IM to Id s.
  • the electro e toils ilfed may c m rise toy electrode coofigumtfom geometry, s o , or fores isclosed in the teasot application.
  • the plurality of eefraefe toils 3 fo-d may be ih ⁇ m disclosed m FIG, 6 A, in which every even to odd electrode Is connected to two out of phase RF voltage® respectively.
  • Two out of hase RF voltages ⁇ are applied «> t o adjacent eleettoi s,
  • one of the two out of phase RF voltages is applied to every ther electrode and die other of the t wo out of hase RF voltages Is applied to the remaining electrodes.
  • RF voltages of the ion transfer device 2 pushes the ions rad llv toward the eeote o or t a ls of the ion tram3 ⁇ 4r eice 20 as isclosed and shown above in exem lay emfeoditn«nt and as for exam le shown In the simulation results of FIG.
  • the DC voltage sources providing the DC voltages ay respire IF ehalres to pm' i die RF voltage from penetrating Into the DC power supply.
  • D DC v iaps ay also be regarded as tire DC offset voltage applied to the RF v tap.
  • the RF voltage (two oid of phas sin waveform applied for: radially pushing tire lorn rewards a eeo « of the loo di fer de ice 20 ⁇ may alwas be presets in the electrodes of the Ion treosifer device 20 Aitem ivdy the I voltage may osly he snt when io esdsts in he tel ate elMirodas of the i tin «refer device 20.
  • Each of the efeettsde n e 3 la-4 is an electrode unit that may ceartt any number of electrodes but top sad eoMs an i.® packer as described earlier in die present a lic k
  • tl two packet of io»s s s&m I an tms 2, are held in DC potential wells cre e it* electrode oniis 31a Mid 3te at Vi voltrup
  • the iowt 1 nad km 2 may be from the same inn source or fro different inn sourees
  • the km I and km 2 ma contain the same or different types of ions obtained float t e same or different sampl es by the innis i mmx.
  • the DC voltage at electrode unit 3 lb m 3 I d are at V3 which is greater than VI. Therefore, the DC voltages of the electrode units 3 lb M).d 3 Id act as i pstefok!
  • the values of DC voltages may he any positive alue In a range fi n G V re 1 OffiV, in tl, the PC voltt : of tie electt te emi 3 I k reikood from V3 to VI, thus allowing the iam 2 to axially expand to the adjacent electrode unit 31 d (the ions at s ll radially containe mi the RF voltages - in feci, the mm 1 mid km 2 are al ays coittsiued the centerline by RF voltages as described above).
  • the otential well of the electrode 3 lb prevents the iwi$ 1 md m 2 from mixing with each other.
  • this se uence enables sequentially packing and efficiently transferring the imts or ion cl uds via the flexible ton transfer device 20 withoat these ion packets being mixe lie ion transfer ay be performed its a sequential manner and the ons, m the for® of ion pockets, may be ra sferred from the Inlet to the outlet of the ion tf sfer device 2 sequentially.
  • this- se uence m allows arrangement of ions roduces front different ion sources or produced fro she ssne ion ou ce but fro different sample, nto len paokefe
  • the DC v ltago values VI and V3 me use but each el ectrode 3 l.a-d may ave a different voltage value and they do not need to tm necessarily the sa e.
  • FIG.19 siiows R a d PC vblttge waveforms applied l ⁇ tfs « electrode mil 31 of t .® flexible or TSKSonfigurabl ® ton transfer device 20 ia ac € ⁇ ianc® with e more em odiments of the present disclosure.
  • the RF sod DC voltages re described m detail with nggpect to FIG, 1 ⁇ 2 and ills same es iii ap licable is FIG, 19.
  • the electrode 31 ay eoro ise of a plurality of fing electrodes Si ilar to those shown la FIG.6A, FIG.6B, sa FIG 6C.
  • each kctrmfe tout la one electrode, for e Mfiln ⁇ tie ting electrode ⁇ sho n n FIG.44) h one cfer-Mb mrit, and he slnitmg of the n packets ate perlbnned in one ek mx m at each e period (tl to iS).
  • the ring electrodes adjacent and to the right of the first group of ring electrodes are switched t ⁇ 3 from yj, and. shortly after, the first group of electrodes are swi tched to VI.
  • th ug electt te ajacent a to the right rf he second groap of ring electrodes ⁇ hid group of electrodes are switched to VI fern ⁇ 1 , and shortly after, the second group folectrodes ar switched to V I,
  • the ring electrodes adjacent and to the right of the third group of ring electrodes are switched to V3 font V I, an shortly after ⁇ Tr exa le tew of micro seconds to milliseconds or secon ®,, the seco d group of electro es « switched to I,
  • the ten packets move aequeotlsl? in the on transfer evice 20 from left (the i n inlet) to the right (tie ion outlet) while keeping the ion puckers septate, for ⁇ cample by a travdtog DC voltage puke while the RF voltages maintain fuse loos around an axis ctfih ⁇ loo transfer device 2D.
  • FIG.20 sh ws a flow ditto of a met od of tran drfog ions wi th the titaMe or ro-e ollg ahle ion transfer device in ooeordanee with one or more aspects of ifee pse»:it discfesum Is one sroFodiment, & nsetiiotl for trsostemng ions iide e prodtemg ions fern a sa le in step SI, transferring the Ions with at least one ion transfer e e that is eofl re to he flexible or ttoootfogufobfe m step S2, the Ion transfer device having an endo-suro, an a plurality of eleetrofe ls o l at least in pari inside he enclosure; separating the Ions with at least one analyser a n
  • step SI and detecting the separated loos with at leat one detector in st S4.
  • FIG.21 shows s hf dk: diagram of control unit 3 K> f ion tMSt3 ⁇ 4f device 20 ope detail «pern which an e ta meM oCtfee resent dis Budapest.
  • the ion fomsfer device 20 a include or may he connected to one or rno co trol u ta2;U>,
  • Ilse control unit 210 include es s memory 21 J , a p cessor 2I.3 ⁇ 4 iu uffoutput (I/O) interface 213 that i s cm eeted to a dis lay 14 nd a eyboard 215, m interface 210 that is connected to RP volta e generaor 2/18 and DC voltage geriOTtefr 10.
  • the control unit 210 loci utfes ne or ore memory 21 !, such as a f&ft em-tceess memory (RAM) or other d na ic storage device (e ,g. 4 d namic RAM (DRAM), static RAM ⁇ SRAM), and synchronous D AM (SDRAM)), coupled to the bus 216 for storing Mormidtm and Instructions to e executed by processor 21 , fas addltroo, the one or « memory 2 i I y be used for storing tem orary vurisMes or other ifotr edkie Mi matkto during the executionof st cttons b the processor 212,
  • the control unit 210 may further foeiude a roa otriv ucmorv (ROM) or other s!Mie storge evice (e.g., pogra mahle ROM (FROM), «s
  • Hie eotstrol unit: 210 may further include a com unication interfsee 221 coupled to the bus 216.
  • the commimkati n interface 221 provides a two- ay date eo ume tiots.
  • the Msrruurie ion interface 221 may be a network interface card to attach to any pocket switched LAN.
  • the eom uttieatiun iMerfece 221 may he an asymmetrical digital subscribe line (ADSL) ca , an I e me service distal network. (ISDN) card, a Onrverss!
  • ADSL digital subscribe line
  • ISDN I e me service distal network.
  • USB Serial Bus
  • a wired or wireless networ ay further he connected to the oommtmicafi on interface 221 connoted to ooe or moe co uters that provide one o ore operators and/or m a platform to ootuxiueicate with the oontirai «i 210.
  • the control Mttil also includes an kiferfase 217 fist tanslste digital dais received Ut t the hi 2M and transmits
  • DC voltage fenerators 21 which provide the RF and DC vol ps &r ofieratai of the l trt devce 30.
  • the RF voltage genrators 218 and DC voltage generator 219 receive the foMruciions ifom the mterihee 217 and produce the voltages 3 ⁇ 4i red by the lee ftimfr de ice 20.
  • the erffeen 217 may a o he crauieeted to a mass spectrometer that k eemrecied to the too transfer device 20 ky for exam le, synctatMze.# to adjust the tiniing and ltlp ⁇ ftg of the i n transfer pocess accenting to those described In relation to FIG.18 an FIG.19.
  • the interface 217 may also- be c moted: to one or mor lonlxabon probes to syn troa e p lu Mk and transfer of i ons from a sample.

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Abstract

An ion transfer device that transfers ions from at least on ion inlet to at least one ion outlet. The ion transfer device includes an enclosure configured to maintain reduced pressure, and a plurality of electrodes disposed at least in part inside the enclosure such that the ion transfer device is configured to be flexible or reconfigurable.

Description

KECO FIGUKAB I S QllI llALLY-F C EO ION (SFIO ) TRANSFER DEVICE RELATED APPLICATIONS
The present application claims pdorlry to and h ¾ no - r visiote application of Provisi nal Application No b2i¾S0,S¾ entitled:‘'Flexible Ion C e," hted on Juee 5, 201$; the centeet and disclosure of which is hereby incorporated by reference in its entirety herein and W w.
TECHNICAL FIELD
The atent disclosure relates to ion transfer evice. fe artiadsp the present disclosure ate to Im transfer device t»M k f!e ibfe or re- eonllgirrable and may be bent or e-oo fi ired from one shape to another shape while traMfemng i ns poduce ffero a sample in a first location using an ion. source (such as an ionization probe) to an ion analyzer (such ns a ass spectrometer or M ion mobility analyzer) in the second location. Tie inns ma he transferred l:«sidc the feu ansfer evice in sc ne iaH - acke i on packets. ACKGROUND
Mass spocraaietry en ion mobility speotrostiery are Malytfeal techfegues for chemical analysis to etect nd rdemify analytes of tetetm in wkm application*. With the increased nse of these striniiens, their applications and the variet of applications have Increased, However, their size still remains large, hindering their applications in poin of cate/aeticai/heed application*, w ere size and portability is limiting.
A mass spectrometer i eornpte syste compose of vaious com ponents as shown i n FIB.1. The eritical coniponents of a typical mass s ectometer consist
analy er 4 detector1 vmam «hamtier housing 3, vacuum system 9 inchiding vas mt praps· anti p«§«s voltage sup ly syttras 6, «oatrol syste s 7, sa data 5 acquisiPoo systems S. fe a typical mass specr eter, first ttie iomzatkut sonree ! ionizes a sa ple is enerate positive n negative loas. The generated i mis travel through lire asm pi g Met 2 an ere £ i ed: far exam le by ion ps et such a» an fot formel an /of melipde lost guides, to eater the mass an l yzer 4. All of these co ponents are os e inec to each other. The ess analyzer 4, which h 0 derived by volia e su ly systems 4 separates ions based on their m.¾. The detector 5 pr uces tn eteetrleal signal w en the i ns bit foe defector 5,. The date aaptsitiotv systems 8 receive the eleeirieal signal fro the detector 5, typically in the form of starte current ctr voltge and produce an ecto speem.. The s ent provi e iin r rlnte for chemical i emiScation of he s pl Clontrot syste s 7 ooafr l:5 various eampommis, All erapO tite relate to the mass analysis an ion detection are placed Inside· a vacuum chamber , maintained at high vacuum. Although FIG. 1A shows sa ple introductfonfiooizefion block 1 outside t e vMwun regfofi, rothsatlon of te ples ay cceur in a wide range of ressures, iksm atmospheric resure to high vacuum. In a conventional mass spectrometer, the sample0 Itttrotfuchotfoontza ett ) Is attached to the «upifog relet 2,
Mass spec o etes require high vacuu for proper operation because, iditeilly, ions oust travel inside a ass spectromete wit out colliding with background s efeute, The efore,, the vacuum in the ass .analyser 4 of a mass spectrometer must be maintained at a pressure that correlates with ats mean5 path length longe (Meaty m folds) than the length of the ass analyzer.
According to the kinetic theory of gases, the mesa free path L (in ro) is given by: lAkT/t2 peg where k h the B tmann a stent, T is the tem permute K i. p is the ress re (in Pa), so o is the coll ision cross-section Cm m*). In a typical mass 30® , n a i¾: 45 c K)¾! rr, the me n free path equation s rp!lfieaf l>:4.95/p, wlere L its ce etorsi anti p k k fo- Torr In Is oTatosy-scs mass s ectrometers,. ion filtering and etection usually occur in high acuum* t,e, <Iti5 Terr, cattmapost iag to a mean free path of >4.95 meters. IMs necessary to achieve high ressolntion se arati n of ions. To- achieve a pressure of lCf5 Torr wi th availablevac um oelt ologies, s two*4tage vacuum generati n ocess is utilized First, the essure is reduced to - -ICfo Torr usi g nshanieal or roughing purnps, tad free e or moe tofrcMt eeular pum * ion props, or cryogenic omps fttrfrer reduc frt ressote to t0's Terr Turbo molecular pumps provide relati ely higher pumping ca acities! compared to ion pro s mi are mom appropriate tor tmos heric pressure sa ling mi kmkaim Ion u ps have advsntages when ibration!»© operation and uhra» h vacuu is require (vacuum levels of < iCf Torr)
Prior to the Introduction of soft fon Mion and ambient ionizati n toeMipeig mass s ectrometry was general iy liMried to the analysis of volatile, relatively iow- oteeokruRass samples, sod ess spectrometric analysis of lio oisoyles wss illleoltifnot lm ossifeiK Also, conventional ionisation sources suc as electron impact ionia i m caused excessive fim tetmtion when applied to bi mole les The advent of soft ionization techniques, which produce ass spectra with Itle or no fragme stitst m amgrienr or ow-amblerd onvironneot, ade it possible to analyze large organic molecules and hio oleeufes with mass spectrooreMS. In particular, the dtwe p ent ofe!settospray lofoation (ESI) and atrix-asisted laser esorptlosdloKieation (MALDI) has extend d the appliceti c of mass speairo oby to ro eeufes These te iniipes have emonstrated unparalleled advantages, for example its analyzing peptides end proteins, because of the speed of ex eriments, the amount of information generated, and the outstanding rasoM m and to&Mvitfcs ufi¾ l
Among various soft ionization techniques, ESI sources are best suied for direct hfom !eeoks. ESI may fteetiuts as a liquid sam le introdu ion syste ® (typically a
50/50 mixture of waf eE/metban with 0.1-1% acehcorforaik add) enters a narrow eapll&ry and leaves the cap!kry as a liquid spy. The voltage at the end !' the capillary Is sigMf ndy higher (3 to 5 k¥) than that of the mass anal yzes s the sample m spreyed or ispersed into an aerosol of laigM charged droplets. Ivaponatlon of solvent deuroaos Use si e of t e droplets, Because the electrically charge droplets rmsm their efearge hut get smeller, their eleetrie field leereases. At some point, utual ropusMon between like charges casrses sons to leave the surface of the droplet As a result, multiply charged ions from mdi vi nal biotnolec l ea, fee from solvent ae released anil enter the aampl i mlet for analysis by the ass spectrometer.
Except fiat MALDI a d similar fOTzafrotr metho s first ionize sa ples in the frigh-vae im rgion, most ass spectrometry techniques for iwiyzfe bu olecules rely on mrfuces or sam ling Mets that deliver as-phase olecular loos from at ospheric pre ize m near atmospheric presure to high vacuum through orifices or eapi!lm½s, Achievin high ion transfer efficiencies tor ass spectrometers is emcM and chell eagiag; Couducrntwe limiting orifice plat® enable differential pumping of various stages of a mass s ectr ete; Smaller orifices enable operatio wiiii lower pumping capacities but result In lower i transfer efSct e s. Lsrgernferoeter orifices may improve the efficiency of ion transfer but allow more neutrals to ertter tbs vaekrom region, tiros rciplrio lettr, higher- speed pomps to maintain the desired vacuum. Therefore, the pumpi ng cpacity of the vcuu system Indirectly determines the Ion transfer efficiency,b$mm the size an dimensi ns of the sampling; inlet must he designed saw ng to the u pin capacity of the vac u system. Finding the right halsnce between the pumping capacity and the ion tra $tet efficiency is a ch&il egging design consl er ioo for ass, spectrometers if a limited pumping capacity Is available. Various sampling mes niisms are developed to a dress the aboveutoMs challenges, such m the keoafmuaos· atmospheric rases® interface (DAM) and the pulse inhole atmospheric pressu interface (FP-AFl). The couiauows atmospheric pressure interface enabl ed by diiisrenii al pumping i s another sampling mechanism ial uses »telksta§e vacuu pumps for differential pumping, to wide gra ual pressure re ued m. transport tons ¾»n tmos heric pressure to high vacuum , The mu t to which the motion of tons may he control ted in different vacuum sta es det rmines the overall ism transmission effi iency of de mass s ectro ete Recently im founds have attracted significant interest in atmospheric pressure sampling in a tion to the e vmtttonl midtipole ion guides. Ion funnels enable die manipuliaioa and fbeusrag uf ions in a pressureregime (0.01 to 3 Totr), providing mm peater km Pinsmiisaoo ei Usually, loci funnels are located rght after heated ea l&ry inlets m a mass spectrometer. Ion fu nels arc rigid structures that g ides iotas in mi -v&osum l ev of iOl to 30 Terr.
In \m funnels·, the spacing between ring electrode are constant.
Mass t yoefs are the core «om stmt of mass speoltOte uts a d a typically ahteactorize by tfeek ass range and resolution. esa range is the axi ummass resol able mass by the analyser. Resolution is ms indicator of b w selective a ass· filter is In distinpi sfeittg tons with mf* that ere osein value. Titus fer, vario s ass analyzers with different mechanisms have been developed. Genera! nmss s ectrometry handbooks povide detailed scriptions of various ass analyzers. Mass naly ers may be categorized into bea .analyzers, sued as gus mp te and TOP analyzers, and trapping analyzers* such as ion traps.
Faraday cu s so icro channel plate (MCF) detectors are the t o most widely used ion detectors in mass spectrometry. Faraday cups may operate at high ressures (up to st ospbc c pressure), but are sensitive an are not compatible with highresdution mass spectrometry due to slow response ti es. MCFs su ot high mass resolution* dynamic range*, and detection sensitivity. Most modern MO* etectOta sht of two MC g with ttgled m& s rotated I 0-s Irons eacfe other, prodticmg a chevron (vdike-i shape. ¾ angle between fc dmnels m ttees lm fee back Its a chewse M€P? the desir us that ©¾:¼ Use first late initiate the c scade in the neat plate. The advantage of the chevron MCF ove the straight tamtel MCP Is si nificantly more gain at a gives voltage ¾ two MCFs taay either he pressed together oar have a small a b twen them to pr«J the ete acrosa multiple ebmtmis
With the ad ent of mnMerit desorpdoo i teaii n sooroas.: which des fb d i nize molecules in their native state, the applications of ass spectrometers have been extended signifteandy. For esat le, ambient desorption. iomzailoR teehnigttes may he use to anal yze human ti ssues during a surgery to differentiate cancer celts. A§ other eample, a bient ioaiz ii desorption toefrn iss tts&y he u ed in homds d security to monito cargo and passengers at security shock points for ©xpfosives. Three iffeent sce arios have been use thus fhr for such appti cations. In die coiweteional ethod shown in FIG. IB, the sa pl s are brught close to- a mass spectrometer for ionization anti analyses. Its. this approach, samples are directly place m froth of a mass spectromeler. Its a second approach shown i ts FIG: I C„ samples or sample molecules ate transferred through a bare tube 1 ¾ which may he plasd c or m«sl, Imo the Ion source 11 of the mass s ctroitto A sampli ng medium, such water, may be used to mix sample wi th sampling medium to he transferred through tit® btu¾ mb© to a mass spectro eter. In the tMt-d approach shown in FIG; ID, samples are ionizedusing an ion source that Is detached from a mass spectromete an tfte produced ions ere hmsf «d via the haretube 19 to a ass s ete setor f r analysis Alt of t ose a proaches have tsa Mte m For example, placing a sample directly m front of a mass spectrometer (FIG. IB) may not he praef aj In many app!!eatb pmt ukriy when the mp!© is bulky r immobile. Second transferring sample molecules via the bare tube If to a ass spectromette' (FIG. 2B) e y result m ttteteory e octs ten sa ple tesi ttoi eeuto stklkg to to toer surface of to bare ube 19. These residues may contaminate the inner si e of the bare tube 1¾ and may adversely affect the analytical «suits. Transferring ions through bare tube 19» sho s m FIG ID, ay result in decreased km transfer efficiency as a rasfority of ions are Ms! to theinner walls of t e bare tuba it s d deteriorate ion transfer efficiency. In other wor s, the ion transfer efficiency of this metho ma not be rnhSckup e a majority of ions may be te¾t in the to transfer rocess, thus negatively affecting atm!yiical erformance
SUMMARY
One or more e bodi ents of to resent disclosure retoea to A flexible ion transfer e re tot may totoerions fern a is Ic to to a secon location, ¾eb that to i¾t location ay be n a roxi ity of w ere sa ples to be analysed are locate and the secon Joe&tto A hee a met spectrometer k located ass spectro eters are still bulk bet the growing demand of mass af»etromete« in oint tdocedCgir iohoa, such as e ical and. security applleatloas require havin mass s irometers «tore toces ble. With to conventtoal mass specromeers, that is ne possible because mass spectrometers are bulky and large further, a bient to&to techniques prottee loos from «oples- in their native environmen (such as human tissues during surgery to detect cancer cells). Therefore, the present disclos re aims to ovide on improvement over the sta ofThe-art by providing a flexible i trersfer de ice that ay he connecte between an ambient l o source (which ay bo cmstmcted as an application-specific or neai-purpose tooiaarion prebe) in first location and a ass s etro eter m a second location such to.t to ions produced by to ion source may be efficiently imt d to a mass spectrometer via the todbte ion h¾osl device. The tteible ion transfer devic provides an advantage tot m operator/urer may easily move to \m m M XMIK! the sa ple and ay pro uce tons for ass spectrometry anal
Farther,vario s its sources or ton scarce pro es rna be attached to a stogie ass s eferoroetei; which r cals In e efSetont n¾ of a mss spectrometer. it k noted that the s&nrpk analyst s to a mass spectrometer fo the morami tons ae produced o iw moment too ions are deteste by tie detector takes rmllraceonris to a few seconds. lleroforo, m« s osro ete are ideally able to provide eontin oi analysis every few Sec nds at tm Ifewevuq tlw sam le feiro yetiem techniques are cu ently a limiting factor of fee pocess. The time in between two ass s et¾rc etr analyses cui i ily lag behind a mass speetro oiers ideal throughut because of the slow sam le Imroneri Therefore, toductog a se uence of tons packets to he analysed by a . ass sectro ete will significantly improve throughput of mass spocirametry as¾ l si s. For example, sequentially pasted ions ay be produced from various iodcsriori sources ted rnay be queue and transferred to a ttrass itpecdontetor for analysis, feus Increasing thtwghprt of anal ses. l¾e present disclosure provides an Ion transfer device and an roe transfer ethod tor producing loos in a e ote !oo ton end for irs ferofeg the produced Ions setpetfeally to a M S spectrometer tor analysis
In one or more embodiments, n i on transfer device transfers Ions from at feast one ion into to at Imt mm Ion ootler o the too t nsfer device, an the ton transfer device includes an enclosure coni gored to Mai tain reduced pressure; sad a plurality of eiecOosles disposed at least in part inside the enclosure arch that the Ion transfer device is configure to be fl xible or raroonilprabk.
to one or me ctnbodl tcfeg the ton transfer device is eontlgure to be bmi i¼m two or more bend ash loro to form a plurality of airvaturas while actively and efffefendy transferring fee ions.
In one or ote tnbo luranto the pluralit of electrodes are flexibly co tracted to each other to make the too transfer device ^-config rable while actively transferring th Ions from a ftrat location to a second lucauon. In: « s or re embodiments, the one or more JOK r nsfer «closures sod on ¾" more ds es are feibly ausebod to e&ch ot er to allo the l o trMsi wice to tansfer the i us in two or ore different sh es.
In one or more ern odimeMs, dm i n transfer device Is emilguted; to be Smnsfeonabito between two or more different physical shapes, and the ion transfer deice Is e figntod to tansfer the loos in the two or ae difiereni hysios! shapes fimn t e at lest one o infef to the M mm e outlet
In one or more embodiments, the reduced ressure In which « ion t nslfer device Is reclatafee st Is between 0,00! to 1 0 Tore
In one or more embodiments, the Ion taesfer device is eHsasifigyrnfeie &ud !t sfo talde between at least a first ettofigunhfen and a second ct>nSgm¾tfen such that the Ion transfer device, in the first e figu lon, trensfers Ions from a first location to a secon teeMiom an t e fen tansfer device, in the second configuration, transfers the Ions from the first location to a third location, the third location being different from she second location.
In one or mote embodimets, at least two of the plurality of deetfodes are eooflgnred to be flexibly Sadhed to each other asiug electrically mauJating aterial
In one or more embodiments, a first group of electrodes include a first number of' she piutalty of electrodes arc abashed to s elt other In a ao -ffaiy e anner, a secon grou of -electrodes Including a scond number of the plurality of electrodes arc attache to each other in a noiwieaiMe tnanug and the first group of electrodes and the seco group of electrodes are a ire to smelt other m a il sibiiemauucFto allow bending of the first group of electrodes or the second group of efeettsefes crenn me or more ases with respect to eac other.
In ne or more embodiments, the plurality of electrodes are ring-shaped decirodes shat form art elongated ton funnel sttoch to: * the plurality of etoetrocte mo wiresn feel-osl form
to; one om embtvintenfa, the plortoi% of eteeredes ¾ra disposed parallel to each other and era elongated along an axi s of the ion transfer device. to ne w moe embodiments* tie plurality of dcetrodes are attached to inner swfecn of the enclosure,
to ¾t¾ or more emboiments* RF vtotsge and PC voltage are a lied to each of the plurality of electrodes, sd the EF voltag mi DC voltage am applie to each of the plurality of dleotofe respectively via a oapa.eitor and a red star. to ne or raora embodiments* to PC voltage Is traveling DC voltage el se. In on ormore embodbeetos, RF voltage applied to each of tie plurality of deetftxfcs k ut of phase wi th toe E.F dhm a l ied to ajaoeat electrodes, in one or mere embodiments, the PC vdfege esoses the fens to move axially rail to m axis of the km tmmfer evice, tod the IF voltage e oses too tons to move radially around the so s of the k® transfer device.
to one or more etnioitnords, the too transfer devce is conect to an ion source that is eonttpred to he freely movable in 3-tometofeoto s e to bring it hi dose to a sample trader teat to roduce the ions from the sample trader teal.
to one or more emdodme an 1m t ly system t nelu es at toast one
Ion source configured to produce ions from a sample; at least one Ion transfer device having an enclosure, and a jpferaluv of etoefrotfcs dl spose at toast In et insMe too OTGIMIM such that the ion transfer evice; is configured to be flexible or re- configurable; and a trsum body having at least one analyser eotfe tod to soparaio the tm$ bae m mobility or mass to char e «do; an at least on detector configured to detect the separated Ions..
in o?ae of m«¾ emboditMfe a met o inclu es pfodn ng ions from a sample; transferring toe ions with at least one i on transfer device that s c fipued to be felbfe or ra-ooofignrabfe the Ion transfer device having en«Io¾«, mid a toraJiw of electrodes disposed least pan: iMtofe Ik nelo rie; se tf¾ tlse tons with at least one osalyzer configured to se arate the ions b sed cm mobility or i» lo dmg r » «d debsettog the *»t?Medtons with it least one defector,
BRIEF DESCRiFriO OF DRAWINGS Certain embc hntmts of the present diseloKLsre are described ith refeimce to the csontpfeiyfeg rawing . Ilowever, the aceompam-irig dttwtogs illustrate only certain aspects or iroplemenidroife of the present disdosure by ay of es rapte and ana not m ant to limit its© scope of the claims.
FIG, 1 A shows a Week diagram of a eonvenironal ass spectr eter,
FIG.1 B sho s a bl ck diagram of a coovemiood ass spectro sfer.
FIG.1C sho ws a bl ock diagram of a eonvemioal ass spectrometer mak that the im souce ½ detached from the tors grade and the fees are tr&nsferrod to to® guide of & mass s eetro eer via a bite trite
FIG, ID s e s a block: diagam of a ronventioml m ss spectro eter such that the sample is located at a distance from the too roraee an the tons arc i«si¾tro to Ion source of a m ss sp;cttonteMt via a hare tribe.
FIG.2A shows a block dksgrsm of a mass spectrometry system each that the JGA source detached from the top guide an t he ions are eildeutly transferred to ion guide via a iteihfe or re-cofrilfsi ble ion transfer device aceordmsce with one or moe etiibitolments of the present lsdosure,
FIG.2B shows a blac diagram of a a s spectrometry syste swell that the too source to form of &n Ion soy roe probe is detached from the tort guid d the i mis arc eild ctttl y transferred to- the ion gui e vis a flexible or reroonfi rattle ton transfer device to accordance with oe or more embodiments of the present irotoswe,
FIG.2C shows a block diagram of a mass spedroraery system such that the ton mm® to detadfet! feotn the mass spectrometer md the toes pro uced to. mi kxtfcatien grob© are ell etffiy tsoostkrod to tie n»s s ea&ro -eter v a ftaifle orr©eoafi prafele k¾n transfer deice ¾ accordance with one or ore embodiments o the presort disclosure,
FIG.2D sho s a block diagram of a mass speeiro etsr such that the ion sooree detached torn the mass spectrometer anil the i ns produce lom iqn robe Me efildefdJy pmnffkred to the mass speeiromeioi: via a farbk crreeo»fl§i*ttfele ion itmisik deice n aecorfa ee th site or owe e todlm ts of the present disclosure.
FIG.2E shows a block diagram of a mass s ectrometry s stem such that the e source ¼ detached fro the ion ude and the l tts are efficiently transferre to too guide via a flexible or ereonfsgos to on transfer evice in accordance with « or om embodiments of the resent dkcteute.
FIG.2F stows a Moc dagra of a mass speetomeiry system snets that the loo source is dehseM. o the i n guide md the Ions are efficiently tetssltaed to ioa -Lide via a flexible or rereonigerabie Ion transfe device ia accordance with e or more embodiments of the present disclosure.
FIG.3 A shows ablock diagram of a mass spectrometry system such that: three different ion sources are attached to ass spectrometry system via flexible or fe-ecMthg rabie ion transfer devices re accordance with erne or ute em o i ents of the present disclosure.
FIG.3B stows a bloc iagram of a mass spectrometry system such that three different ion mam are efScieafly transfer tors to two differani ass spectrometry s stems via flexible or re-eouigurahie loo transfer de ices in accordance ith one or ore emboiments of the present isclosure.
FIG.4A, F!G.4B, FIG.4C, and FIG.4I> stow bl ock diagrams of different eouigumtions for loo ttirtsfcr devices i aceoffbot with ne or more em oim nts of the pressai isclosure. FIG. 5 A, FIO, SB, « FlO: 5C %how block iara s of dt&e ¥nf!gursii«as of ion transfer eise is accodance with me or more embo uneais. of the r ent disclosure,
FIG 6A FIG.6B, FIG. #C„ and FIG 61) show perspective views offlexible m re-cosigmtbie km ransfe devise m aeeatdtase with one or «ser rabodia fe of the rea at. diwkoure.
FIG.7.4 anti FIG·. IB sho peripeeSvi iews effl&a&it o m€rmii rabfe n transfer device Is accordance with one or is¾ e bodiments of die present discloaus©.
FIG, IA, FIG, IB, tod FIG, 1C show tent views of etetrotfes of flexi l or re-wooi gursble ion. transferdevice in scnorfance with one or more embodiments of the resen disclosure.
FIG.9A, FIG. OB, FIG.9€s FIG.9D, an FIG.01 show eross~sectk>u views of electrodes of flexible or rwcmifigurahle Ion is fer device copoecmd to eac other in accor ant® with one or ore ernbrxllmems of the resent diclosur ,
FIG 10A and FIG. B show perspective views of etatode structure of fcdhb or t¾-eonilgntihb Ion rasfer device in accordance with one or more emboiments of the present disclosure.
FIG.1 LA FIG·. I IB, and FIG, I i€ show erspecti ve ie s of falbb or remonSgurable ion transfer device including three electrode structures eonoeete to uadi other m ac or a ce with one or snore e hodtmenrs of the ocM disclosure
FIG. 12 A and F!G. 1 B show perspective views of flexible or re»· configurable ion transfer device including le en Gectrode iryetmes connecte to each other In accordance with one or more embodiments. of the present disclosure.
FIG.13- shows a pers ective view of flexible or re-eonfiptihle 1cm tmt fe evice including : t o electrode structures connected to each other accord nce with one or mom embodi ents of the presen t di dosure, FIG.1 A, FIG.. I4B, mi FIB I4C sho ers ective vie s e ek afe and electrode geometries of ffesfole or re-configurable Ion trsrfer device In accordance with one or matt em lMcnts of t e present direloMre,
FIG. SA, FIG-. I SB, and FIB. ISC show perspective views of flexible or e-config sbk loo transfer devices In accor ance with one or more emho bn fe of the present di reinsure.
FIB.16 shows perspective view of electrode a«etcy of Sedbi© or re- ronf!gurebte bn transfer de ice m accordance with one gr more embodiments of ill® pnese disclosure.
FIG.17 A an FIG 17® show two d® vfe s of ion trajectory fonihatlon In flexible or w-crefogurable i® transfr device In acordance with one or ore ensh ltnents of the present iselew®,
FIG. IS shows 1¾F anil DC voltage avefo s for flexible or re- eonfi mhle tort transfer evice m aoeor anco with one or morn «nhodtntcnts of th pesent dhe re
FIG 19 sho s EF mi DC voltge waveforms for flexible or .re eotfopttbie Ion ttmesfor de fee m acco ance ith one or mote OTbcall e ts of the preseM disclosure.
FIG.2Q allo s i flow chart of a method fo lOTifemog Ions wi th teMe or e«Sgu ble ion transfer device m accodance with one or more ®uho immts of the res t disclosure.
FIG.21 hows a block diagram of control unit for Ion transfer device upon which one or more e bodiments of the present disclosure may he implemented
DETAILED DESCRIPTION
to general, embodiments of the present disci smir rel sited to a fl exible or re eonignnble ion transfer device sod methods for tn siemng fons with a flexible or rreonEgumbl© ion transfer deice. S ecific tlxAi ta « dts oacd with ti xas® «© the «esi tfttnyhg drawings. In She following escription, numerous details aro set forth as examples of the pfo t isclosure.1 will he uiide tood by those skills the art that one or more emb»diimer»& of the prese t disclosure may be practiced without these speckle details an that nnmertms «nati ns or medife&ti«m ay be possi le without departing from the sco e of the invention. Certain details own to those of ordinary skill to the art arc omitted to avoid obsaumg lie description.
f!0, 2A shows block diagram of a ass spectrometry system suc that: the ion source 21 is detached from the km guide D and the ons- ate eflciestily trauyfeed to loo guide via a falble re-cool gurable loo transfer device 21 m acoonlanee with one or raora embodiments of tiie present disclosue. The mass spectrometry s im, as disclosed heeby stay include the km sourc 2L the Ion transfer device 20, the ion guide 13, the mass analyser IS, the det ctor 1 ?, and the corresponding vacuu system and etoctroni os (additional sub-systems) for proper operation an foil functionality. Additional sub-systms for a ass spectrometer are shown In P!D. I and omitted In this and other figures of the presorti application to av d obs iting the tiera ficu and rawings and for maintaining stmp!idty of illustration. One of ordinar skill in the art, in view of the present dis osure, will eoiietft id that the m ss sf w etry syste includes additional sub-t teiM sudt as those shown in PIG..1 A for full functionality an operation.
In FIG- 2A, the ass x eofrome syste In oties an ion source 21 that Is detache fro an im guide 13 of the mass spectrcanetry system and the i ons are efficiently transferred front the ion source 21 to the l o guide 13 of the mass spectrometry yst through the km transf r device 20, which fiesihle or rw configurable. The ion guide 13 may be one or more ion funnels, or one or more Muitl e Ions guides lisvfog a plurality of even nu ber of pdos used hi conventional it» spectrometers. The ion source 21 ma he eieetrospray, lasma, glo discharge, laser, photo-iottfealfon, or a eomhfoahoe of the used In ambient fcmtatien tedtM< e& Id me or ore ettbo l rdy tie ten source 21 mtty use any ambient io&teabcBi techniques under cate oric ^exfr&ctlorT (a solid o liquid extraction process s dynamically foil owed by spray or dhe kal lookat n), "pbs sT (thermal or chemical desorption with chemical ramztfion), ii*v< siep'" (desor tion: r ablation fe!Jowed fey isi¾atioos‘laser (laser desorption or ablation followed by bnl tloo),“Mroustbs (asmisik desorption fallo ed by ionization), or multimode (imbfvtei two of iw ibex# o es!.
In one r more embodiments, the ioo souce 20 a be any of Ah How-· assisted iaru&aiiaa,, Air fiow-assisted desorption ei cte®spiaj ionization.
Atmospheric pessue glow discharge dcsorptbu Ionization, Ambient ressure pyroelectric ion souce, Atmospheric pressure thermal destK tkws chemical n atlnn, At os heric pressure thermal (tesot tioniionianen, Atmospheric pressure solids analysis p be, Beta eleotfon-asslsfe direct chemteal ionization, Charge i lsied lase deser tlmm nizatli¾ Desorption mosphetie pressre chemical Ionization, Desorption atmospheric pressure pfe obabati», Direct analysis in real bras, Dielectric banter discharge t rd^ffio . Desorption corotta beam Ionization, Des rption ch«ical io iion, Deso ti n declro-llow focosi eg ionization, Desorption el oetrospraybiolastafeie-'in duced: ionization, Lbsorptlon deotrospny k ihe , Desorption. sonic s ray z im Desor tion ionization fey charge exchange. Direct inlet cobe-atmosphsric- ressnre chemical ionization. Direct probe deetrosp y ionization, E eirodmzsriated desorption oietrosp y ionization. Easy ambient sunk-spay ionis tio . Extractive etearospray Ioni ation, Bbetraspoty laser deeerpt u ionization, Eleettospray- sssted pyrolysis ioelzation, Eieepostafic spray ionization, Flowing at spheric p ure akcrglow, Field induced droplet Ionization, fighwo!tage-sssi sled lase desorption ionization, LMiam atmospheric pressure glow db isr iomzaiion, h med laser ablation etastahledodneed che ical Ionization, let desorption e!eetrosprsy Ionization, Laser asslAed desorptiesa eleeirospmy Ionization:, Laser ablation ebotrospra l nmti , L ser abtat n flowing at os heric pmsw .afterglo , Laser sMal rt inductively couple plas a, Laser desorption atmospheric pressure efeerascal ionhatk , aw diode thermal e^pbcm, Law esortion e st p ? ionization, Laser desorption s ray postdonization, Laser deeires my mas spectrometry, Liquid extraction surface analysis, aw- d«ce acoustic dsaaipi ii-ele tTO sw knuzation, Liqui ma©-j unction-wface sam lin probe, Lai enflost ptara tmoMsrism therma desoption, Liquid sam ling- atmospheric pressure glow ischarge, Laser spay Ionization, L w te peraure plasma, Matri -ass iad Me! ionization, M oMstistod laser desorption eteiros ay ionization, MscofeMeated glow ischarge lasma, microwave induced plasma desorption ionization, Nano^spcay desorption eut.reis.p ybn at sn, Neutral desorption extractive tdeetrs^r imu¾¾titm, Fisma- slsie deo tion ionraatieiy Paint spray, Plasms-assisted tee desorption amz ioa, Fle a-ssistsd ntultiwavc agtii law des p-tkm io ization, Piastnt-sased ambient sampilngdonlaedesntranamlasion, Paper assiste ultrasonic spray looizalioa, Probe eleeirosp¾y kytiz ttm, Piper spray, 3¾pitii tip column eerax ray ionizati n, Rsd fe eeey acoustic clesurpion mi omxMcM, Re ote Millets sa pling transport and ionization May, Rapid evaporative k ation MISS s ctrOTotry, Robotc las a probeit izatkm, Surface activated chemical ionization, Solveurassisted mist: ionization. Surface acoustic wave nofeul tk , Secon ary clectmspray Ionization, Solid probe assiste Nano- electropray ionization, Single^particle aeos l smm spectrometry, SpoageeSpray Ionization, Surftae sampling probe. Switched fbms cotrk- plas a Ionizer, Thermal dcsorikn baaed a bient mass ypeet raetry, Transmission o e desorption elecirospray ionization, Touch spray, Lltrasomcaboerassisted spray Ionization, Veriti easy a b rt so ic-s ray i nization Rmafe-Spray taxation, or Fiber- Spray Ionization to: n;: of more r«-c«slgynfofo or flexible m the present disclosure is defined as the capability of being transformed between at less! two different shaes or forms, o befog transformed fo one cofolgu iMi o another 5 configniati In one or me e embodiments, this transformed on occurs and a stop® m a form of the fou transfer device 2@ is chan e when ons ate being actively tmasfered y lire ion ransfer device SO. The ion transfer device 20 ay have a plurality of bend poitions 12& tad 12b, so the ion transfer evice ay form one or more enrcaiures around the ben p sfoe in one or re embodi e ts, the 0 flexible or ^co fi u ble km transfer device 20 ma hoi d or ids# anew shape or tern after chan ing the shape or form from an old shape to a new shap , for examle, by a force applied by hands of user or an operator in « or mote mh Imerds, the flexible or ^-configurable ion transfer evice 2-0 ay be soft ari ay BOS retain or hold a ne s a e or form alter changn foe shape or form fromS an d shape to the new shpe. In one or mor cnibodiMcnts, flexible o re- configurable in the present di sclosur i s defined as foe capabi lity of being bent and Icing able to chan e from an old form or slope to a ste form or slo e h n foe ion transfer device 21 is actively fransfeotug the tons, to one or more embo iments, flexible or re-ecmflguraMe may be defined as the son transfer device 20 having aft plurality of bend positions soc!t that foe i n tnntfer evice 20 may fbm cumexre& In one or more embod ents, flexibility is defined ns foe achievable range of spofion or being at a heed position or a pkirallty ofbead poskions wii af!tain ion hrasssfer efficiency of the ion transfer device 20, without losing the fraicdonality of the ion transfer device 2fo or without shoring electrical connections of the ion5 transfer device 2ft, In one embodment,flexible Is defined as befog capable of having a plurality of curvatures around an axis of the ion transfer device 20. In one embcMjiment, fatbiilty of the ton transfer device 0may or may no man a from or a shape while being flexible or ra^onf!gurabfe. In one or mote embodiments, flexibility may be defined as spacing between electrodes of the ion transferdevice ne tr toct e enfe imenkg being flexible a& feeing rereonllgwabfe may be used in an mtwtsngte anner.
Th ion trmsfer devise 20 h a diameter tod a lertffe, The fesmcter may fee tl¾¾ ss e or if erent aioog the fen tra sfe device 20. In ooe or more ertbo i«t the dt&metor of the io transfer evise 2f> may fee any value betw en 0.2 to 2 fee½s or even u to 5 inches, the length of the :i Mmsfer device 20 may he any value between 0.5 to MtOO fe , or 1 to 500 f»t. hi «e or ore embodiments, the length may he 2, S, !ø, 100 or even 1000 ti es of the diameter (or the largest or the smallest diameter if the di ameter varies long the length). The length deBaed as the distance between th p im the ten twister device 20 Is conaected to foe lots somce 21, (or for example the loo inlet of the ion tauuder device 20) and the poi nt the lee trattster device 20 Is connected to the MU idc O (or for exa ple t e io« ouifef of the Ion transfer device 20) hen the km transfer device 2 is in the fonn of a skitg Wine between these two poi nts. The lott inlet (illustrated in drawiup as dcms > and the Ion outlet (illustrated in drawing as Tons όoG in the present disclosure are deli tied as sides of Ion tunisfer device from which Ions respectively enter and exit the ten transfer device 20.
FIG. 2B shows a block diagram of a mass spectrometry syste such ha the lett sretroc pfobe 22 Is tietatfe from the ion gli e U and ke are eftkfent!y transferred to ion guide 13 via a flexible or rereeniigumbie i on transfer device 20 in aeeotslnnce will? « rnp i of t prerefe disclosure.. The mass spvctmmoiry system shown in FIG. 2B Includes a flexible k t a sfe device 0, which may efficiently transfer ions from a and-held or portable ionization probe 22 to an ion goide 13 of a conventional mass speetromeier that als fed odes a mass analyzer 15 and a detector 17.
Th terms "Egk f or ·¾)¾¾»# t r” of ions or "o fee i« defined the present dfedt ire as the transfer of mm wife no ton loss or with minima! loss. Tim loti lorn may be KSM by colliskttsof ions with the inner walls of the oo ttuife device 20 or by ©oiidiog with structures dispose inside the m transfer tube 20. In seme e bodime ts, $ m kn ansfer ay be JM tr nsfer wi th the ratio of km kng k km mtM of k im !rmvkr db ce 2ΰ to the km entering f km inM qfke km &ma$r devte# 29 being letter than 0,99, 0.95, 0.90, 0 S, 0/80, 0,5* 0,2 orOJ,
trmsfer device 2§ hn m> ko e appiie to ike imt mmitfir evice 29” being geater tha , for estm le, 15, 2, 3, 1QS 50, 500, 1000, r ing greater than 3000 ormore. In one m mere s hckl ents, effk wi may be defined as the percentage of Jons exiting the outlet ttf the tonransfer evice 20. The efficiency may be geater than 90%, 5 %, or 10% The number of ions entering the kn inlet or ediing the kn outlet of the ion itittsf device 20 ay he meatuted or guaMtikil, for example, by onitoring ion current at the kn inlet or kn outlet of the i on tansfer device 20 with krt «rat defector soeh as MI a meter, ¾¾ d momeeg or an ekvhwn multiplier, In ne ot more embedments, derive ka transfer or ^ckmfy trmfecring ions hi the pres nt ii sciosura is defined s transfer of ions with aid of electric Helds or praeMals crested by «pplkatMu of voltages to lectrodes o the i t n ier device 20 or when various voltages (such as DC or RF or a combination of both) are applied to 4<totmdies of the ion transfer device 20 TfeMfe or ovemen of iom ksideihe ion transfer device 20 may he under m effect of electric Hel , or gas flow* or a eomMnntl oa of both. Further, iomkn .repulsion ay move I ons Insi de the ion transfer device 20.
The pressure Inside the ion transfer device may be in the r tge of 0.001 to 7bP Tott, this ressureregime,. the loos li»e a elati ey small meat* fee pair, (in the order of s few nanometers to- several ierarnete), so therefore,. collision o imis with backgrou d! gas s te ksiie the k ifMsfer device SO tod when loos are bekg transferred or graded inside the io transfer de ice 2 , The collision of teas with the back ound §ss (for example a molecules) in these pressure regimes results in ions is¾ travelling is ^aigtrt lings nd frequently collidmg with haetemmd gas molecules an changing path as a remit of these eai ons.. Out of phase IF voltages (or alttmadrtg cur ent (AC) voltages) are used in conj nction with DC oltages to sli on ll y p.ii ds an ra sfer die ions nside tm transfer device 20. RF voltages Miy push i ons tew&fds a central sods of the tel transfer evko 20 an malniafe loos in a central portion of the loo transfer device 20, thus preventing ions from colliding with inner walls and being lost. WMie RF voitages and the resulting electric- d fr¥ RF voltages ratal» ions in a centra! portion of the ion trans er device 20 (for ex ple al ng a longitudinal axis of the i® transfer device 20), the DC volt ge may provide * gradient ro franri¾r and gni.de the km m direettea towards ten outlet of the im transfer device 20
The ten transfer evice 20 may bo in a shape of a fl etebl a t be or a fie ble bellow with a plurality of etetrodss disposed inride fee flexible tube or bellow toreceive: the loos from art ten inlet of the ion transfer tube 20 item M ioriisrariau i«ik^ s ch as the andheld lonkatroa probe 22, and lira actively transfer the loos to an ion outlet of the ion transfer device 20, where ions then enter the ion gra e 13 of the mss s ciroroeie .
It is noted that although fee present disclosure mainly describes use of a mass xp«lro vkr to describe peMtei of the i transfer devise 20, how ver, cue o ordinary skill m fee ait will reeopi® and usderstand feat the resent discl su e may also elate to an ion mobili ty speedomete or any othe a aratus feat transfers ps phase i« teas m the present disclosure a e defined ss charged partlclm having positive or negati ve cha ges. Therefore, all the example in which a mass· spectrometer h described ma e similarly a lied to MI i obili y spectrometer, or any other apparatus using an ions or electrons, or any charged particles. In one o more embodiments» ions are atoms or olecules with a not electric charge oe to the l ss or in of «on or re ekefransc ami the ¾to« or m ecoles ay he the sa e or different:.
The iort tr nsfer de ice 20 ay fochnSe a tube a e to a sfogte pm suc as a plsstk etal t be or ma e from muMfsile l bes dial are cemt ded to each other, One or more layers of trims ay ho use to rovi e vae sm igte« md also for hoesmg wires, ca acitos, resi ors and efeekmle sn between foifoient layers of tobing, The plastic tube may be a beat -shrink tubs. ldest-fotmk tube may tse made of a y one of thermoplastics, in mlng pd Dleim, polyvkry! ehfohdle fPVC) Vltoii® ffor high erap and ooitosive eoviron eots), eopmoelP, dytet OoeTOeih lete CPTFI¾ lluctrinaied ethylene pep lene (FEP) attd Kynsf®. fo addition to t ese polymers, some yes of s eeial-applioatlon beat i t may al» mdude art a esive lining that ma help to bon the tubing is underl ing electrodes and connectors, forming stong seals that ay be erpreef or gas-tight aufiktait to mmmmn the eg tod pressure mslda the ion teofer tribe 20. In one embodiment, the heawstefek tubing may have conductive polymer thick film to provides efechicat conneetka® between the wo or more deetm s withoot foe nee to s ldering, to shMd the efe OTtageeik field pre ao by the RF vol tages of the i on transfer device 20·.
The sam le, as she m FIG/ 2B, may be any abitrary sam le i ler analysis or tost, which the ion source probe 22 produces ions from, such as a biological sa le, a human nr a it aTtisMis, or an sample of rntefs thatincl es trace amount of analyte of Interest, or a geological sa le. The sample y be a human body part for exam le a human hand, for exa le, being screen for skin cancer. The ion transfer evice 21) may have a plurality uffeend ositio :* I2a; 12b, 12c.
FIG.2C s o s a lt«k diagmm «if a crervc tlrMal e s ectro eter 21 sad* ifeat the ion sooroe s detache fern tie mass spectometer and tine ions pre&ad k at* ionfo&tfon probe :2S ar fmasietred t the ess spnetromotor 23 vi a a flesihle or roHro. ig¥b mn ttiMibr feioe 2 in teeardattee wMi on* emboimemis of the present disci t sre. A e¥veatksaal ass spectrometer23 Is «ml an tire fenkittiM source of the mas sftectoriteter (which is directly attached to l¾¾ mass «.peetramete· 23 in fii&ce of an adapter 24} A replace will an ion transfer device I@ including the adapter 24 m m$ md it® ilia km outlet side) fi t is cosmecEed to the ass vpeeirametsr 23 an an ii feation obe 25 i.he odret end of the Ion trimsfer device 2d ( fhi ion inlet side). Jk one embo iment* tfee adapter 24, the Ion trans r device 2(1 and the boiaafei probe 25 replaces conventional ion source assemblies provided by mass spectro eter ¥¥faeta¾rs (not sho n - acama!l ermnected where the adapter 24 is connected m FKl 2€> o the mass s ectrometer 23. This oeofiguraikie allows using. m ionization probe26 that eta he attende se eral to a istero, I r estntpfe m a range fro 0. ! i&n depending on a length of the ion ransfer device 20, from th m ss apeelmmetef 23, thus eo&bf mg easy scaw g and analysis of diffe M arms of object under test 27
Hie ion transfer devke 20 offMently ttansl¾fs tie ions produced y tie ItMkah n ale 26 to the mass spectro eter 23. Tire flesdbk or re-etmigucahleou transferdsviee 20 is eceisiected to the mass spectrometer 23 with the adapter 24 that is feigned to t the tekaiMt source inte of the tttsss spectro eter 23 (where tire adapter 24 is oonneeied in FIG.2€). Thetotizat as pole 26 may lean ambieist i nisation somtte, atmospherie pressure lonta fert soure, or a reduced pessure i nisati n s ee, which is laud-held, whi ch m y 6e easily held with a hand 25 of an operator and moved feely to different locations or parte of an ofejeet under test 27. For exa ple, the ionization prob 26 may he freely moved to differosk parts of a uman body so that: the ionization probe 26 may become in contact with skin of different ots such as hand or leg of a person 2? so that tie Imlteion prole 26 may produce ions from huma skin that is transferred to l e mass spectrometer 23 by tire Ion transfer device 20 ter analysis by tie mans spectrometer 23 Ube feibil csf the im b ifer devc 20 enables ns g & hand-leld. kaazatiait proto 26 and provi es several atoants es no? available In oanvenii onsJ i» speet<¾ tertk thus srtea kg the use of seeh nm$s spectrometry totoeam to any new applications Because conveniioradi m ss spectrometers are bulky and oeauso kmzathm sources in convMtlonal mass spoehxsmsrars ere directly rached order to analysse kmran skin with conventional Mass speeiriHftetory die hre n must aw »d bring vari is body arts directly its front of 8 conv nti nal mas spectrometer That ca be difficult, impractical, or impossible. The flexible km transfer device 20, as disclosed herein, snakes it ssible for the i o¥at½« probe 6 to tel ly sod feely mwe to dlf& rt bod part located away frant the mass spectrometer 23. This enbles «sing conventional ass spceit¾>m¾Krs in new epplkaifms, such hospitals tad Mieal offices, for example, for real-lime skin an l ses repteeteg the c nv ntional ion sources wit tie ioirizteion probe 26 wtaic!i Is cmaeet d to tie ass s ectro ete 23 vi tie flexible ion transfer device 26. Therefore, the mass spectrometer 23 ma be fo«M far from the place where die ¾I plkg^k tibn is taking place by di the source oise 26.. For esteple, tie ass spetototaetet 23 may be pl ced In a separate oom sad the ion transfer device 20: may transfer the ions using the km trmefor device 20 that is ssed through ¾ wail ilia? scpaMcs the as spcetro eicf
23 from the object: en e· test 27. Further, this approach enables efficient transfer of IOM to the ass s ciOTnctev 23 witbom or with tninimal tor? less, resell br¾ in increased anaiybcai performance, sack as increase detection limits ®d sensitivities res ire for mmiy applications s-w h as k hy toman tissue artalysta. hs ether words, the ion tansfer devic 20 enables exten ing the Ion source 26 of the mass spectrometer 2:3 away from a ns spectrometer to enable sample analysis from objects 27 ilia? ara difficult to bring dose to the mm. spe rw eior 23 , Tie abject under test 27 may be a pabent that is going: through surge y on a bosphai le . Tie ion transfer device 20 may have a plurality of bend positions l¾ :2b, I2«? 1 lie around which the \ tmns r device 20 ma form plurality of eurvatures.
FIG. :2P shows a block iagrm of a ass s ectro eter 23 such that the ton source is detached from the mass s ectro eter an the bans produced in an ioni tion probe 26 rc transferred to he ass spectrometer 23 v a re- config rable « transfer device 20 in aecordi ve with e m WW e adhneais of ill® prosem disclosure.. He iooi afion probe 26 may be held by t hind 25 of operator or a user (or for «am le by a robotic arm of a robot) a surface of interest 28 may bo anal se without having t e mass ectrometr 23 dose to the surface csf imprest 2S. The lengh of the Im transfer device 20 may bo .§teater than lC sm, 50em, !Cfoem, IStfo ^ or :200cm. In ofeer embodiments, die length of the ion transfer evice 20 may he greater than 2meters, 5 eter, or IQ metr, more.
The lmiaaiioa pobe 26 produces tons from the surface of i erest 2$, raid the prouced loos are transferred via the km transfer device 20 to the ass spectrometer 23 for anal sis. As noted above., this enables modifying the conventional « specbxmeter23 tepla ing foe original ion source (not shown) of the cnwemkmal m ss spectrometer 23 by an adapter 24 that connects the ion transfer device 20 to the ass spectrometer 23 an efficiently transfers the ions from the m transfer evce 2Q to the i« sfwctromerer 23. This allows us o ionieation probes 26 that ay he freely move aroun to scan one or ors surfaces of Intermit 28. For example, t M airport, his i<¾ni tion probe may be use by a security office at a check point to scan for trices of « losive materials c passenge , cargo, or luggage. In a rover for planetary enploration in space application, such a configuration sbl es lacing the i source :M m a robotic at and placing the mass spectrometer 23 on a body of the rover.. The ion source 26 ay I» used in a fectuckg line to momtor for di quality or etmrahMtkm of produced ro ucts, such ns pharmaceutical products in the production line with one or ore fofogatfoo sources :2b connected with otto or ote m aife devices 20 dtete W mm have a plurality of braid positions 2a,.12b, 12c, iM around whkh tire ion transfer device D ay form enrv&te
FIG- 2E an FIG: 2F stow two block diagrams of a n s spectrometry system «1 that the son ource 1 k etache from tl® ion guide 1.3 ad the i ns are fe wf erred to ioo guide 13 via a re-Oonfi lraltle ion transfer devkc 20 m accrnttaec wild CM® or more ombedistieats oftto rescttt disclosure The flexible n fomsfer device 20 may have m adapter 14 {Including: one or snoe deefoxba such as skimmer and sample cones disposed insi e, or conventional on funnels an ionpities) feat eon«eois to the fo a ifoo robe 21 and efficiently transfer tons from be ionlrsiioo probe 21 to the flexi le bn transfer device20. The adapter 14 may .also fedrete t e etelroni.es necessary to ©peretethe ten ititisfof eice 20, mcloding direct mr iX <DQ, alternadog current (AC), radio tfegoeoe (RF) v l i for oper ton f tio ion teaistor device 20, M one Ion transfer device 20 may be connected to a secon adaptor 16 bat connects the ion transfer evte D to an ion pide 13 of a m speetrooMer Tie second adapte 16 may ho used to attach be ton transfer device 20 to fee mass spedremefer m a v&cuumfoght manner while efficiently transferring; the loos from fee i n transfer device 20 to fee w ipcet utetot , The sec nd a apter 16 may fecin e etamnfcc necessary to operate the ion transfer device 20 (such as P and DC voltage power snpplte and the ral ed control anil for conho!ling the o er su plies) of may include one or more electrodes tinte at a voltage (such as skimmer and sam le cones, or one or more conv ntional ion fonttefe) for offi ent transfer nd e^tactieri ©f foei from fee i on ootls t of the Ion tote r deice 20 to the bn guide 13 of the man spectrometer The first adapter 14 or tie second adaptor 1 ay dude etetrooles and ot her com crita ncoeastry t operate the fomcatfou sottra 1, toe example, connectors, electronics for plasma iomzaiou, liquid reservoir for etetropmy ionkatfort or Inset odules wt fiber optics font: may he atache to the crnter diamete or ma b imptem fed long the km transfe evice 20 for ser deso^Oc /fomzmta, or a combination of them. Related wires and optical fibers stay e atached to the mi ti fer device 26 to reach the io ikn ®STO 21 tars the ass spectrometer or the adapter 16. This is advantageous for reducing the weight an sze of the ion souce 2! that ma be an tai abou robe 26 used by o erator, which require educed wei^rt .tea* easy han ling by the o erat ,
PIG..3 A shows Mock dga of a ass speetro etry syste such that the thee e sourc s 21 a-e ore ataehd to o rmm speetrooietef via a reroo»fi§u ble ion transfer device 20 in accordance with one or om embodiments of the present is osure. Three ioniaatieu s uces 2Ia-e, which m y be #ta¾ro: or the «te lo ted at throe differ ent locations, am connected to an ion pride IS of a mass specforoiefor. The katrostiu» sources 21s, 21.fe, :21c rosy he dttaero or the same. One o more ioni¾tion souces 2la 2!b, 21o ay e connected to one or ore sample preparation devices 29 to pre are the sa les for kmfeat , fat exa le, the ioni¾adoa sources 21a, 21b, 21c may be connote one or mee sample ro atbo o scpav fort m mmerits, such as e itigh-pressuro liquid chromatography s ste (IX at BFfC system) or a gss ebraroafography (GC) syste to separate analytes before analysis with the ass spectrometer The ion sources 21 ¾s 2 lb, 21 e are eated a rtml hpte ed roamier and each ion souce m a periodic allocated time frame to introduce ions into the ass spectrometer via the corrus uudtug ion transfer tube that is attached to the km source for analysis. In the eset disclosure, the combined» of the ion guide 13 the mass nal se I S ®d the detector 17 may be inferre as the mass spectrometer. This nflgoratioti ovi es· the a vantage dint a single ass ¾pesroroe»r may be us d to analyze different sample located in different places and co ing fro different separation or ssroplu r^mtkm iMtastents M desorbed ubo ecause analysis by a wm$ spectrometer is performed in milllseooads to seconds, thus such multiplexing greatly uabaacea apltaal of mass spect eters by cont oou y and stecpettikUy providing ions to ifferent loosttoMfrns nnentsi or ionization sources 21 a, 21b, 2lc ?© the ma» spectrometer for analysis.
FIG.3 sho s a !doek iagmtn of a mass speohymtotr ¾«« suc irtt the three k¾tj satras 21s2!c are atached to fcwo mass spectrometers va re eoafip ble on transfer evices 20are m aecsrdax» with m® or moe eutorajlm ts. of the presen hto sc tosure, T e ho ces j 30 (also referred to m dre too M&tof &boi device its the prereto disdusu ait ix&Mpli of which is escribed US. patent ¾%6,244 for lossless too a i ulation (SLIM)) ay be «re to selectively transfer the loss received from three ioiifeatton we 21a, 21b, 21c espectivly cotmeeetl to three teible ion ««tier deices 2 fa, 21 h, 21 e to tire loti rocessor 30. The toe processor 30- then selectively tr nsfers he ions via two tlmsibfe ion ttaitofer devices 2C¾i 20e to two dltlereM mass speeitOTetets.: the first mass apectrmneter Including the ion guide Ba, he ass analyzer 15a and the detector 17a, and the seeoml one metodiog toe too gui e 13b, the ass analy er
1 b an the detector 1%, m shown in FIG.3® . The ton processor 30 may trap, store, rocess (for rereMpto se arate toes treses! m their raohilhyT and selectively transfer loo «kere into there two mass sectr meters.
FIG.4A shows a Mock dksran of m ion transfer device 20 in aocotdanee with one mote e.rttorktmems of toe present disclosure. The m ttattsfer device
20 may include an electrode «nit 31 (each electrode «nit m compromise one or mote tod peuflvM ets u iv# toeetresies as dissitreed til# resent application) connected to one or ore voltages. The ten transfer device 20 may include m im transfer etrekreere 21. The ton transfer e cloMr# 21 may be a take made tore piastre or mctil corniected to a voltage or ground in ease tire tube made f m metal or conductive plastic. The errels ire 21 may be & plurality of tubes 21. The tube 21 may he emruptotl or m b tow form to allow f blc lending of the rube
21 and the ism transfer device 20 to roduce a plurality of cur atres. The tube 2! may he constructed from n or mor hear-s nk tobc$.= Tic ion trinsfer enclosure 21 (or sim l referred to as fee end centre) maiM&hs tire one or more el e ro e u its 31 in in uced r¾si¥i (or htemrediste pressure below 760 Torr) an also r v es a raedMoleai atroeto to s pporf fee (te^ nit 31, Tire ressure lea Inside the ersdosure 21 may be maintained between in a ¾e from 0.0001 Torr to 7S0 Tore for example in a range front §.1 to 10 Tore A vacuum pom ra y be eoonecred to fee endosnre 21 ife a T TOmreoto with an son inlet (shaws s io s in) and an ion source, wife s X connretof at an ion outlet (shewn m ions on t) or one or more locations m between tire ion inlet or fee ion ooti along tire enclosure 21, for example,. in a middle portion of fee enclosure 21. l re pressure inside fee ion transfer device 20 may be fee same m !Jfereni at felfeent l cation reside fee enclosure 21 along fee ion transfer device 20. The pressu e inside fee encl sure may be in a range from 0.01 to 30 Tore, The electrode trait 31 may be itetble for flexible bending along wife fee im transfer enclosure 21. The loo transfer device 20 Includes ma include ti e eieetrotfe omt 31 having two or more nlen rodei, whidt may be flexibl electrodes, sncb m fe e sho , and described lat in fee present: application, for ft«pl¾ k FIG 14A, FIG. 140, FIG. I4C; FIG ISA, FIG; 1SB, FIT. I5C and FIG. Id other e bodiments, the one electrode unit feeindes a plural! ty of electrodes that are flexibly connected to each other or the enclosure 1 , omreples of which are slfew» In FIG, 6-A, FIG, SB, FIG, 6C, and FIG; SO esc ibe later in the present applied on. The «closure 21 ay be bent: to have two or more diiitmi: shapes or Ib m to have a pknillty of cut alrees. (which ma also be referred to as a plurality of twists, arcs, or curves)
FIG. 4B and FIG 4C sho two block diagrams of embodiments of the ion transfer device 20 in aocordmree wife tre or more entbodl meats of fee present isclosure. The ion transfer device 20 may include a plurality of electrode units 3 la-e in FIG . 4B or 3 la-j m FIG. 4C that are eormeered to et h other, Eielr of fee pluralit of eleetrode units 3 lay may com ose a pl rality of electrodes, which ay be flexible electrodes, reeh as there shown, and e cribed i ter in fee present application, for osampie, to ¥\Q HA, FIG, MB, FIB:, 4C, FIG. ISA, FIG, 158, FIG 1SC„ and FIG 16 In other embodime t^ She ion transfer device 21) may include a l rality of electrodes that « fiet bly etMcetod -s each other or the me! imsra 21„ samples o whi eh are shown in FIB. FA, FIG.6®, FIG: 6C„ an FIG.
6© describe Filer In the pre ent applieg!iosi. The plurality s# electrode tmite 3taj an the msdosure 21 may be ilesib! e or be lafefe or rs-eaeilgn from s first shape o cistiflgurbon to a secon iha e or e fi ststeri:, fit one «¾ embodititoMs, She plurality of electrode unit 3!a~j ay t fl ¾!e orre-eonfigurafefc bat flexibly c ¥©ctod to each other, such as th se shown in FIG.7 , FIG ?B, FIG. I IB, FIG.
I IC, FIG 12 A* FIG 138, and FIG 13,
FIG.4D shows a bl ock diagam of an ism transfer device in accordance with on# aspect of the pteseM disclosure. In <sae «hodimen^ a lumlit of connecting deetrades seg eots 4la~ s which w ebclffcally is ated fern the plurality rf deetro e «nits 31a-|, an My be individually connected to different volta e^ c nnect the plurality of electrode units 1 me to one etubixllmeui, the lurality of commoting electrodes scjpteTM 41 aAI may ensure ftMent iraosfhr ofious between two e gbborittg electrode units pie and llbj or (3 lb an 31c). The pte&i!ty of connecting electrodes seg ents 4 land may be in form of skimmer cones or oondnct ce lumttog «te an si ilar structom used h dil etmlai pnto.pl.ng In eooveoti nai mass speet etefs other e bodiments, the plurality of connecting etecire es raeois 41s-d, a be one or .more «tuc nce limiting ocillces or a plurality of capillary tubes.
FIG.5A, FIG SB, en FIG. SC show hroe block iagra s of dif&rcM ensboii eors of the sou transfer device 20 conneoiona to the mam spectrometers SO, $2, 55 in accordance with one or ore emttodimenis of the present disclosure. The Ion t nsfer evice 20 tony include a p!m¾li ty of electrode unite 31a-i, as described above, that are eormeeted to each other. Eac of the plurality of electmde units 3 la raay ttofSeiible or «» he rigi md flestbly connecte to each othe, as fcmb la ove* aad ar l cked Inside the «mete te 21, The plurality of tectocfe amts 31&»j d Hie en ostns 21 ma be beet to have two o more ilfere&t. shapes o forms a i my be reecrf tMble o flexible. The loti transfer devise 20 may e «mected t one end to die ion source probe 51 that may fteely move in 3· imeatoMl s wre because of the flea¾ of -the i« transfer device 2tX 11» iou WW probe Si may be flexibly oved ar nd to ring fee Inn saurne probe SI dose to a ple or object under test to be snalysed, Further, the im transfer device 20 ay be connected to inn ride so mass anal y ear of a ass spectrometer 50.
In one embodiment shown in FIG. SB, an ion processor 54 ay be included and the loo processor (as describes above septdinglfS , patent 9,966,244) may be conaected to the inn source probe S3 CM e end an the mass spent rometer 52 on the other end using t o different ton transfer de ices 20t and 20b so th«t tow or tue-separation of ions (base on their ion mobility in fee ton processor 54) may be controlled. FIG. SC is simlar to FIG; 5B with the different that fee loo rocessor 59 is connected to two different Ion sources 56a3¾ and ai lti teea the ions receive from these two ion sourees. to the mass vpcelrometr 55,
FIG.6 A, FIG 6BS FIG, 6€s » FIG.6D show perspective views of an emboiment of the flexible or r cooHg ¾bk Ion tran sfer devi ce M in accor ance wife one or more embodimens of the present tiretosttre; In one or more erabfflii ents, fee plurality of electrodes€1 each having a central hole 65 (of fee sa e or different diameter. In one etobodl tnent sseending or deseendlog feam terto which may also act as conductance limiting orifice to limit gas Sow between two adjacent electrode units and provide differential pressure m two adjacent eotrodd uni ts) may be connected to each other usin flexible or elastic rods 6l«~d, which go through a lurality of boles 62 provided on each of the plurality of feeelectrodes 63. lire plurality of dectro es §3 ate isposed Inside a tosdMe tube or enclosure 67. (Thetobe or enclosure 67 is not shown in FIG 6€, FIG.6D, FIG; 7 A, and FIG. 7 for im lkdy of Ilkstmtfen). This ¾M%ur¾h«e allo s the plurality of fee ee xlte to Ϊ M one o more oarvatores aroun m to s 66 of fee n croler evice 2¾ as shown In FIG b€ ami PIG.6D. The plurality of electrodes 63 each amy have ne or more eleetr al eormeetk 68 to appl ifleteal voltages, such as RF voltages VRF1 nd VRF2, and DC ¥d¾ ¾, VDCI an VDC2. The lurality of oieetrodte 63 may o ma e ft®® My rusts! (stainless sled,nickd, copper, gold, or any ther metal wifh or with ut coatings) Of any c n uctive maeial such aa co uctive p!&stte. The sp&efeg betweoo the electrodes may he di ffere® or m he the sa e sod ma be a val e between 0. ! to 10mm Tbe t ekoesa of electrodes may be different or ay he fee same and may be a value bet een 6.01 to 5mm .
F voltages may he applie by eonaecikg a plurality of otpi tora TOt Ofe In series t fee electrical. ocK eet s 68, ich are eonneeied to electrodes 63., as shown m FIG 6A and FIG 6B. The ca acitors 7¾ Qb «my hive value of 1 to 1660 pF. The DC voltages may he applied by «««eetlag rohstora m series with fee deeirkd e®M¾tohoro 6§* as shown m FIG 6.4, The snsbtOf vaue nitty be 0.CMM to
10M Oteis.
The capacitors a resistors may bo eotvoectod by c nnector^ sblderini, or speu-wedkg to the eloctrofe 63 or th eleeirieti iromeetkrro 68 bistros! of usi ng the electrical ccsnneclions 68. Alternatively fee esp&dors ?0a,70b sod resistors 6# may he assembled m a se arate ilefehle or rigid printed droits hoard (FCB) and connected to fee electrodes, as shown in FIG.8 A, FIG. SB, and FIG. §€ as described Met in the present a plication.
Application of DC voltage m be to the fmt and last electrodes of the plurality of electrode 63 , as show in FIG6A by annotations VDCI and VDC2. In one emhofen¾M shown in FIG ¾ etch electrode of the plural ity of el cumlet 61 is connected to a separate coniraliable and addressable DC voltage (VDCI to VDC6) to provi de diflst ? vo!feges to each of the plurality of elcomKte· 63, The DC voltage may be any value from 1 to S0t> volts or greater thin S00V . The RF voltages tmy he applie as two out of hase RF vohagro respectivel couoeotcd to odd an even ectodes (VRpl and ¥RF2), T e am litude of the IFwtege ay¬ be any value fen* 1 to SOD volts or greater than SCM¥. The frequency of the EF volage may he any fteqmme tra 50 H¾ to 20M!fe Preferably the RF an DC voltages should n t cause ps breakdown ai the pressure that the ion transfer device 20 is operating it.
In ram or re e t i fs, foe plurality of electrodes 6-3 are eosmscted to each other is shown fo FIG 6A but instead of sing the flexble or elatic rods 63 a- d, a plurality of efeetriefoly fosu!afog streetoras (fo exa le alarik or rigid Vi ton or FIFE O-ring or any similar material) are placed bet een each two electrodes of the plurality ofelectrodes 63 (similar to the electrically kaalatlng structures shown by nnoations: 92a-'d m FIG. $A an FIG.98). Bach of the electrically i ulalfog stoieuea. such es etc O-riftg, ay be glued ts> one side of each electrodes 63 to hold the elecricall hmikrfog steciures in plac This helps in eoi the drastically iMnMbtg steeture f m moving or being ost oscd. to the bus passing formtgh the ion transfer device 2b, which may create charging problems if they trad op rat dielectric materials. In the flexible km trsasiet device 2d, th electrically inso t g sMtct ros ate preferably not oppose to the ions to avoid charging rflbc&y which results from accumulation of charged policies on the elocrieslly strttdteg fractures, m4 may reform the sha e of eirasrie d¼ e therefor ton taj ecories Therefore^ the inner diameers of the electrically iosuladig structures etc larger than the dia ee -of the holes 65, 32, 13 or 94) so that if charge accumulation occurs (for example on foe efecfrieally insulating sructures sho n by annotations :2&-d in FIG.9A and FIG.9B), the harge accumulation on rwi ad ersel y affect the d-eetri c fields imite the Ion tra sfer device
20. In one embodiment, the resistors and capacitors are directly connected to the rasrwfcs; 63 without the ecide emmeetk® OB, dMilar to those sho y l a FIG . SA, FIG:. SB, and FIG SC and the corresponding description later in if application. 1¾ assemble the rnci re, the plurality of lectro es 63 d the electrically insulating structures may be assembled on a cylindrical h lder {not shown), and then open assembly of the electrodes anil eeeme ig A® necessary· dectti l connections and cmrapoiserits (resistors and capac tors), the assembly may be incited into a heat-shrink tube (which is shown by t omfiea &7 m me or mote emb di enfa) m that by appl aboo of hear the heatrahrink mire 67 A an b l d tbs asse bly in place. The»* lie cvliadrioil bolder ay be re oved. Such an asse bly with treat-shrink tetre holds the deeprodes firmly m place and also provi es flexibility and rs-eonilgureMMty. Further, using IreaGsferinfc tubing may eliminate tbs need for having electrically iosofetuig ¾i¾reirn¾s (tor e a le annotations 02 -tl in FIG·. 0C) in between the electrodes to keep the electrodes separate m the hem-shrink, upon app icati n of beet and shrinking, holds the electrodes in lace and acts like electrically insulating structures to make the electro es in place wMIe rwidmg the OexMlity is dlrefrared in the resen application, as shows in FIG 9C in which the heat-shrink tube shrink Into the area In between too ad «out electrodes 1
FIG. 7A md FIG 71 show perspective views of the flexible or re- smfranrab!e ion transfer device 20 in accordance with one or more embodiments of the present tfedsMi A this exe lary embe !»»* Instead of having ail of the plurality of electrodes flexibly attached to e ch other (like those embodiments shown in FIG 6Ά, FIG OB, FIG. ri€, and FIG riD), the ion transfer device 20 may Include electrode assemblies (or units) T?¾ 77b, 77c In which the electrodes 14 are rigidly attached! to each other, anti the electr de mm 77a, 77b, 77c (electrode units are also referred to as eteroife assemblies in the present disclosure) are flexibly attached to each other. The plurality of electrodes 74 each having a central hole 72 may be connecte to adjacent eetrodes «sing rigid reds 61 a-d, which go through a plurality of holes 72 provided on each of the plurality of the electrodes 74 tn other «nhodimettfe, the electrodes 74 may be fixed to each other with gl ue, epoxy, m w whilemaintaining s predeter i e S aekg in ¾ o of 0.Q5 t® Smm between the egra es.74. The eiaeirode asse lies (« ts) 77a,.77b, 71® are flesafely t»ebed to «a«fe other sod proi e the flexbility/
FIG.8 A, FIG. SB, and FIG. SC sho front views af throe embodiments of tbs Asrtredes of At flexible or t-eenfi arabl t i n transfer eviee 20 in accor ance with me or more embodime ts of At present died enro, A one embodiment sho n in FIG. BA, a pdated eir bt beard (FCB) ojeeifo n 82 of fee plnra!iiy of electro es may he made with PCll Hie CB el ectrode &2 may include a pksrahty of holes t l.«d that provide a path for the .rods 61 awl A ©enter h le 83 In hie PCB oo!rode 12 provides s fh for loos m the center area of the FCB rede M2, Around the center bole S3, a rneisl trac Si acts as a eonduebve eclrc e tbr application of voltages to pro uce electric fields in nod arou fee oa« bole 83 necessary for traasfmsf fens. The metal track &4, which may he co pe, or gfedAmmersion electrodes used in PCB oianufectoong similar to through-bole asac bllea well known 1» PCB production bet wife much larger diameter. The diameter of the hole 83 ay be s value bet een 8.2 inches to ID inehes. A resistor S6a and e cepacMor S6fe may be assembled on the PCB electrode 82 to provide the necessary DC voltage an RF voltage, res ectivel A plurality of connectors S5a connec to a pccbt FCB electro e 82 or DC and EF power su lies provi e the respired voltages.
lit one ernbodintenl sho n in FIG.8b, a FCB eleetiode 82 of the plurality of eledxotte 63 m y he circular sh e. One of ordinary skill in the art would roeegniae that fee electrodes may ho made in ay arbitrary sha e. In one erahoil ent s own In FIG, 8€, a FCB electrode 82 of the pfyra!ife of electrodes 63, instea of plurality of holes l!a-d that provide a path for the rodfelafe (as shown m FIG 8 A with Mnoisifeas Sla- ), fee FCB electrode 82 may Itiefede a plurality of electrically insulated structures 88sd to flexibly connect two ajacent FCB electrods $2.. Theplurality of ectrkalfy insulated sr etwes iSa-tl is bn made with pogopins, or elasikt Wk, or O- m atached S the board.
FIG. ms FIG.9B, FIG 9C, FIG. ¾>, miFIG. « ste eras $ i views of electrodes 91. of the flexible or m-c nil iaWe too transfer device 20 essraiected to each other in accordance mih om or more esrikodtments f the pesent dlsdasLne. The Giscimdss 91 a e stacked on es.eh other, as shown lit FIG.9A and may be centered af an teas 6, which ay cross the centers of holes 94 on lectrodes 91. A plurality of spacers 92&4 m be place in bet een tic decto es 91. to provide the seipiied s a sig between electrodes and also the re-
©eligibility and flexibility, lire electrodes 91 may a r sist r 95 an capacitor 93. This rontlg ratiori provides flexibility for he foe transfe e ice 20. The electrodes 91 each h ving an electrode axis 96a-c may he flexibly bend arm d the xis 90. The degree of b nding is defined as the angle between the axis 6 and each electrode teas 96a-e correspondi g to t e i otmli ty of eloett les 91. The egree of bending may be any value between 0.000 ! to S degrees for eac electrode 91. In sotne embodime ts, only scene of the e!ccht>des 91 may bend around the axis Ob. In some enfeodim ts, instead of employing die plurality of spacers 92a-d, a beat- shrink tube 99 may keep the electrodes 91 in place (electrically se arate fro each other) while mm at ng :fl Mlfy, li other embodiments, both the plumlity of spacers 234, and heatehriitk tube 99 may keep the electrode» 91 in place while rovi in flexibility The ateten tube ma also- serve as the ottotosmo 21 to aintain the electrodes 91 in reduced pressure m disclosed earlier in tire present application Although FIG 9C sho s only one layer of heat-sfmnk tube 99, bmt one or m re layer of heaGs rink tube 99 may be provided to adftm flexibility id the pressure inside the Ion transfer device· 20. In one embodiment, a plurality of wires, which may bo ispose ttaltle or i side the encl sue 21 (which may be fm example the heat-shrink tube 99) provide respired deeirktd radio frequency (RF), or di rect astro (DC) voltages {or c nstant v ltage) The voltages may he provided |r¾ pi-sl pulse ·$«#<«€, far exra le, Qt ! * 0,5, h 5, tO, 100, or 1009 rnilliseeands 'Us® oised voltages may ½ periodic, having a period of 0.01, 0.1, 0: I, r 2 seconds, or more than 2 seoarn Is, Id other embodments, a plurality of heatetek lute ay be provided, an l¾e oteotrle ! wte may be disposed in between tbs l ayers of the hetehrmk fate
n one or more embodiment temre in FIG, 9B and FIG. E, instead: of using the plurali ty of spacers 92a~ iis sho n lor «tajs in FIG M tile eloelrodes 01 may tee marching extrnstes· 1, 98 m two aides of the eleatee 91 hat re engaged wt corresponding matching exhitsi ems 97, 8 of adjacei eciredes 91, as shown m FIG P end FIG.91, to provide flexibility its dsclosed in the present application. On® of ordinary skill in the art would recognte that tins structure ay be anyteoreb by separae Geottees 91 flexibly era eefed to etdb other and having many egees of freedom such as those te d teake robots ' having many degrees of freedom or may be maoufhetote by rolling a structure having matching mstes 97, 9S si ilar to those use In conventional flexible Geetrical conduits.
FIG. lOA ud FIG, 10E show erspective views of indivttteii electrodes of the flexible or re~conflgu le ion transfe device 20 in accordance with one or more emb dime ts t€ the present teio For ai plidw of illustration, the enclosure 21 is not shown in these figures. FIG. IDA and FIG. 1DB show a niultlp le ion guide that inclu e a plurality of rods M3 connecte to DC and/or &F voltages Multiple ion guides ay have any even number of teg such as four, sis, eight, etc th are hold In place with a plurality of rod holders 192, 104 Two conduct nce limitin plates 191, fOS haing an odiloe \ &7 are attached at the two ends to the rod A ders 192, 104. The conductance limiting: plates 101, 105 may be Kmeote to DC or RF voltages (for example at a flres m y of 9, IMIfe to lO Hte). A plurality of electrically m l ing pieces 106 (which may be made by elastic at als sueti as Vrton) may he co noote to the conductance limiting rifices 105 o rovide fcMIty.. The odd tod even .nu tfeurs of the plurality of ods- M atu respesiively ccioisecied to two out of phase 8F voltages. A DC offset: volisgemay fee applie to Ml of the rods 103.
FIG. HA, FIG. TiB aid FIG. 11C sho perspective views of three electrodes of ie flexible or m-Mciguntble ion transfer evice 2$ corumetcd to each otlser hi accordance with tic or to ts em od ieto of the present discl sure. In one «bodittt it, th# ion tramber device 20 may he constructe with multi pole too pidss (each acting as on electr de unit) SwdMy attached to each other. A plurality of Individual deet des (each electrode including the components as shown ia FIG.10 am! FIG 10B) ay he eofm cted to each other as shown in FIG. 11 A, FIG t !B, an FIG 11C to provide a flexible ion transfer device 20. The two eon ucfwce limiting plates 105 CM two ajacent ete fedes « connected to each other with the plurality of the lwa%' of electrically itouMeg pieces 106 placed Itt between to provi e flexibility. In other e bmi nnf the t o electrodes or multipole Ion splc!e sstmetimet may fee connected to each other with the structure shown in FIG 9A an FIG 9B to provide liability, GetiNshriuk tubes ma also be iii d as endosure 21 »d are not wa lor simplicity of Ilnsl t! n.
FIG. I2A and FIG.12B sho perspecti ve views of seven electrodes of tire ttoib or fc-ronigurtble ion tt n hr device 20 corMocted to «eh other in accordance with one or more entfeodi enis of the present disclosure. In one e sbo l MF $ie elcebndes. may lav« a plurality of outvatorcs orfee s MOmst! an am 110 of the ion transfer de vice 20: The enclosure is not shown in this S ins for simplicity of illastraSon. The ilwdhility of this structure may be similar io those shown in HO TA an FIG. ®.
FIG.13 shows a perspective view of two electrodes of the flexible or re coni rablcion ø¾«!½ de ice 20 commoted to each other In Mcowlffitce with one or more embodiments of the present disclosure. In on e bo iment the nmliipole Ion gui es may inelcde a luality o rods 130 diet ate hold in place with a red holder 131, To provide flexibility the od# 130 f die two adgeeent lectrodes are connected flexibly to eseh other as shows in PIG. D wi th & plurality of cormeefog iece# 132, The lurality rf<¾ ¼ml g eeea«o.tmeef t o- ewn¾sp<«Kling rods- D to each oiler The plurality of connecting pieces 132 may he conductive o dectdesl!y insulating, whch may be M by, for example, eot eeting the rods with flexible epoxy is another embodment, the plurality of rod# 130 may be flexible while mai tains a etss!M or ssmdco ta dishme® bet een two adpeoit r d# mi electrode assembly to provide a flexible lo transfer evice 20,
FIG.14 A, FIG.1.4B„ sod FIG.1.4C show perspective views of an enclosure
141 and two different electro e geometries o the flexible or te-oonfi ra!de ion transfer device 20 in accodance with one or more embodiments of the pesent isclosure, FIG, I SA, FIG, lSB, ta FIG, ISC sho pespective vie s of thee emb diments of the fle ible or re ioaSg rabk lot transfe device 20 in accordance with one or ore embodiments of the present dbdoaare. In one e boiment he enclosure 21 may be ade of a flexible tube 141 having m outer surface 142 as sh wn in FIG, 1 A. A pknsIMy of nog electrodes 145, as s own it) FIG, 14B, are connecte to a plurality of DC and RP voltage# (not shown far si plkity of illustration) may be disposed inside the flexibletube 1.41 to provide the ion transfer device 20, Faeb of the pforaiity o ring eetrodes 145 may include an inner sarlace 143 and an outer surface 144. The outer surface 144 ay be disposed on the inner surface 142 of the flexible tube 14 ! to rovide an loo transfer evice 20 as. shown in FIG, ISA. In another e bodiment a plurality of elongated electrode# 14S (any even number of electrodes} having an miter surface 147 and an lone suface 146 ma bo dis osed in the flexible tube 141. FIG.1SB sho s an exa ple of the ion transfer device 21) according to this xem lar embodiment The ring electrodes 145 and the elongated electrodes HI ane flexible and may deni hen the flexible 141 tube bends. The flexible hits© 141 maybe made with a faeafeshrin tube that has a stick inner surf o 142 fo stic ing to the outer surface 144 of the ring electrodes 145 or fee outer 17 of fee plurality of elongated eteetradet I 1 to the Itmer surface 142 of the flexible tube 145 PIG. ISC show a cross section of another e h dlmcui ft fexfole fort transfer device 20 hich may be «tide with bellow tube 151 sod a plurality of electrodes 152 may be lace inside ie belfew tube 151. Id this e hednraui a plurality of ground eefrodes 151 revent ions Iran charged hmlfoap on die bellow tube 151. Although these einFadimeas ere shown in. straig t fom, of ordinay skill la the art;, in view of the resent disclosure, would un erstand id appreciate that these structures rovide flexibility and may he bent to any form OF shape similar to a cotwe ion l hose.
FIG.16 sho s a perspective view of electro t omet is « e hodimeot of he flexible or re-corafigurafete ion. tra fes:device 26 in accor ance with one or more «fotfointer® of the resent dfedtMtre, The flexible ion transfer tu e 20 ay fee e isiructeii with two wi s MI, 162 lor a plurality of the two wires Id!, 162} that a wonrad around an axis 163 into heli structu s having a dia eter with any value in the rang of 6.2 to 6 inches. lie two wires am connected to Iff v ltaps a: a lioqucncy of 0.05 to 1.0 MH& and stirplitodes oC Ibr exMtpfo 50V, lie amplitude may fee any v lue between 1 to ICM30V, The erado te 21 is not sfet n in FIG.16 fee simplicity of illustration bet similar flexible tubes, or heat-shriek luhos disclosed «diet m the present application may be used. The too. transfer device 2d made with the e etodes· shown m PIG. 16 is flexible an may have severs! curvatures alon the length of the ion transfer evke 26, As riote abo e, the prewire of the im transfer tube ay be lit the range of, for example, 6(101 to 760 Totr
FIG.17 A am! FIG, 17B show fw side views of fora trajectory simulation in an erafeochmersi of the flexible or re-cooflgurafele ion transfer device· 20 in avetriaracc wife one or more emb diments of the prase® dudosum. fora trajectory simulations were performed with SIMiON soft are and the results are shown in FIG, 1 ?A (ride view) sefo FIG, 178 (top vie ?), Tire rimfostfons were peiiormed m a pressure of I !'¥ mi the skndatioa results de to rate that the eteetoKba effectively top tie Ions, producing an ion could M4, for a long period o time. The slmy tioim were performed «1 a hem stn*eture of FM 15 aroun m «is 163. A variety of RF voltiges wore applied at dii&rait frequencies and voltages and the stoeter® was fonkional in a i e rnge of arameters (voltage and amplitude f the RF v ltage) and prsssuoo (0,01 iOllrr).
PIG. I S shows. RF an DC ol ge wavetbsiiis applied to die elesh fe of the flexible or ee-eoefi ira le ito to sfor device in accordance with 010 r m e boi ens of the esent scl sore. in l!ie five sequenii al grapiss shown m FIG.
IS, the dotes are sho n by tl to t5, tl graph being tire ii wive form erf the sequence and t5 being the si e e far of the se uence. The time peri between each graph may be the sa e or different For eaample fire time dii¾teo«hetw¾eri tl aod t2 may he m the order of mdlseoi da s or seconds (ay and ay he any vaioi between 0, 1 IM to Id s.
The electro e toils ilfed may c m rise toy electrode coofigumtfom geometry, s o , or fores isclosed in the teasot application. The plurality of eefraefe toils 3 fo-d may be ih<m disclosed m FIG, 6 A, in which every even to odd electrode Is connected to two out of phase RF voltage® respectively. Two out of hase RF voltages· are applied «> t o adjacent eleettoi s, For «sa ple, in a multipole· ion guide, one of the two out of phase RF voltages is applied to every ther electrode and die other of the t wo out of hase RF voltages Is applied to the remaining electrodes. RF voltages of the ion transfer device 2€ pushes the ions rad llv toward the eeote o or t a ls of the ion tram¾r eice 20 as isclosed and shown above in exem lay emfeoditn«nt and as for exam le shown In the simulation results of FIG. I7 A andFIG.17B, which i s m RF only simulation. Theradial fora is w bd vk anActive potential horn RF wltages m waveforms on the electrodes, Hie RF waveforms effectively kee tons oft die plates lie DC tl re s ttsfe tc» «ally t ard fho two mfa of the km tr«n*$sf evce 20 , ¾$ applied: RF voltages trap kins around m ask and iiiskle tiie its® tosfe device 20
¾ iCl ! C: v t¾ge& are lltetote wit! s li lines nd t gRF voltages are illustrated with a s e or s g sg waveform. Although the DC aod F voltages are Illustrated reparetely for simplicity of Illustration.* one of ordinary sill in die art rttlM rtnd#rgt*»ci hat those two ave for s may fee eornhisre so nmposed nr ad ed by application nitlie IF vintages via a eapadfor is iisDC vslreges. The DC voltage sources providing the DC voltages ay respire IF ehalres to pm' i die RF voltage from penetrating Into the DC power supply. D DC v iaps ay also be regarded as tire DC offset voltage applied to the RF v tap. The RF voltage (two oid of phas sin waveform applied for: radially pushing tire lorn rewards a eeo« of the loo di fer de ice 20} may alwas be presets in the electrodes of the Ion treosifer device 20 Aitem ivdy the I voltage may osly he snt when io esdsts in he tel ate elMirodas of the i tin «refer device 20.
The tea»“elecro e aai * 1» the present application Is deined m a n mber of electrodes that: eeaa m ion packet fo exam le km i or foe 3 sho n in FIG. IS, Each of the efeettsde n e 3 la-4 is an electrode unit that may ceartt any number of electrodes but top sad eoMs an i.® packer as described earlier in die present a lic k
In tl, two packet of io»ss s&m I an tms 2, are held in DC potential wells cre e it* electrode oniis 31a Mid 3te at Vi voltrup The iowt 1 nad km 2 may be from the same inn source or fro different inn sourees Also, the km I and km 2 ma contain the same or different types of ions obtained float t e same or different sampl es by the innis i mmx. The DC voltage at electrode unit 3 lb m 3 I d are at V3 which is greater than VI. Therefore, the DC voltages of the electrode units 3 lb M).d 3 Id act as i pstefok! barfkr and pr ent the two ions ackets (which may he in the form of on clouds or km population) from mixing with each other. The values of DC voltages may he any positive alue In a range fi n G V re 1 OffiV, in tl, the PC voltt : of tie electt te emi 3 I k reikood from V3 to VI, thus allowing the iam 2 to axially expand to the adjacent electrode unit 31 d (the ions at s ll radially containe mi the RF voltages - in feci, the mm 1 mid km 2 are al ays coittsiued the centerline by RF voltages as described above). The otential well of the electrode 3 lb prevents the iwi$ 1 md m 2 from mixing with each other.
In S3* tile DC voltage on eloeirOile unit 31c is imetottod from V I to V3 thus forcing or pushing the man 2 into the electrode urai 3 M Iherefere, the iom 2 are shilled one efec ¾&? writ to the .right
In t4s the PC voltage of the electrode unit 31b ½ reduced from V3 to VI, thus allowing the tons I to axially ex an to Mb electrodes. The potential wait of the electrode 3 lc pre ents the m mi m 2 from mMog with each «h«,
In tig fre DC voltage on electrode w¾ 3 la is incre sed from VI to V3 thus os ing lie iem I into the electrode 3 lb. shifted «to Acf ode- mm to tie right (where the ion outlet of the Ion transfer device 20 is locate·;! in this exemplary embodiment).
During the sec eno» front tl to 15, two separate ion packets, itm i anti mm 2 ar shilled on ekvinxh tmM i™ the ion Inlet side of the Ion transfer device (on the le to the feu outlet side of the on transfer device 20 (on the right). Therefore, this se uence enables sequentially packing and efficiently transferring the imts or ion cl uds via the flexible ton transfer device 20 withoat these ion packets being mixe lie ion transfer ay be performed its a sequential manner and the ons, m the for® of ion pockets, may be ra sferred from the Inlet to the outlet of the ion tf sfer device 2 sequentially. arther, this- se uence m allows arrangement of ions roduces front different ion sources or produced fro she ssne ion ou ce but fro different sample, nto len paokefe Although, n each time fcm of t l to of FIG. 18 the DC v ltago values VI and V3 me use but each el ectrode 3 l.a-d may ave a different voltage value and they do not need to tm necessarily the sa e.
FIG.19 siiows R a d PC vblttge waveforms applied l© tfs« electrode mil 31 of t .® flexible or TSKSonfigurabl ® ton transfer device 20 ia ac€¥ianc® with e more em odiments of the present disclosure. The RF sod DC voltages re described m detail with nggpect to FIG, ½ and ills same es iii ap licable is FIG, 19. The electrode 31 ay eoro ise of a plurality of fing electrodes Si ilar to those shown la FIG.6A, FIG.6B, sa FIG 6C. in exemplary embodiment s o n in: FIG.19, DCvdtsges re dmdusly cmtralled and -applied to each e ro e of the eieetrocfe unit 31 In the f tomng* lire appllestlons s d shifting of on packets are describe for the electrode unit 31 will rin -electrodes similar to these shown it¾ FIG 6A but one of ordinary skill l« the at would understand an appreciate that the s illiog of ion packets may also bo realfoed ith cgher deetrede tpo etties of the ion tnmsftr device 20 as disclosed! in die resen t: appik forr
In this exe lary e boclime-nt, each kctrmfe tout la one electrode, for e Mfiln ©tie ting electrode {sho n n FIG.44) h one cfer-Mb mrit, and he slnitmg of the n packets ate perlbnned in one ek mx m at each e period (tl to iS).
In tl, foot' ek« of ions, xts /, «t« 2, mm i, and texts 4 fin the form of ion packets), are trapped snp ralely by DC potential wells create in electrode unit 31 created by application of ¥3 to font of the ring electrodes which are spMialty se wste (first group of d og electrodes of the el ectrode -unit 31). In FIG.19 an at i!, first group of ring electrodes are held at DC voltage ¥3 md the remaining el eemxJes are at held at V I ,
In t2, the ring electrodes adjacent and to the right of the first group of ring electrodes (second grou of electrodes) are switched t ¥3 from yj, and. shortly after, the first group of electrodes are swi tched to VI. In fi, th ug electt te ajacent a to the right rf he second groap of ring electrodes {hid group of electrodes) are switched to VI fern ¥1 , and shortly after, the second group folectrodes ar switched to V I,
in M, the ring electrodes adjacent and to the right of the third group of ring electrodes (fourthgroup of eIevtrod.es) are switched to V3 font V I, an shortly after {Tr exa le tew of micro seconds to milliseconds or secon ®,, the seco d group of electro es « switched to I,
As a result, the ten packets move aequeotlsl? in the on transfer evice 20 from left (the i n inlet) to the right (tie ion outlet) while keeping the ion puckers septate, for ©cample by a travdtog DC voltage puke while the RF voltages maintain feu loos around an axis ctfih© loo transfer device 2D.
Hit wav® focro rfFKI 19 Is si i sr to the wave fern uf FIG, IS ith tie diil'trwt that esch electrode is individually connected to addressalte DC v ltogcs In FIG, 19. In FIG: 1$* & grou of Gecttodes ae ceMseefod is it sanre DC voltage Therefore, sequential transfer of feus according to FIG.18 ay require smaller mmfoet ufindividualy addressable DC v lieips sotnpared to that deroited in FIG. 19, IK die «foodlmeM of FIG , 1 , all indii ual electro es roust: be Individually connected to controllable DC voltages.
FIG.20 sh ws a flow ditto of a met od of tran drfog ions wi th the titaMe or ro-e ollg ahle ion transfer device in ooeordanee with one or more aspects of ifee pse»:it discfesum Is one sroFodiment, & nsetiiotl for trsostemng ions iide e prodtemg ions fern a sa le in step SI, transferring the Ions with at least one ion transfer e e that is eofl re to he flexible or ttoootfogufobfe m step S2, the Ion transfer device having an endo-suro, an a plurality of eleetrofe ls o l at least in pari inside he enclosure; separating the Ions with at least one analyser a n d to separate the loos bsed on mobility or etnas to bla.t¾e ratio k. step SI; and detecting the separated loos with at leat one detector in st S4. The timsfetiing of tie loos tmy ho reuliro by the method and ¾pp!te&uon of the waveforms escibed with Marion to- FiCi 1 S atKl FIG.. IF to trie km rastaier devke
20
FIG.21 shows s hf dk: diagram of control unit 3 K> f ion tMSt¾f device 20 ope detail «pern which an e ta meM oCtfee resent discteure ma be implemented. The ion fomsfer device 20 a include or may he connected to one or rno co trol u ta2;U>, Ilse control unit 210 inclu es s memory 21 J , a p cessor 2I.¾ iu uffoutput (I/O) interface 213 that i s cm eeted to a dis lay 14 nd a eyboard 215, m interface 210 that is connected to RP volta e generaor 2/18 and DC voltage geriOTtefr 10. The control unit 210 loci utfes ne or ore memory 21 !, such as a f&ft em-tceess memory (RAM) or other d na ic storage device (e ,g.4 d namic RAM (DRAM), static RAM {SRAM), and synchronous D AM (SDRAM)), coupled to the bus 216 for storing Mormidtm and Instructions to e executed by processor 21 , fas addltroo, the one or « memory 2 i I y be used for storing tem orary vurisMes or other ifotr edkie Mi matkto during the executionof st cttons b the processor 212, The control unit 210 may further foeiude a roa otriv ucmorv (ROM) or other s!Mie storge evice (e.g., pogra mahle ROM (FROM), «sable PROM (EPROM), sod electrically erasable PROM (EEPROM)) coupled to the bus 216 for storing static information and iMttoctiom for the processor 21:2.. Hie eotstrol unit: 210 may further include a com unication interfsee 221 coupled to the bus 216. The commimkati n interface 221 provides a two- ay date eo ume tiots. For example, the Msrruurie ion interface 221 may be a network interface card to attach to any pocket switched LAN. As another exam le, the eom uttieatiun iMerfece 221 may he an asymmetrical digital subscribe line (ADSL) ca , an I e me service distal network. (ISDN) card, a Onrverss! Serial Bus (USB), or a modem to provide a data Kmtmm aikn e meet n to a eortcspotulioi type of ¾«mmtm ati« lute.. A wired or wireless networ ay further he connected to the oommtmicafi on interface 221 connoted to ooe or moe co uters that provide one o ore operators and/or m a platform to ootuxiueicate with the oontirai «i 210.. The control Mttil also includes an kiferfase 217 fist tanslste digital dais received Ut t the hi 2M and transmits
DC voltage fenerators 21 , which provide the RF and DC vol ps &r ofieratai of the l trt devce 30. The RF voltage genrators 218 and DC voltage generator 219 receive the foMruciions ifom the mterihee 217 and produce the voltages ¾i red by the lee ftimfr de ice 20. one emiKKi , the erffeen 217 may a o he crauieeted to a mass spectrometer that k eemrecied to the too transfer device 20 ky for exam le, synctatMze.# to adjust the tiniing and ltlp ^ftg of the i n transfer pocess accenting to those described In relation to FIG.18 an FIG.19. The interface 217 may also- be c moted: to one or mor lonlxabon probes to syn troa e p lu Mk and transfer of i ons from a sample.
Wide die present disdosum has bee escibed above with respect to a Striked number of eiuhodiraeids, those silled in th i having the benefit: of this disclosure, will appreciate that other embodiments may be devsed which do not depart from diemm o the inveritkao m disclosed hereto. Acwdbt^y, tic scope of the Invention should be limited only fey the attached claims.

Claims

CIAI S
Wh dmsd
L An ion transfer evice feat »od½rs ions tern at least ate n islet to m least M rniet of l!se km n¾ fe de ke, die lost transfer device eoenprfe g;
M eeelosnr eenfi gured to aintain referee pressure: and
pluality of deorro es disposed at feast in part insde the encl sure* wber n the ion transfer device is eooiipired to be ftaible or re- eonfi bfe
2. Ill* ton transfer device eeeor kg to daim 1* tadn ion transfer device s configured: be heat frmn two or more bend positions to form a plurality rf crtrvatufes white actively end vffiei rtdy transferring the ions.
3. llw ion transfer evke seaming to aint 1 * wherein the kua!ity oi earodes are flmbly connected to each other to ma the ion transfer device re- eonfigpm!hie while activel transferring the ions from a fist location ton second location,
4 The ion transfer device sceoniittg to oifr 1, wherein the one or more ice transfer enetosnree and one or ore eieefeesdea are toihly attached to each other to aife the ion transfer device to transfer fee ons in two or mere different shapes
5 11¾ ion transfer device aceoedfeg to dal M 1 * herein
fee im transfer device is cmrfigured to be transformable between t o or more iffernt physkol feapoy an the ton OTsstbf <iev * Is eotoifiito fe¾ transfer rise is> m lie two r OTB toffereet physical sha es from the at seato one 1» fe to #» it 1«¾M otto ieo yt:l < , Tbe sen irasAr e ce aoeotomg to daitn ls hereto fee tebcei re«sto is bet een 0,001 to 100 Torn,
7. The loss IML device aecordtog to clai ! , -wherein Ac iw transfer device 1$ re-conl frahle an trsisAimrislebetween at least a first canfsg sndoss. and a
$bo¥ά cttoSg«c«o%
the loss tramfe: e ice, in Use first eotoigirr&tlon, transfers ions from a first location to m secon toc iim anti the loes t*:«¾f device, in toe acco l ccKflgu don, transfers toe io J&o toe first location to a thid location, toe tblrd locan» being different front toe second location.
S, The ion rt«Mf¾f device according to ctoim 1, whereto at least t o of the plurality of el ectrodes ®rs cenfigisrai to be flexibly ati&cbed: to each other «sing eetrieslly IMUMS&I MitetM
0 The ion imnsfter device .according to dittos wttototo
t feto group of etorofe comprising t ling umber of she pluralit of electrodes are etosdsed to each other in s norrto todh!e mm x g sseoo l group of decoodee mdutlln a acetonf nn ber of die lomtty of electrodes are attached to etch other in a norofievlble manner, and list tote irciip of dotosxs to told site accent! grxtof to5 eteettodto nregimdhcd to tads other in a flexible &rsner to si low trending of toe first grou group of tecfowkss ssasssl « or »r¾t axes with r s ect fa each other. 10 The i n iraissfer evice aoooKing to d m 1 , wherein die plurality of dectrodes are o -sha e electrodes that form as « tm! %m funnel structure,.
11. The ion transfer evic aecoifeng to el&Jm 1 s whereto th plurality of el eeirodes are wires its frelicsl form.
! 2, lire km transfer device reco ing to claim 1 > wherein the plural of electrodes are ispose parallel toeach other aud are elongated along .an. as of the i« transfer device, 13, The ion transfer device scoordlng to ehh L wherein t e pforal Ity of electrodes are attached to m i nner surface of the enclosure.
14, The ion transfer device accoring to cMm l 5 wherein RF voltage and DC volta e are applied to each of the plurality of electrodes, the SF voltage and DC voltage eing a lied to each of tire plurality of elecrodes respectively via. a capacitor and a resistor.
1 The Ion transfer device according to claim 16, herein the DC voltage Is traveling DC voltage pylse.
16. The i on transfer device according to daim I, wherein RF voltageapplied to ea i of fee piumhty of eetodes is out of ase wMt tire RF voltage applied to adjacent electrodes. , The
the DC wlisge eposes the ions to mow axially parallel to an axis of toe ion transfer itovfe am!
toe RF voltag loses the ions to move radially around toe axis of toe ion transfer device, The too transfer device according to eint I* whe ein toe loo transfer devi ce is coMeeted to an ton wrae feet k cotfigwra to be freely movable n 3~ me ioual space to bring in cl ose to a sam le tinder test to produce the ions from the sample ««tie tost An toe tnaipis sy sten comprising:
M l east one ion s u ce configured to produce i ns fr a sample;
at feast one ion transfer device having eacfoeur»» an a plurality of electrodes disposed at teas? in part insi e the enclosure, the ion transfer device being eoail rod to bo flexible or te-ceittfigumbie: and
s. main body comprising:
a few otto toal er eonfl guresi to se rate tlto i ons based on obili y or mass to charge rati o; and
at least otto etector eon.fl ued to detect fee separated ions, 0 A method etm rk ng;:
producing im fen a sample;
transferring the tens with si least one ion transfer device feat is conflprod to e flexible or ro-eoa mhl , tlto too transfer device having ait enclosure, and a plurality of electrodes· is osed m least k pai inside i:he enclos re
EP19816034.3A 2018-06-05 2019-07-12 Reconfigurable sequentially-packed ion (spion) transfer device Withdrawn EP3815127A2 (en)

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US201816530396A 2018-07-12 2018-07-12
PCT/IB2019/055944 WO2019234724A2 (en) 2018-06-05 2019-07-12 Reconfigurable sequentially-packed ion (spion) transfer device

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US6231054B1 (en) * 1998-12-21 2001-05-15 Axcelis Technologies, Inc. Elastomeric sliding seal for vacuum bellows
US7514673B2 (en) * 2007-06-15 2009-04-07 Thermo Finnigan Llc Ion transport device
US8759757B2 (en) * 2010-10-29 2014-06-24 Thermo Finnigan Llc Interchangeable ion source for electrospray and atmospheric pressure chemical ionization
GB2502155B (en) * 2012-05-18 2020-05-27 Fasmatech Science And Tech Sa Apparatus and method for controlling ions
JP2017511571A (en) * 2014-04-02 2017-04-20 ザ ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティー Apparatus and method for submicron elemental image analysis by mass spectrometry
US10458944B2 (en) * 2016-06-03 2019-10-29 Bruker Daltonik Gmbh Trapped ion mobility spectrometer with high ion storage capacity

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