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EP3848961A4 - SEMICONDUCTOR DEVICE - Google Patents

SEMICONDUCTOR DEVICE Download PDF

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Publication number
EP3848961A4
EP3848961A4 EP18932539.2A EP18932539A EP3848961A4 EP 3848961 A4 EP3848961 A4 EP 3848961A4 EP 18932539 A EP18932539 A EP 18932539A EP 3848961 A4 EP3848961 A4 EP 3848961A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18932539.2A
Other languages
German (de)
French (fr)
Other versions
EP3848961B1 (en
EP3848961A1 (en
Inventor
Takanobu Kajihara
Katsuhiko Omae
Takashi Nagao
Atsuki FUJITA
Ryosuke TAKESHITA
Masakazu Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of EP3848961A1 publication Critical patent/EP3848961A1/en
Publication of EP3848961A4 publication Critical patent/EP3848961A4/en
Application granted granted Critical
Publication of EP3848961B1 publication Critical patent/EP3848961B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
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  • Manufacturing & Machinery (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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