EP3749054A1 - Agencement d'éléments dans une plaque de chauffage électrique et son procédé de fabrication - Google Patents
Agencement d'éléments dans une plaque de chauffage électrique et son procédé de fabrication Download PDFInfo
- Publication number
- EP3749054A1 EP3749054A1 EP19382452.1A EP19382452A EP3749054A1 EP 3749054 A1 EP3749054 A1 EP 3749054A1 EP 19382452 A EP19382452 A EP 19382452A EP 3749054 A1 EP3749054 A1 EP 3749054A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductive
- band
- elements
- arrangement
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000005485 electric heating Methods 0.000 title claims 8
- 239000003973 paint Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 10
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002966 varnish Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 4
- 229910052618 mica group Inorganic materials 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 244000144972 livestock Species 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000009313 farming Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000004411 aluminium Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 206010061876 Obstruction Diseases 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000036619 pore blockages Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Definitions
- the object of the present invention reveals an arrangement of elements in a heating plate and its manufacturing procedure, where the plate is constituted from conductive elements and dielectric elements, that can cover any need for heat, as whether domestic, industrial, agricultural or livestock activities, the elements that make up the plate industrially can be incorporated by a novel procedure that includes techniques such as serigraphy.
- a heater plate generally comprises an insulated substrate in which a resistive heater track is provided.
- a resistive heater track is provided.
- an insulating layer of glass, ceramic or glass is provided on a metal base that has a metal plate, and the track is arranged on the insulating layer.
- This can be achieved by joining thin resistive material to the substrate or, more generally, by using printed circuit techniques where a resistive ink is placed on the substrate or by metal spraying, for example.
- the result of any of these techniques is a flat shape heater that can be conveniently formed, formed or joined to the base of a warming container.
- Resistive heating tracks can also be placed on non-flat substrates, such as tubular objects or other three-dimensional objects.
- the EP-A-0574310 document describes an example of a water heating container that has a plastic body with a printed circuit board heater that forms its base.
- the electrical connection is made at each end of the spiral track, by wires that are attached to the track and connected to the power supply.
- Patent FR1584094 describes a circuit deposited on an anodised aluminium substrate. But this realization in which the layer of alumina reaches only a few microns is not suitable for a circuit that works to the voltage of the electrical sector. In addition, the use is limited to lower temperatures than those of an iron sole.
- Document EP120119 describes an aluminium substrate provided to receive a deposited electrical circuit.
- a thick layer of anodized alumina provides electrical insulation with silicic obstructions. But if this substrate can receive an electrical or electronic circuit, there is no indication that it is adapted to withstand temperatures as high as those experienced by an iron sole.
- Document EP058023 also describes an obstruction treatment of an anodized aluminium substrate.
- the alumina layer is clogged with a polymerized organometallic product, for example, by heating.
- the sealing treatment required to obtain a good dielectric resistance does not constitute a redundant safety and does not assume resistance to thermal shock that finds an iron.
- Patent FR2763780 describes a method for manufacturing printed circuits on an aluminium substrate where a thick layer of alumina is formed on the surface to serve as insulation and can withstand high temperatures without the appearance of defects.
- the pore blockage is not mandatory.
- the circuit can work when the substrate is elevated at high temperature, it is specially adapted to support the implementation of integrated circuits or modules. These components, which help to cool down, do not have by far, instantaneous variations of power and temperature of an iron sole.
- Document US3805023 describes a heating element that has an anodized aluminium substrate.
- the alumina layer obtained in a weak acid bath is dense in contact with the substrate and is an electrical barrier, while the outer layer is porous.
- a light sensitive product containing a precious metal was deposited which serves, after irradiation through a negative and development, as a catalyst to a chemical deposition of the nickel conducting track.
- This present invention solves the problem in a satisfactory way, since it presents an arrangement of elements in a heating plate allowing a high performance, as well as the manufacturing process for obtaining such a plate.
- the object of the invention consists of a heating plate constituted in turn by two elementary plates.
- Each of the elementary plates consists of a nonconductive electric plate that serves as a resistant support.
- the resistive component to be used is a conductive paint that offers a certain degree of resistance in such a way that the passage of the current through the painted band, dissipates energy in the form of heat achieving the desired effect: the generation of heat.
- the electric power supply of the band painted with conductive paint is carried out by means of two metal tracks between which the conductive paint is interposed. These metallic tracks are the ones that polarize and feed the conductive paint.
- the heating plate of the invention is composed of a facing or elemental plate composed of a nonconductive material, either mica, ceramic, glass, plastic or natural stone not electrically conductive. On it is configured a resistive circuit on its surface.
- the circuit is consisting, of at least, three conductive tracks, formed by the projection of three metallic bands, in particular constituted by a conductive copper paste. These bands feed the resistive surface, which is achieved by painting the surface between the bands with conductive paint, on the facing of resulting product, a dielectric varnish is printed in order to encapsulate the circuit and then is dried at 450 degrees Celsius.
- the plate arrangement (10) is configured from a facing (30) which can be rectangular, circular, square or similar, composed of a dielectric material such as mica, wood, ceramics, glass, plastics or natural stone, in such a way that it is not conductive electric.
- a conductive paste is printed on two perpendicular conductive bands (40a) and (40b), united among themselves and arranged in such a way that the band (40a) is of greater dimensions than the length of the band (40b) and where it is also printed conductive paste on a third conductive band (60) parallel to the band (40a) and located at a distance (50) between the band (60) and the band (40b), in such a way that a rectangle of vertices is formed ABCD between of the band (40a) and the band (60). Over this rectangle surface ABCD is covered with conductive paint (20).
- This plate can be used for the construction of a power supply electric heater.
- the heater must have the power supply that connects to the terminals of the plate used, and also of the means of protection so that, if possible, it is not directly accessible by the user, to avoid accidents.
- the manufacturing process of the heating plate allows a wide line of automatic serigraphy, for which, the selected meshes have been determined according to the drawing that they will make on the facing, the material to deposit, the chosen dimension, power that will develop, temperature and final destination.
- the line is fed automatically, in the first machine, the line prints the conductive copper paste , on the facing we have chosen according to its final utility, the conductive copper paste, we will use it to introduce the electrical energy in the system, automatically it passes the oven, the paste passes through a drying oven at 450°C
- the future heating element is reprinted, this time it is printed with conductive paint, which will be deposited the precise amount for the destination to be used, developing the precise power and temperature once finished, this conductive paint is the one that will transform the electrical energy into heat; once printed, it is transported automatically to another oven, where it is dried, cured and stabilized at 450°C.
- the facing (heating element) is carried to a new printing machine, which will print water epoxy paint on all the surface (heating element), with the layer necessary for the heating element to be submerged in water, without leakage of electricity, then through the transfer it passes through another drying oven, which dries the paint at 150°C, once dry, the transfer deposits the heating element in the storage area, once this process is completed, the heating element is passed back through the last printing machine to print the other side with water epoxy paint, with this last step the manufacturing process is finished, either in mica plates, ceramics, crystals, plastics, etc., then come the appropriate quality checks.
- the operational steps in the manufacturing process are:
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Surface Heating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19382452.1A EP3749054A1 (fr) | 2019-06-03 | 2019-06-03 | Agencement d'éléments dans une plaque de chauffage électrique et son procédé de fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19382452.1A EP3749054A1 (fr) | 2019-06-03 | 2019-06-03 | Agencement d'éléments dans une plaque de chauffage électrique et son procédé de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3749054A1 true EP3749054A1 (fr) | 2020-12-09 |
Family
ID=66912762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19382452.1A Withdrawn EP3749054A1 (fr) | 2019-06-03 | 2019-06-03 | Agencement d'éléments dans une plaque de chauffage électrique et son procédé de fabrication |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP3749054A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4301090A1 (fr) * | 2022-06-28 | 2024-01-03 | CENTITVC - Centro de Nanotecnologia e Materiais Tecnicos, Funcionais e Inteligentes | Panneau en pierre naturelle avec un système de chauffage intégré et son procédé de fabrication |
| WO2024003624A1 (fr) * | 2022-06-28 | 2024-01-04 | Centitvc - Centro De Nanotecnologia E Materiais Técnicos Funcionais E Inteligentes | Panneau de pierre naturelle doté d'un système de chauffage intégré et son procédé de fabrication |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1584094A (fr) | 1967-08-03 | 1969-12-12 | ||
| US3805023A (en) | 1972-03-31 | 1974-04-16 | Horizons Inc | Electrical heating device having metal depositions: in a porous anodized metal layer |
| EP0058023A2 (fr) | 1981-02-02 | 1982-08-18 | The Fujikura Cable Works, Ltd. | Procédé de traitement d'une couche d'oxyde anodique, circuit imprimé et son procédé de fabrication |
| EP0120119A2 (fr) | 1982-12-27 | 1984-10-03 | International Business Machines Corporation | Colmatage de couches épaisses anodiques sur des substrats en aluminium |
| EP0555159A1 (fr) | 1992-01-24 | 1993-08-11 | Seb S.A. | Elément chauffant à structure sandwich et appareil éléctroménager, du type fer à repasser à vapeur, comportant un tel élément |
| EP0574310A1 (fr) | 1992-06-11 | 1993-12-15 | Seb S.A. | Plaque chauffante pour récipient chauffant, notamment pour bouilloire |
| FR2763780A1 (fr) | 1997-05-20 | 1998-11-27 | Sagem | Procede de fabrication de circuits imprimes sur substrat metallique |
| US5943799A (en) | 1994-11-14 | 1999-08-31 | U.S. Philips Corporation | Iron having an anti-friction layer |
| WO2005022954A1 (fr) * | 2003-08-30 | 2005-03-10 | H K Wentworth Limited | Panneau chauffant |
| WO2007009232A1 (fr) * | 2005-07-18 | 2007-01-25 | Datec Coating Corporation | Element chauffant a film epais, exempt de plomb, |
| EP2081413A1 (fr) * | 2006-06-16 | 2009-07-22 | David Sanchez Duque | Plaque chauffante et procédé de fabrication |
-
2019
- 2019-06-03 EP EP19382452.1A patent/EP3749054A1/fr not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1584094A (fr) | 1967-08-03 | 1969-12-12 | ||
| US3805023A (en) | 1972-03-31 | 1974-04-16 | Horizons Inc | Electrical heating device having metal depositions: in a porous anodized metal layer |
| EP0058023A2 (fr) | 1981-02-02 | 1982-08-18 | The Fujikura Cable Works, Ltd. | Procédé de traitement d'une couche d'oxyde anodique, circuit imprimé et son procédé de fabrication |
| EP0120119A2 (fr) | 1982-12-27 | 1984-10-03 | International Business Machines Corporation | Colmatage de couches épaisses anodiques sur des substrats en aluminium |
| EP0555159A1 (fr) | 1992-01-24 | 1993-08-11 | Seb S.A. | Elément chauffant à structure sandwich et appareil éléctroménager, du type fer à repasser à vapeur, comportant un tel élément |
| EP0574310A1 (fr) | 1992-06-11 | 1993-12-15 | Seb S.A. | Plaque chauffante pour récipient chauffant, notamment pour bouilloire |
| US5943799A (en) | 1994-11-14 | 1999-08-31 | U.S. Philips Corporation | Iron having an anti-friction layer |
| FR2763780A1 (fr) | 1997-05-20 | 1998-11-27 | Sagem | Procede de fabrication de circuits imprimes sur substrat metallique |
| WO2005022954A1 (fr) * | 2003-08-30 | 2005-03-10 | H K Wentworth Limited | Panneau chauffant |
| WO2007009232A1 (fr) * | 2005-07-18 | 2007-01-25 | Datec Coating Corporation | Element chauffant a film epais, exempt de plomb, |
| EP2081413A1 (fr) * | 2006-06-16 | 2009-07-22 | David Sanchez Duque | Plaque chauffante et procédé de fabrication |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4301090A1 (fr) * | 2022-06-28 | 2024-01-03 | CENTITVC - Centro de Nanotecnologia e Materiais Tecnicos, Funcionais e Inteligentes | Panneau en pierre naturelle avec un système de chauffage intégré et son procédé de fabrication |
| WO2024003624A1 (fr) * | 2022-06-28 | 2024-01-04 | Centitvc - Centro De Nanotecnologia E Materiais Técnicos Funcionais E Inteligentes | Panneau de pierre naturelle doté d'un système de chauffage intégré et son procédé de fabrication |
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