EP3573334A4 - Dispositif de traitement d'informations, procédé de traitement d'informations, et support d'enregistrement - Google Patents
Dispositif de traitement d'informations, procédé de traitement d'informations, et support d'enregistrement Download PDFInfo
- Publication number
- EP3573334A4 EP3573334A4 EP17892403.1A EP17892403A EP3573334A4 EP 3573334 A4 EP3573334 A4 EP 3573334A4 EP 17892403 A EP17892403 A EP 17892403A EP 3573334 A4 EP3573334 A4 EP 3573334A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- information processing
- recording medium
- processing device
- processing method
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/779—Circuitry for scanning or addressing the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017009410A JP7042025B2 (ja) | 2017-01-23 | 2017-01-23 | 情報処理装置、情報処理方法、及び記録媒体 |
| PCT/JP2017/043718 WO2018135161A1 (fr) | 2017-01-23 | 2017-12-06 | Dispositif de traitement d'informations, procédé de traitement d'informations, et support d'enregistrement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP3573334A1 EP3573334A1 (fr) | 2019-11-27 |
| EP3573334A4 true EP3573334A4 (fr) | 2019-11-27 |
| EP3573334B1 EP3573334B1 (fr) | 2022-01-26 |
Family
ID=62908509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP17892403.1A Active EP3573334B1 (fr) | 2017-01-23 | 2017-12-06 | Dispositif de traitement d'informations, procédé de traitement d'informations, et support d'enregistrement |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US11012652B2 (fr) |
| EP (1) | EP3573334B1 (fr) |
| JP (1) | JP7042025B2 (fr) |
| CN (1) | CN110235436B (fr) |
| WO (1) | WO2018135161A1 (fr) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7042025B2 (ja) | 2017-01-23 | 2022-03-25 | ソニーセミコンダクタソリューションズ株式会社 | 情報処理装置、情報処理方法、及び記録媒体 |
| KR102421774B1 (ko) * | 2018-02-12 | 2022-07-18 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102768077B1 (ko) * | 2019-01-07 | 2025-02-13 | 삼성전자주식회사 | 지문 인식 회로 및 이를 포함하는 지문 인식 장치 |
| CN111353421A (zh) * | 2019-04-19 | 2020-06-30 | 神盾股份有限公司 | 光学指纹感测装置 |
| TWI701948B (zh) * | 2019-07-18 | 2020-08-11 | 香港商京鷹科技股份有限公司 | 影像感測裝置及影像感測方法 |
| US11908947B2 (en) * | 2019-08-08 | 2024-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2021064509A1 (fr) * | 2019-10-04 | 2021-04-08 | 株式会社半導体エネルギー研究所 | Dispositif d'affichage |
| JP7656557B2 (ja) * | 2020-02-06 | 2025-04-03 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| JP2022076720A (ja) * | 2020-11-10 | 2022-05-20 | ソニーグループ株式会社 | 半導体装置 |
| JP7682677B2 (ja) * | 2021-04-02 | 2025-05-26 | キヤノン株式会社 | 光電変換装置、機器、基板 |
| KR20220160359A (ko) | 2021-05-27 | 2022-12-06 | 에스케이하이닉스 주식회사 | 이미지 장치 |
| US12119365B2 (en) * | 2021-12-14 | 2024-10-15 | Nanya Technology Corporation | Optical semiconductor device with integrated vias implementing inter-die connection |
| US20240205563A1 (en) * | 2022-12-19 | 2024-06-20 | University Of Southern California | Peripheral circuits for processing in-pixel |
| KR20240127735A (ko) * | 2023-02-16 | 2024-08-23 | 에스케이하이닉스 주식회사 | 이미지 처리 장치 및 물리적 고유 식별키 생성 방법 |
| DE102023108680A1 (de) * | 2023-04-05 | 2024-10-10 | Trustnxt Gmbh | Verfahren zum Erzeugen mindestens eines kryptografischen Schlüssels sowie Computerprogrammprodukt und Vorrichtung dafür |
| KR20240176646A (ko) * | 2023-06-16 | 2024-12-24 | 에스케이하이닉스 주식회사 | 이미지 시그널 프로세서 및 노이즈 제거 방법 |
| US11961263B1 (en) * | 2023-09-16 | 2024-04-16 | SiliconeSignal Technologies | Zero-vision camera system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150199552A1 (en) * | 2014-01-10 | 2015-07-16 | Qualcomm Incorporated | Sensor identification |
| WO2016167076A1 (fr) * | 2015-04-16 | 2016-10-20 | ブリルニクスインク | Dispositif d'imagerie à semi-conducteurs, procédé de commande de dispositif d'imagerie à semi-conducteurs et appareil électronique |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004173154A (ja) | 2002-11-22 | 2004-06-17 | Fuji Photo Film Co Ltd | デジタルカメラ |
| JP4406835B2 (ja) * | 2004-05-25 | 2010-02-03 | ソニー株式会社 | 通信装置及び通信方法 |
| JP4217698B2 (ja) * | 2005-06-20 | 2009-02-04 | キヤノン株式会社 | 撮像装置及び画像処理方法 |
| US8224018B2 (en) * | 2006-01-23 | 2012-07-17 | Digimarc Corporation | Sensing data from physical objects |
| WO2008009826A2 (fr) * | 2006-07-19 | 2008-01-24 | Advanced Track & Trace | Procedes et dispositifs de securisation et d'authentification de documents |
| GB201012631D0 (en) * | 2010-07-28 | 2010-09-15 | Isis Innovation | Image sensor and method of sensing |
| FR2971342B1 (fr) * | 2011-02-07 | 2013-03-01 | Supersonic Imagine | Dispositif d'imagerie avec optimisation de cadence |
| JP5921239B2 (ja) * | 2012-02-10 | 2016-05-24 | キヤノン株式会社 | 撮像装置ならびに制御方法およびプログラム |
| US9741085B2 (en) * | 2013-03-14 | 2017-08-22 | Artificial Intelligence Research Group Limited | System and method of encoding content and an image |
| EP3156947B1 (fr) * | 2015-10-12 | 2020-01-01 | Nxp B.V. | Dispositif électronique |
| JP2017118229A (ja) * | 2015-12-22 | 2017-06-29 | ソニー株式会社 | 情報処理装置、情報処理方法、プログラム |
| US20180006230A1 (en) * | 2016-06-29 | 2018-01-04 | International Business Machines Corporation | Physical unclonable function (puf) including a plurality of nanotubes, and method of forming the puf |
| JP7042025B2 (ja) | 2017-01-23 | 2022-03-25 | ソニーセミコンダクタソリューションズ株式会社 | 情報処理装置、情報処理方法、及び記録媒体 |
| JP7114833B2 (ja) * | 2018-01-22 | 2022-08-09 | ブリルニクスジャパン株式会社 | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
-
2017
- 2017-01-23 JP JP2017009410A patent/JP7042025B2/ja active Active
- 2017-12-06 WO PCT/JP2017/043718 patent/WO2018135161A1/fr not_active Ceased
- 2017-12-06 US US16/478,159 patent/US11012652B2/en active Active
- 2017-12-06 CN CN201780083655.1A patent/CN110235436B/zh active Active
- 2017-12-06 EP EP17892403.1A patent/EP3573334B1/fr active Active
-
2021
- 2021-04-30 US US17/245,102 patent/US11381770B2/en active Active
- 2021-07-27 US US17/386,356 patent/US11665448B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150199552A1 (en) * | 2014-01-10 | 2015-07-16 | Qualcomm Incorporated | Sensor identification |
| WO2016167076A1 (fr) * | 2015-04-16 | 2016-10-20 | ブリルニクスインク | Dispositif d'imagerie à semi-conducteurs, procédé de commande de dispositif d'imagerie à semi-conducteurs et appareil électronique |
| US20180115723A1 (en) * | 2015-04-16 | 2018-04-26 | Brillnics Inc. | Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus |
Non-Patent Citations (2)
| Title |
|---|
| CAO YUAN ET AL: "CMOS Image Sensor Based Physical Unclonable Function for Coherent Sensor-Level Authentication", IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I: REGULAR PAPERS, IEEE, US, vol. 62, no. 11, 1 November 2015 (2015-11-01), pages 2629 - 2640, XP011588597, ISSN: 1549-8328, [retrieved on 20151026], DOI: 10.1109/TCSI.2015.2476318 * |
| See also references of WO2018135161A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20190373195A1 (en) | 2019-12-05 |
| EP3573334A1 (fr) | 2019-11-27 |
| US20210360183A1 (en) | 2021-11-18 |
| US11665448B2 (en) | 2023-05-30 |
| CN110235436A (zh) | 2019-09-13 |
| EP3573334B1 (fr) | 2022-01-26 |
| US11012652B2 (en) | 2021-05-18 |
| JP2018121111A (ja) | 2018-08-02 |
| US20210258523A1 (en) | 2021-08-19 |
| CN110235436B (zh) | 2022-03-18 |
| WO2018135161A1 (fr) | 2018-07-26 |
| JP7042025B2 (ja) | 2022-03-25 |
| US11381770B2 (en) | 2022-07-05 |
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