EP3461228B1 - Heater and glow plug equipped with same - Google Patents
Heater and glow plug equipped with same Download PDFInfo
- Publication number
- EP3461228B1 EP3461228B1 EP17799141.1A EP17799141A EP3461228B1 EP 3461228 B1 EP3461228 B1 EP 3461228B1 EP 17799141 A EP17799141 A EP 17799141A EP 3461228 B1 EP3461228 B1 EP 3461228B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating resistor
- fold
- heater
- projection
- ceramic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Definitions
- the present disclosure relates to a heater utilized as, for example, a heater for ignition or flame detection in a combustion-type vehicle-mounted heating device, a heater for ignition for various combustion equipment such as an oil fan heater, a heater for a glow plug of a diesel engine, a heater for various sensors such as an oxygen sensor, a heater for heating measuring equipment, and a glow plug equipped with such a heater.
- Patent Document 1 As a heater, there have been known ceramic heaters such as that described in JP 2007-240080 A (hereinafter referred to as Patent Document 1), for example.
- the ceramic heater described in Patent Document 1 includes a base having a rod shape and made of ceramic, and a heating element embedded in this base.
- the heating element includes a pair of electrically conductive portions each having a rod shape and extending in an axis direction, and has a circular shape when the electrically conductive portions are viewed in a cross section perpendicular to the axis direction.
- WO 2011/065366 A1 discloses a ceramic heater provided with a heat resistive element embedded in a bar-like ceramic base body, wherein the heat resistive element has a folded portion positioned in the leading end portion of the ceramic base body and two facing portions facing each other and extending in the axis direction of the ceramic base body from the folded portion.
- US 2010/155389 A1 discloses a ceramic heater comprising a heating resistor with first and second conducting portions facing each other and a ceramic base in which the heating resistor is embedded, wherein the first conducting portion comprises a first burr which extends from the first conducting portion and is located between the first conducting portion and the second conducting portion and the second conducting portion comprises a second burr which extends from the second conducting portion and is located between the second conducting portion and the first conducting portion, and wherein at least a part of the first and second burrs is spaced apart from the line linking a starting point of the first burr and a starting point of the second burr in a cross-section perpendicular to a conduction direction of the first and second conducting portions.
- EP 2343951 A1 discloses a ceramic heater constructed by embedding a heat-generator in a base body made of ceramics, wherein the heat-generator has a recess in a surface thereof, the ceramics being inside the recess.
- the present invention provides a heater according to claim 1, a heater according to claim 6, and a glow plug according to claim 9. Preferred embodiments are described in the dependent claims.
- a heater 1 includes a ceramic body 2, a heating resistor 3 embedded in the ceramic body 2, and leads 4 connected to the heating resistor 3 and drawn to a front surface of the ceramic body 2.
- the ceramic body 2 of the heater 1 is formed into a rod shape having a longitudinal direction, for example.
- the heating resistor 3 and the leads 4 are embedded in this ceramic body 2.
- the ceramic body 2 includes ceramic.
- the ceramic includes ceramic having an electrical insulating property such as oxide ceramic, nitride ceramic, or carbide ceramic.
- the ceramic body 2 may include silicon nitride ceramic. This is because silicon nitride, which serves as a primary component of silicon nitride ceramic, is excellent in terms of strength, toughness, electrical insulating property, and thermal resistance.
- the ceramic body 2 including silicon nitride ceramic is obtained by, for example, mixing from 3 to 12 mass% of rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 , or Er 2 O 3 as a sintering aid, from 0.5 to 3 mass% of Al 2 O 3 , and from 1.5 to 5 mass% of SiO 2 in terms of an amount of SiO 2 contained in the sintered body into silicon nitride, which is the primary component, forming the mixture into a predetermined shape, and subsequently subjecting the mixture to hot press firing at a temperature of from 1650 to 1780°C.
- the length of the ceramic body 2 is set to from 20 to 50 mm, for example, and the diameter of the ceramic body 2 is set to from 3 to 5 mm, for example.
- the ceramic body 2 including silicon nitride ceramic when used, MoSiO 2 , WSi 2 , or the like may be mixed and dispersed into the ceramic body 2.
- a coefficient of thermal expansion of the silicon nitride ceramic serving as a base material can be made approximate to a coefficient of thermal expansion of the heating resistor 3, thus enhancing a durability of the heater 1.
- the heating resistor 3 is provided in an interior of the ceramic body 2.
- the heating resistor 3 is provided on a leading end side (first end side) of the ceramic body 2.
- the heating resistor 3 is a member that generates heat by the flow of electrical current therethrough.
- the heating resistor 3 includes linear portions 32 extending in the longitudinal direction of the ceramic body 2, and a fold-back portion 30 connecting the linear portions 32.
- a heating resistor containing carbide, nitride, silicide or the like of W, Mo, Ti or the like as a primary component can be used as the heating resistor 3.
- tungsten carbide is excellent as the material of the heating resistor 3 among the materials described above.
- the heating resistor 3 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 20 mass% or greater.
- WC is an inorganic electrically conductive material, as a primary component
- the content of silicon nitride to be added to WC may be 20 mass% or greater.
- electrically conductive elements that form the heating resistor 3 have large coefficients of thermal expansion compared to the coefficient of thermal expansion of silicon nitride, and thus the heating resistor 3 is usually in a state where a tensile stress is applied to the heating resistor 3.
- the coefficient of thermal expansion of the heating resistor 3 can be brought close to the coefficient of thermal expansion of the ceramic body 2, and thus stress caused by the difference in coefficients of thermal expansion between a time where a temperature of the heater 1 is elevated and a time where a temperature of the heater 1 is lowered can be alleviated.
- the content of silicon nitride contained in the heating resistor 3 when the content of silicon nitride contained in the heating resistor 3 is 40 mass% or less, a variation of a resistance value of the heating resistor 3 can be reduced. Accordingly, the content of silicon nitride contained in the heating resistor 3 may be from 20 to 40 mass%. Preferably, the content of silicon nitride is from 25 to 35 mass%. Further, as an additive to be added into the heating resistor 3 in the same manner as silicon nitride, from 4 to 12 mass% of boron nitride may be added in place of silicon nitride. A total length of the heating resistor 3 can be set to from 3 to 15 mm, and the cross-sectional area may be set to from 0.15 to 0.8 mm 2 .
- the leads 4 are members for electrically connecting the heating resistor 3 and an external power supply.
- the leads 4 are connected to the heating resistor 3 and drawn to the front surface of the ceramic body 2. Specifically, the leads 4 are bonded to both end portions of the heating resistor 3, one lead 4 is connected to a first end of the heating resistor 3 on one end and led from a side surface near a rear end of the ceramic body 2 on the other end, and the other lead 4 is connected to a second end of the heating resistor 3 on one end and led from the rear end portion of the ceramic body 2 on the other end.
- the leads 4 are formed using the same material as that of the heating resistor 3, for example.
- the leads 4 include WC, for example.
- the leads 4 have a greater cross-sectional area than that of the heating resistor 3, a lower content of the formation materials of the ceramic body 2 than that of the heating resistor 3, and thus a low resistance value per unit length.
- the leads 4 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 15 mass% or greater.
- the coefficient of thermal expansion of the leads 4 can be brought close to the coefficient of thermal expansion of the silicon nitride constituting the ceramic body 2.
- the content of silicon nitride when the content of silicon nitride is 40 mass% or less, a resistance value of the leads 4 decreases and becomes stable. Accordingly, the content of silicon nitride may be from 15 to 40 mass%. Further, the content of silicon nitride may be from 20 to 35 mass%.
- the heater 1 of the present embodiment includes the ceramic body 2 having a rod shape, and the heating resistor 3 provided in the interior of the ceramic body 2, with the heating resistor 3 including the fold-back portion 30 and a projection 31 having a wire shape and extending across an entirety of an outer periphery of the fold-back portion 30 in a folding-back direction.
- the projection 31 projects outward and extends along an entirety of the fold-back portion 30 along the fold-back portion 30.
- the heat can be readily dispersed from the projection 31 having a wire shape to the ceramic body 2.
- This makes it possible to reduce the amount of heat momentarily trapped in the heating resistor 3 and thus reduce the thermal stress between the heating resistor 3 and the ceramic body 2.
- the possibility of the occurrence of cracks in the heating resistor 3 can be reduced.
- a long-term reliability of the heater 1 can be improved.
- the projection 31 may be positioned on an outermost periphery of the fold-back portion 30.
- the heat can be more readily dispersed to the outer peripheral side of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3.
- the cross-section shape of the fold-back portion 30 is elliptical.
- the fold-back portion 30 folds back on an imaginary plane.
- the cross-section shape of the fold-back portion 30 has a major axis in the direction perpendicular to the imaginary plane on which the fold-back portion 30 folds back.
- the projection 31 is positioned on an extended line of a minor axis of the elliptical shape.
- the projection 31 has a triangular shape in FIG. 2
- the shape is not limited thereto.
- various shapes can be used.
- the shape may be semicircular or semi-elliptical.
- the length (height) of the projection 31 in the direction of projection can be set to from 5 to 30 ⁇ m, for example.
- a tip of the projection 31 when viewed in a cross section perpendicular to an extending direction of the projection 31 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in the ceramic body 2 caused by a contact portion that comes into contact with the projection 31 can be reduced.
- the heating resistor 3 may include the fold-back portion 30 and the linear portions 32 connected to the fold-back portion 30, with the projection 31 extending to the linear portions 32. In this way, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2. This makes it possible to further reduce the trapping of heat in the heating resistor 3.
- end portions of the projection 31 are positioned on the linear portions 32 and not on the fold-back portion 30. Because the heat tends to become trapped particularly in the fold-back portion 30, the heating resistor 3 including the fold-back portion 30 may be subjected to a large concentration of thermal stress at the end portions of the projection 31 when the end portions of the projection 31 are positioned in the middle of the fold-back portion 30.
- the end portions of the projection 31 By positioning the end portions of the projection 31 on the linear portions 32 as illustrated in FIG. 4 , it is possible to reduce the possibility of concentration of thermal stress in the end portions of the projection 31.
- the heating resistor 3 may further include a second projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction.
- a second projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction.
- heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2.
- the shape may be semicircular or semi-elliptical.
- the length (height) of the second projection 33 in the direction of projection can be set to from 5 to 30 ⁇ m, for example.
- a tip of the projection 33 when viewed in a cross section perpendicular to an extending direction of the projection 33 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in the ceramic body 2 caused by a contact portion that comes into contact with the second projection 33 can be reduced.
- a glow plug 10 includes the heater 1 described above, and a metal tube 5 having a tubular shape and attached so as to cover a rear end side (second end side) of the heater 1.
- the glow plug 10 further includes an electrode fitting 6 disposed on an inner side of the metal tube 5 and attached to the rear end of the heater 1. According to the glow plug 10, because the heater 1 described above is used, durability is improved.
- the metal tube 5 is a member for holding the ceramic body 2.
- the metal tube 5 is a tubular member, and is attached so as to surround the rear end side of the ceramic body 2. That is, the ceramic body 2 having a rod shape is inserted into the inner side of the metal tube 5 having a tubular shape.
- the metal tube 5 is provided to a side surface on the rear end side of the ceramic body 2, and is electrically connected to the exposed portions of the leads 4.
- the metal tube 5 includes, for example, stainless steel or iron (Fe) - nickel (Ni) - cobalt (Co) alloy.
- the metal tube 5 and the ceramic body 2 are bonded by a brazing material.
- the brazing material is provided so as to surround the rear end side of the ceramic body 2, between the metal tube 5 and the ceramic body 2. With the brazing material provided, the metal tube 5 and the leads 4 are electrically connected.
- a silver (Ag) - copper (Cu) brazing material, a silver brazing material, or a copper brazing material containing glass components in an amount from 5 to 20 mass% or the like can be used as the brazing material.
- the glass components have favorable wettability with the ceramic of the ceramic body 2 and a high friction coefficient, making it possible to improve a bonding strength between the brazing material and the ceramic body 2 or a bonding strength between the brazing material and the metal tube 5.
- the electrode fitting 6 is positioned on the inner side of the metal tube 5, and attached to the rear end of the ceramic body 2 so as to be electrically connected to the leads 4.
- the electrode fitting 6 various forms may be used.
- the electrode fitting 6 is configured by connecting a cap portion attached to the rear end of the ceramic body 2 so as to cover the rear end including the leads 4, and a coil-shaped portion electrically connected to an external connecting electrode, by a wire-shaped portion.
- This electrode fitting 6 is kept separated from an inner peripheral surface of the metal tube 5 so as to not cause a short with the metal tube 5.
- the electrode fitting 6 is a metal wire having a coil-shaped portion provided to alleviate stress in the connection with the external power supply.
- the electrode fitting 6 is electrically connected to the leads 4, and electrically connected to the external power supply. Voltage is applied between the metal tube 5 and the electrode fitting 6 by the external power supply, making it possible to allow electrical current to flow to the heating resistor 3 via the metal tube 5 and the electrode fitting 6.
- the electrode fitting 6 includes, for example, nickel or stainless steel.
- the heater 1 can be formed by, for example, injection molding or the like which uses metal molds having shapes of the heating resistor 3, the leads 4, and the ceramic body 2, respectively, of the configuration described above.
- the heater 1 may include the ceramic body 2 having a rod shape, and the heating resistor 3 provided in the interior of the ceramic body 3, with the heating resistor 3 including the fold-back portion 30 and a stepped portion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 in the folding-back direction.
- the stepped portion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of the heating resistor 3 in the folding-back direction, the heat can be readily dispersed from the stepped portion 34 having a wire shape to the ceramic body 2.
- the stepped portion 34 may be positioned on the outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3.
- the heating resistor 3 may further include a second stepped portion 35 having a wire shape and extending across the entirety of the inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2, making it possible to further reduce the trapping of the heat in the heating resistor 3.
- the heating resistor 3 further includes a third projection 36 having a wire shape and extending across the inner periphery and the outer periphery. Note that, in FIG. 8 , the focus is on the third projection 36 and thus the projection 31 or the stepped portion 34 is omitted. With the third projection 36 provided, heat can be more readily transmitted from the heating resistor 3 to the ceramic body 2.
- the third projection 36 extends diagonally in the folding-back direction of the fold-back portion 30.
- the heat can be more readily dispersed to the inner peripheral side and the outer peripheral side across a wider range of the ceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in the heating resistor 3 under rapid temperature rise.
- the third projection 36 may extend diagonally in the folding-back direction, or may extend in a direction perpendicular to the folding-back direction.
- the third projection 36 may be provided across the entire periphery of the fold-back portion 30.
- the third projection 36 may be formed into an annular shape and provided across the entire periphery of the fold-back portion 30.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
Description
- The present disclosure relates to a heater utilized as, for example, a heater for ignition or flame detection in a combustion-type vehicle-mounted heating device, a heater for ignition for various combustion equipment such as an oil fan heater, a heater for a glow plug of a diesel engine, a heater for various sensors such as an oxygen sensor, a heater for heating measuring equipment, and a glow plug equipped with such a heater.
- As a heater, there have been known ceramic heaters such as that described in
(hereinafter referred to as Patent Document 1), for example. The ceramic heater described inJP 2007-240080 A Patent Document 1 includes a base having a rod shape and made of ceramic, and a heating element embedded in this base. The heating element includes a pair of electrically conductive portions each having a rod shape and extending in an axis direction, and has a circular shape when the electrically conductive portions are viewed in a cross section perpendicular to the axis direction. -
WO 2011/065366 A1 discloses a ceramic heater provided with a heat resistive element embedded in a bar-like ceramic base body, wherein the heat resistive element has a folded portion positioned in the leading end portion of the ceramic base body and two facing portions facing each other and extending in the axis direction of the ceramic base body from the folded portion. -
US 2010/155389 A1 discloses a ceramic heater comprising a heating resistor with first and second conducting portions facing each other and a ceramic base in which the heating resistor is embedded, wherein the first conducting portion comprises a first burr which extends from the first conducting portion and is located between the first conducting portion and the second conducting portion and the second conducting portion comprises a second burr which extends from the second conducting portion and is located between the second conducting portion and the first conducting portion, and wherein at least a part of the first and second burrs is spaced apart from the line linking a starting point of the first burr and a starting point of the second burr in a cross-section perpendicular to a conduction direction of the first and second conducting portions. -
EP 2343951 A1 discloses a ceramic heater constructed by embedding a heat-generator in a base body made of ceramics, wherein the heat-generator has a recess in a surface thereof, the ceramics being inside the recess. - The present invention provides a heater according to
claim 1, a heater according to claim 6, and a glow plug according to claim 9. Preferred embodiments are described in the dependent claims. -
-
FIG. 1 is a vertical cross-sectional view illustrating an example of a heater. -
FIG. 2 is a horizontal cross-sectional view of the heater illustrated inFIG. 1 taken along line A-A'. -
FIG. 3 is a horizontal cross-sectional view illustrating another example of a heater. -
FIG. 4 is a vertical cross-sectional view illustrating another example of a heater. -
FIG. 5 is a vertical cross-sectional view illustrating another example of a heater. -
FIG. 6 is a vertical cross-sectional view illustrating an example of an embodiment of a glow plug. -
FIG. 7 is a horizontal cross-sectional view illustrating another example of a heater. -
FIG. 8 is a schematic view illustrating a front surface of a heating resistor of a heater of another example. - As illustrated in
FIG. 1 , aheater 1 includes aceramic body 2, aheating resistor 3 embedded in theceramic body 2, and leads 4 connected to theheating resistor 3 and drawn to a front surface of theceramic body 2. - The
ceramic body 2 of theheater 1 is formed into a rod shape having a longitudinal direction, for example. Theheating resistor 3 and theleads 4 are embedded in thisceramic body 2. Here, theceramic body 2 includes ceramic. As a result, it is possible to provide theheater 1 having high reliability under rapid temperature rise. Examples of the ceramic include ceramic having an electrical insulating property such as oxide ceramic, nitride ceramic, or carbide ceramic. Particularly, theceramic body 2 may include silicon nitride ceramic. This is because silicon nitride, which serves as a primary component of silicon nitride ceramic, is excellent in terms of strength, toughness, electrical insulating property, and thermal resistance. Theceramic body 2 including silicon nitride ceramic is obtained by, for example, mixing from 3 to 12 mass% of rare earth element oxide such as Y2O3, Yb2O3, or Er2O3 as a sintering aid, from 0.5 to 3 mass% of Al2O3, and from 1.5 to 5 mass% of SiO2 in terms of an amount of SiO2 contained in the sintered body into silicon nitride, which is the primary component, forming the mixture into a predetermined shape, and subsequently subjecting the mixture to hot press firing at a temperature of from 1650 to 1780°C. The length of theceramic body 2 is set to from 20 to 50 mm, for example, and the diameter of theceramic body 2 is set to from 3 to 5 mm, for example. - Note that, when the
ceramic body 2 including silicon nitride ceramic is used, MoSiO2, WSi2, or the like may be mixed and dispersed into theceramic body 2. In this case, a coefficient of thermal expansion of the silicon nitride ceramic serving as a base material can be made approximate to a coefficient of thermal expansion of theheating resistor 3, thus enhancing a durability of theheater 1. - The
heating resistor 3 is provided in an interior of theceramic body 2. Theheating resistor 3 is provided on a leading end side (first end side) of theceramic body 2. Theheating resistor 3 is a member that generates heat by the flow of electrical current therethrough. Theheating resistor 3 includeslinear portions 32 extending in the longitudinal direction of theceramic body 2, and a fold-back portion 30 connecting thelinear portions 32. As theheating resistor 3, a heating resistor containing carbide, nitride, silicide or the like of W, Mo, Ti or the like as a primary component can be used. When theceramic body 2 includes silicon nitride ceramic, from a viewpoint that a difference in the coefficients of thermal expansion of theheating resistor 3 and theceramic body 2 is small and from a viewpoint that theheating resistor 3 exhibits high thermal resistance, tungsten carbide (WC) is excellent as the material of theheating resistor 3 among the materials described above. - Further, when the
ceramic body 2 includes silicon nitride ceramic, theheating resistor 3 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 20 mass% or greater. For example, in theceramic body 2 including silicon nitride ceramic, electrically conductive elements that form theheating resistor 3 have large coefficients of thermal expansion compared to the coefficient of thermal expansion of silicon nitride, and thus theheating resistor 3 is usually in a state where a tensile stress is applied to theheating resistor 3. In contrast, with the addition of silicon nitride into theheating resistor 3, the coefficient of thermal expansion of theheating resistor 3 can be brought close to the coefficient of thermal expansion of theceramic body 2, and thus stress caused by the difference in coefficients of thermal expansion between a time where a temperature of theheater 1 is elevated and a time where a temperature of theheater 1 is lowered can be alleviated. - Further, when the content of silicon nitride contained in the
heating resistor 3 is 40 mass% or less, a variation of a resistance value of theheating resistor 3 can be reduced. Accordingly, the content of silicon nitride contained in theheating resistor 3 may be from 20 to 40 mass%. Preferably, the content of silicon nitride is from 25 to 35 mass%. Further, as an additive to be added into theheating resistor 3 in the same manner as silicon nitride, from 4 to 12 mass% of boron nitride may be added in place of silicon nitride. A total length of theheating resistor 3 can be set to from 3 to 15 mm, and the cross-sectional area may be set to from 0.15 to 0.8 mm2. - The
leads 4 are members for electrically connecting theheating resistor 3 and an external power supply. Theleads 4 are connected to theheating resistor 3 and drawn to the front surface of theceramic body 2. Specifically, theleads 4 are bonded to both end portions of theheating resistor 3, onelead 4 is connected to a first end of theheating resistor 3 on one end and led from a side surface near a rear end of theceramic body 2 on the other end, and theother lead 4 is connected to a second end of theheating resistor 3 on one end and led from the rear end portion of theceramic body 2 on the other end. - The
leads 4 are formed using the same material as that of theheating resistor 3, for example. Theleads 4 include WC, for example. Theleads 4 have a greater cross-sectional area than that of theheating resistor 3, a lower content of the formation materials of theceramic body 2 than that of theheating resistor 3, and thus a low resistance value per unit length. Further, theleads 4 may contain WC, which is an inorganic electrically conductive material, as a primary component, and the content of silicon nitride to be added to WC may be 15 mass% or greater. Along with the increase in content of silicon nitride, the coefficient of thermal expansion of theleads 4 can be brought close to the coefficient of thermal expansion of the silicon nitride constituting theceramic body 2. Further, when the content of silicon nitride is 40 mass% or less, a resistance value of theleads 4 decreases and becomes stable. Accordingly, the content of silicon nitride may be from 15 to 40 mass%. Further, the content of silicon nitride may be from 20 to 35 mass%. - Here, the
heater 1 of the present embodiment, as illustrated inFIG. 1 , includes theceramic body 2 having a rod shape, and theheating resistor 3 provided in the interior of theceramic body 2, with theheating resistor 3 including the fold-back portion 30 and aprojection 31 having a wire shape and extending across an entirety of an outer periphery of the fold-back portion 30 in a folding-back direction. Theprojection 31 projects outward and extends along an entirety of the fold-back portion 30 along the fold-back portion 30. In this way, with the provision of theprojection 31 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of theheating resistor 3 in the folding-back direction, the heat can be readily dispersed from theprojection 31 having a wire shape to theceramic body 2. This makes it possible to reduce the amount of heat momentarily trapped in theheating resistor 3 and thus reduce the thermal stress between theheating resistor 3 and theceramic body 2. Thus, the possibility of the occurrence of cracks in theheating resistor 3 can be reduced. As a result, a long-term reliability of theheater 1 can be improved. - Further, as illustrated in
FIG. 2 , theprojection 31 may be positioned on an outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3. In theheater 1 illustrated inFIG. 2 , the cross-section shape of the fold-back portion 30 is elliptical. The fold-back portion 30 folds back on an imaginary plane. The cross-section shape of the fold-back portion 30 has a major axis in the direction perpendicular to the imaginary plane on which the fold-back portion 30 folds back. Theprojection 31 is positioned on an extended line of a minor axis of the elliptical shape. - While the
projection 31 has a triangular shape inFIG. 2 , the shape is not limited thereto. For theprojection 31, various shapes can be used. For example, the shape may be semicircular or semi-elliptical. The length (height) of theprojection 31 in the direction of projection can be set to from 5 to 30 µm, for example. - Further, as illustrated in
FIG. 3 , a tip of theprojection 31 when viewed in a cross section perpendicular to an extending direction of theprojection 31 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in theceramic body 2 caused by a contact portion that comes into contact with theprojection 31 can be reduced. - Further, as illustrated in
FIG. 4 , theheating resistor 3 may include the fold-back portion 30 and thelinear portions 32 connected to the fold-back portion 30, with theprojection 31 extending to thelinear portions 32. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. This makes it possible to further reduce the trapping of heat in theheating resistor 3. - Further, with the
projection 31 continuously formed from the fold-back portion 30 to thelinear portions 32, end portions of theprojection 31 are positioned on thelinear portions 32 and not on the fold-back portion 30. Because the heat tends to become trapped particularly in the fold-back portion 30, theheating resistor 3 including the fold-back portion 30 may be subjected to a large concentration of thermal stress at the end portions of theprojection 31 when the end portions of theprojection 31 are positioned in the middle of the fold-back portion 30. By positioning the end portions of theprojection 31 on thelinear portions 32 as illustrated inFIG. 4 , it is possible to reduce the possibility of concentration of thermal stress in the end portions of theprojection 31. - Further, as illustrated in
FIG. 5 , theheating resistor 3 may further include asecond projection 33 having a wire shape and extending across an entirety of an inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. For thesecond projection 33, various shapes can be used. For example, the shape may be semicircular or semi-elliptical. The length (height) of thesecond projection 33 in the direction of projection can be set to from 5 to 30 µm, for example. Further, a tip of theprojection 33 when viewed in a cross section perpendicular to an extending direction of theprojection 33 may have a smooth curved shape. In this way, the possibility of the occurrence of cracks in theceramic body 2 caused by a contact portion that comes into contact with thesecond projection 33 can be reduced. - As illustrated in
FIG. 6 , aglow plug 10 includes theheater 1 described above, and ametal tube 5 having a tubular shape and attached so as to cover a rear end side (second end side) of theheater 1. Theglow plug 10 further includes an electrode fitting 6 disposed on an inner side of themetal tube 5 and attached to the rear end of theheater 1. According to theglow plug 10, because theheater 1 described above is used, durability is improved. - The
metal tube 5 is a member for holding theceramic body 2. Themetal tube 5 is a tubular member, and is attached so as to surround the rear end side of theceramic body 2. That is, theceramic body 2 having a rod shape is inserted into the inner side of themetal tube 5 having a tubular shape. Themetal tube 5 is provided to a side surface on the rear end side of theceramic body 2, and is electrically connected to the exposed portions of theleads 4. Themetal tube 5 includes, for example, stainless steel or iron (Fe) - nickel (Ni) - cobalt (Co) alloy. - The
metal tube 5 and theceramic body 2 are bonded by a brazing material. The brazing material is provided so as to surround the rear end side of theceramic body 2, between themetal tube 5 and theceramic body 2. With the brazing material provided, themetal tube 5 and theleads 4 are electrically connected. - As the brazing material, a silver (Ag) - copper (Cu) brazing material, a silver brazing material, or a copper brazing material containing glass components in an amount from 5 to 20 mass% or the like can be used. The glass components have favorable wettability with the ceramic of the
ceramic body 2 and a high friction coefficient, making it possible to improve a bonding strength between the brazing material and theceramic body 2 or a bonding strength between the brazing material and themetal tube 5. - The electrode fitting 6 is positioned on the inner side of the
metal tube 5, and attached to the rear end of theceramic body 2 so as to be electrically connected to theleads 4. As the electrode fitting 6, various forms may be used. In the example illustrated in FIG. 9, the electrode fitting 6 is configured by connecting a cap portion attached to the rear end of theceramic body 2 so as to cover the rear end including theleads 4, and a coil-shaped portion electrically connected to an external connecting electrode, by a wire-shaped portion. This electrode fitting 6 is kept separated from an inner peripheral surface of themetal tube 5 so as to not cause a short with themetal tube 5. - The electrode fitting 6 is a metal wire having a coil-shaped portion provided to alleviate stress in the connection with the external power supply. The electrode fitting 6 is electrically connected to the
leads 4, and electrically connected to the external power supply. Voltage is applied between themetal tube 5 and the electrode fitting 6 by the external power supply, making it possible to allow electrical current to flow to theheating resistor 3 via themetal tube 5 and the electrode fitting 6. The electrode fitting 6 includes, for example, nickel or stainless steel. Theheater 1 can be formed by, for example, injection molding or the like which uses metal molds having shapes of theheating resistor 3, theleads 4, and theceramic body 2, respectively, of the configuration described above. - Further, as illustrated in
FIG. 7 , theheater 1 may include theceramic body 2 having a rod shape, and theheating resistor 3 provided in the interior of theceramic body 3, with theheating resistor 3 including the fold-back portion 30 and a steppedportion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 in the folding-back direction. In this way, with the provision of the steppedportion 34 having a wire shape and extending across the entirety of the outer periphery of the fold-back portion 30 of theheating resistor 3 in the folding-back direction, the heat can be readily dispersed from the steppedportion 34 having a wire shape to theceramic body 2. This makes it possible to reduce the amount of heat momentarily trapped in theheating resistor 3 and thus reduce the thermal stress between theheating resistor 3 and theceramic body 2. Thus, the possibility of the generation of cracks in theheating resistor 3 can be reduced. As a result, the long-term reliability of theheater 1 can be improved. - Further, as illustrated in
FIG. 7 , the steppedportion 34 may be positioned on the outermost periphery of the fold-back portion 30. In this way, the heat can be more readily dispersed to the outer peripheral side of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3. - Further, the
heating resistor 3 may further include a second steppedportion 35 having a wire shape and extending across the entirety of the inner periphery of the fold-back portion 30 in the folding-back direction. In this way, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2, making it possible to further reduce the trapping of the heat in theheating resistor 3. - Further, as illustrated in
FIG. 8 , theheating resistor 3 further includes athird projection 36 having a wire shape and extending across the inner periphery and the outer periphery. Note that, inFIG. 8 , the focus is on thethird projection 36 and thus theprojection 31 or the steppedportion 34 is omitted. With thethird projection 36 provided, heat can be more readily transmitted from theheating resistor 3 to theceramic body 2. - In
FIG. 8 , thethird projection 36 extends diagonally in the folding-back direction of the fold-back portion 30. In this way, the heat can be more readily dispersed to the inner peripheral side and the outer peripheral side across a wider range of theceramic body 2, making it possible to further reduce the amount of heat momentarily trapped in theheating resistor 3 under rapid temperature rise. Note that thethird projection 36 may extend diagonally in the folding-back direction, or may extend in a direction perpendicular to the folding-back direction. When extended in a direction perpendicular to the folding-back direction, thethird projection 36 may be provided across the entire periphery of the fold-back portion 30. In other words, thethird projection 36 may be formed into an annular shape and provided across the entire periphery of the fold-back portion 30. -
- 1 Heater
- 2 Ceramic body
- 3 Heating resistor
- 30 Fold-back portion
- 31 Projection
- 32 Linear portion
- 33 Second projection
- 34 Stepped portion
- 35 Second stepped portion
- 36 Third projection
- 4 Lead
- 5 Metal tube
- 6 Electrode fitting
- 10 Glow plug
Claims (9)
- A heater (1) comprising:a ceramic body (2) having a rod shape; anda heating resistor (3) provided in an interior of the ceramic body (2),whereinthe heating resistor (3) comprises a fold-back portion (30) and a projection (31) having a wire shape and extending across an entirety of an outer periphery of the fold-back portion (30) in a folding-back direction,characterized in thatthe heating resistor (3) further comprises a third projection (36) having a wire shape and extending across an inner periphery and an outer periphery of the heating resistor (3).
- The heater (1) according to claim 1, wherein the cross-section shape of the fold-back portion (30) is elliptical, wherein the fold-back portion (30) folds back on an imaginary plane, wherein the cross-section shape of the fold-back portion (30) has a major axis in the direction perpendicular to the imaginary plane, and wherein the projection (31) is positioned on an extended line of a minor axis of the elliptical shape.
- The heater (1) according to claim 1 or 2, wherein a tip of the projection (31) when viewed in a cross-section perpendicular to an extending direction of the projection (31) has a smooth curved shape.
- The heater (1) according to any one of claims 1 to 3, wherein
the heating resistor (3) comprises the fold-back portion (30) and a linear portion (32) connected to the fold-back portion (30), and
the projection (31) extends to the linear portions (32) . - The heater (1) according to any one of claims 1 to 4, wherein the heating resistor (3) further comprises a second projection (33) having a wire shape and extending across an entirety of an inner periphery of the fold-back portion (30) in the folding-back direction.
- A heater (1) comprising:a ceramic body (2) having a rod shape; anda heating resistor (3) provided in an interior of the ceramic body (2),whereinthe heating resistor (3) comprises a fold-back portion (30) and a stepped portion (34) having a wire shape and extending across an entirety of an outer periphery of the fold-back portion (30) in a folding-back direction,characterized in thatthe heating resistor (3) further comprises a third projection (36) having a wire shape and extending across an inner periphery and an outer periphery of the heating resistor (3).
- The heater (1) according to claim 6, wherein the cross-section shape of the fold-back portion (30) is elliptical, wherein the fold-back portion (30) folds back on an imaginary plane, wherein the cross-section shape of the fold-back portion (30) has a major axis in the direction perpendicular to the imaginary plane, and wherein the stepped portion (34) is positioned on an extended line of a minor axis of the elliptical shape.
- The heater (1) according to claim 6 or 7, wherein the heating resistor (3) further comprises a second stepped portion (35) having a wire shape and extending across an entirety of an inner periphery of the fold-back portion (30) in the folding-back direction.
- A glow plug (10) comprising:the heater (1) according to any one of claims 1 to 8 including the heating resistor (3) positioned on a first end side of the ceramic body (2); anda metal tube (5) attached covering a second end side of the ceramic body (2).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016098489 | 2016-05-17 | ||
| PCT/JP2017/016347 WO2017199711A1 (en) | 2016-05-17 | 2017-04-25 | Heater and glow plug equipped with same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP3461228A1 EP3461228A1 (en) | 2019-03-27 |
| EP3461228A4 EP3461228A4 (en) | 2020-01-01 |
| EP3461228B1 true EP3461228B1 (en) | 2020-12-30 |
Family
ID=60325023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP17799141.1A Active EP3461228B1 (en) | 2016-05-17 | 2017-04-25 | Heater and glow plug equipped with same |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3461228B1 (en) |
| JP (1) | JP6725653B2 (en) |
| WO (1) | WO2017199711A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117249031A (en) * | 2023-11-01 | 2023-12-19 | 上海夏雪科技有限公司 | Glow plugs and internal combustion engines |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2141961B1 (en) * | 2007-03-29 | 2015-09-09 | Kyocera Corporation | Ceramic heater, and its mold |
| JP5279447B2 (en) * | 2008-10-28 | 2013-09-04 | 京セラ株式会社 | Ceramic heater |
| JP5409806B2 (en) * | 2009-11-27 | 2014-02-05 | 京セラ株式会社 | Ceramic heater |
| JP2014219107A (en) * | 2011-09-07 | 2014-11-20 | ボッシュ株式会社 | Ceramic heater type glow plug |
| JP5795029B2 (en) * | 2013-07-09 | 2015-10-14 | 日本特殊陶業株式会社 | Ceramic heater, glow plug, ceramic heater manufacturing method, and glow plug manufacturing method |
| JP6165601B2 (en) * | 2013-11-27 | 2017-07-19 | 日本特殊陶業株式会社 | Ceramic heater and glow plug |
| JP6144609B2 (en) * | 2013-11-27 | 2017-06-07 | 日本特殊陶業株式会社 | Ceramic heater and glow plug |
| CN107211492B (en) * | 2014-12-25 | 2020-09-04 | 京瓷株式会社 | Heater and glow plug provided with same |
-
2017
- 2017-04-25 JP JP2018518188A patent/JP6725653B2/en active Active
- 2017-04-25 WO PCT/JP2017/016347 patent/WO2017199711A1/en not_active Ceased
- 2017-04-25 EP EP17799141.1A patent/EP3461228B1/en active Active
Non-Patent Citations (1)
| Title |
|---|
| None * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017199711A1 (en) | 2017-11-23 |
| JPWO2017199711A1 (en) | 2019-03-07 |
| EP3461228A1 (en) | 2019-03-27 |
| JP6725653B2 (en) | 2020-07-22 |
| EP3461228A4 (en) | 2020-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2600688B1 (en) | Heater and glow plug provided with same | |
| JP6023389B1 (en) | Heater and glow plug equipped with the same | |
| EP3461228B1 (en) | Heater and glow plug equipped with same | |
| CN104662998B (en) | Heater and glow plug equipped with the heater | |
| CN103493585B (en) | Heater and there is the glow plug of this heater | |
| EP3383130B1 (en) | Heater and glow plug provided therewith | |
| EP2623866B1 (en) | Heater and glow plug provided with same | |
| JP6603321B2 (en) | Heater and glow plug equipped with the same | |
| JP6342653B2 (en) | Heater and glow plug equipped with the same | |
| JP6105464B2 (en) | Heater and glow plug equipped with the same | |
| JP7116237B2 (en) | heater | |
| JP6711697B2 (en) | Heater and glow plug equipped with the same | |
| CN112314051B (en) | Heater and glow plug provided with same | |
| EP3413686A1 (en) | Heater and glow-plug provided therewith | |
| JPWO2013031728A1 (en) | Heater and glow plug equipped with the same | |
| JPWO2018084083A1 (en) | Heater and glow plug equipped with the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
| 17P | Request for examination filed |
Effective date: 20181105 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| AX | Request for extension of the european patent |
Extension state: BA ME |
|
| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20191203 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05B 3/10 20060101AFI20191127BHEP Ipc: F23Q 7/00 20060101ALI20191127BHEP Ipc: H05B 3/14 20060101ALI20191127BHEP Ipc: H05B 3/48 20060101ALI20191127BHEP Ipc: H05B 3/18 20060101ALI20191127BHEP Ipc: F23Q 7/22 20060101ALI20191127BHEP |
|
| GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
| INTG | Intention to grant announced |
Effective date: 20200908 |
|
| GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602017030600 Country of ref document: DE |
|
| REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1351255 Country of ref document: AT Kind code of ref document: T Effective date: 20210115 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210330 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210331 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 1351255 Country of ref document: AT Kind code of ref document: T Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210330 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG9D |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210430 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210430 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602017030600 Country of ref document: DE |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| 26N | No opposition filed |
Effective date: 20211001 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210425 |
|
| REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20210430 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210425 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20210430 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20210430 |
|
| P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230508 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20201230 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20170425 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20201230 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20250310 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20250306 Year of fee payment: 9 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20250305 Year of fee payment: 9 |