EP3327165A1 - Procédé de création d'une piste conductrice - Google Patents
Procédé de création d'une piste conductrice Download PDFInfo
- Publication number
- EP3327165A1 EP3327165A1 EP16382558.1A EP16382558A EP3327165A1 EP 3327165 A1 EP3327165 A1 EP 3327165A1 EP 16382558 A EP16382558 A EP 16382558A EP 3327165 A1 EP3327165 A1 EP 3327165A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic assembly
- plasma flow
- comprised
- plasma
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 229920003023 plastic Polymers 0.000 claims abstract description 28
- 239000004033 plastic Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 239000000428 dust Substances 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
Definitions
- This invention belongs to the field of methods which are intended to manufacture electronic assemblies and automotive lighting devices comprising such assemblies.
- Directly depositing a conductive track on a plastics substrate normally supposes substantial cost savings, mainly due to the fact that a dedicated printed circuit board need not be provided. Therefore, other integral parts of the device to be controlled with the electronic assembly can be taken advantage of to play the role of substrate for the conductive track.
- Plasma deposition is sometimes used to directly deposit a conductive track on a plastics substrate. This process comprises the step of including in the plasma flow some metal dust particles, usually copper, that are melted by the plasma flow and then deposited on the plastic part, thus creating a conductive track on said plastic part.
- Patent EP 2247766 B1 shows a way of solving this problem by the use of masks when creating these tracks.
- these masks need to be specifically designed for each track and plastic part geometry, which make it expensive and non-practical for its use in a field with different and varied shapes and geometries.
- the border of the conductive track appears as a sharp edge because the process is focused on isolating the conductive track from the masked areas in an abrupt way.
- the invention provides a solution for this problem by means of a method for manufacturing an electronic assembly according to claim 1, a method for manufacturing a lighting device for an automotive vehicle according to claim 7, an electronic assembly according to claim 10 and a lighting device according to claim 11.
- Preferred embodiments of the invention are defined in dependent claims.
- the present invention provides a method for manufacturing an electronic assembly, the method comprising the steps of:
- a method for manufacturing an electronic assembly using these parameters ensures that the borders of the conductive tracks of the electronic assembly can be defined without falling back on masks or other elements that would normally suppose an increase of the production cost and reduce the versatility of the method -in other words, these value ranges limits the dispersion of the metal particles outside the borders of the conductive track.
- the electronic assembly obtained by this method differs from those obtained by prior art methods in that the borders of the conductive tracks are of irregular, random shape (i.e. they do not follow a given pattern, such as that of a mask).
- the metal dust is fed to the plasma flow at a rate comprised between 0.016 and 0.16 g/s, preferably between 0.03 and 0.035 g/s.
- This flow rate is advantageous to achieve a good density of the conductive track.
- This flow rate provides a good environment for the metal dust particles being deposited on the plastic substrate.
- the electric power generated to create a plasma flow is comprised between 800 and 1200 W, preferably between 950 and 1050 W.
- This power is suitable for create a plasma flow with energy enough to melt conductive metals.
- the microwave frequency is comprised between 50 and 100 kHz, preferably between 60 and 65 kHz.
- This frequency is suitable for creating a plasma flow which optimizes the metal melting and its deposition in the plastic substrate.
- the suitable combination of these parameters improves the metal transfer coefficient, which should be understood in this specification as the ratio between the metal actually deposited on the plastic substrate and the metal dust which is fed into the plasma flow.
- the metal transfer coefficient should be improved but without excessively increasing temperature, as this would cause the plastic substrate deformation.
- the plasma flow comprises at least one of nitrogen, helium, neon, argon, krypton or xenon.
- Inert gases as nitrogen or noble gases are preferred to avoid chemical reactions between melted metal and activated gases at plasma high temperatures where activated species are generated, obtaining non electrical conductive oxides.
- the invention provides a method for manufacturing a lighting device for an automotive vehicle, the method comprising the steps of:
- An optical element is an element that has some optical properties to receive a light beam and emit it in a certain direction and/or shape, as a person skilled in automotive lighting would construe without any additional burden. Reflectors, collimators, light guides, projection lenses, etc., or the combination thereof are some examples of these optical elements.
- This method achieves the manufacturing of a lighting device for its use in an automotive vehicle, wherein the conductive tracks may be directly formed on a plastics substrate. This saves costs and space, as no printed circuit board is needed to be arranged on the lighting device structure.
- the light source is a semiconductor light source.
- These kind of light sources such as LEDs or laser devices, offer efficiency advantages over standard light sources.
- the invention provides an electronic assembly obtained by the method of the previous inventive aspect, the electronic assembly comprising a conductive track with sides comprising discontinuities in the track material.
- the electronic assembly obtained by this method differs from those obtained by prior art methods in that they are easier to obtain, as they do not require the use of external devices to limit the plasma flow. Further, they do not depend on the way a mask is placed during the track formation, so the final result is much less influenced by human skills than parts obtained by prior art methods.
- the invention provides for a lighting device for automotive vehicle comprising an electronic assembly according to the previous inventive aspect.
- Lighting devices for automotive vehicles can benefit from the use of electronic assemblies comprising conductive tracks directly deposited on a plastics substrate.
- a wide range of the lighting device's parts can be used either as plastics substrate or as base for the plastics substrate (in which case the plastics substrate may for instance coat the base), taking into account that even three-dimensional plastics substrates are suitable for direct deposition of conductive tracks. Therefore, a dedicated printed board circuit is not required, which leads to reducing the cost and the weight of the lighting device.
- cost savings are even more significant due to the fact that direct deposition does not normally want removing conductive material to shape the conductive tracks.
- Figure 1 shows one of the steps of a method for manufacturing an electronic assembly according to the invention.
- a plastics substrate 1 has been provided, and a plasma flow 2 containing metal dust 3 is ejected by means of a plasma nozzle 4 on the plastics substrate 1 to create a conductive track 5.
- the plasma flow 2 has been generated by an electric power comprised between 800 and 1200 W, generated at a frequency comprised between 50 and 100 kHz.
- Metal dust 3 has been fed to said plasma flow 2 at a rate comprised between 0.016 and 0.16 g/s.
- the resulting plasma flow 2 with the metal dust 3 is made exit the plasma nozzle 4 at a rate comprised between 0.58 and 1.33 l/s.
- Figure 2 shows the manufacturing of a lighting device 11 out of this electronic assembly 10.
- an electronic assembly 10 which has been manufactured according to a method partially shown in figure 1 is provided, and a semiconductor light source 6 has been added to this electronic assembly 10.
- the final step includes the provision of some optical elements 71, 72 suitable for receiving light from the semiconductor light source 6 and projecting it in the shape of a pattern light in a forward direction.
- the forward direction should be understood as the advance direction of an automotive vehicle where the lighting device is intended to be installed.
- the optical elements include a reflector 71 and a projection lens 72.
- the reflector 71 is placed in the electronic assembly 10, arranged to reflect the light emitted by the semiconductor light source 6.
- the projection lens is in turn located in a forward position with respect to the lighting device 11, and receives the light from the semiconductor light source 6 which has been reflected by the reflector 71.
- the projection lens 72 orientates this received light according to the vehicle advancing direction.
- optical elements 71, 72 makes the lighting device 11 suitable for being installed in an automotive vehicle 100 and able to perform lighting functions, such as high-beam and low-beam.
- Figure 3 shows a lighting device 11 which comprises such an electronic assembly 10 being installed in an automotive vehicle 100.
- This lighting device 11 occupies a smaller volume than the lighting devices of the state of the art, and that makes that the lighting device may be smaller or house more elements without the need of increasing its size.
- This lighting device 11 may be incorporated in an automotive vehicle 100, saving space and weight, because its manufacturing requires less time and a lower number of elements.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16382558.1A EP3327165A1 (fr) | 2016-11-24 | 2016-11-24 | Procédé de création d'une piste conductrice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16382558.1A EP3327165A1 (fr) | 2016-11-24 | 2016-11-24 | Procédé de création d'une piste conductrice |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3327165A1 true EP3327165A1 (fr) | 2018-05-30 |
Family
ID=57482357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16382558.1A Withdrawn EP3327165A1 (fr) | 2016-11-24 | 2016-11-24 | Procédé de création d'une piste conductrice |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP3327165A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3582592A1 (fr) * | 2018-06-13 | 2019-12-18 | Valeo Iluminacion | Carte de circuit imprimé, prise de connecteur de carte enfichable, ensemble électronique et dispositif d'éclairage d'automobile |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005031026A1 (fr) * | 2003-09-26 | 2005-04-07 | Michael Dvorak | Procede de revetement de la surface d'un substrat avec utilisation d'un jet de plasma |
| US20090067169A1 (en) * | 2007-09-03 | 2009-03-12 | Osram Gesellschaft Mit Beschrankter Haftung | Luminous module and method for producing it |
| US8241710B2 (en) * | 2006-12-23 | 2012-08-14 | Leoni Ag | Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track |
| EP2247766B1 (fr) | 2008-02-26 | 2013-08-14 | Maschinenfabrik Reinhausen GmbH | Procédé pour produire des surfaces structurées |
| US20140241937A1 (en) * | 2011-07-25 | 2014-08-28 | Eckart Gmbh | Coating Method Using Special Powdered Coating Materials and Use of Such Coating Materials |
| US20150174686A1 (en) | 2012-08-28 | 2015-06-25 | Maschinenfabrik Reinhausen Gmbh | Method and device for joining conductors to substrates |
| US20160258048A1 (en) * | 2014-10-21 | 2016-09-08 | Oreltech Ltd. | Method and system for forming a patterned metal film on a substrate |
-
2016
- 2016-11-24 EP EP16382558.1A patent/EP3327165A1/fr not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005031026A1 (fr) * | 2003-09-26 | 2005-04-07 | Michael Dvorak | Procede de revetement de la surface d'un substrat avec utilisation d'un jet de plasma |
| US8241710B2 (en) * | 2006-12-23 | 2012-08-14 | Leoni Ag | Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track |
| US20090067169A1 (en) * | 2007-09-03 | 2009-03-12 | Osram Gesellschaft Mit Beschrankter Haftung | Luminous module and method for producing it |
| EP2247766B1 (fr) | 2008-02-26 | 2013-08-14 | Maschinenfabrik Reinhausen GmbH | Procédé pour produire des surfaces structurées |
| US20140241937A1 (en) * | 2011-07-25 | 2014-08-28 | Eckart Gmbh | Coating Method Using Special Powdered Coating Materials and Use of Such Coating Materials |
| US20150174686A1 (en) | 2012-08-28 | 2015-06-25 | Maschinenfabrik Reinhausen Gmbh | Method and device for joining conductors to substrates |
| US20160258048A1 (en) * | 2014-10-21 | 2016-09-08 | Oreltech Ltd. | Method and system for forming a patterned metal film on a substrate |
Non-Patent Citations (1)
| Title |
|---|
| RAM P. GANDHIRAMAN ET AL: "Plasma Jet Printing of Electronic Materials on Flexible and Nonconformal Objects", ACS APPLIED MATERIALS AND INTERFACES, vol. 6, no. 23, 10 December 2014 (2014-12-10), US, pages 20860 - 20867, XP055371103, ISSN: 1944-8244, DOI: 10.1021/am505325y * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3582592A1 (fr) * | 2018-06-13 | 2019-12-18 | Valeo Iluminacion | Carte de circuit imprimé, prise de connecteur de carte enfichable, ensemble électronique et dispositif d'éclairage d'automobile |
| US11466831B2 (en) | 2018-06-13 | 2022-10-11 | Valeo Iluminacion | Printed circuit board, card edge connector socket, electronic assembly and automotive lighting device |
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