EP3276042A4 - Method for producing plated article - Google Patents

Method for producing plated article Download PDF

Info

Publication number: EP3276042A4
Authority: EP; European Patent Office
Prior art keywords: plated article; producing plated; producing; article; plated
Prior art date: 2015-03-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP16768841.5A

Other languages

German (de)

French (fr)

Other versions

EP3276042B1 (en

EP3276042A1 (en

Inventor

Yoshiyuki Nishimura

Rie MIYAKE

Chisa FUKUDA

Masao Takamizawa

Yutaka Mitooka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

OM SANGYO CO Ltd

Original Assignee

OM SANGYO CO Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-03-24

Filing date

2016-03-23

Publication date

2018-11-07

2016-03-23 Application filed by OM SANGYO CO Ltd filed Critical OM SANGYO CO Ltd

2018-01-31 Publication of EP3276042A1 publication Critical patent/EP3276042A1/en

2018-11-07 Publication of EP3276042A4 publication Critical patent/EP3276042A4/en

2024-01-31 Application granted granted Critical

2024-01-31 Publication of EP3276042B1 publication Critical patent/EP3276042B1/en

Status Active legal-status Critical Current

2036-03-23 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1868—Radiation, e.g. UV, laser
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Metallurgy (AREA)
Engineering & Computer Science (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Mechanical Engineering (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
Optics & Photonics (AREA)
Physics & Mathematics (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Surface Treatment Of Glass (AREA)
Manufacturing Of Printed Wiring (AREA)

EP16768841.5A 2015-03-24 2016-03-23 Method for producing plated article Active EP3276042B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2015061779		2015-03-24
PCT/JP2016/059264 WO2016152938A1 (en)	2015-03-24	2016-03-23	Method for producing plated article

Publications (3)

Publication Number	Publication Date
EP3276042A1 EP3276042A1 (en)	2018-01-31
EP3276042A4 true EP3276042A4 (en)	2018-11-07
EP3276042B1 EP3276042B1 (en)	2024-01-31

Family

ID=56978210

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP16768841.5A Active EP3276042B1 (en)	2015-03-24	2016-03-23	Method for producing plated article

Country Status (5)

Country	Link
US (1)	US20170191165A1 (en)
EP (1)	EP3276042B1 (en)
JP (1)	JP6264596B2 (en)
CN (1)	CN106460177A (en)
WO (1)	WO2016152938A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6458285B2 (en) *	2015-03-24	2019-01-30	オーエム産業株式会社	Device manufacturing method
JP2019026879A (en) *	2017-07-27	2019-02-21	株式会社クオルテック	Electronic component manufacturing method and electronic component
WO2019102701A1 (en) *	2017-11-21	2019-05-31	株式会社クオルテック	Electronic component manufacturing method and electronic component
CN110306213B (en) *	2019-07-08	2020-08-04	广州三孚新材料科技股份有限公司	Tin plating solution for solar cells and preparation method thereof
JP6745560B1 (en) *	2020-03-25	2020-08-26	株式会社イオックス	Plating product having a pattern-shaped electroless plating layer
LT7117B (en)	2023-06-01	2025-01-27	Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras	METHOD FOR SELECTIVE METAL COATING ON THE SURFACE OF A PRODUCT MADE OF AN INORGANIC DIELECTRIC OR SEMICONDUCTOR MATERIAL

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4637862A (en) *	1985-12-16	1987-01-20	General Motors Corporation	Wire-glass composite and method of making same
EP0501095A1 (en) *	1991-03-01	1992-09-02	Lucien Diégo Laude	Process for metallising metal containing dielectric surfaces
US6238749B1 (en) *	1993-10-11	2001-05-29	U.S. Philips Corporation	Method of providing a metal pattern on an electrically insulating substrate in an electroless process

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS50112231A (en) *	1974-02-15	1975-09-03
JPS60149782A (en) *	1984-01-17	1985-08-07	Inoue Japax Res Inc	Selective plating method
US5260108A (en) *	1992-03-10	1993-11-09	International Business Machines Corporation	Selective seeding of Pd by excimer laser radiation through the liquid
JPH06235169A (en) *	1993-02-05	1994-08-23	Teijin Ltd	Method of metallizing surface of polyester fiber
TW300879B (en) *	1993-11-10	1997-03-21	Ibm
JP3742872B2 (en) *	2001-07-05	2006-02-08	独立行政法人科学技術振興機構	Electroless plating method using light-fixed fine particles as catalyst
JP4332736B2 (en) *	2005-02-18	2009-09-16	セイコーエプソン株式会社	Wiring board manufacturing method
JP2007243034A (en) *	2006-03-10	2007-09-20	Seiko Epson Corp	Wiring board manufacturing method
JP2007243037A (en) *	2006-03-10	2007-09-20	Seiko Epson Corp	Wiring board manufacturing method
JP4997548B2 (en) *	2006-08-07	2012-08-08	独立行政法人理化学研究所	Metal wiring formation method
JP4706690B2 (en) *	2007-11-05	2011-06-22	パナソニック電工株式会社	Circuit board and manufacturing method thereof
US7816220B2 (en) *	2008-02-27	2010-10-19	President & Fellows Of Harvard College	Laser-induced structuring of substrate surfaces
EP2233608B1 (en) *	2009-03-23	2016-03-23	ATOTECH Deutschland GmbH	Pre-treatment process for electroless nickel plating
JP4996653B2 (en) *	2009-07-10	2012-08-08	三共化成株式会社	Manufacturing method of molded circuit components
US8676545B2 (en) *	2010-07-07	2014-03-18	Rite-Hite Holding Corporation	Methods and apparatus to determine air duct system configurations

2016
- 2016-03-23 EP EP16768841.5A patent/EP3276042B1/en active Active
- 2016-03-23 US US15/314,761 patent/US20170191165A1/en not_active Abandoned
- 2016-03-23 CN CN201680001511.2A patent/CN106460177A/en active Pending
- 2016-03-23 JP JP2017508399A patent/JP6264596B2/en active Active
- 2016-03-23 WO PCT/JP2016/059264 patent/WO2016152938A1/en not_active Ceased

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4637862A (en) *	1985-12-16	1987-01-20	General Motors Corporation	Wire-glass composite and method of making same
EP0501095A1 (en) *	1991-03-01	1992-09-02	Lucien Diégo Laude	Process for metallising metal containing dielectric surfaces
US6238749B1 (en) *	1993-10-11	2001-05-29	U.S. Philips Corporation	Method of providing a metal pattern on an electrically insulating substrate in an electroless process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016152938A1 *

Also Published As

Publication number	Publication date
CN106460177A (en)	2017-02-22
US20170191165A1 (en)	2017-07-06
EP3276042B1 (en)	2024-01-31
EP3276042A1 (en)	2018-01-31
JPWO2016152938A1 (en)	2017-10-12
JP6264596B2 (en)	2018-01-24
WO2016152938A1 (en)	2016-09-29

Publication	Publication Date	Title
EP3173508A4 (en)	2018-03-28	Method for producing plated component
EP3325443A4 (en)	2019-01-16	Process for preparing pridopidine
EP3333266A4 (en)	2019-01-16	Method for producing selenoneine
EP3227023B8 (en)	2020-05-27	Method for producing drops
EP3199519A4 (en)	2018-05-23	Method for producing methionine
IL266044B (en)	2021-03-25	Method for producing 3-alkylsulfanyl-2-chloro-n-(1-alkyl-1h-tetrazol-5-yl)-4-trifluoromethyl-benzamides
EP3287548B8 (en)	2020-04-08	Method for producing aluminium-scandium alloy
EP3144337A4 (en)	2018-02-14	Method for producing polyamide
EP3588654A4 (en)	2020-03-18	Method for producing mono-cell
EP3275886A4 (en)	2018-08-01	Method for producing dialkylaminosilane
PL3364800T3 (en)	2020-05-18	Method for producing substantially cylindrical articles
EP3327505A4 (en)	2019-04-03	Novel compound and method for producing same
EP3594217A4 (en)	2020-09-02	Method for producing dialkylaminosilane
EP3276042A4 (en)	2018-11-07	Method for producing plated article
EP3109246A4 (en)	2017-04-26	Thiopyranose compound and method for producing same
EP3733858A4 (en)	2021-04-07	Method for producing urolithins
IL258148B (en)	2020-08-31	Method for producing flutemetamol
EP3284568A4 (en)	2018-12-26	Method for producing three-dimensional object
SG11202004021RA (en)	2020-05-28	Production method for dihydroxyindoles
ZA201801650B (en)	2019-05-29	Process for producing novel 4-benzoazonine derivatives
EP3530131A4 (en)	2020-05-13	Brassiere production method
PL3448159T3 (en)	2024-02-19	Method for producing unfried nugget-like products
EP3398929A4 (en)	2019-09-04	Method for producing , -difluoroacetaldehyde
EP3299394A4 (en)	2018-12-05	Method for producing modified xylopolysaccharides
EP3330073A4 (en)	2019-02-27	Method for producing laminate

Legal Events

Date	Code	Title	Description
2016-12-06	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2017-12-29	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2017-12-29	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2018-01-31	17P	Request for examination filed	Effective date: 20161201
2018-01-31	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2018-01-31	AX	Request for extension of the european patent	Extension state: BA ME
2018-06-27	DAV	Request for validation of the european patent (deleted)
2018-06-27	DAX	Request for extension of the european patent (deleted)
2018-11-07	A4	Supplementary search report drawn up and despatched	Effective date: 20181009
2018-11-07	RIC1	Information provided on ipc code assigned before grant	Ipc: C23C 18/16 20060101ALI20181002BHEP Ipc: C23C 18/54 20060101ALN20181002BHEP Ipc: C23C 18/32 20060101ALI20181002BHEP Ipc: C23C 18/18 20060101AFI20181002BHEP Ipc: C23C 18/42 20060101ALI20181002BHEP
2021-02-04	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2021-03-10	17Q	First examination report despatched	Effective date: 20210203
2023-08-30	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2023-08-30	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: GRANT OF PATENT IS INTENDED
2023-09-06	RIC1	Information provided on ipc code assigned before grant	Ipc: C23C 18/54 20060101ALN20230801BHEP Ipc: C23C 18/42 20060101ALI20230801BHEP Ipc: C23C 18/32 20060101ALI20230801BHEP Ipc: C23C 18/16 20060101ALI20230801BHEP Ipc: C23C 18/18 20060101AFI20230801BHEP
2023-09-27	INTG	Intention to grant announced	Effective date: 20230831
2023-12-22	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2023-12-29	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2023-12-29	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE PATENT HAS BEEN GRANTED
2024-01-31	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2024-01-31	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D Ref country code: CH Ref legal event code: EP
2024-02-22	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602016085573 Country of ref document: DE
2024-02-28	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D
2024-05-27	REG	Reference to a national code	Ref country code: LT Ref legal event code: MG9D
2024-06-05	REG	Reference to a national code	Ref country code: NL Ref legal event code: MP Effective date: 20240131
2024-07-01	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240531
2024-07-09	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-07-15	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240501
2024-07-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: MK05 Ref document number: 1653915 Country of ref document: AT Kind code of ref document: T Effective date: 20240131
2024-07-18	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240430 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-07-22	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-07-23	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-07-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240430 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240430 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240531 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240501 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-08-01	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240531 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-08-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240531 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-11	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-14	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-23	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-10-31	REG	Reference to a national code	Ref country code: CH Ref legal event code: PL
2024-11-01	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602016085573 Country of ref document: DE
2024-11-18	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240323
2024-11-20	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-11-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240323
2024-12-04	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2024-12-06	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2024-12-06	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2024-12-16	REG	Reference to a national code	Ref country code: BE Ref legal event code: MM Effective date: 20240331
2024-12-25	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20240430
2024-12-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2025-01-08	26N	No opposition filed	Effective date: 20241101
2025-01-16	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240331
2025-01-17	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240430
2025-01-20	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240331
2025-01-24	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240323
2025-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240323 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240430 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240331 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240331 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240331
2025-04-11	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20250326 Year of fee payment: 10
2025-04-24	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131
2025-08-07	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20160323
2025-09-03	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20160323
2025-12-12	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20240131