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EP3247529A4 - Angled lift jetting - Google Patents

Angled lift jetting Download PDF

Info

Publication number
EP3247529A4
EP3247529A4 EP16739876.7A EP16739876A EP3247529A4 EP 3247529 A4 EP3247529 A4 EP 3247529A4 EP 16739876 A EP16739876 A EP 16739876A EP 3247529 A4 EP3247529 A4 EP 3247529A4
Authority
EP
European Patent Office
Prior art keywords
angled lift
jetting
lift jetting
angled
lift
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16739876.7A
Other languages
German (de)
French (fr)
Other versions
EP3247529A1 (en
Inventor
Zvi Kotler
Michael Zenou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of EP3247529A1 publication Critical patent/EP3247529A1/en
Publication of EP3247529A4 publication Critical patent/EP3247529A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34Laser welding for purposes other than joining
    • B23K26/342Build-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/048Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225Oblique incidence of vaporised material on substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/18Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • General Chemical & Material Sciences (AREA)
EP16739876.7A 2015-01-21 2016-01-05 Angled lift jetting Withdrawn EP3247529A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562105761P 2015-01-21 2015-01-21
PCT/IL2016/050007 WO2016116921A1 (en) 2015-01-21 2016-01-05 Angled lift jetting

Publications (2)

Publication Number Publication Date
EP3247529A1 EP3247529A1 (en) 2017-11-29
EP3247529A4 true EP3247529A4 (en) 2019-01-16

Family

ID=56416516

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16739876.7A Withdrawn EP3247529A4 (en) 2015-01-21 2016-01-05 Angled lift jetting

Country Status (7)

Country Link
US (1) US20170306495A1 (en)
EP (1) EP3247529A4 (en)
KR (1) KR20170102984A (en)
CN (1) CN107206548B (en)
IL (1) IL253169A0 (en)
TW (1) TW201639654A (en)
WO (1) WO2016116921A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102353254B1 (en) 2014-08-07 2022-01-18 오르보테크 엘티디. Lift printing system
EP3207772B1 (en) 2014-10-19 2024-04-17 Orbotech Ltd. Lift printing of conductive traces onto a semiconductor substrate
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
CN107849687B (en) 2015-07-09 2020-01-14 奥博泰克有限公司 Control of laser induced forward transfer spray angle
US10688692B2 (en) 2015-11-22 2020-06-23 Orbotech Ltd. Control of surface properties of printed three-dimensional structures
TW201901887A (en) * 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 Electrical interconnection circuit components on the substrate without prior patterning
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method
JP7424093B2 (en) * 2019-03-08 2024-01-30 株式会社リコー Devices for printing 3D objects, methods for printing 3D objects
JP7536787B2 (en) 2019-05-01 2024-08-20 アイオー テック グループ リミテッド Method for electrically connecting a chip to a top connector using 3D printing
US12162294B2 (en) 2019-05-07 2024-12-10 Orbotech Ltd. Lift printing using thin donor foils
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
EP3893611A1 (en) 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Controlled deposition method of a donor material onto a target surface and plate therefor
US11497124B2 (en) * 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
EP1938970A1 (en) * 2005-09-30 2008-07-02 Think Laboratory Co., Ltd. Photogravure engraving roll and production method thereof
US20080084611A1 (en) * 2006-10-05 2008-04-10 Bright View Technologies, Inc. Methods and Apparatus for Creating Apertures Through Microlens Arrays Using Curved Cradles, and Products Produced Thereby
CN102067726B (en) * 2008-06-16 2014-06-04 东丽株式会社 Patterning method, device manufacturing method using the patterning method, and device
EP2509396A1 (en) * 2009-12-03 2012-10-10 Toray Industries, Inc. Donor substrate, patterning method, and method for producing device
KR20120138472A (en) * 2011-06-15 2012-12-26 삼성디스플레이 주식회사 Liti apparatus, method of liti and fabricating method of using the same
JP6042457B2 (en) * 2012-02-23 2016-12-14 エーエスエムエル ネザーランズ ビー.ブイ. Device, exposure apparatus, and radiation induction method
JP2015516672A (en) * 2012-02-26 2015-06-11 ソレクセル、インコーポレイテッド System and method for laser splitting and equipment layer relocation
KR102353254B1 (en) * 2014-08-07 2022-01-18 오르보테크 엘티디. Lift printing system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016116921A1 *

Also Published As

Publication number Publication date
CN107206548B (en) 2019-08-13
TW201639654A (en) 2016-11-16
EP3247529A1 (en) 2017-11-29
IL253169A0 (en) 2017-08-31
KR20170102984A (en) 2017-09-12
CN107206548A (en) 2017-09-26
WO2016116921A1 (en) 2016-07-28
US20170306495A1 (en) 2017-10-26

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