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EP3187288A4 - Metallic copper particles, and production method therefor - Google Patents

Metallic copper particles, and production method therefor Download PDF

Info

Publication number
EP3187288A4
EP3187288A4 EP15835228.6A EP15835228A EP3187288A4 EP 3187288 A4 EP3187288 A4 EP 3187288A4 EP 15835228 A EP15835228 A EP 15835228A EP 3187288 A4 EP3187288 A4 EP 3187288A4
Authority
EP
European Patent Office
Prior art keywords
production method
method therefor
copper particles
metallic copper
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15835228.6A
Other languages
German (de)
French (fr)
Other versions
EP3187288A1 (en
Inventor
Kiyonobu Ida
Mitsuru Watanabe
Masanori Tomonari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Sangyo Kaisha Ltd
Original Assignee
Ishihara Sangyo Kaisha Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Sangyo Kaisha Ltd filed Critical Ishihara Sangyo Kaisha Ltd
Publication of EP3187288A1 publication Critical patent/EP3187288A1/en
Publication of EP3187288A4 publication Critical patent/EP3187288A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B22F2009/245—Reduction reaction in an Ionic Liquid [IL]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
EP15835228.6A 2014-08-28 2015-08-26 Metallic copper particles, and production method therefor Withdrawn EP3187288A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014174251 2014-08-28
JP2015081081 2015-04-10
PCT/JP2015/074025 WO2016031860A1 (en) 2014-08-28 2015-08-26 Metallic copper particles, and production method therefor

Publications (2)

Publication Number Publication Date
EP3187288A1 EP3187288A1 (en) 2017-07-05
EP3187288A4 true EP3187288A4 (en) 2018-04-11

Family

ID=55399746

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15835228.6A Withdrawn EP3187288A4 (en) 2014-08-28 2015-08-26 Metallic copper particles, and production method therefor

Country Status (8)

Country Link
US (1) US20170252801A1 (en)
EP (1) EP3187288A4 (en)
JP (1) JPWO2016031860A1 (en)
KR (1) KR20170046164A (en)
CN (1) CN106715009A (en)
CA (1) CA2959294A1 (en)
TW (1) TWI658156B (en)
WO (1) WO2016031860A1 (en)

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US20180264548A1 (en) * 2015-01-09 2018-09-20 Clarkson University Silver Coated Copper Flakes and Methods of Their Manufacture
JP6746094B2 (en) * 2016-03-22 2020-08-26 株式会社豊田中央研究所 Method for producing hydrophilic polymer-coated copper nanoparticles
TWI623946B (en) * 2016-07-05 2018-05-11 國立成功大學 Preparation of nano-silver pastes
US10827747B2 (en) * 2016-08-08 2020-11-10 Universiti Brunei Darussalam Anti-bacterial and anti-fungal photocatalytic coating film and method for producing thereof
JP7007140B2 (en) * 2016-09-30 2022-01-24 Ｄｏｗａエレクトロニクス株式会社 Joining material and joining method using it
JP6745350B2 (en) * 2016-11-02 2020-08-26 富士フイルム株式会社 Fine particles, dispersion liquid, and deodorant
JP6908398B2 (en) * 2017-03-08 2021-07-28 株式会社Adeka Resin composition, method of forming cured product and cured product
TWI691403B (en) 2017-07-18 2020-04-21 日商旭化成股份有限公司 Copper wiring
WO2019106739A1 (en) * 2017-11-29 2019-06-06 国立大学法人北海道大学 Low-temperature-sinterable copper particle and method for manufacturing sintered compact using same
CN108115127A (en) * 2017-11-29 2018-06-05 上海师范大学 A kind of Nanometer Copper biomimetic material and preparation method and application
JP7473475B2 (en) 2018-01-30 2024-04-23 テクナ・プラズマ・システムズ・インコーポレーテッド Metal powder for use as an electrode material in multilayer ceramic capacitors and methods of making and using same - Patents.com
JP6985202B2 (en) * 2018-03-30 2021-12-22 トヨタ自動車株式会社 Manufacturing method of metal nanoparticles
JP6526888B1 (en) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 Laminate of ceramic layer and sintered body of copper powder paste
JP6526889B1 (en) * 2018-08-01 2019-06-05 Ｊｘ金属株式会社 Laminate of ceramic layer and sintered body of copper powder paste
KR102673325B1 (en) * 2018-09-28 2024-06-10 나믹스 가부시끼가이샤 conductive paste
MY208039A (en) * 2018-11-29 2025-04-10 Resonac Corp Method for producing bonded object and semiconductor device and copper bonding paste
JP2020100888A (en) * 2018-12-25 2020-07-02 京セラ株式会社 Copper particles, method for producing copper particles, copper paste, semiconductor device, and electric/electronic component
CN110202136B (en) * 2019-05-21 2021-09-03 深圳第三代半导体研究院 Low-temperature sintering copper paste and sintering process thereof
CN110181041B (en) * 2019-05-29 2021-09-03 深圳第三代半导体研究院 Copper particles with surface subjected to anti-oxidation protection, low-temperature sintering copper paste and sintering process using copper particles
CN110202137B (en) * 2019-05-29 2021-07-20 深圳第三代半导体研究院 A kind of low temperature sintered copper paste and its sintering process
JP7347980B2 (en) * 2019-07-18 2023-09-20 株式会社リコー Fixing device and image forming device
CN110695373B (en) * 2019-10-14 2022-05-10 天津大学 Preparation method of graphene-coated rare earth element-supported copper composite material with double-layer harmonic structure
US12376230B2 (en) 2019-11-08 2025-07-29 Asahi Kasei Kabushiki Kaisha Structure with conductive pattern and method for manufacturing same
WO2021100320A1 (en) * 2019-11-18 2021-05-27 日清エンジニアリング株式会社 Microparticles
CN111128702A (en) * 2019-12-10 2020-05-08 Tcl华星光电技术有限公司 Preparation method of metal electrode
JP7302487B2 (en) * 2020-01-14 2023-07-04 トヨタ自動車株式会社 Composite particles and method for producing composite particles
JP6901227B1 (en) * 2020-03-25 2021-07-14 石原ケミカル株式会社 Copper ink and conductive film forming method
US20210309427A1 (en) * 2020-04-03 2021-10-07 Hazen Paper Company Anti-microbial packaging assembly
JP7465747B2 (en) * 2020-07-31 2024-04-11 京セラ株式会社 Coated copper particles, method for producing coated copper particles, copper paste, method for producing copper paste, and semiconductor device
US20220143538A1 (en) * 2020-10-15 2022-05-12 Engineered Materials, Inc. Filtration system and method of use thereof
JP7711390B2 (en) * 2021-02-22 2025-07-23 三菱マテリアル株式会社 Bonding layer, bonded body, and method for producing bonded body
JP7666011B2 (en) * 2021-02-22 2025-04-22 三菱マテリアル株式会社 Bonding paste and method for manufacturing bonded body
US20240321806A1 (en) * 2021-02-22 2024-09-26 Mitsubishi Materials Corporation Bonding paste, bonding layer, bonded body, and method for producing bonded body
WO2022211008A1 (en) * 2021-04-01 2022-10-06 三菱マテリアル株式会社 Metal paste for joining, and method for manufacturing joined body
CN115188589B (en) * 2021-04-02 2023-08-01 北京元六鸿远电子科技股份有限公司 Copper external electrode slurry for MLCC printing
US20240018627A1 (en) * 2021-05-21 2024-01-18 Harada Metal Industry Co., Ltd. Phosphor bronze alloy powder
JP7000621B1 (en) * 2021-06-17 2022-01-19 古河ケミカルズ株式会社 Method for manufacturing copper fine particles
KR102819845B1 (en) * 2021-06-22 2025-06-13 연세대학교 산학협력단 Powdery composition for 3D printing, 3D printer and method for manufacturing objects additively by using the same 3D printer
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CN114346254B (en) * 2022-01-21 2023-08-18 重庆科技学院 Method for preparing nanometer copper powder in eutectic ionic liquid
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JP2007184143A (en) * 2006-01-06 2007-07-19 Sumitomo Metal Mining Co Ltd Conductive powder surface treatment method, conductive powder and conductive paste
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Title
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Also Published As

Publication number Publication date
US20170252801A1 (en) 2017-09-07
TW201623639A (en) 2016-07-01
CA2959294A1 (en) 2016-03-03
WO2016031860A1 (en) 2016-03-03
JPWO2016031860A1 (en) 2017-06-15
EP3187288A1 (en) 2017-07-05
TWI658156B (en) 2019-05-01
CN106715009A (en) 2017-05-24
KR20170046164A (en) 2017-04-28

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