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EP3177117A4 - Corps de câblage, substrat de câblage et capteur tactile - Google Patents

Corps de câblage, substrat de câblage et capteur tactile Download PDF

Info

Publication number
EP3177117A4
EP3177117A4 EP16743575.9A EP16743575A EP3177117A4 EP 3177117 A4 EP3177117 A4 EP 3177117A4 EP 16743575 A EP16743575 A EP 16743575A EP 3177117 A4 EP3177117 A4 EP 3177117A4
Authority
EP
European Patent Office
Prior art keywords
wiring
touch sensor
substrate
wiring substrate
wiring body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16743575.9A
Other languages
German (de)
English (en)
Other versions
EP3177117A1 (fr
Inventor
Makoto Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of EP3177117A1 publication Critical patent/EP3177117A1/fr
Publication of EP3177117A4 publication Critical patent/EP3177117A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Structure Of Printed Boards (AREA)
EP16743575.9A 2015-01-30 2016-01-29 Corps de câblage, substrat de câblage et capteur tactile Withdrawn EP3177117A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015016897 2015-01-30
PCT/JP2016/052796 WO2016121972A1 (fr) 2015-01-30 2016-01-29 Corps de câblage, substrat de câblage et capteur tactile

Publications (2)

Publication Number Publication Date
EP3177117A1 EP3177117A1 (fr) 2017-06-07
EP3177117A4 true EP3177117A4 (fr) 2017-12-20

Family

ID=56543574

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16743575.9A Withdrawn EP3177117A4 (fr) 2015-01-30 2016-01-29 Corps de câblage, substrat de câblage et capteur tactile

Country Status (6)

Country Link
US (1) US10101865B2 (fr)
EP (1) EP3177117A4 (fr)
JP (1) JP6027296B1 (fr)
CN (2) CN106605455B (fr)
TW (1) TWI590727B (fr)
WO (1) WO2016121972A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180011575A1 (en) * 2015-01-21 2018-01-11 Lg Innotek Co., Ltd. Touch window
EP3177117A4 (fr) * 2015-01-30 2017-12-20 Fujikura, Ltd. Corps de câblage, substrat de câblage et capteur tactile
JP6650923B2 (ja) * 2015-03-24 2020-02-19 三井金属鉱業株式会社 キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板
CN106019678B (zh) * 2016-08-04 2020-03-06 京东方科技集团股份有限公司 一种触控显示装置及其制备方法
WO2018123976A1 (fr) * 2016-12-28 2018-07-05 株式会社フジクラ Ensemble corps de câblage, structure de câblage et capteur tactile
CN107765916A (zh) * 2017-10-16 2018-03-06 业成科技（成都）有限公司 触控感应模组、三维曲面触控面板与触控显示装置
CN108323145A (zh) * 2018-03-14 2018-07-24 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN112117567A (zh) * 2019-06-19 2020-12-22 广州方邦电子股份有限公司 导电连接结构
JP7424868B2 (ja) * 2020-03-06 2024-01-30 日本航空電子工業株式会社 電気接続部材を生産する方法及び配線構造
JP2023132391A (ja) * 2022-03-11 2023-09-22 イビデン株式会社 プリント配線板

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04240792A (ja) 1991-01-24 1992-08-28 Matsushita Electric Ind Co Ltd 回路基板の製造方法
US5201268A (en) 1990-12-25 1993-04-13 Matsushita Electric Industrial Co., Ltd. Intaglio printing process and its application
JPH0740624B2 (ja) * 1991-01-14 1995-05-01 信越ポリマー株式会社 低ピッチ印刷配線板及びその製造方法
JP2004063943A (ja) 2002-07-31 2004-02-26 Koa Corp 導電パターン形成方法
JP2004071695A (ja) 2002-08-02 2004-03-04 Fcm Kk 導電性シートおよびその製造方法
JP2004342648A (ja) 2003-05-13 2004-12-02 Matsushita Electric Ind Co Ltd 回路転写装置
JP2006114577A (ja) 2004-10-13 2006-04-27 Mitsui Chemicals Inc 回路基板およびその製造方法
EP1903840A4 (fr) * 2005-07-15 2013-05-01 Panasonic Corp Tableau de connexions, matériel de câblage, laminé plaqué cuivre et procédé de fabrication de tableau de connexions
US7713836B2 (en) 2006-09-29 2010-05-11 Semiconductor Energy Laboratory Co., Ltd. Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device
KR100782412B1 (ko) 2006-10-25 2007-12-05 삼성전기주식회사 전사회로 형성방법 및 회로기판 제조방법
JP5354873B2 (ja) * 2007-05-30 2013-11-27 富士フイルム株式会社 導電性膜及び導電性膜の製造方法
US8283577B2 (en) * 2007-06-08 2012-10-09 Dai Nippon Printing Co., Ltd. Printed matter and its manufacturing method, and electromagnetic shielding material and its manufacturing method
JP5151464B2 (ja) 2007-12-26 2013-02-27 大日本印刷株式会社 電磁波シールド部材
JPWO2010064630A1 (ja) * 2008-12-02 2012-05-10 大日本印刷株式会社 電磁波シールド材、及びその製造方法
JP5487787B2 (ja) 2009-08-04 2014-05-07 大日本印刷株式会社 透明導電部材
JP5516077B2 (ja) * 2009-09-30 2014-06-11 大日本印刷株式会社 タッチパネル用電極フィルム及びタッチパネル
JP5440165B2 (ja) * 2009-12-28 2014-03-12 デクセリアルズ株式会社 導電性光学素子、タッチパネル、および液晶表示装置
JP6077194B2 (ja) * 2010-12-07 2017-02-08 ソニー株式会社 導電性光学素子ならびに情報入力装置および表示装置
JP2014021401A (ja) * 2012-07-20 2014-02-03 Dexerials Corp 導電性光学素子、入力素子、および表示素子
JP2014106974A (ja) * 2012-11-22 2014-06-09 Lg Innotek Co Ltd タッチウィンドウ
JP2014120568A (ja) * 2012-12-14 2014-06-30 Showa Denko Packaging Co Ltd 配線基板の表裏導通方法
KR20140087761A (ko) * 2012-12-31 2014-07-09 삼성전기주식회사 터치패널
TWI549573B (zh) * 2013-06-20 2016-09-11 Ｌｇ電子股份有限公司 導電薄膜及含有該導電薄膜的觸控面板
KR20150103977A (ko) * 2014-03-04 2015-09-14 엘지이노텍 주식회사 터치 윈도우 및 이를 포함하는 디스플레이 장치
WO2016104723A1 (fr) * 2014-12-26 2016-06-30 株式会社フジクラ Corps de câblage, carte de câblage, capteur tactile et procédé de production de corps de câblage
EP3177117A4 (fr) * 2015-01-30 2017-12-20 Fujikura, Ltd. Corps de câblage, substrat de câblage et capteur tactile
JP5918896B1 (ja) * 2015-02-06 2016-05-18 株式会社フジクラ 配線体、配線基板及び配線体の製造方法
TWI608398B (zh) * 2015-02-27 2017-12-11 Fujikura Ltd Wiring body, wiring board, wiring structure, and touch detector
WO2016178409A1 (fr) * 2015-05-01 2016-11-10 株式会社フジクラ Corps de câblage, substrat de câblage et capteur tactile
JP5969089B1 (ja) * 2015-05-20 2016-08-10 株式会社フジクラ 導体層付き構造体の製造方法、基材付き配線体、及び基材付き構造体
JP5974147B1 (ja) * 2015-07-31 2016-08-23 株式会社フジクラ 配線体アセンブリ、導体層付き構造体、及びタッチセンサ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
US10101865B2 (en) 2018-10-16
US20170277290A1 (en) 2017-09-28
CN106605455A (zh) 2017-04-26
TW201644345A (zh) 2016-12-16
JPWO2016121972A1 (ja) 2017-04-27
EP3177117A1 (fr) 2017-06-07
JP6027296B1 (ja) 2016-11-16
TWI590727B (zh) 2017-07-01
CN110381674A (zh) 2019-10-25
WO2016121972A1 (fr) 2016-08-04
CN106605455B (zh) 2020-04-14

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