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EP3087579A1 - Conducteur fusible, protection par fusible, procédé de fabrication d'une protection par fusible, protection smd et circuit smd - Google Patents

Conducteur fusible, protection par fusible, procédé de fabrication d'une protection par fusible, protection smd et circuit smd

Info

Publication number
EP3087579A1
EP3087579A1 EP13824496.7A EP13824496A EP3087579A1 EP 3087579 A1 EP3087579 A1 EP 3087579A1 EP 13824496 A EP13824496 A EP 13824496A EP 3087579 A1 EP3087579 A1 EP 3087579A1
Authority
EP
European Patent Office
Prior art keywords
conductor
fuse
fusible
fusible conductor
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13824496.7A
Other languages
German (de)
English (en)
Other versions
EP3087579B1 (fr
Inventor
Peter Straub
Hans-Peter Blättler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schurter AG
Original Assignee
Schurter AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schurter AG filed Critical Schurter AG
Priority to PL13824496T priority Critical patent/PL3087579T3/pl
Publication of EP3087579A1 publication Critical patent/EP3087579A1/fr
Application granted granted Critical
Publication of EP3087579B1 publication Critical patent/EP3087579B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/20—Bases for supporting the fuse; Separate parts thereof
    • H01H85/205—Electric connections to contacts on the base

Definitions

  • Fusible link, fuse method of making a fuse, SMD fuse and SMD circuit
  • the present invention relates to a fuse, a fuse, a method of manufacturing a fuse, an SMD fuse and an SMD circuit.
  • SMD surface-mounted device
  • SMD fuses are soldered by means of reflow soldering or wave soldering on the circuit board.
  • base materials for SMD fuses for example, FR4 printed circuit board materials or A1 2 O 3 - ceramics are used, so all the usual base materials for PCB manufacturing.
  • Fuses include a fusible conductor disposed on a base support, which comprises, for example, copper.
  • the fusible conductor is usually used for
  • Fuses have the disadvantage that the base supports usually have limited operating temperatures. For example, the operating temperature of a
  • Base carrier made of FR4 base material at only 200 ° C. Higher temperatures damage the FR4 base material.
  • the material delaminates and dissolves the usually made of a copper foil fuse from
  • Base support made of an Al 2 O 3 ceramic, which can endure much higher temperatures than for example 200 ° C without being damaged.
  • it has the disadvantage that the
  • Coefficient of thermal expansion (CTE) of this Al 2 O 3 ceramic is usually less than 8 ppm / K and thus differs greatly from the coefficient of thermal expansion CTE of copper, which is 17 ppm / K. Due to this high difference between the coefficients of expansion of the base support of Al 2 O 3 ceramic and copper arise
  • reflow soldering process can be soldered.
  • the reason for this is to be found in the fact that the known thermal fuses trigger immediately at the high temperatures occurring in a range of 240 ° C to 265 ° C.
  • the fusible conductor comprises two
  • Connection contacts and an intermediate conductor track wherein the conductor track reduced at least in sections one in relation to the connection contacts
  • Conductor cross-section further comprising at least one support, wherein the fusible conductor and the support each comprise materials which undergo diffusion when exceeding a predetermined ambient temperature and when passing an electrical current through the fusible conductor.
  • Melting conductor created which does not trigger at the occurring during soldering high temperatures, but in the Operation at high ambient temperatures, for example, more than 200 ° C will trigger.
  • This advantage is achieved by a diffusion process which is activated as soon as the ambient temperature exceeds a predetermined temperature, for example 200 ° C., and additionally an electric current (eg rated current) flows through the fusible conductor.
  • a predetermined temperature for example 200 ° C.
  • an electric current eg rated current
  • the diffusion process takes place in a region in which the at least one support communicates with the fusible conductor (also called the diffusion zone).
  • the reduced melting temperature of about 500 ° C. is thus achieved even at low currents (for example nominal current), which causes the fusible conductor to be triggered and, advantageously, the circuit is reliably interrupted.
  • low currents for example nominal current
  • An essential advantage of the inventive fusible conductor is that the fusible conductor in operation at predetermined high ambient temperatures
  • the line cross section of the conductor track is at least partially reduced in a plane perpendicular to the longitudinal direction of the fusible conductor in relation to the line cross section of the connection contacts.
  • This relation has a value less than 1 ( ⁇ 1).
  • fusible conductor can also have a different profile, as long as the surfaces of the terminal contacts in relation to the conductor track are possible large.
  • the areas of the terminal contacts may be rectangular, circular, elliptical or triangular.
  • the fusible conductor may be formed by punching out a one-piece material. Alternatively, the fusible conductor can be formed by cutting, for example by means of a laser.
  • an overcurrent threshold value can also be defined, from which the fusible conductor will be triggered.
  • Fuse on SMD basis by, for example, a Reflow soldering process can be connected to the circuit board without the fusible conductor in this case
  • each standard (240 ° C to 265 ° C, 10s) can be soldered to the circuit board.
  • the at least one support is at least partially disposed within the conductor track.
  • Extension of the support provided to the fusible conductor e.g., length, width and thickness in relation to
  • Fusible conductor can trigger characteristics of
  • Conductor of the fusible conductor can be determined.
  • the at least one support is arranged within the conductor track adjacent to one of the connection contacts of the fusible conductor. This allows the
  • Diffusion zone are placed particularly close to an adjacent, with regard to overcurrent and excess temperature to be protected electronic component (eg power transistor). It may be provided a support adjacent to a terminal contact or it may be two Editions each adjacent to the two
  • Connection contacts may be provided. Fuses are increasingly being used to hedge
  • Diffusion zone i. the pad is placed in a region of the track adjacent one of the terminal contacts of the fuse conductor, i. by the
  • Fusible conductor can be further increased.
  • a further advantage of this arrangement is that a basic carrier underlying the fusible conductor is attached to the
  • Border area i. adjacent to one of the terminal contacts of the fusible conductor, has a reduced heat dissipation than, for example, in the middle region.
  • the eccentric portion of the base support is arranged, i.
  • a predetermined ambient temperature for example 200 ° C
  • the surface of a respective terminal contact in relation to the conductor track is formed as large as possible.
  • the connection contacts in relation to the conductor track on better properties for heat dissipation.
  • the highest temperature values when viewed in the longitudinal direction of the fusible conductor, the highest temperature values will advantageously occur in the middle of the conductor track.
  • the conductor cross-section of the conductor path progressively increases over the line cross-section of the connection contacts.
  • Conductor can increase linear or non-linear.
  • the conductor cross-section of the conductor increases at each of the two ends of the conductor with a minimum line cross-section gradually and grows to a maximum line cross-section, which is equal to the line cross-section of the terminals.
  • the cable cross-section of the connection contacts can be constant starting from this section.
  • the fusible conductor assumes a bone shape that looks like a plan view.
  • the at least one support at least in sections within the conductor track in a region of the gradually increasing line cross-section
  • the at least one support is in one
  • the fusible conductor further comprises at least one introduced into the conductor track recess in which the at least one support is arranged.
  • This is the diffusion zone is diluted as a whole, so that a diffusion of the atoms of the material of the fusible conductor into the material of the support which is necessary or sufficient for triggering the fusible conductor takes place more rapidly.
  • the temperature threshold decreases to trigger the fusible conductor. Also, the current threshold drops to trip on overcurrent. Thus, the extent of the recess is an important design parameter by which the temperature threshold and the current threshold are set.
  • the at least one recess is aligned transversely to the longitudinal direction of the conductor track.
  • the fusible conductor is usually formed as an elongate, thin strip body.
  • the recess is at the surface and perpendicular to the flow direction in the
  • a laser, etc. introduced into the conductor.
  • This recess is then filled with the material of the support, for example by means of a galvanic process.
  • the recess can be partially or completely filled.
  • the recess can also over the edge of the recess away with the
  • Material of the pad to be filled It may be one or more recesses may be provided, which are each filled with a support.
  • the material of the fusible conductor comprises copper and the material comprises the support tin.
  • Conventional fused conductors for overcurrent protection are usually formed of copper. With the selection of tin as
  • Material of the overlay is an excellent material found, which in case of excess temperature and current flow through the fusible conductor, a diffusion with the copper as
  • the copper atoms diffuse into the tin and thus a copper-tin alloy is formed.
  • this load on the fusible conductor does not cause any change.
  • Soldering device comprising a fuse element according to any one of claims 1 to 9 and further comprising a base support made of an electrically insulating material, wherein the fuse element on a surface of the base support
  • a base support for example, a FR4 base material or an Al 2 O 3 ceramic can be used.
  • Wire terminations can be dispensed with.
  • inventive fuse is cheaper and much smaller than previously known thermal fuses.
  • Fuse also complies with all known approvals (IEC 60127 and UL248-14 standard). In addition, the
  • the fusible conductors are disposed on opposite surfaces of the base support.
  • a fuse based on a multilayer construction with two fuse elements can be provided in parallel.
  • the diffusion zones of the individual fusible conductors can be arranged in mutually offset positions in relation to the longitudinal direction. This ensures a more reliable triggering of the fuse in the event of overheating.
  • the fuse further comprises two
  • Base contacts which are electrically connected to each of the base support opposite terminal contacts of the fuse element.
  • interconnected fuse element comprises. These base contacts may also be formed of copper. Vorzugsswelse includes the base carrier a Rogers4000
  • fuses are usually composed of base carriers, which comprise, for example, FR4 base materials, or circuit board materials, or Al 2 O 3 ceramics.
  • the FR4 base material is made of glass fabric reinforced with epoxy resin. This material has good coefficients of expansion in the x and y directions. These coefficients of expansion are in the range of 14 to 17 ppm / K and come to the
  • Fusible conductor with 17 ppm / K very close. Copper foils having various thicknesses, for example 6, 9, 12, 18, 35, 70, 120 and 240 ⁇ m, are pressed on the FR4 base material under pressure and temperature and form the basis for the fusible conductor. However, the limited operating temperatures of the FR4 base materials, which have a max. 200 ° C. Even higher
  • the FR4 base material delaminates and dissolves, for example, as a fusible conductor
  • This ceramic withstands higher temperatures than the FR4 base material. However, that is
  • Rogers4000 material As the material of the base support, as proposed, all advantages of the Al 2 O 3 ceramic and the FR4 base material are advantageously combined.
  • the Rogers4000 material is therefore excellently suited as the base material of the
  • the Rogers4000 material is also compatible with all board processes and is self-contained
  • the at least one fusible conductor is preferably coated with a protective lacquer, in particular a polymer protective lacquer. As a result, the fusible conductor is reliably protected against environmental influences.
  • At least one fuse element comprising two
  • the fusible conductor and the support are each selected from materials which when exceeding a predetermined ambient temperature and when passing an electric current through the
  • Fusible conductors undergo diffusion; and arranging the at least one fusible conductor on the base support.
  • Overcurrent threshold can be defined, from which the fusible conductor will trigger.
  • the line cross section of the conductor track is reduced in a plane perpendicular to the longitudinal direction of the fusible conductor in relation to the line cross section of the connection contacts.
  • the conductor cross section of the fusible conductor can be linear or non-linear on the
  • a fusible conductor is created, which corresponds to a bone profile in plan view.
  • the fusible conductor is in Trap of overtemperature and / or overcurrent always in the section with reduced line cross-section, ie in the course of the conductor, trigger.
  • the fusible conductor is, for example, by punching a one-piece
  • the fusible conductor is formed by cutting, for example by means of laser.
  • the at least one support is preferably arranged at least in sections within the conductor track of the fusible conductor.
  • the at least one support within the conductor track is arranged adjacent to one of the connection contacts of the fusible conductor.
  • the diffusion zone can thus be arranged in close proximity to an electronic component to be protected, for example a power transistor.
  • the reliability can be further increased, with which the fusible conductor is triggered quickly and reliably when a predetermined temperature is exceeded.
  • the step of providing the fusible conductor comprises the at least one pad
  • a temperature threshold can be defined or defined, when exceeded the
  • Tripping characteristics of the fusible conductor are easily determined.
  • an SMD fuse which comprises a fuse according to one of claims 10 to 14. This is the
  • thermocouple It is possible to equip an SMD printed circuit board with a SMD fuse as a thermocouple.
  • an SMD circuit comprising an SMD fuse according to claim 19.
  • an SMD circuit is provided which at least one SMD fuse for thermal
  • Figure 2 shows the fuse shown in Figure 1 according to the invention in a sectional view
  • FIG. 4 shows the fusible conductor according to the first embodiment of the invention shown in FIG
  • Figure 5 shows a fuse element according to a second
  • FIG. 6 shows the fusible conductor according to the second embodiment of the invention shown in FIG.
  • Fuse 10 according to the invention, two fusible links 12 ', 12 ", each in the longitudinal direction of
  • the base support 14 is made of an electrically insulating material which is durable even at high temperatures, for example up to 300 ° C. Particularly preferred
  • the supports 16 ', 16 each extend in a region of the fusible conductors 12', 12 ", which extends transversely to the current direction.
  • Respective ends of the opposite fusible conductors 12 ', 12 " are electrically connected to each other via base contacts 18', 18".
  • These base contacts 18 ', 18 servee as terminals of the fuse 10 for conducting an electrical current in the longitudinal direction of the fuse 10.
  • the fuse element 12', 12" and the base contacts 18 ', 18'' are formed for example of copper. As soon as the current conducted by the fuse 10 has a predetermined value
  • Fuse 10 also provides protection against
  • Ambient temperature a predetermined temperature threshold, for example 200 ° C, and flows in addition an electric current through the fuse element 12 ', 12' ', according to the invention a diffusion process is activated in which the atoms of the material of the fusible conductor (copper) in the material of the support 16 ', 16 "diffuse in.
  • the material used for this purpose is the material of the support 16', 16" made of tin.
  • a copper-tin alloy is formed by diffusing the copper atoms into the tin overlay.
  • the copper layer completely diffuses into the tin layer. It also creates a high-impedance at rated current
  • the diffusion zone is by appropriate choice of design parameters, such as
  • Ambient temperatures for example, more than 200 ° C, when no overcurrent flows.
  • Figures 3 and 4 show in detail a fusible conductor 12_1 according to a first embodiment of the invention in each case in a perspective view and in a sectional view.
  • the fuse element 12_1 is in one piece of two
  • connection contacts 24_1 ', 24_1''in relation to the conductor track 26_1 very large area.
  • Embodiment is in the area of the connection contacts 24_1 ', 24_1' 'allows a much higher heat dissipation than in the area of the conductor track 26_1 itself.
  • the temperature is highest approximately in the middle of the conductor track 26_1 and decreases in the direction of both connection contacts 24_1 ', 24_1 ".
  • Fusible conductor 12_1 an H-profile.
  • the connection contacts 24_1 ', 24_1' ' are rectangular, wherein the
  • the fusible conductor 12_1 is formed by punching out a one-piece material (e.g., copper).
  • the fuse element 12 can be formed by cutting, for example by means of a laser.
  • the support 16_1 is filled in the recess 20_1, which is introduced in the material of the conductor track 26_1.
  • recesses with respectively filled-in supports may be provided at both end sections of the conductor track 26_1, at the junctions to the connection contacts 24_1 ', 24_1 ".
  • the temperature threshold is increasingly reduced.
  • the geometric shape of the recess 20_1 as a whole allows a possibility for setting or defining the temperature threshold value. As soon as the outside temperature is this
  • Temperature threshold exceeds, this has a melting or burning of the fuse element 12_1 in the area of the conductor 26_1 result.
  • the amount of material of the overlay 16_1 i. the amount of tin.
  • Another design parameter for setting the temperature threshold is by choosing the material composition of the two
  • Diffusion partners shown In addition to the diffusion partners copper and tin presented here, other suitable diffusion partners can also be selected.
  • a protective lacquer 22_1 for example a polymer protective lacquer (see FIG. 4).
  • Figures 5 and 6 show in detail a fusible conductor 12_2 according to a second embodiment of the invention in each case in a perspective view and in a sectional view.
  • the fusible conductor 12_2 is in one piece of two
  • the fusible conductor 12_2 according to the second embodiment differs from the fusible conductor 12_1 according to the first embodiment in that the line cross section of the conductor track 26 2 at both end sections approaches the larger conductor cross section of the connection contacts 24_2 ', 24_2 "in a stepped manner. Unlike the first
  • Conductor 26_2 not constant over the entire extent of the conductor track 26_2.
  • the conductor track 26_2 thus includes, in the
  • Sections of the form of an isosceles trapeze Seen in plan view, the outer shape of the
  • Fusion conductor 12_2 thus a bone-shaped profile.
  • the line cross section of the conductor track 26_2 can also increase non-linearly, whereby the end sections of the conductor track 26_2, viewed in plan view, are given a different geometric shape from the isosceles trapezoid.
  • the terminal contacts 24_2 ', 24_2'' are further rectangular in plan view, where they can also assume other geometric shapes, as long as the total conductor cross-section of the conductor 26_2 in relation to the line cross-section of the terminals 24_2', 24_2 "to the center of the fusible conductor 12 second progressively decreases.
  • the fusible conductor 12_2 according to the second embodiment comprises two recesses 20_2 ', 20_2 "which are incorporated in the material of the conductor track 26_2.
  • the recesses 20_2 ', 20_2 " as viewed in plan view, are respectively disposed on the blunt tips of the trapezoidal end portions of the track 26_2.
  • Ladder 26_2 in plan view is one of a variety of design parameters for setting or
  • the fusible conductor 12_2 is coated with a protective lacquer 22_2.
  • the fuse 10 shown in Figures 1 and 2 may be single-sided or double-sided with one or more
  • FIGS. 3 and 4 or one or more fusible conductors 12_2 of the second embodiment (see Figures 5 and 6) are fitted. There are also combinations possible.
  • Fuse 10 despite thermal fuse feature is suitable to be soldered by a direct reflow soldering on the circuit board without triggering. Since, in the course of this reflow soldering process, no current flows through the fusible conductor 12, the high temperatures which occur in this process do not trigger the fusible conductor 12 either. Only in the operating state, i. when passing a current, such as rated current, triggers the
  • a hitherto unprecedented SMD fuse is created, which can be automatically populated and soldered on SMD basis. Due to the small form factor of the SMD fuse, it can advantageously be placed particularly close to a highly heat-generating electrical component, for example a power transistor.
  • the SMD fuse triggers quickly, whereby the current flow to this defective component is reliably interrupted.
  • the fuse 10 has a smallest possible form factor (for example, 0201, 0402, 0603, 1206, 1812, 2010, 2512, 4018, etc.).
  • the fuse 10 has a high pulse load capacity, since the fusible conductor 12 is fixed on the base support 14.
  • Fusible conductors 12; 12 ', 12 "in parallel is possible to protect against environmental influences of the
  • Fuse element 12; 12 ', 12 "completely protected by a protective varnish 22, 22', 22".
  • a protective varnish 22, 22', 22 By appropriate selection of the aforementioned design parameters, the use at maximum ambient temperatures of up to 280 ° C is possible. Similarly, currents in the range of a few mA to several hundred A can be hedged. Because of the small
  • the fuse 10 advantageously be placed particularly close to strong heat-generating electrical components, such as power transistors. As a result, a good heat coupling is allowed by which increased temperatures,
  • Thermal fuses 10 provides overall significant improvements in terms of reliability, cost, size, weight, processing, pulse resistance,
  • Vibration resistance, response, etc. It is a fuse 10 created which previously known properties of fuses in terms of current-time behavior, temperature behavior,

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)

Abstract

L'invention concerne un conducteur fusible (12_1 ; 12_2) qui comprend deux contacts de borne (24_1', 24_1''; 24_2', 24_2'') et une piste conductrice intermédiaire (26_1 ; 26_2), la piste conductrice (26_1 ; 26_2) ayant au moins en partie une section transversale réduite en relation avec les contacts de borne (24_1' ; 24_1''; 24_2', 24_2''), et qui comprend en outre au moins un support (16_1 ; 16_2', 16_2''), le conducteur fusible (12_1 ; 12_2) et le support (16_1 ; 16_2', 16_2') comportant chacun des matières qui effectuent une diffusion lorsqu'une température ambiante prédéterminée est dépassée et lorsqu'un courant électrique circule à travers le conducteur fusible (12_1 ; 12_2). En outre, l'invention concerne une protection par fusible (10) comportant un tel conducteur fusible (12_1 ; 12_2) et un support de base (14), le conducteur fusible (12_1 ; 12_2) étant disposé sur une surface du support de base (14).
EP13824496.7A 2013-12-23 2013-12-23 Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd Active EP3087579B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL13824496T PL3087579T3 (pl) 2013-12-23 2013-12-23 Topik, bezpiecznik topikowy, sposób wytwarzania bezpiecznika topikowego, bezpiecznik SMD i układ SMD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/077913 WO2015096853A1 (fr) 2013-12-23 2013-12-23 Conducteur fusible, protection par fusible, procédé de fabrication d'une protection par fusible, protection smd et circuit smd

Publications (2)

Publication Number Publication Date
EP3087579A1 true EP3087579A1 (fr) 2016-11-02
EP3087579B1 EP3087579B1 (fr) 2018-08-08

Family

ID=50023517

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13824496.7A Active EP3087579B1 (fr) 2013-12-23 2013-12-23 Conducteur fusible, coupe-circuit a fusible, procédé de fabrication d'un coupe-circuit a fusible, d'un fusible a smd et d'un comutateur a smd

Country Status (7)

Country Link
US (1) US10192705B2 (fr)
EP (1) EP3087579B1 (fr)
KR (1) KR102128065B1 (fr)
CN (1) CN105874553B (fr)
PL (1) PL3087579T3 (fr)
SG (1) SG11201604918XA (fr)
WO (1) WO2015096853A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2017121474A1 (fr) 2016-01-14 2017-07-20 Schurter Ag Fusible thermique activable mécaniquement
US11359975B2 (en) 2019-02-08 2022-06-14 International Business Machines Corporation Using ionic liquids in a programmable sensor
DE102019004223A1 (de) * 2019-05-16 2020-11-19 Siba Fuses Gmbh Schmelzleiter und Sicherung
US11532452B2 (en) * 2021-03-25 2022-12-20 Littelfuse, Inc. Protection device with laser trimmed fusible element
US11605519B1 (en) * 2021-11-12 2023-03-14 Chi Lick Schurter Limited High breaking capacity strip fuse and the manufacture method of thereof

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DE29717120U1 (de) * 1997-09-25 1997-11-13 Wickmann-Werke GmbH, 58453 Witten Elektrisches Sicherungselement
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
JP3562696B2 (ja) * 1997-12-16 2004-09-08 矢崎総業株式会社 ヒューズエレメントの製造方法
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US20070018774A1 (en) * 2005-07-20 2007-01-25 Dietsch Gordon T Reactive fuse element with exothermic reactive material
US20090189730A1 (en) * 2008-01-30 2009-07-30 Littelfuse, Inc. Low temperature fuse
US8339235B2 (en) * 2008-08-06 2012-12-25 Beckert James J Housing securing apparatus for electrical components, especially fuses

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WO2015096853A1 (fr) 2015-07-02
KR102128065B1 (ko) 2020-06-30
CN105874553A (zh) 2016-08-17
KR20160102298A (ko) 2016-08-29
PL3087579T3 (pl) 2019-03-29
US10192705B2 (en) 2019-01-29
CN105874553B (zh) 2018-11-27
US20170040136A1 (en) 2017-02-09
EP3087579B1 (fr) 2018-08-08
SG11201604918XA (en) 2016-07-28

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