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EP3084874A1 - Composant électronique et procédé de fabrication d'un composant électronique - Google Patents

Composant électronique et procédé de fabrication d'un composant électronique

Info

Publication number
EP3084874A1
EP3084874A1 EP14805864.7A EP14805864A EP3084874A1 EP 3084874 A1 EP3084874 A1 EP 3084874A1 EP 14805864 A EP14805864 A EP 14805864A EP 3084874 A1 EP3084874 A1 EP 3084874A1
Authority
EP
European Patent Office
Prior art keywords
electrode
electronic component
plate
layer
carrier layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14805864.7A
Other languages
German (de)
English (en)
Inventor
Ricardo Ehrenpfordt
Frederik GOLKS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3084874A1 publication Critical patent/EP3084874A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H01M10/0585—Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an electronic component for supporting at least one electrical circuit and for storing electrical energy and to a manufacturing method for producing such an electronic component.
  • Energy-autonomous systems for example as a signal generator consisting of sensor and actuator elements, electronics, energy storage and wireless
  • an electronic component for carrying at least one electrical circuit and for storing electrical energy and a manufacturing method for producing an electronic component for carrying at least one electrical
  • Connection technology can be used both for storing electrical energy and for carrying at least one electrical circuit.
  • the concept proposed here describes an advantageous realization of an electronic component or a thin-film battery by a direct use of materials, in particular of electrode films,
  • Separators and electrolytes as used in lithium-ion battery technology, while simplifying the construction geometry by u.
  • A. can be dispensed with an elaborately manufactured cavity.
  • An electronic component designed in accordance with this concept can be used as a carrier of electrical circuits and other components and at the same time for
  • the electrodes required for the functionality of the thin-film battery including u. U. applied active materials and the separator detached from the component in an independent process step to produce and optimize externally. This includes in particular the possibility of commercially available materials of lithium-ion technology,
  • a simplification and reduction of the component result from an optimized design, eg. B. can be dispensed with by introducing the paste-like electrode materials in cavities.
  • process steps can be optimized, for example by the application of plane-parallel layers, the creation of space for fluidic and electrical vias by staggered structures and possibly the use of optimized materials such as foil-like composite materials and foil-like electrodes with battery-typical coatings.
  • a thin-layer cell manufactured in accordance with the concept presented here is characterized by a small size which promotes the compactness of an overall system, a high packing or functional density at the same time
  • An electronic component for carrying at least one electrical circuit and for storing electrical energy has the following features: a first plate-shaped, in particular foil-like, electrode and a second plate-shaped, in particular foil-like, electrode; an oxidizing agent and a reducing agent; and a first carrier layer and a second carrier layer, wherein the first
  • Carrier layer, the first plate-shaped electrode, the second plate-shaped electrode and the second carrier layer stacking are arranged plane-parallel one above the other, and wherein a first main side of the first electrode with the oxidizing agent or the reducing agent is coated and / or a first main side of the second electrode with the oxidant is coated when the first electrode is coated with the reducing agent or coated with the reducing agent, when the first electrode is coated with the oxidizing agent, wherein the first main side of the first electrode of the first main side of the second electrode facing.
  • the electronic component can have a very compact design and find application especially in microsystems.
  • the electronic component may be an electrochemical store which, in the finished state, has a rigid z. Rectangular plate shape to be suitable for supporting one or more electrical circuits.
  • the electronic component can fulfill the functions of a battery, a rechargeable battery or a capacitor.
  • Carrier layer may form an upper and a lower side of the stacked electronic component.
  • Carrier layer, the top and the second carrier layer, the bottom or vice versa, the first carrier layer, the bottom and the second carrier layer form the top of the stapeiförmigen device.
  • Component may have above or below the first carrier layer and / or above or below the second carrier layer any plurality of further carrier layers.
  • the first and the second carrier layer may consist of a robust and / or non-deformable plastic material and be plate-shaped.
  • the substrate plates can be formed large enough to the remaining between them
  • the two carrier layers can each have a rectangular shape.
  • the first and the second plate-shaped electrode may be formed as a foil, that is, with a low thickness and flexible.
  • the two plate-shaped electrodes may each have a rectangular shape.
  • the oxidizing agent and the reducing agent can ensure a chemical reaction for generating or storing electrical energy in the electronic component.
  • the electrode can be designed to receive electrons of an electrolyte. Accordingly, the other plate-shaped electrode by means of the coating with the reducing agent for Dispensing electrons of an electrolyte are designed.
  • Carrier layer, the first plate-shaped electrode, the separator layer, the second plate-shaped electrode and the second carrier layer may be arranged in the order mentioned forming the stack plane-parallel one above the other, that the stack has a z.
  • Separator layer each form a rectangular shape and all edges or corners of the rectangles are arranged congruent.
  • the carrier layers, the plate-shaped electrodes and the separator layer can each have a uniform thickness of the same, ie be free from recesses and cavities.
  • the electronic component may be a
  • Separator layer which is arranged for spatially and electrically separating the first plate-shaped electrode from the second plate-shaped electrode between the first plate-shaped electrode and the second plate-shaped electrode.
  • the separator layer may have a porous structure, which is advantageously suitable for a functional capability of the electronic component as a galvanic cell or as a redox flow cell for a passage of ions of an electrolyte between the first and the second electrode.
  • a second main side of the first electrode lying opposite the first main side may be fastened to the first carrier layer by means of an adhesive and / or a second main side of the second electrode lying opposite the first main side can be attached to the second by means of the adhesive
  • the electronic component may further at least one
  • the at least one connection layer may be between the first electrode and the second electrode and in particular between the first electrode and the first electrode
  • Separator layer are arranged plane-parallel to the stack and formed to connect the stack forming elements firmly together.
  • all the cell components of the stack can be connected in a single process step with little time to a one-piece component.
  • the support of the thermosetting material additive readily a rigid and thus highly robust final condition of the finished electronic component can be realized, with which the electronic component can be particularly suitable for carrying sensitive electrical and electronic components in terms of a circuit board.
  • connection layer may have an opening for forming a channel between the first electrode and the second electrode, in particular between the first electrode and the second electrode
  • the electronic component may comprise a further compound layer comprising the thermosets.
  • the further connection layer may be arranged adjacent to the connection layer and have a further opening.
  • the electronic component may have at least one filling opening.
  • the filling opening may extend from an outer side of the first carrier layer facing away from the stack to the second electrode.
  • the filling opening may extend from an outer side of the second carrier layer facing away from the stack to the first electrode.
  • the filling opening may be designed to allow a fluidic electrolyte to be introduced into the stack, in particular into the channel between the first electrode and the second electrode, in particular between the first electrode and the separator layer.
  • the electrolyte can be present in liquid or gel form for filling through the filling opening. This embodiment has the advantage that the electrolyte only at the end or after an end of a manufacturing process for producing the electronic component to supply this. So can the
  • the first electrode and the second electrode may differ in their dimensions.
  • the first electrode and the second electrode may be arranged laterally offset from each other. In both cases, such a lateral
  • Projection of the first electrode with respect to the second electrode or the second electrode with respect to the first electrode form. It can the
  • Fill opening be positioned in a portion of the stack, which is located in the region of the lateral projection.
  • This embodiment can facilitate the filling of the electrolyte into the cell stack, since in this case the electrolyte can be supplied by the shortest route to the cavity formed through the opening in the connection layer or to the channel between the electrodes.
  • the electronic component in the portion of the stack which is located in the region of the supernatant, further an electric
  • the electrical via may be configured to extend from the outside of the first carrier layer to the first
  • Electrode or the second electrode to extend. So the second one
  • Electrode can be easily contacted without the risk of a short circuit.
  • a manufacturing method for producing an electronic component for carrying at least one electrical circuit and for storing electrical energy comprises the following steps: providing a first carrier layer and a second carrier layer, a first plate-shaped electrode with a coating of one
  • Oxidizing agent a reducing agent and a second plate-shaped electrode with a coating of the oxidizing agent or
  • Reducing agent for forming a stack of the first carrier layer, the first plate-shaped electrode, the second plate-shaped electrode and the second carrier layer.
  • the manufacturing method can be used to produce an electronic
  • Component can be used according to one of the preceding embodiments.
  • the manufacturing method is suitable for use in a wholly or partially automated production line for the efficient production of a large number of the electronic components according to the invention.
  • FIG. 4 shows a cross section through a single-layer printed circuit board according to the prior art.
  • FIG. 5 shows a cross section through a multilayer printed circuit board according to the prior art.
  • FIG. 6 is a perspective view of a structure of an electronic component according to an embodiment of the present invention.
  • FIG. 7 is a perspective view of the electronic component of FIG. 6 after completion, according to an embodiment of the present invention.
  • FIG. 8 shows a cross section through the electronic component from FIG. 6 before filling in an electrolyte, according to an exemplary embodiment of the present invention
  • FIG. 9 shows a cross section through the electronic component from FIG. 6 after an electrolyte has been introduced, according to an exemplary embodiment of the present invention
  • 10 shows a cross section through the electronic component from FIG. 6 with a through contact, according to an embodiment of the present invention.
  • 1 1 is a flowchart of a manufacturing method for manufacturing an electronic component, according to an embodiment of the present invention.
  • FIG. 1 to 3 show examples of chemical energy storage in small
  • Fig. 1 shows an exemplary real-time clock board according to the prior art.
  • Fig. 2 shows an exemplary control unit according to the prior art.
  • Smartphones - including the contact strip for contacting the battery - usually occupy more than 30% of the total volume of the device.
  • For small system sizes are often - as shown in Figures 1 and 2 - button cells in primary or secondary version application, whose
  • Fig. 3 shows an exemplary thin-film battery according to the prior art.
  • the battery layers - electrodes, separator, electrolyte - have typical thicknesses of a few hundred micrometers and can u. A. be applied directly to MEMS or electronic chips.
  • circuit carriers in the form of the printed circuit board or the PCB 400 are often used as a substrate for the construction and connection technology of sensor and
  • a printed circuit board core 402 formed from a thermoset is at least partially coated with a solder resist or insulating varnish 404. At locations free of the insulating varnish 404, metal layers form on the core 402
  • the vias 408 may be metallized border or filled.
  • FIG. 5 shows, by way of another cross-sectional illustration, an exemplary schematic structure of a multilayer printed circuit board 500 according to the prior art
  • the printed circuit board 500 has a plurality of superposed thermoset layers 402 with metal layers which are laminated by means of pre-impregnated fibers, so-called prepregs 502, arranged between them.
  • the thermoset layers or epoxy resin 402 are traversed by glass fibers -. B. in the form of epoxy resin impregnated
  • Epoxidharzlagen 402 arranged metal layers are used to create rewiring and connection pads 406 and the vias or
  • Prepregs 502 is an unhardened thermoset
  • Plastic matrix that cures when pressed.
  • standard thicknesses for the epoxy resin cores 402 are 50 to 710 ⁇ m.
  • Typical prepreg thicknesses are 50 to 180 ⁇ .
  • the lateral size of the circuit boards 400, 500 is usually determined by the circuit and assembly image on the surface, without - except for the vias 408 - within the circuit board 400, 500 a high
  • FIG. 6 schematically shows a construction of an electronic component 600 according to a perspective illustration
  • FIG. 6 shows well the stacked structure of the electronic component 600, by the individual components or layers of the component 600, which in the finished
  • the electronic component 600 serves as a circuit carrier and is in the form of a thin-film battery or a thin-film battery.
  • the electronic component 600 comprises a first carrier layer 602, a second carrier layer 604, a first plate-shaped electrode 606, a second plate-shaped electrode 608, a separator layer 610 and four thermoset bonding layers 612.
  • the electronic component 600 also have only one connection layer 612 or more than four connection layers 612.
  • the carrier layers 602, 604 form the outer sides of the electronic component 600 or, in the exemplary embodiment shown in the illustration, form the first carrier layer 602
  • the first and the second plate-shaped electrode 606 and the second plate-shaped electrode 608 are designed as electrode tapes or foil electrodes, thus characterized by a very small thickness or strength. Both the first electrode 606 and the second electrode 608 have one
  • the first electrode 606 fulfills the function of the cathode and is located at one of the
  • the second electrode 608 satisfies the
  • the functions and corresponding coatings are distributed inversely to the electrodes 606, 608.
  • the first electrode 606 with a second main side 622 opposite the first main side 616 is fixed to an inner side of the first carrier layer 602 facing the cell stack and the second electrode 608 to a second main side opposite the first main side 618 624 at a the
  • the separator layer or separator 610 is disposed adjacent to the second electrode 608 in the cell stack and configured to spatially and electrically separate the electrodes 606, 608 with their active materials.
  • Separator layer 610 for showing cavities between the
  • Fiberglass or polyethylene formed according to lithium-ion technology Fiberglass or polyethylene formed according to lithium-ion technology.
  • the four connecting layers 612 disposed between the first electrode 606 and the separator 610 in the cell stack of the thin-film battery 600 each have an opening 626 for forming a channel for guiding a channel
  • all the components 602, 604, 606, 608, 610, 612, 620 of the cell stack of the embodiment of the electronic component 600 shown here are implemented in thin layers or plates. All layers or plates have a rectangular shape, in which case the
  • Electrodes 606, 608 and separator layer 610 over the others Components have smaller dimensions both in length and in width. Also, the openings 626 of the thermoset
  • Bonding layers 612 are rectangular in shape and approximately equal in size to those of the electrodes 606, 608 and the separator 610.
  • the openings 626 are placed in the bonding layers 612 so as to form a channel between the electrodes 606, 608 upon completion of the electronic device 600 form.
  • the openings 626 may have different geometric shapes or positions in the respective connection layer 612 or different sizes to give the channel a specified shape.
  • FIG. 6 clearly shows that all the components 602, 604, 606, 608, 610, 612, 620 of the PCB thin-film battery stack 600 are arranged plane-parallel to each other.
  • the plane parallelism refers to a marked by a double arrow in the illustration
  • Main extension plane 628 along major sides of components 602, 604, 606, 608, 610, 612, 620.
  • the major sides are opposite sides of the cell components 602, 604, 606, 608, 610, 612, 620 having a larger extent than the remaining pages.
  • the cell concept proposed here and the geometry resulting therefrom comprise at least the first and second layer-wise arranged substrate planes 602, 604, between which the at least two layered electrode foils 606, 608 are located (eg copper and copper)
  • the electrode films can z. B. made of copper or aluminum and are provided with a battery-typical electrode composite for the anode 608 and the cathode 606, the u. A. can be performed as a film, deposited, grown, printed or scrubbed layer over the entire surface, porous, or sponge-like. At least one of the material components per electrode 606, 608 can function both as an oxidizing agent and as a reducing agent and thus absorb or release ions or electrons.
  • the positive electrode 608 is aluminum with a lithium-containing transition metal oxide, e.g. B.
  • the negative electrode 606 is made of, for example, copper provided with a graphite coating. Aluminum and copper act as Elektronenableiter or
  • Electron collector The layered electron-conducting electrodes 606, 608 including the applied active materials at least partially cover the inner surfaces of the carrier layers 602, 604 and are in the embodiment shown in FIG. 6 at the back 622, 624 with the adhesive layers
  • the printed circuit boards or carrier layers 602, 604 are made of a glass-fiber-reinforced epoxy plastic.
  • further metallization layers can be introduced parallel or substantially perpendicular to the electrodes 606, 608 in such a way that they close off or seal the cell 600 almost completely to the surrounding atmosphere, above all against moisture.
  • Fig. 7 shows in a perspective view of the embodiment of the electronic component 600 of FIG. 6 after the pressing.
  • the now one-piece stack or stack of the thin-film cell 600 shown in the illustration consists of the substrate plates 602, 604 and the cell components arranged between the substrate plates 602, 604 shown in FIG. 6 and was used in a lamination or pressing step of a method for
  • Epoxy layers 612 glued.
  • the prepreg connection layers 612 are placed around the cell arrangement in such a way that, apart from the channel mentioned in the explanation for FIG. 6, no further cavities are formed.
  • the finished thin-film cell 600 has a uniform, flat
  • connection pads 614 for contacting the thin-film cell 600 with other components, eg. B. another thin-film cell before.
  • the manufacturing process was the stack through the first carrier layer 602 with two filling openings 700 for filling a liquid or gel
  • FIG. 8 is a cross-sectional view of a portion of the embodiment of the compressed thin-film cell 600 shown in perspective in FIG. 7. In the illustration, the electronic component or the
  • Fill openings 700 one of which is shown here, shown.
  • the embodiment of the electronic component 600 shown in FIG. 8 has the peculiarity that the first electrode 606 has a smaller one
  • the first electrode 606 extends along the direction of extent only through a portion of the thin-film cell 600.
  • the illustration also shows that the filling opening 400 is disposed in a portion of the cell stack into which the first electrode 606 does not extend. Thus, the first electrode 606 is not contacted by the filler opening 700.
  • FIG. 8 shows the coating of the first electrode or
  • the filling opening 700 extends from above from an outer side of the first carrier layer 602 through the first carrier layer 602, the compressed connecting layer 612, the separator layer 610 and the
  • Oxidant layer 802 extends to the second electrode 608.
  • the filling opening 700 extends in a straight line and with a constant shape
  • the above-mentioned channel for guiding an electrolyte formed by the openings in the connecting layer 612 is part of the filling opening 700.
  • the at least one filling opening 700 extends in the form of a passage opening from the
  • this can advantageously be used directly as a drill stop in the context of a laser drilling method.
  • the passage 700 allows the filling of a liquid or gel electrolyte after completed production of the circuit board 600 and / or even after further placement and soldering processes.
  • FIG. 9 shows, by way of another cross-sectional illustration, the section of the embodiment of the compressed view shown in perspective in FIG. 7
  • Thin-film cell 600 after a process step of filling the stack with an electrolyte 900.
  • FIG. 9 shows that as a result of the process step of FIG.
  • the fill opening 700 was sealed by applying a cover layer 902 to prevent later leakage of the electrolyte 900.
  • the filling with the electrolyte 900 for example, under vacuum, can be improved.
  • at least one of the two electrode foils which extend the electrode foil 608 laterally at least in a partial area of the stack, projects beyond the other electrode foil, in this case the electrode foil 606. In this projecting area, the at least an opening 700 for the
  • the printed circuit board layers 602, 604 are designed as largely plane-parallel layers without further deepened structuring.
  • Electrodes 606, 608 are largely flat on the printed circuit board layers 602, 604.
  • the area between the circuit board layers 602, 604 that is not occupied by the sheet-like electrodes 606, 608, their coatings 800, 802 or the separator 610 is filled by the prepreg or epoxy material 612 used in the manufacture of the cell 600 in FIG a thermal process was pressed under mechanical pressure so that it mechanically bonds the stack together.
  • FIG 10 shows by way of another cross-sectional illustration a section of a further exemplary embodiment of the thin-film cell 600.
  • the cross-section shows the electronic component with the through opening or filling opening 700 and the further feature of a through-connection 1000.
  • the via 1000 is provided, like the fill opening 700, in the portion of the stack that is free of the first electrode 606. The electric
  • Through-contact 1000 extends from the outside of the first carrier layer 602 to the second electrode 608 and also extends in a straight line and with a constant diameter transverse to the extension direction 628 of the cell stack.
  • the thin-film cell 600 is equipped with a plurality of electrical contacts 1000.
  • the electrical contact 1000 consists of the electrode foil 608 itself, which is indeed made of aluminum or copper.
  • the through contact 1000 leads without further contact or composite sites as a continuous metallization to further electrodes within the circuit substrate 600, to the Anschlußpad vom shown in Fig. 4 on the outer surfaces or to the other
  • Interconnections can then be the contacting of other cells, electronic circuits, such as DC / DC circuits, the contacting of
  • Fig. 1 1 shows a flowchart of an embodiment of a
  • Manufacturing method 1 100 of an electronic component for example, an embodiment of the thin-film cell shown in the preceding Figures 1 to 10.
  • a step 1 102 at least a first carrier layer, a second carrier layer, a first plate-shaped electrode coated with an oxidizing agent or reducing agent, a second plate-shaped coated with an oxidizing agent or reducing agent
  • Electrode and a Separator Mrs for spatial and electrical separation of the first electrode from the second electrode, and further connecting layers for connecting the cell components.
  • a step 1 104 all components are arranged in a stape-shaped plane-parallel.
  • a step 1 106 the plane-parallel stacking components are pressed together to form the one-piece thin-layer cell by means of the connecting layers.
  • filling holes are provided from an outside of the cell for filling an electrolyte into the cell.
  • an electrolyte is filled through the filling openings and then with a
  • the approach presented here can be used above all in energy-self-sufficient systems in the automotive or consumer sector and can be detected on the product by making a cut or by opening the circuit carrier.
  • an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, then this is to be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment either only first feature or only the second feature.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Secondary Cells (AREA)

Abstract

L'invention concerne un composant électronique (600) destiné à supporter au moins un circuit électrique et à stocker de l'énergie électrique. Le composant électronique (600) comprend une première électrode (606) se présentant sous la forme d'une plaque, en particulier de type film, et une deuxième électrode (608) se présentant sous la forme d'une plaque, en particulier de type film; un agent oxydant ainsi qu'un agent réducteur, et une première couche de support (602) et une deuxième couche de support (604), la première couche de support (602), la première électrode (606) en forme de plaque, la deuxième électrode (608) en forme de plaque, et la deuxième couche de support (604) étant disposées les uns au-dessus des autre dans des plans parallèles en formant une pile et une première face principale (616) de la première électrode (606) étant recouverte de l'agent oxydant ou de l'agent réducteur et/ou une première face principale (618) de la deuxième électrode (608) étant recouverte de l'agent oxydant lorsque la première électrode (606) est recouverte de l'agent réducteur ou étant recouverte de l'agent réducteur lorsque la première électrode (606) est recouverte de l'agent oxydant, la première face principale (616) de la première électrode (606) étant dirigées vers la première face principale (618) de la deuxième électrode (608).
EP14805864.7A 2013-12-19 2014-11-28 Composant électronique et procédé de fabrication d'un composant électronique Withdrawn EP3084874A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013226646.4A DE102013226646A1 (de) 2013-12-19 2013-12-19 Elektronisches Bauelement und Herstellungsverfahren zum Herstellen eines elektronischen Bauelements
PCT/EP2014/075883 WO2015090901A1 (fr) 2013-12-19 2014-11-28 Composant électronique et procédé de fabrication d'un composant électronique

Publications (1)

Publication Number Publication Date
EP3084874A1 true EP3084874A1 (fr) 2016-10-26

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EP14805864.7A Withdrawn EP3084874A1 (fr) 2013-12-19 2014-11-28 Composant électronique et procédé de fabrication d'un composant électronique

Country Status (4)

Country Link
EP (1) EP3084874A1 (fr)
CN (1) CN105814729A (fr)
DE (1) DE102013226646A1 (fr)
WO (1) WO2015090901A1 (fr)

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CN111362227A (zh) * 2018-12-25 2020-07-03 无锡华润矽科微电子有限公司 Mems传感器封装结构

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JP4419568B2 (ja) * 2003-12-25 2010-02-24 Ｔｄｋ株式会社 電気化学デバイス及び電気化学デバイスの製造方法
US7624499B2 (en) 2004-02-26 2009-12-01 Hei, Inc. Flexible circuit having an integrally formed battery
JP4316604B2 (ja) * 2006-12-08 2009-08-19 株式会社東芝 電源一体型半導体モジュールおよびその製造方法
US20090186169A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
WO2012029556A1 (fr) * 2010-09-03 2012-03-08 日本電気株式会社 Accumulateur non aqueux, et procédé de fabrication de celui-ci
DE102011085863A1 (de) * 2011-11-07 2013-05-08 Robert Bosch Gmbh Träger für eine elektrische Schaltung mit einem integrierten Energiespeicher

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WO2015090901A1 (fr) 2015-06-25
DE102013226646A1 (de) 2015-06-25
CN105814729A (zh) 2016-07-27

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