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EP3078246A1 - Procédé permettant de former une structure électroconductrice sur un substrat en matière plastique - Google Patents

Procédé permettant de former une structure électroconductrice sur un substrat en matière plastique

Info

Publication number
EP3078246A1
EP3078246A1 EP14796142.9A EP14796142A EP3078246A1 EP 3078246 A1 EP3078246 A1 EP 3078246A1 EP 14796142 A EP14796142 A EP 14796142A EP 3078246 A1 EP3078246 A1 EP 3078246A1
Authority
EP
European Patent Office
Prior art keywords
plastic substrate
electron beam
electrically conductive
ink
copper particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14796142.9A
Other languages
German (de)
English (en)
Inventor
Matthias Fahland
Benjamin Graffel
Gösta MATTAUSCH
Falk Winckler
Stefan Weiss
Sindy Mosch
Robert Jurk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of EP3078246A1 publication Critical patent/EP3078246A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Definitions

  • the invention relates to a method for forming an electrically conductive structure on a plastic substrate, in which initially an ink is printed on the plastic substrate.
  • lithographic and galvanic methods are established. However, these methods are very complex and expensive and therefore less suitable for a small series production and rapid prototyping.
  • Very flexible alternative techniques are direct writing methods, such as, for example, the aerosol and inkjet printing.
  • the metal particles are coated with an organic layer that prevents agglomeration and sedimentation within the ink. In order to reduce the electrical resistance of printed wiring patterns printed with such inks, the organic components must be removed from the wiring patterns.
  • a method is known in which a silver-containing ink is printed on a substrate.
  • the ink also contains a dispersion stabilizer and a solvent.
  • the entire substrate is heated to above 1 90 ° C. by means of an electron beam in order to remove organic material remaining on the substrate and thus to form conductive tracks of silver. Due to the heating of the substrate above 1 90 ° C, the process is limited in terms of the substrate materials to be used, in particular with respect to plastic materials. Another disadvantage is due to the expensive silver-containing ink required for this purpose.
  • the invention is therefore based on the technical problem of providing a method by means of which the disadvantages of the prior art are overcome.
  • an electrically conductive structure is also on
  • Plastic substrates can be formed, in which an inexpensive ink is used and in which a high electrical conductivity of the formed on the substrate interconnect structure can be achieved.
  • an ink containing electrically conductive solid particles is first printed on the plastic substrate at least on the surface regions on which the electrically conductive structure is to be formed.
  • electrically conductive solid particles copper particles are used according to the invention. It has an advantageous effect here that copper-particle-containing inks are cheaper than inks in which the electrically conductive particles consist of noble metals. Because an oxidation Of copper particles during storage at atmospheric conditions usually can not be prevented, are the term copper particles in the sense of the invention also to understand such copper particles on the surface of which is partially or completely formed an oxide layer. It is expressly mentioned, however, that oxidation of the copper particles is neither required nor desired for the process according to the invention. Therefore, according to the invention, the term “copper particles” also means oxides and alloys which have a copper content of at least 90%.
  • a path energy is selected with an energy input into the printed ink such that sintering of the copper particles is effected as a result of sweeping the ink with the electron beam.
  • the sintering of the copper particles causes adjacent copper particles to be fused together only at certain points or in smaller surface areas, whereby only a good electrically conductive contact is made from a copper particle to adjacent copper particles and thus an electrically conductive structure is formed.
  • organic components of the ink are removed from the plastic substrate at the same time.
  • the method according to the invention is also suitable for temperature-sensitive substrates, such as plastic substrates , suitable. With the method according to the invention but also conductive structures on other substrate materials, such as semiconductors, G lasers or ceramics, are formed. embodiments
  • a plastic substrate 1 is shown schematically, on which an electrically conductive structure is to be formed. According to the invention is on the
  • Plastic substrate 1 first printed an ink containing electrically conductive particles in the form of copper particles.
  • the printing of the ink takes place at least in the surface regions of the plastic substrate 1, on which an electrically conductive structure 2 is to be formed. In the embodiment associated with FIG. 1, only those surface regions of the plastic substrate 1 have been printed with the ink on which the electrically conductive structure 2 is to be formed.
  • Any ink printing processes known in the art may be used in the process of printing the ink, such as inkjet, aerosoljet, spray or screen printing.
  • An ink used according to the invention is characterized in that the proportion of copper particles in the ink is at least 15% by weight and the copper particles have a size in the range from 5 nm to 100 ⁇ m. Preference is given to using copper particles having a size in the range from 5 nm to 1 ⁇ m, because it is also possible to form particularly narrow and filigree conductor track structures with particles of this size.
  • the ink may also contain solvents, water, and additives for controlling ink viscosity, as well known from other inks for printing circuits.
  • a copper-containing ink is used, which is formed as a low-viscosity suspension having a viscosity of less than 5 Pa s (pascal second).
  • the copper particles of the printed ink are sintered only on the surface portions of the plastic substrate 1 on which the electroconductive structure 2 is to be formed, and thus an electrically conductive contact is formed between adjacent copper particles within these surface regions.
  • the plastic substrate 1 is introduced into a vacuum chamber, not shown in Fig. 1.
  • the surface regions of the plastic substrate 1 on which the electrically conductive structure 2 is to be formed are swept over by means of an electron beam 3 with a first energy of the line, which causes sintering of the copper particles.
  • an electron beam is particularly suitable because such an electron beam can be generated with a very small beam focus and thus very narrow conductor track structures can be formed. Furthermore, an electron beam is very quickly deflected with high precision, resulting in a high
  • an electron beam 3 which is generated by an electron beam generator 4, with a power of 1 W to 1 50 W, wherein a feed of the electron beam 3, with which the electron beam 3 sweeps over the plastic substrate 1, at a speed of 0, 1 m / s to 100 m / s is applied.
  • the plastic substrate 1 can be introduced into the vacuum chamber and then checked to see whether the plastic substrate 1 is properly aligned in the vacuum chamber. If the check reveals that the plastic substrate is aligned correctly, the surface of the plastic substrate 1 is scanned with the electron beam 3 in accordance with a predetermined geographical pattern of the electrically conductive structure to be formed.
  • backscattered electrons and / or secondary electrons are detected by means of a sensor device (not shown in FIG.
  • Electron beam 3 is controlled. In this procedure, it can be checked and ensured that the position of the electron beam 3 on the surface of the plastic substrate lies within the surface regions on which the electrically conductive structure is to be formed.
  • the requisite sensor devices for detecting secondary and backscattered electrons with associated evaluation and control device are known, for example, from electron beam welding, and can be easily integrated into devices and methods for forming a conductive structure.
  • the plastic substrate 1 by means of the electron beam 3 with a second energy range covered wherein the second energy range is chosen smaller than the first energy range.
  • both surface regions of the plastic substrate 1 can be covered on which an electrically conductive structure 2 is to be formed, as well as surface areas on which no electrically conductive structure 2 is to be formed.
  • secondary and / or backscattered electrons are detected by means of the sensor device.
  • a contrast image of the surface of the plastic substrate 1 formed therefrom can then be determined whether the plastic substrate 1 is properly aligned within the vacuum chamber and / or if the electron beam 3, when it sweeps over the surfaces of the plastic substrate 1 with the first path energy, still within the surface areas act on which the electrically conductive structure 2 is to be formed.
  • the electron beam 3 can be switched during the sweeping of the surface of the plastic substrate with the first path energy at time intervals to the second path energy, with the second energy path, the entire surface of the plastic substrate 1 to check its position on the surface of the plastic substrate 1 and then continue the sweeping of the plastic substrate 1 with the first path energy.
  • the necessary control means for switching the path energy of an electron beam and for controlling the direction of an electron beam are known.
  • the plastic substrate 1 has been printed only in the surface areas with the ink containing copper particles, on which the electrically conductive structure 2 should be formed.
  • the entire surface of the plastic substrate 1 can be printed with the copper-containing ink or coated with copper particles.
  • the ink is then removed from the other surface portions of the plastic substrate 1 in which the copper particles were not sintered by the electron beam. This can be done, for example, by the ink, which is not supplied with the electron beam 3 with the first energy of the path, from the surface of the ink
  • Plastic substrate 1 is removed by mechanical or chemical means.
  • the electrical conductivity of an electrically conductive structure 2 produced according to the invention can be further increased further by introducing a gas reducing the oxidation of the copper particles into the vacuum chamber during the charging of the ink containing copper particles with the electron beam 3.
  • the hydrogen gas has proved to be particularly suitable because it extracts oxygen from an oxidized surface layer of copper particles and combines with this to water, which evaporates from the ink.
  • An oxidized boundary layer in the case of copper particles is reduced in this way and thus the electrical conductivity of the formed electrically conductive structure 2 is increased.
  • a hydrogen-containing gas can also be used for this purpose.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé permettant de former une structure électroconductrice sur un substrat en matière plastique. Une encre, laquelle contient des particules solides électroconductrices, est imprimée sur le substrat en matière plastique. Des particules de cuivre sont utilisées comme particules solides électroconductrices et, une fois l'encre imprimée, seules les zones superficielles du substrat en matière plastique sur lesquelles la structure électroconductrice doit être formée sont balayées à l'intérieur d'une chambre à vide au moyen d'un faisceau électronique présentant une première énergie d'extension, laquelle provoque un frittage des particules de cuivre.
EP14796142.9A 2013-12-04 2014-11-12 Procédé permettant de former une structure électroconductrice sur un substrat en matière plastique Withdrawn EP3078246A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013113485.8A DE102013113485A1 (de) 2013-12-04 2013-12-04 Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
PCT/EP2014/074373 WO2015082179A1 (fr) 2013-12-04 2014-11-12 Procédé permettant de former une structure électroconductrice sur un substrat en matière plastique

Publications (1)

Publication Number Publication Date
EP3078246A1 true EP3078246A1 (fr) 2016-10-12

Family

ID=51871080

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14796142.9A Withdrawn EP3078246A1 (fr) 2013-12-04 2014-11-12 Procédé permettant de former une structure électroconductrice sur un substrat en matière plastique

Country Status (7)

Country Link
US (1) US20160324010A1 (fr)
EP (1) EP3078246A1 (fr)
JP (1) JP6290417B2 (fr)
KR (1) KR20160094425A (fr)
CN (1) CN106165551A (fr)
DE (1) DE102013113485A1 (fr)
WO (1) WO2015082179A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017180163A1 (fr) 2016-04-15 2017-10-19 Hewlett-Packard Development Company, L.P. Pièces de cellule de charge imprimées de façon tridimensionnelle
US11868083B2 (en) * 2018-04-27 2024-01-09 Hewlett-Packard Development Company, L.P. Containers with gas vessel
CZ2020110A3 (cs) * 2020-03-03 2021-04-28 Západočeská Univerzita V Plzni Způsob výroby rezistoru pro výkonové aplikace

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
DE3629474A1 (de) * 1986-08-29 1988-03-03 Licentia Gmbh Verfahren zum aufbringen erhabener strukturen und danach hergestellter verzoegerungsleitungstraeger einer lauffeldroehre
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6537052B1 (en) * 1999-08-23 2003-03-25 Richard J. Adler Method and apparatus for high speed electron beam rapid prototyping
US20050173380A1 (en) * 2004-02-09 2005-08-11 Carbone Frank L. Directed energy net shape method and apparatus
US20050255253A1 (en) 2004-05-13 2005-11-17 White John M Apparatus and methods for curing ink on a substrate using an electron beam
US7625063B2 (en) * 2004-11-04 2009-12-01 Applied Materials, Inc. Apparatus and methods for an inkjet head support having an inkjet head capable of independent lateral movement
US20070193026A1 (en) * 2006-02-23 2007-08-23 Chun Christine Dong Electron attachment assisted formation of electrical conductors
JP2009004669A (ja) * 2007-06-25 2009-01-08 Panasonic Corp 金属配線基板の製造方法およびそれを用いて形成した金属配線基板
KR101600559B1 (ko) * 2008-10-17 2016-03-08 엔씨씨 나노, 엘엘씨 저온 기판상에서의 박막 환원 방법
KR20100082558A (ko) 2009-01-09 2010-07-19 삼성에스디아이 주식회사 인쇄회로기판용 도전성 잉크 조성물 및 이를 이용한 인쇄회로기판의 제조 방법
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
JP5616070B2 (ja) * 2010-01-21 2014-10-29 株式会社フジクラ 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法
US20140097002A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components

Also Published As

Publication number Publication date
DE102013113485A1 (de) 2015-06-11
US20160324010A1 (en) 2016-11-03
CN106165551A (zh) 2016-11-23
KR20160094425A (ko) 2016-08-09
JP6290417B2 (ja) 2018-03-07
JP2016541121A (ja) 2016-12-28
WO2015082179A1 (fr) 2015-06-11

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