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EP3055867B1 - Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil - Google Patents

Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil Download PDF

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Publication number
EP3055867B1
EP3055867B1 EP14781510.4A EP14781510A EP3055867B1 EP 3055867 B1 EP3055867 B1 EP 3055867B1 EP 14781510 A EP14781510 A EP 14781510A EP 3055867 B1 EP3055867 B1 EP 3055867B1
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component
polymeric material
group
compound
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EP3055867A1 (fr
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Anna Di Gianni
Bernhard Von Allmen
Denis Tehlar
Navid Mahdizadeh
Thomas Alfred Paul
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Hitachi Energy Ltd
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Hitachi Energy Ltd
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Priority claimed from PCT/EP2014/071274 external-priority patent/WO2015052100A1/fr
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/56Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances gases

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  • the present invention relates to an apparatus for the generation, the distribution and/or the usage of electrical energy, to a component for such an apparatus, as well as to the process for the preparation of such a component.
  • Dielectric insulation media in liquid or gaseous state are conventionally applied for the insulation of an electrically conductive part in a wide variety of apparatuses, such as for example switchgears, gas-insulated substations (GIS), gas-insulated lines (GIL), transformers, or others.
  • GIS gas-insulated substations
  • GIL gas-insulated lines
  • transformers or others.
  • the electrically conductive part is arranged in a gas-tight housing, which defines an insulating space, said insulation space comprising an insulation gas and separating the housing from the electrically conductive part without letting electrical current to pass through the insulation space.
  • the insulating gas further functions as an arc extinction gas.
  • WO-A-2010/142346 discloses a dielectric insulation medium comprising a fluoroketone containing from 4 to 12 carbon atoms. Further, WO-A-2012/080246 discloses a fluoroketone containing exactly 5 carbon atoms (hereinafter referred to as "C5K”) in a mixture with a dielectric insulation gas component different from said C5K to be particularly preferred.
  • C5K fluoroketone containing exactly 5 carbon atoms
  • Fluoroketones have been shown to have high insulation capabilities, in particular a high dielectric strength, as well as high arc extinction capabilities. At the same time, they have a very low Global Warming Potential (GWP) and very low toxicity. The combination of these characteristics renders these fluoroketones highly suitable as a possible alternative to conventional insulation gases.
  • GWP Global Warming Potential
  • the apparatus of the present invention comprises a housing enclosing an insulating space and an electrically conductive part arranged in the insulating space, said insulating space containing a dielectric insulation medium at least a portion of which being in the form of an insulation gas comprising an organofluorine compound, in particular a fluoroketone.
  • the insulation medium, and specifically the insulation gas can comprise one or more degradation products (or “decomposition products") of the organofluorine compound, as will be discussed below.
  • At least some of the components of the apparatus that are directly exposed to the insulation gas are made of a material which remains unaltered during exposure to the insulation gas for a predetermined period of time, which is here more than 1 year, at operational conditions.
  • a prolonged contact of more than 1 year with the insulation gas comprising the organofluorine compound and, as the case may be, the decomposition product(s) does not alter the material's properties that are essential for fulfilling its function.
  • the functionality of the components is maintained and there is, thus, no need for regular replacement of the components, ultimately allowing for a long service lifetime and a low maintenance of the apparatus.
  • component as used in the context of the present invention relates to any component of essentially stable form, more specifically to any solid or semi-solid component.
  • coating compounds more particularly paints or resins, as well as sealing compounds are encompassed by the term “component”.
  • Paste-like components such as a lubricating compound or grease, are also encompassed.
  • the term "for a predetermined period of time” relates to a period of more than 1 year, more preferably of more than 2 years, even more preferably of more than 5 years, and most preferably of more than 10 years.
  • the components of the apparatus that are directly exposed to the insulation gas are made of a material which remains unaltered during exposure to the insulation gas for a period of more than 2 years, more preferably of more than 5 years, and most preferably of more than 10 years.
  • insulation medium as used in the context of the present invention relates to an insulation fluid. Since at least a portion of the insulation medium is in the form of an insulation gas, the insulation medium can be entirely in gaseous form or can be a two-phase system comprising a portion in gaseous form and a portion in liquid form.
  • the insulation medium and in particular the insulation gas, can comprise one or more degradation products of the organofluorine compound.
  • the apparatus is a switching apparatus, more particularly a switchgear or a component thereof.
  • the degradation product can particularly be hexafluoropropene and/or heptafluoropropene.
  • a least some of the components of the apparatus that are directly exposed to the insulation gas have a surface, at least a portion of which is devoid of any nucleophilic group reactive towards the organofluorine compound and/or reactive towards any degradation product of the organofluorine compound at operational conditions.
  • devoid of any nucleophilic group relates both to compounds which are an integral part of the material as well as compounds which are bound in any way to the surface of the material, e.g. resulting from condensation of a gas component of the insulation medium.
  • nucleophilic group relates to any chemical group that is able to donate (in a chemical reaction) an electron pair to an electrophile to form a chemical bond.
  • nucleophilic group thus specifically relates to any chemical group which is considered nucleophilic in relation to the organofluorine compound or its degradation product(s) which are considered the electrophile.
  • decomposition reactions with the organofluorine compound such as a nucleophilic substitution of the fluoroketone's carbonyl group, are efficiently prevented and the integrity of the insulation gas and thus also its insulation and arc extinction performance is maintained, which further contributes to a long service lifetime and a low maintenance of the apparatus.
  • decomposition products are according to this aspect of the present invention reduced or even eliminated. This is of particular relevance in the case where one potential decomposition product is hydrogen fluoride (HF), which is highly corrosive and extremely toxic.
  • HF hydrogen fluoride
  • decomposition products being reduced or eliminated are further emphasized by the fact that some decomposition products might open reaction pathways which are closed for the organofluorine compound on which they are based. This is for example the case for copper which has the potential to react with a decomposition product of C5K, but not with C5K itself. Such secondary reactions are efficiently reduced or even eliminated by the present invention.
  • At least some of the components are made of or comprise a material selected from the group consisting of: a polymeric material, a metal, a metal alloy, a ceramic, a composite thereof, mixtures thereof, combinations thereof; in particular a polymeric material (including a polymeric material contained in a composite material).
  • a polymeric material including a polymeric material contained in a composite material.
  • the polymeric material is selected from the group consisting of silicones, polyolefins, polyethers, polyesters, polyurethanes, polyepoxides, polyamides, polyimides, polyketones and polysulfones, as well as mixtures thereof.
  • plasticizer contained in the polymeric material has a molecular weight higher than 450 g/mol. The reason is that it has been found that a plasticizer of this molecular weight does not exude (or "sweat") out of the material when exposed to an organofluorine-containing insulation gas, whereas exudation might occur, if the plasticizer had a lower molecular weight.
  • plasticizer having a molecular weight above the threshold molecular weight of 450 g/mol disclosed herein is in clear distinction to the amounts of plasticizers used in commercially available sealing components comprising a plasticizer having a low molecular weight, i.e. lower than 450 g/mol.-%.
  • the polymeric material further contains a filler, e.g. for providing the required mechanical properties to the material.
  • the polymeric material contains at least one functionalized and/or unfunctionalized metal oxide, and/or the polymeric material contains at least one functionalized and/or unfunctionalized metal hydroxide.
  • At least a portion, in particular all, of the metal oxide and/or metal hydroxide contained in the polymeric material is unfunctionalized, the amount of unfunctionalized metal oxide and/or metal hydroxide being equal to or less than 5 wt.-%, preferably is 4 wt.-% or less, more preferably is 2 wt.-% or less, and even more preferably is less than 1 wt.-%, and most preferably is approximately 0 wt-%.
  • metal oxide and metal hydroxide are in the context of the present invention, and in particular of the above embodiment, to be understood as metal compounds having a free oxide group or a free hydroxide group, respectively. They are, however, not to be interpreted as encompassing compounds, the oxide or hydroxide group of which is functionalized or blocked, unless explicitly stated to be so.
  • the above embodiment relating to "the amount of metal oxide and/or metal hydroxide” thus particularly relates to the amount of metal compounds having a free oxide group or a free hydroxide group, respectively, i.e. to unfunctionalized metal oxide and/or unfunctionalized hydroxide.
  • a polymeric material which requires an amount of filler higher than the upper limits given for the above mentioned embodiments, it is preferred that at least the portion of the filler exceeding the respective upper limit is substituted by a filler being devoid of an oxide or a hydroxide group and/or is functionalized in a manner such that they are devoid of a free oxide or hydroxide group, respectively.
  • a filler being devoid of an oxide or a hydroxide group carbon black can for example be used.
  • the polymeric material contains a filler based on a metal oxide and/or metal hydroxide, wherein at least a portion, in particular all, of the metal oxide and/or metal hydroxide is functionalized.
  • the term “functionalization” or “functionalized” relates to a treatment by which a property of a first chemical entity is altered.
  • the term “functionalization” or “functionalized” relates to the reaction of a first chemical entity with another chemical entity whereby the reactivity of the first chemical entity is altered.
  • the first chemical entity can e.g. be a reactive group, such as a nucleophilic group. Specifically, it can be the oxide group of a metal oxide or the hydroxide group of a metal hydroxide, respectively.
  • the term “functionalization” or “functionalized” relates to the blocking of a first reactive group, whereby the first reactive group is rendered chemically inert, i.e. unreactive towards any other component present in the respective system.
  • Functionalization can for example be achieved by halogenation, in particular fluorination, or by alkylation with an alkyl group or a fluoroalkyl group.
  • At least a portion of the surface of the component is hydrophobic. More particularly, at least a portion of the surface of the component has a contact angle of more than 90° when contacted with water. Due to its hydrophobicity, the component's surface is essentially free of water; reactions, which might otherwise occur on the solid-gas interface when water is bound to it, are thus efficiently reduced or even prevented.
  • the surface of a component (be it made of a polymeric material as described above or of a metal or a metal alloy or a ceramic) has exposed nucleophilic groups, at least some of the nucleophilic groups shall be functionalized.
  • functionalization can for example be achieved by halogenation, in particular fluorination, or by alkylation with an alkyl group or a fluoroalkyl group.
  • the surface treatment can be a chemical treatment, a plasma treatment and/or a chemical vapour deposition, in particular a plasma-enhanced chemical vapour deposition.
  • the insulation medium comprises a fluoroketone containing from four to twelve carbon atoms, preferably containing exactly five carbon atoms or exactly six carbon atoms or mixtures thereof.
  • the advantages achieved by the present invention are particularly pronounced when the insulation medium comprises a fluoroketone as defined above, since any problem, which might otherwise arise from the ketone group being subject to nucleophilic substitution, can be avoided.
  • fluoroketone as used in this application shall be interpreted broadly and shall encompass both perfluoroketones and hydrofluoroketones, and shall further encompass both saturated compounds and unsaturated compounds, i.e. compounds including double and/or triple bonds between carbon atoms.
  • the at least partially fluorinated alkyl chain of the fluoroketones can be linear or branched, or can form a ring, which optionally is substituted by one or more alkyl groups.
  • the fluoroketone is a perfluoroketone.
  • the fluoroketone has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain.
  • the fluoroketone is a fully saturated compound.
  • the insulation medium comprises a fluoroketone containing exactly five carbon atoms or exactly six carbon atoms or mixtures thereof.
  • fluoroketones containing five or six carbon atoms have the advantage of a relatively low boiling point. Thus, problems which might go along with liquefaction can be avoided, even when the apparatus is used at low temperatures.
  • the fluoroketone is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom:
  • Fluoroketones containing five or more carbon atoms are further advantageous, because they are generally non-toxic with outstanding margins for human safety. This is in contrast to fluoroketones having less than four carbon atoms, such as hexafluoroacetone (or hexafluoropropanone), which are toxic and very reactive.
  • fluoroketones containing exactly five carbon atoms herein briefly named C5K
  • fluoroketones containing exactly six carbon atoms are thermally stable up to 500°C.
  • the fluoroketones, in particular C5K), having a branched alkyl chain are preferred, because their boiling points are lower than the boiling points of the corresponding compounds (i.e. compounds with same molecular formula) having a straight alkyl chain.
  • the C5K is a perfluoroketone, in particular has the molecular formula C 5 F 10 O, i.e. is fully saturated without double or triple bonds between carbon atoms.
  • the fluoroketone a) may more preferably be selected from the group consisting of 1,1,1,3,4,4,4-heptafluoro-3-(trifluoromethyl)butan-2-one (also named decafluoro-2-methylbutan-3-one), 1,1,1,3,3,4,4,5,5,5-decafluoropentan-2-one, 1,1,1,2,2,4,4,5,5,5-decafluoropentan-3-one and octafluorocylcopentanone, and most preferably is 1,1,1,3,4,4,4-heptafluoro-3-(trifluoromethyl)butan-2-one.
  • 1,1,1,3,4,4,4-heptafluoro-3-(trifluoromethyl)butan-2-one can be represented by the following structural formula (I): 1,1,1,3,4,4,4-heptafluoro-3-(trifluoromethyl)butan-2-one with molecular formula CF 3 C(O)CF(CF 3 ) 2 or C 5 F 10 O, has been found to be particularly preferred for high and medium voltage insulation applications, because it has the advantages of high dielectric insulation performance, in particular in mixtures with a dielectric carrier gas, has very low GWP and has a low boiling point. It has an ODP of 0 and is practically non-toxic.
  • even higher insulation capabilities can be achieved by combining the mixture of different fluoroketone components.
  • a fluoroketone containing exactly five carbon atoms, as described above and here briefly called C5K, and a fluoroketone containing exactly six carbon atoms or exactly seven carbon atoms, here briefly named fluoroketone c) can favourably be part of the dielectric insulation at the same time.
  • an insulation medium can be achieved having more than one fluoroketone, each contributing by itself to the dielectric strength of the insulation medium.
  • the further fluoroketone c) is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom: and as well as any fluoroketone having exactly 6 carbon atoms, in which the at least partially fluorinated alkyl chain of the fluoroketone forms a ring, which is substituted by one or more alkyl groups (IIh); and/or is at least one compound selected from the group consisting of the compounds defined by the following structural formulae in which at least one hydrogen atom is substituted with a fluorine atom: and in particular dodecafluoro-cycloheptanone, as well as any fluoroketone having exactly 7 carbon atoms, in which the at least partially fluorinated alkyl chain of the fluoroketone forms a ring, which is substituted by one or more alkyl groups (IIIo).
  • the present invention encompasses each compound or each combination of compounds selected from the group consisting of the compounds according to structural formulae (Ia) to (Ii), (IIa) to (IIh), (IIIa) to (IIIo), and mixtures thereof.
  • fluoroketone c a fluoroketone containing exactly six carbon atoms (falling under the designation "fluoroketone c)" mentioned above) may be preferred; such a fluoroketone is non-toxic, with outstanding margins for human safety.
  • fluoroketone c alike C5K, is a perfluoroketone, and/or has a branched alkyl chain, in particular an at least partially fluorinated alkyl chain, and/or the fluoroketone c) contains fully saturated compounds.
  • the fluoroketone c) has the molecular formula C 6 F 12 O, i.e. is fully saturated without double or triple bonds between carbon atoms.
  • the fluoroketone c) can be selected from the group consisting of 1,1,1,2,4,4,5,5,5-nonafluoro-2-(trifluoromethyl)pentan-3-one (also named dodecafluoro-2-methylpentan-3-one), 1,1,1,3,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)pentan-2-one (also named dodecafluoro-4-methylpentan-2-one), 1,1,1,3,4,4,5,5,5-nonafluoro-3-(trifluoromethyl)pentan-2-one (also named dodecafluoro-3-methylpentan-2-one), 1,1,1,4,4,4-hexafluoro-3,3-bis-(trifluoromethyl)butan-2-one (also named dodecafluoro-3,3-(dimethyl)butan-2-one), dodecafluorohexan-2-one, dodecafluorohexan-3-one and deca
  • 1,1,1,2,4,4,5,5,5-Nonafluoro-2-(trifluoromethyl)pentan-3-one can be represented by the following structural formula (II): 1,1,1,2,4,4,5,5,5-Nonafluoro-4-(trifluoromethyl)pentan-3-one (here briefly called "C6-ketone", with molecular formula C 2 F 5 C(O)CF(CF 3 ) 2 ) has been found to be particularly preferred for high voltage insulation applications because of its high insulating properties and its extremely low GWP.
  • the insulation medium preferably comprises a hydrofluoromonoether containing at least three carbon atoms.
  • the organofluorine compound can also be a fluoroolefin, in particular a hydrofluoroolefin. More particularly, the fluoroolefin or hydrofluorolefin, respectively, contains exactly three carbon atoms.
  • the ratio of the amount of carbon dioxide to the amount of oxygen ranges from 80:20 to 95:5, more preferably from 85:15 to 92:8, even more preferably from 87:13 to less than 90:10, and in particular is about 89:11.
  • oxygen being present in a molar fraction of at least 5% allows soot formation to be prevented even after repeated current interruption events with high current arcing.
  • oxygen being present in a molar fraction of at most 20% (i.e. of 20% or less), more particularly of at most 15% (i.e. of 15% or less) reduces the risk of degradation of the material of the electrical apparatus by oxidation.
  • This technique uses a humidity sensing material, the dielectric constant of which changes in relation to the water (humidity) content present.
  • the preferred features specified for the component in the context of the apparatus likewise relates to this capacitive humidity sensing material.
  • a polymeric material is used as a (capacitive) humidity sensing material, it preferably contains less than 10 wt.-% plasticizer and/or contains a plasticizer having a molecular weight higher than 450 g/mol.
  • a metal oxide such as e.g. Al 2 O 3 , can be used as a humidity sensing material.

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Insulating Materials (AREA)

Claims (23)

  1. Appareil pour la production, la distribution et/ou l'utilisation d'énergie électrique, ledit appareil comprenant un boîtier renfermant un espace isolant et une partie électriquement conductrice disposée dans l'espace isolant, ledit espace isolant contenant un milieu isolant diélectrique dont au moins une partie est sous la forme d'un gaz isolant comprenant un composé organofluoré, dans lequel au moins certains des composants de l'appareil qui sont directement exposés au gaz isolant sont faits d'un matériau qui reste inchangé pendant une exposition au gaz isolant pendant une période de plus de 5 ans dans les conditions de fonctionnement et ont une surface dont au moins une partie est dépourvue de tout groupe nucléophile réactif vis-à-vis du composé organofluoré et/ou réactif vis-à-vis de tout produit de dégradation du composé organofluoré dans les conditions de fonctionnement, dans lequel tout composé contenu sur la surface du composant et formant une partie intégrante du matériau et/ou tout composé lié à la surface est ou sont dépourvu(s) de tout groupe nucléophile, et le groupe nucléophile se rapporte à tout groupe chimique capable de donner dans une réaction chimique une paire d'électrons à un électrophile, l'électrophile étant le composé organofluoré ou son/ses produit(s) de dégradation et le composé organofluoré étant choisi dans le groupe constitué par : fluoroéthers, fluorocétones, fluorooléfines, fluoronitriles et leurs mélanges, dans lequel au moins certains des composants sont constitués d'un matériau polymérique ou comprennent un tel matériau, la quantité totale de composés organiques volatils ayant un point d'ébullition inférieur à 400 °C dans le matériau polymérique étant inférieure à 1 % en poids par rapport au poids total du matériau polymérique.
  2. Appareil selon l'une quelconque des revendications précédentes, dans lequel au moins certains des composants sont faits de ou comprennent un matériau polymérique choisi dans le groupe constitué par les silicones, les polyoléfines, les polyéthers, les polyesters, les polyuréthanes, les polyépoxydes, les polyamides, les polyimides, les polycétones, les polysulfones, ainsi que leurs mélanges.
  3. Appareil selon l'une quelconque des revendications précédentes, dans lequel la quantité de plastifiant contenue dans le matériau polymérique est inférieure à 10 % en poids, de préférence inférieure à 8 % en poids, plus préférablement inférieure à 6 % en poids, et le plus préférablement inférieure à 4 % en poids, sur la base du poids total du matériau polymérique, ou dans lequel le plastifiant contenu dans le matériau polymérique a un poids moléculaire supérieur à 450 g/mole.
  4. Appareil selon l'une quelconque des revendications précédentes, dans lequel la quantité totale de composés organiques volatils ayant un point d'ébullition inférieur à 260 °C dans le matériau polymérique est inférieure à 1 % en poids sur la base du poids total du matériau polymérique.
  5. Appareil selon l'une quelconque des revendications précédentes, dans lequel le matériau polymérique contient au moins un composé choisi dans le groupe constitué par : oxyde métallique fonctionnalisé, oxyde métallique non fonctionnalisé, hydroxyde métallique fonctionnalisé, hydroxyde métallique non fonctionnalisé, ou toute combinaison de ceux-ci.
  6. Appareil selon la revendication 5, dans lequel au moins une partie de l'oxyde métallique et/ou de l'hydroxyde métallique contenus dans le matériau polymérique est non fonctionnalisée, la quantité d'oxyde métallique et/ou d'hydroxyde métallique non fonctionnalisé étant égale ou inférieure à 5 % en poids, de préférence est égale ou inférieure à 4 % en poids, plus préférablement est égale ou inférieure à 2 % en poids, et de manière encore plus préférée est inférieure à 1 % en poids, et le plus préférablement est environ 0 % en poids.
  7. Appareil selon la revendication 5 ou 6, dans lequel la quantité d'oxyde métallique et/ou d'hydroxyde métallique contenue dans le matériau polymérique est égale ou inférieure à 5 % en poids, de préférence est égale ou inférieure à 4 % en poids, plus préférablement est égale ou inférieure à 2 % en poids, et encore plus préférablement est inférieure à 1 % en poids, et le plus préférablement est d'environ 0 % en poids.
  8. Appareil selon l'une quelconque des revendications précédentes, dans lequel le matériau polymérique contient une charge à base d'un oxyde métallique et/ou d'un hydroxyde métallique, dans lequel la totalité de l'oxyde métallique et/ou de l'hydroxyde métallique est fonctionnalisée.
  9. Appareil selon l'une quelconque des revendications précédentes, dans lequel au moins une partie de la surface du composant est hydrophobe, et/ou dans lequel au moins une partie de la surface du composant a un angle de contact supérieur à 90° lorsqu'elle est mise en contact avec de l'eau.
  10. Appareil selon l'une quelconque des revendications précédentes, dans lequel le composant est choisi dans le groupe constitué par : un composé de revêtement, en particulier une peinture ou une résine, un composé d'étanchéité, un adhésif, un composé isolant, un composé lubrifiant, en particulier une graisse, un matériau de détection d'humidité, ainsi que des combinaisons de ceux-ci.
  11. Appareil selon l'une quelconque des revendications précédentes, dans lequel le composé organofluoré est choisi dans le groupe constitué par : hydrofluoromonoéthers, perfluorocétones, hydrofluorooléfines, perfluoronitriles et leurs mélanges ; et/ou dans lequel le milieu isolant comprend de l'air ou au moins un composant de l'air, en particulier choisi dans le groupe constitué par l'oxygène (O2), l'azote (N2), le dioxyde de carbone (CO2), et des mélanges de ceux-ci.
  12. Appareil selon l'une quelconque des revendications précédentes, dans lequel le milieu isolant comprend une fluorocétone contenant de quatre à douze atomes de carbone, de préférence contenant exactement cinq atomes de carbone ou exactement six atomes de carbone ou des mélanges de ceux-ci, et/ou dans lequel le milieu isolant comprend un hydrofluoromonoéther comprenant au moins trois atomes de carbone.
  13. Appareil selon la revendication 11, dans lequel le milieu isolant comprend du dioxyde de carbone et de l'oxygène, et le rapport de la quantité de dioxyde de carbone sur la quantité d'oxygène est dans la plage de 50:50 à 100:1, de préférence de 80:20 à 95:5, plus préférablement de 85:15 à 92:8, de manière encore plus préférée de 87:13 à moins de 90:10, et en particulier est d'environ 89:11.
  14. Appareil selon l'une quelconque des revendications précédentes, dans lequel l'appareil, en particulier un appareil isolé au gaz, fait partie d'un(e) ou est un(e) : appareil haute tension, appareil moyenne tension, appareil basse tension, appareil à courant continu, appareillage de commutation, pièce ou composant d'appareillage de commutation isolé par air, appareillage de commutation encapsulés dans des métaux à isolation gazeuse (SIG), pièce ou composant de dispositif de commutation à isolation gazeuse à enveloppe métallique, ligne de transmission à isolation gazeuse (GIL), barre de distribution, douille, câble à isolation gazeuse, joint de câbles, transformateur de courant, transformateur de tension, capteur, capteur d'humidité, limiteur de surtension, condensateur, inductance, résistance, limiteur de courant, interrupteur haute tension, interrupteur de mise à la terre, disjoncteur, sectionneur combiné et interrupteur de mise à la terre, interrupteur de coupure de charge, disjoncteur, disjoncteur à gaz, disjoncteur à vide isolé au gaz, disjoncteur du générateur, interrupteur moyenne tension, unité principale annulaire, réenclencheur, sectionneur, interrupteur basse tension, tout type de commutateur à isolation gazeuse, transformateur, transformateur de distribution, transformateur de puissance, changeur de prise, douille de transformateur, machine électrique rotative, générateur, moteur, entraînement, dispositif semi-conducteur, dispositif semi-conducteur de puissance, convertisseur de puissance, station de conversion, bâtiment convertisseur ; et des composants et/ou des combinaisons de tels dispositifs.
  15. Appareil selon l'une quelconque des revendications précédentes, dans lequel au moins certains des composants de l'appareil qui sont directement exposés au gaz isolant sont faits d'un matériau qui reste inchangé pendant l'exposition au gaz isolant pendant une période de plus de 10 ans dans des conditions de fonctionnement de l'appareil.
  16. Composant conçu pour être monté dans un appareil selon l'une quelconque des revendications 1 à 15, dans lequel le composant doit être directement exposé au milieu isolant, en particulier au fluide isolant, le composant étant constitué d'un matériau qui, lors d'une exposition à un gaz isolant constitué d'un composé organofluoré pendant une période de plus de 5 ans dans des conditions de fonctionnement, reste inchangé, et dont la surface est dépourvue, en partie au moins, de tout groupe nucléophile réactif vis-à-vis du composé organofluoré et/ou réactif vis-à-vis de tout produit de dégradation du composé organofluoré dans les conditions de fonctionnement de l'appareil dans lequel il doit être monté, tout composé contenu sur la surface du composant et faisant partie intégrante du matériau et/ou tout composé lié à la surface étant dépourvu de tout groupe nucléophile, et le groupe nucléophile désignant tout groupe chimique capable de donner dans une réaction chimique une paire d'électrons à un électrophile, l'électrophile étant le composé organofluoré ou son ou ses produit(s) de dégradation et le composé organofluoré étant choisi dans le groupe constitué par : fluoroéthers, fluorocétones, fluorooléfines, fluoronitriles et leurs mélanges, dans lequel le composant est constitué de ou comprend un matériau polymérique choisi dans le groupe constitué par les silicones, les polyoléfines, les polyéthers, les polyesters, les polyuréthanes, les polyépoxydes, les polyamides, les polyimides, les polycétones, les polysulfones, ainsi que des mélanges de ceux-ci, dans lequel la quantité totale de composés organiques volatils ayant un point d'ébullition inférieur à 400 °C dans le matériau polymérique est inférieure à 1 % en poids par rapport au poids total du matériau polymérique.
  17. Composant selon la revendication 16, dans lequel la quantité de plastifiant contenue dans le matériau polymérique est inférieure à 10 % en poids, de préférence inférieure à 8 % en poids, plus préférablement inférieure à 6 % en poids, et le plus préférablement inférieure à 4 % en poids, par rapport au poids total du matériau polymérique, ou dans lequel le plastifiant contenu dans le matériau polymérique a un poids moléculaire supérieur à 450 g/mole.
  18. Composant selon l'une quelconque des revendications 16 à 17, dans lequel la quantité totale de composés organiques volatils ayant un point d'ébullition inférieur à 260 °C dans le matériau polymérique est inférieure à 1 % en poids par rapport au poids total du matériau polymérique.
  19. Composant selon l'une quelconque des revendications 16 à 18, dans lequel la quantité d'oxyde métallique et/ou d'hydroxyde métallique contenue dans le matériau polymérique est égale ou inférieure à 5 % en poids, de préférence est égale ou inférieure à 4 % en poids, plus préférablement est égale ou inférieure à 2 % en poids, et de manière encore plus préférée est inférieure à 1 % en poids, et le plus préférablement est d'environ 0 % en poids.
  20. Composant selon l'une quelconque des revendications 16 à 19, dans lequel au moins une partie de la surface du composant est hydrophobe, et/ou dans lequel au moins une partie de la surface du composant a un angle de contact supérieur à 90° lorsqu'elle est mise en contact avec de l'eau.
  21. Composant selon l'une quelconque des revendications 16 à 20, dans lequel le composant est choisi dans le groupe constitué par : un composé de revêtement, en particulier une peinture ou une résine, un composé d'étanchéité, un adhésif, un composé isolant, un composé lubrifiant, en particulier une graisse et un matériau de détection d'humidité, ainsi que des combinaisons de ceux-ci.
  22. Procédé de préparation d'un appareil selon l'une quelconque des revendications 1 à 15 ou de préparation d'un composant selon l'une quelconque des revendications 16 à 21, le composant étant constitué de ou comprenant un matériau polymérique contenant une charge à base d'un oxyde métallique et/ou d'un hydroxyde métallique, dans lequel, avant le mélange du matériau polymérique, l'oxyde métallique ou l'hydroxyde métallique, respectivement, est fonctionnalisé de telle sorte que le groupe oxyde de l'oxyde métallique et/ou le groupe hydroxyde de l'hydroxyde métallique soient rendus chimiquement inerte.
  23. Procédé de préparation d'un appareil selon l'une quelconque des revendications 1 à 15 ou de préparation d'un composant selon l'une quelconque des revendications 16 à 21, le composant étant constitué d'un matériau polymérique ou comprenant un matériau polymérique, dans lequel au moins une partie, en particulier la totalité, des groupes nucléophiles exposés d'une surface du composant sont fonctionnalisés, en particulier dans lequel la fonctionnalisation est effectuée par traitement chimique, par exemple, par halogénation ou fluoration ou alkylation par un groupe alkyle ou un groupe fluoroalkyle, par traitement par plasma et/ou par dépôt chimique en phase vapeur, notamment par dépôt chimique en phase vapeur assisté par plasma.
EP14781510.4A 2013-10-07 2014-10-03 Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil Active EP3055867B1 (fr)

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EP14781510.4A EP3055867B1 (fr) 2013-10-07 2014-10-03 Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP2013070843 2013-10-07
PCT/EP2014/071274 WO2015052100A1 (fr) 2013-10-07 2014-10-03 Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil
EP14781510.4A EP3055867B1 (fr) 2013-10-07 2014-10-03 Appareil permettant la production, la distribution et/ou l'usage de l'énergie électrique et composant pour un tel appareil

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EP3055867A1 EP3055867A1 (fr) 2016-08-17
EP3055867B1 true EP3055867B1 (fr) 2025-03-19

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