EP2768920A4 - Non-amine post-cmp composition and method of use - Google Patents

Non-amine post-cmp composition and method of use

Info

Publication number: EP2768920A4
Authority: EP; European Patent Office
Prior art keywords: cmp composition; amine post; amine; post; cmp
Prior art date: 2011-10-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP11874382.2A

Other languages

German (de)

French (fr)

Other versions

EP2768920A1 (en

Inventor

Jeffrey A Barnes

Jun Liu

Peng Zhang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Entegris Inc

Original Assignee

Advanced Technology Materials Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-10-21

Filing date

2011-10-21

Publication date

2015-06-03

2011-10-21 Application filed by Advanced Technology Materials Inc filed Critical Advanced Technology Materials Inc

2014-08-27 Publication of EP2768920A1 publication Critical patent/EP2768920A1/en

2015-06-03 Publication of EP2768920A4 publication Critical patent/EP2768920A4/en

Status Withdrawn legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3454—Organic compounds containing sulfur containing sulfone groups, e.g. vinyl sulfones
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Oil, Petroleum & Natural Gas (AREA)
Wood Science & Technology (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Inorganic Chemistry (AREA)
Health & Medical Sciences (AREA)
Emergency Medicine (AREA)
Cleaning Or Drying Semiconductors (AREA)
Detergent Compositions (AREA)

EP11874382.2A 2011-10-21 2011-10-21 Non-amine post-cmp composition and method of use Withdrawn EP2768920A4 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2011/057287 WO2013058770A1 (en)	2011-10-21	2011-10-21	Non-amine post-cmp composition and method of use

Publications (2)

Publication Number	Publication Date
EP2768920A1 EP2768920A1 (en)	2014-08-27
EP2768920A4 true EP2768920A4 (en)	2015-06-03

Family

ID=48141217

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP11874382.2A Withdrawn EP2768920A4 (en)	2011-10-21	2011-10-21	Non-amine post-cmp composition and method of use

Country Status (4)

Country	Link
EP (1)	EP2768920A4 (en)
KR (1)	KR101914817B1 (en)
CN (2)	CN105869997A (en)
WO (1)	WO2013058770A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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WO2014089196A1 (en)	2012-12-05	2014-06-12	Advanced Technology Materials, Inc.	Compositions for cleaning iii-v semiconductor materials and methods of using same
WO2014138064A1 (en)	2013-03-04	2014-09-12	Advanced Technology Materials, Inc.	Compositions and methods for selectively etching titanium nitride
JP6723152B2 (en)	2013-06-06	2020-07-15	インテグリス・インコーポレーテッド	Compositions and methods for selectively etching titanium nitride
US10138117B2 (en)	2013-07-31	2018-11-27	Entegris, Inc.	Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility
WO2015031620A1 (en)	2013-08-30	2015-03-05	Advanced Technology Materials, Inc.	Compositions and methods for selectively etching titanium nitride
EP3060642B1 (en)	2013-10-21	2019-11-06	FujiFilm Electronic Materials USA, Inc.	Cleaning formulations for removing residues on surfaces
KR102134577B1 (en) *	2013-11-12	2020-07-16	주식회사 동진쎄미켐	Composition for post cmp cleaning
US9562211B2 (en)	2013-12-06	2017-02-07	Fujifilm Electronic Materials U.S.A., Inc.	Cleaning formulation for removing residues on surfaces
WO2015095175A1 (en)	2013-12-16	2015-06-25	Advanced Technology Materials, Inc.	Ni:nige:ge selective etch formulations and method of using same
TWI662379B (en)	2013-12-20	2019-06-11	美商恩特葛瑞斯股份有限公司	Use of non-oxidizing strong acids for the removal of ion-implanted resist
US10475658B2 (en)	2013-12-31	2019-11-12	Entegris, Inc.	Formulations to selectively etch silicon and germanium
TWI659098B (en)	2014-01-29	2019-05-11	美商恩特葛瑞斯股份有限公司	Post chemical mechanical polishing formulations and method of use
WO2015119925A1 (en)	2014-02-05	2015-08-13	Advanced Technology Materials, Inc.	Non-amine post-cmp compositions and method of use
IL277275B2 (en)	2018-03-28	2023-11-01	Fujifilm Electronic Mat Usa Inc	Cleaning compositions
CN115612573B (en) *	2022-09-05	2023-10-13	圣戈班汇杰(杭州)新材料有限公司	Adhesive removing agent formula for curing silicone adhesive and application method of adhesive removing agent formula

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US20050245411A1 (en) *	2004-05-03	2005-11-03	Bo Yang	Methods and composition for cleaning and passivating fuel cell systems
WO2007047365A2 (en) *	2005-10-13	2007-04-26	Advanced Technology Materials, Inc.	Metals compatible photoresist and/or sacrificial antireflective coating removal composition
WO2008039730A1 (en) *	2006-09-25	2008-04-03	Advanced Technology Materials, Inc.	Compositions and methods for the removal of photoresist for a wafer rework application

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PL207297B1 (en) *	2002-06-07	2010-11-30	Mallinckrodt Baker Inc	Microelectronic cleaning and arc remover compositions
CN101366107B (en) *	2005-10-05	2011-08-24	高级技术材料公司	Aqueous Oxygen Cleaner for Removal of Post-Etch Residues
US20070225186A1 (en) *	2006-03-27	2007-09-27	Matthew Fisher	Alkaline solutions for post CMP cleaning processes
JP2009069505A (en)	2007-09-13	2009-04-02	Tosoh Corp	Resist removing cleaning solution and cleaning method
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2011
- 2011-10-21 CN CN201610274374.1A patent/CN105869997A/en active Pending
- 2011-10-21 WO PCT/US2011/057287 patent/WO2013058770A1/en not_active Ceased
- 2011-10-21 CN CN201180075099.6A patent/CN103958640B/en active Active
- 2011-10-21 EP EP11874382.2A patent/EP2768920A4/en not_active Withdrawn
- 2011-10-21 KR KR1020147013154A patent/KR101914817B1/en not_active Expired - Fee Related

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WO2007047365A2 (en) *	2005-10-13	2007-04-26	Advanced Technology Materials, Inc.	Metals compatible photoresist and/or sacrificial antireflective coating removal composition
WO2008039730A1 (en) *	2006-09-25	2008-04-03	Advanced Technology Materials, Inc.	Compositions and methods for the removal of photoresist for a wafer rework application

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Also Published As

Publication number	Publication date
WO2013058770A1 (en)	2013-04-25
KR20140082816A (en)	2014-07-02
KR101914817B1 (en)	2018-12-28
CN105869997A (en)	2016-08-17
CN103958640B (en)	2016-05-18
CN103958640A (en)	2014-07-30
EP2768920A1 (en)	2014-08-27

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EP2768920A4 (en)	2015-06-03	Non-amine post-cmp composition and method of use
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SG2014010706A (en)	2014-05-29	Method and composition
GB201016001D0 (en)	2010-11-10	Composition and method
SG2014012306A (en)	2014-05-29	Etching liquid composition and etching method
EP2663635A4 (en)	2016-02-17	Microbial compositions and methods
GB201122195D0 (en)	2012-02-01	Composition and method
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GB2503842B (en)	2014-10-08	Composition and method of manufacture
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HUE041627T2 (en)	2019-05-28	Cleaning compositions and methods
EP2693459A4 (en)	2015-04-22	Polishing composition and polishing method
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Legal Events

Date	Code	Title	Description
2014-07-25	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2014-08-27	17P	Request for examination filed	Effective date: 20140513
2014-08-27	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-01-28	DAX	Request for extension of the european patent (deleted)
2015-06-03	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20150508
2015-06-03	RIC1	Information provided on ipc code assigned before grant	Ipc: C11D 3/43 20060101ALI20150430BHEP Ipc: C11D 7/50 20060101ALI20150430BHEP Ipc: C11D 3/04 20060101ALI20150430BHEP Ipc: C11D 3/20 20060101ALN20150430BHEP Ipc: C11D 7/26 20060101ALN20150430BHEP Ipc: C11D 7/34 20060101ALN20150430BHEP Ipc: C11D 3/34 20060101ALN20150430BHEP Ipc: H01L 21/02 20060101AFI20150430BHEP Ipc: C11D 7/06 20060101ALI20150430BHEP
2015-07-01	RAP1	Party data changed (applicant data changed or rights of an application transferred)	Owner name: ENTEGRIS INC.
2017-01-04	17Q	First examination report despatched	Effective date: 20161206
2018-07-12	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2018-08-08	INTG	Intention to grant announced	Effective date: 20180713
2018-08-08	RIC1	Information provided on ipc code assigned before grant	Ipc: C11D 7/06 20060101ALI20180703BHEP Ipc: C11D 3/04 20060101ALI20180703BHEP Ipc: C11D 3/43 20060101ALI20180703BHEP Ipc: C11D 7/34 20060101ALN20180703BHEP Ipc: C11D 7/50 20060101ALI20180703BHEP Ipc: C11D 3/20 20060101ALN20180703BHEP Ipc: C11D 3/34 20060101ALN20180703BHEP Ipc: H01L 21/02 20060101AFI20180703BHEP Ipc: C11D 7/26 20060101ALN20180703BHEP
2019-05-03	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2019-06-05	18D	Application deemed to be withdrawn	Effective date: 20181124