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EP2766130A4 - Appareil et procédé de dépôt d'une fine couche de réserve sur un substrat - Google Patents

Appareil et procédé de dépôt d'une fine couche de réserve sur un substrat

Info

Publication number
EP2766130A4
EP2766130A4 EP12840425.8A EP12840425A EP2766130A4 EP 2766130 A4 EP2766130 A4 EP 2766130A4 EP 12840425 A EP12840425 A EP 12840425A EP 2766130 A4 EP2766130 A4 EP 2766130A4
Authority
EP
European Patent Office
Prior art keywords
resist
depositing
substrate
thin layer
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12840425.8A
Other languages
German (de)
English (en)
Other versions
EP2766130A2 (fr
EP2766130B1 (fr
Inventor
Guy M Danner
Holly G Gates
Vladimir S Tarasov
Peter E Kane
Peter G Madden
Emanuel M Sachs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
1366 Technologies Inc
Original Assignee
1366 Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 1366 Technologies Inc filed Critical 1366 Technologies Inc
Publication of EP2766130A2 publication Critical patent/EP2766130A2/fr
Publication of EP2766130A4 publication Critical patent/EP2766130A4/fr
Application granted granted Critical
Publication of EP2766130B1 publication Critical patent/EP2766130B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/001—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means incorporating means for heating or cooling, e.g. the material to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/005—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means the high voltage supplied to an electrostatic spraying apparatus being adjustable during spraying operation, e.g. for modifying spray width, droplet size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/087—Arrangements of electrodes, e.g. of charging, shielding, collecting electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/0012—Apparatus for achieving spraying before discharge from the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • B05D1/06—Applying particulate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Spray Control Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP12840425.8A 2011-10-12 2012-10-12 Appareil et procédé de dépôt d'une fine couche de résine sur un substrat Active EP2766130B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161546384P 2011-10-12 2011-10-12
PCT/US2012/059967 WO2013056059A2 (fr) 2011-10-12 2012-10-12 Appareil et procédé de dépôt d'une fine couche de réserve sur un substrat

Publications (3)

Publication Number Publication Date
EP2766130A2 EP2766130A2 (fr) 2014-08-20
EP2766130A4 true EP2766130A4 (fr) 2015-09-16
EP2766130B1 EP2766130B1 (fr) 2020-07-08

Family

ID=48082755

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12840425.8A Active EP2766130B1 (fr) 2011-10-12 2012-10-12 Appareil et procédé de dépôt d'une fine couche de résine sur un substrat

Country Status (8)

Country Link
US (1) US9815072B2 (fr)
EP (1) EP2766130B1 (fr)
JP (1) JP6415323B2 (fr)
KR (1) KR20140089373A (fr)
CN (1) CN104220638B (fr)
MY (1) MY185093A (fr)
TW (1) TWI607809B (fr)
WO (1) WO2013056059A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015100579A1 (de) * 2015-01-15 2016-07-21 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten
CA2899255A1 (fr) * 2015-07-31 2017-01-31 National Research Council Of Canada Appareil et methode de depot par aerosol de nanoparticules sur un substrat
JP6807045B2 (ja) * 2015-09-07 2021-01-06 大日本印刷株式会社 インプリント装置及びインプリント方法
CN105118934B (zh) * 2015-09-17 2017-03-15 京东方科技集团股份有限公司 不平坦粒子层制备方法、有机电致发光器件和显示装置
CN107399715B (zh) * 2016-05-20 2019-10-15 清华大学 一种带电纳米微粒的制备装置及制备方法
CN108837962B (zh) * 2018-07-13 2024-02-13 金华职业技术学院 一种有机分子的真空沉积装置
CN109295451B (zh) * 2018-10-12 2021-04-09 哈尔滨工业大学 等离子体辅助气溶胶沉积成膜方法及气溶胶沉积装置
JP7452556B2 (ja) * 2020-01-21 2024-03-19 株式会社ニコン ミスト成膜装置及びミスト成膜方法
IT202000004678A1 (it) * 2020-03-05 2021-09-05 Milano Politecnico Sistema per la deposizione di microparticelle
KR102620937B1 (ko) * 2021-11-29 2024-01-05 주식회사 프로텍 하이브리드형 스프레이 펌프
CN115015203B (zh) * 2022-06-20 2025-10-10 之江实验室 一种呼出气溶胶微生物快速检测装置
EP4547409A1 (fr) * 2022-06-28 2025-05-07 AM Batteries, Inc. Applicateur pour le revêtement par dépôt électrostatique d'une bande continue en mouvement

Citations (4)

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Publication number Priority date Publication date Assignee Title
US6054395A (en) * 1997-10-24 2000-04-25 Micron Technology, Inc. Method of patterning a semiconductor device
WO2004068916A1 (fr) * 2003-01-31 2004-08-12 Dow Corning Ireland Limited Ensemble a electrodes pour production de plasma
US20070116881A1 (en) * 2005-11-21 2007-05-24 Tokyo Electron Limited Method for forming thin film and film-forming device
US20090104372A1 (en) * 2007-10-17 2009-04-23 Ppg Industries Ohio, Inc. Methods and systems for coating substrates

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CA480631A (fr) 1952-01-29 American Viscose Corporation Procede d'enduisage et article pour usage a cet egard
US3000752A (en) 1957-12-30 1961-09-19 Armco Steel Corp Coating metallic sheet or strip material with powdered annealing separator substances
JPH0785784B2 (ja) 1986-10-07 1995-09-20 ノードソン株式会社 液体超微粒子の塗布方法とその装置
US5138520A (en) * 1988-12-27 1992-08-11 Symetrix Corporation Methods and apparatus for material deposition
JPH07257B2 (ja) 1991-03-14 1995-01-11 日本碍子株式会社 半導体ウエハー保持装置及び半導体製造装置
JPH06343904A (ja) 1993-06-08 1994-12-20 Onoda Cement Co Ltd 静電粉体塗装装置
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CN1225570C (zh) * 2000-10-23 2005-11-02 独立行政法人产业技术综合研究所 复合构成物及其制作方法和制作装置
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US6054395A (en) * 1997-10-24 2000-04-25 Micron Technology, Inc. Method of patterning a semiconductor device
WO2004068916A1 (fr) * 2003-01-31 2004-08-12 Dow Corning Ireland Limited Ensemble a electrodes pour production de plasma
US20070116881A1 (en) * 2005-11-21 2007-05-24 Tokyo Electron Limited Method for forming thin film and film-forming device
US20090104372A1 (en) * 2007-10-17 2009-04-23 Ppg Industries Ohio, Inc. Methods and systems for coating substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013056059A2 *

Also Published As

Publication number Publication date
US9815072B2 (en) 2017-11-14
CN104220638B (zh) 2017-03-22
TWI607809B (zh) 2017-12-11
EP2766130A2 (fr) 2014-08-20
JP6415323B2 (ja) 2018-10-31
HK1204344A1 (en) 2015-11-13
WO2013056059A2 (fr) 2013-04-18
CN104220638A (zh) 2014-12-17
KR20140089373A (ko) 2014-07-14
JP2015502834A (ja) 2015-01-29
TW201321088A (zh) 2013-06-01
EP2766130B1 (fr) 2020-07-08
US20140255615A1 (en) 2014-09-11
MY185093A (en) 2021-04-30
WO2013056059A3 (fr) 2014-06-19

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