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EP2497105A4 - Systèmes et procédés de traitement de couche mince partiellement fondue à impulsions non périodiques - Google Patents

Systèmes et procédés de traitement de couche mince partiellement fondue à impulsions non périodiques

Info

Publication number
EP2497105A4
EP2497105A4 EP10828974.5A EP10828974A EP2497105A4 EP 2497105 A4 EP2497105 A4 EP 2497105A4 EP 10828974 A EP10828974 A EP 10828974A EP 2497105 A4 EP2497105 A4 EP 2497105A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
thin film
film processing
partially fused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10828974.5A
Other languages
German (de)
English (en)
Other versions
EP2497105A1 (fr
Inventor
James S Im
Yikang Deng
Qiongying Hu
Ui-Jin Chung
Alexander B Limanov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Columbia University in the City of New York
Original Assignee
Columbia University in the City of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/776,756 external-priority patent/US8440581B2/en
Application filed by Columbia University in the City of New York filed Critical Columbia University in the City of New York
Priority claimed from PCT/US2010/055106 external-priority patent/WO2011056787A1/fr
Publication of EP2497105A1 publication Critical patent/EP2497105A1/fr
Publication of EP2497105A4 publication Critical patent/EP2497105A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02691Scanning of a beam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0221Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • H10D86/0223Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
    • H10D86/0229Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials characterised by control of the annealing or irradiation parameters

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Recrystallisation Techniques (AREA)
EP10828974.5A 2009-11-03 2010-11-02 Systèmes et procédés de traitement de couche mince partiellement fondue à impulsions non périodiques Withdrawn EP2497105A4 (fr)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US25765009P 2009-11-03 2009-11-03
US25765709P 2009-11-03 2009-11-03
US26408209P 2009-11-24 2009-11-24
US28664309P 2009-12-15 2009-12-15
US29166309P 2009-12-31 2009-12-31
US29148809P 2009-12-31 2009-12-31
US29428810P 2010-01-12 2010-01-12
US2010003356 2010-05-04
US12/776,756 US8440581B2 (en) 2009-11-24 2010-05-10 Systems and methods for non-periodic pulse sequential lateral solidification
PCT/US2010/055106 WO2011056787A1 (fr) 2009-11-03 2010-11-02 Systèmes et procédés de traitement de couche mince partiellement fondue à impulsions non périodiques

Publications (2)

Publication Number Publication Date
EP2497105A1 EP2497105A1 (fr) 2012-09-12
EP2497105A4 true EP2497105A4 (fr) 2013-11-20

Family

ID=46640467

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10828974.5A Withdrawn EP2497105A4 (fr) 2009-11-03 2010-11-02 Systèmes et procédés de traitement de couche mince partiellement fondue à impulsions non périodiques

Country Status (1)

Country Link
EP (1) EP2497105A4 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050059265A1 (en) * 2003-09-16 2005-03-17 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
DE102007025942A1 (de) * 2007-06-04 2008-12-11 Coherent Gmbh Verfahren zur selektiven thermischen Oberflächenbehandlung eines Flächensubstrates
US20090121157A1 (en) * 2007-11-08 2009-05-14 Stephen Moffatt Pulse train annealing method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050059265A1 (en) * 2003-09-16 2005-03-17 The Trustees Of Columbia University In The City Of New York Systems and methods for processing thin films
DE102007025942A1 (de) * 2007-06-04 2008-12-11 Coherent Gmbh Verfahren zur selektiven thermischen Oberflächenbehandlung eines Flächensubstrates
US20090121157A1 (en) * 2007-11-08 2009-05-14 Stephen Moffatt Pulse train annealing method and apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011056787A1 *

Also Published As

Publication number Publication date
EP2497105A1 (fr) 2012-09-12

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120529

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: LIMANOV, ALEXANDER, B.

Inventor name: DENG, YIKANG

Inventor name: HU, QIONGYING

Inventor name: CHUNG, UI-JIN

Inventor name: IM, JAMES, S.

A4 Supplementary search report drawn up and despatched

Effective date: 20131023

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 29/66 20060101ALI20131017BHEP

Ipc: H01L 27/12 20060101ALI20131017BHEP

Ipc: H01L 21/20 20060101AFI20131017BHEP

Ipc: H01L 21/02 20060101ALI20131017BHEP

17Q First examination report despatched

Effective date: 20140908

RIN1 Information on inventor provided before grant (corrected)

Inventor name: IM, JAMES, S.

Inventor name: HU, QIONGYING

Inventor name: DENG, YIKANG

Inventor name: CHUNG, UI-JIN

Inventor name: LIMANOV, ALEXANDER, B.

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150120