[go: up one dir, main page]

EP2488789B1 - Lampe à diodes électroluminescentes - Google Patents

Lampe à diodes électroluminescentes Download PDF

Info

Publication number
EP2488789B1
EP2488789B1 EP10785404.4A EP10785404A EP2488789B1 EP 2488789 B1 EP2488789 B1 EP 2488789B1 EP 10785404 A EP10785404 A EP 10785404A EP 2488789 B1 EP2488789 B1 EP 2488789B1
Authority
EP
European Patent Office
Prior art keywords
led lamp
circuit board
base
lamp according
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10785404.4A
Other languages
German (de)
English (en)
Other versions
EP2488789A2 (fr
Inventor
Thomas Preuschl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Ledvance GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ledvance GmbH filed Critical Ledvance GmbH
Publication of EP2488789A2 publication Critical patent/EP2488789A2/fr
Application granted granted Critical
Publication of EP2488789B1 publication Critical patent/EP2488789B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention is based on LED lamps according to the preamble of patent claim 1.
  • LED lamps which have a circuit board and a socket, which are electrically connected to each other via cable.
  • the cable lines have to be fastened and contacted quite expensive on the circuit board (for example, soldered).
  • LED lamp Another embodiment of an LED lamp is in the document US 6,462,475 discloses having a base with a printed circuit board.
  • the object of the present invention is to provide an LED lamp in which the mounting of an electrical connection of a printed circuit board with a socket is simplified.
  • the plug-in section is accommodated in a recess of the printed circuit board, wherein a through-hole is arranged in the plug-in section.
  • the plug-in sections are characterized by a simple installation.
  • a second end section of the at least one pressfit connector is welded or soldered or clamped to the base. This creates an electrical and mechanical connection of the printed circuit board to the base.
  • the LED lamp their shape corresponds approximately to that of a conventional light bulb.
  • a retrofit lamp is provided which can be screwed into conventional sockets, whereby their efficiency or light output is improved.
  • the first circuit board is approximately circular. This allows the PCB to be fitted with the optimum size in the retrofit lamp.
  • a particularly preferred development of the LED lamp has two pressfit connectors, wherein the second end section of the first pressfit connector is fastened to a lower section of the socket and the second end section of the second pressfit connector is fastened to a lateral peripheral section of the socket.
  • a preferred development has a metal core printed circuit board on which a plurality of LEDs are mounted, and which is connected via two further pressfit connectors to the first circuit board.
  • an electrically insulating potting compound is accommodated in the base. This allows the pressfit connectors extending inside the socket to be electrically insulated from each other.
  • an electrical component is received in the potting compound.
  • the electrical component can be fixed and is thereby electrically insulated against the pressfit connectors and against the base.
  • the electrical component is an electrolytic capacitor or a resistor which is connected to the two Pressfit connectors.
  • the LED lamp has a guide pin formed from the potting compound. This can dive into a recess in the circuit board and serve as a rotation for the circuit board.
  • the LED lamp has a heat sink made of metal or thermally conductive plastic, in which a driver board is received.
  • a driver board is received.
  • the heat sink is approximately rotationally symmetrical, wherein at a first edge, a peripheral edge of a plastic piston is fixed, and wherein at a second edge, a peripheral edge of the base is attached.
  • the heat sink serves as a connecting component between the lamp bulb and the base.
  • FIG. 1 is shown in a perspective side view schematically an LED lamp 1 according to a first embodiment.
  • This has a pear-shaped lamp bulb 2 with a base 4.
  • a base 4 Within the lamp bulb 2, at least one LED 6 is arranged, wherein a plurality of LEDs 6 are provided.
  • the LED lamp 1 is preferably a so-called retrofit LED lamp. This should externally correspond for example to a conventional incandescent lamp, although no filament, but the energy-saving LEDs 6 serve as a light source.
  • the base 4 is designed for conventional sockets, such as E14, E27 or GU10.
  • the printed circuit board 8 is approximately plate-shaped and firmly held on a support 14. This has a base portion 16 which is supported on an inner wall of an approximately cylindrical and the base 4 assigning piston portion 18 of the lamp bulb 2. From the cross member 16 extending away from the base 4, two longitudinal members 20, which are mechanically fixedly connected to this for holding the printed circuit board 8.
  • the LEDs 6 are fixed on a side facing away from the base 4 side of a metal core circuit board 22, which also has two pressfit connectors 24, 26 with the circuit board 8 is mechanically and electrically connected.
  • the Pressfit connectors 24, 26 are each pin-shaped and each have a press-in contact or plug-in section 28, which dips into a through hole, not shown, of the printed circuit board 8 and force, material and / or positively fixed to this mechanically and electrically.
  • a central portion of the pressfit connectors 24, 26 is performed through through holes of the metal core printed circuit board 22, wherein at each of the plug portions 28 facing away end portions of the pressfit connectors 24, 26, an anchor member 30 is formed. This engages behind the metal core circuit board 22 and fixes it in the longitudinal direction of the LED lamp 1. With the pressfit connectors 24, 26 thus takes place a rigid mechanical connection between the metal core circuit board 22 and the circuit board 8 and at the same time an electrical connection.
  • the pressfit connectors 24, 26 are inexpensively manufactured as a stamped part.
  • the plug-in sections 28 are formed here needle-needle-shaped, whereby an elastic press-in zone is created. Furthermore, the plug-in sections 28 of the press-fit connectors 24, 26 are immersed in through-holes of the printed circuit board 8, which have a smaller diameter than the plug-in sections 28, whereby they are deformed substantially elastically and are held with an elastic clamping force in the through hole.
  • FIG. 2 shows in a schematic representation of the base 4 with the pressfit connectors 10, 12 from FIG. 1 ,
  • the pressfit connectors 10, 12 are designed as mechanically rigid press-fit pins and each have a plug-in portion 28 which projects away from the socket 4.
  • the plug-in portions 28 are correspondingly like those of the pressfit connectors 24, 26 FIG. 1 designed.
  • the Indian FIG. 2 right pressfit connector 12 extends approximately coaxially to a longitudinal axis of the base 4 to a lower base portion 32, where it is then welded, soldered or clamped for electrical and mechanical connection.
  • the Indian FIG. 2 left Pressfit connector 10 is bent approximately L-shaped, wherein a first leg 34 extends approximately parallel to the pressfit connector 12 and a second leg 36 radially to a lateral peripheral portion 38 of the base 4. On an inside of the peripheral portion 38, the L-shaped press fit connector 10 is then welded, soldered or clamped for electrical and mechanical connection to the socket 4.
  • the plug-in sections 28 of the pressfit connectors 10, 12 are in the FIG. 1 each in a recess of the printed circuit board 8 force, material and / or positively dipped.
  • the pressfit connectors 10, 12 off FIG. 2 each have an elongated recess in the form of a through-hole 40 at their plug-in section 28.
  • the plug-in portions 28 are elastically deformable, whereby certain manufacturing tolerances of the recesses of the circuit board 8 from FIG. 1 are compensable.
  • FIG. 1 is an extremely simple contacting of the circuit board 8 with the base 4 allows.
  • a soldering or welding of the circuit board 8, for example, with live cables for contacting with the base 4 as in the prior art is no longer necessary.
  • the base 4 with the pressfit connectors 24, 26 is simply plugged onto the circuit board 8 by the plug sections 28 are immersed in the recesses of the circuit board 8.
  • axial guide lugs 41 are formed, which serve for easy insertion of the plug-in sections 28 in the recesses of the printed circuit board 8 during assembly. These have a smaller diameter than the plug-in sections 28.
  • the pressfit connectors 12 and 10 are electrically contacted in the mounted state of the base 4 in a socket, not shown.
  • FIG. 3 is the base 4 of an LED lamp 1 according to the invention off FIG. 1 shown according to a second embodiment.
  • FIG. 1 and 2 is in the base 4 an electrically insulating potting compound 42 is introduced.
  • This serves on the one hand for the electrical insulation of the press fit connectors 10, 12 to each other and on the other hand, with a certain mechanical rigidity, the pressfit connectors 10, 12 additionally mechanically support.
  • the Pressfit connectors 10, 12 thereby collar from the potting compound 42 with the plug-in sections 28.
  • FIG. 4 illustrates a socket 4 of an LED lamp according to the invention according to a third embodiment.
  • an electrical component 44 is added in the potting compound 42 in this case.
  • This is an electrolytic capacitor or a resistor that is electrically and mechanically connected to the two Pressfit connectors 10, 12.
  • a guide pin 46 is additionally formed, which extends approximately at a distance parallel to the pressfit connectors 10, 12 from the base 4 out.
  • the guide pin 46 has a greater axial length than the Pressfit connectors 10, 12 and can dive during assembly of the circuit board 8 in a corresponding recess of the circuit board 8, whereby this is additionally supported and secured against rotation.
  • FIG. 5 shows in a schematic representation of the LED lamp 1 with the base 4 from FIG. 3 according to a fourth embodiment.
  • the printed circuit board 8 is supported by the press fit connectors 10, 12 and electrically contacted.
  • Another LED circuit board 48 is mounted on a bracket 50 at a distance parallel to the circuit board 8 at this and contacted with this electrically.
  • the circuit boards 8, 48 are arranged in the cylindrical piston portion 18 of the lamp bulb 2.
  • FIG. 6 discloses in a schematic representation of the LED lamp 1 according to a fifth embodiment.
  • a heat sink is arranged as an annular sink element 52 between the lamp bulb 2 and the base 4.
  • This consists of metal or a thermally conductive plastic.
  • the drain member 52 serves to cool the inner region of the LED lamp 1 and is approximately rotationally symmetrical with a frusto-conical peripheral wall, wherein at a first, facing away from the base 4, edge 54 a peripheral edge 56 of the in the FIG. 6 cylindrical lamp bulb 2 is attached.
  • the base 4 facing edge 58 of the sink member 52 of the base 4 is fixed.
  • the attachment of the sink member 52 with the base 4 and the lamp envelope 2 for example, via laser welding or gluing.
  • the connection can also be made via a latching, for example via a plurality of latching lugs, or by perforation or crimping of the base 4, the sink element 52 and the lamp envelope 2.
  • sink element 52 is one with the circuit board 8 from FIG. 1 or. FIG. 5 connected driver board (not shown).
  • two approximately diametrically arranged spring hooks can protrude on the base 4 approximately in the longitudinal direction, which engage in corresponding recesses of the lamp bulb for holding the lamp bulb.
  • an LED lamp with a base and with a first circuit board.
  • at least one electrically connected to the socket press fit connector is provided. This is connected via a plug-in section with the circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (12)

  1. Lampe à diodes électroluminescentes avec un culot (4) et avec une première carte de circuit imprimé (8), dans laquelle au moins un connecteur enfichable (10, 12) relié électriquement au culot (4) est prévu, qui est relié par l'intermédiaire d'une section d'enfichage (28) à la carte de circuit imprimé (8), caractérisée en ce que
    le connecteur enfichable est un connecteur à insertion de force (10, 12) et la section d'enfichage (28) est reçue dans un évidement de la carte de circuit imprimé (8), et dans laquelle dans la section d'enfichage (28) un évidement traversant (40) est disposé, et dans laquelle le connecteur à insertion de force (10, 12) est réalisé en tant que broche à insertion mécaniquement rigide.
  2. Lampe à diodes électroluminescentes selon la revendication 1, dans laquelle une deuxième section d'extrémité de l'au moins un connecteur à insertion de force (10, 12) est soudée ou brasée ou serrée au niveau d'un côté intérieur du culot (4) pour une liaison électrique et mécanique.
  3. Lampe à diodes électroluminescentes selon l'une quelconque des revendications précédentes, dont la forme correspond à peu près à celle d'une ampoule à incandescence classique.
  4. Lampe à diodes électroluminescentes selon la revendication 3, dans laquelle la première carte de circuit imprimé (8) est à peu près circulaire.
  5. Lampe à diodes électroluminescentes selon la revendication 3 ou 4, avec deux connecteurs à insertion de force (10, 12), dans laquelle la deuxième section d'extrémité du premier connecteur à insertion de force (12) est fixée à une section inférieure (32) du culot (4) et la deuxième section d'extrémité du deuxième connecteur à insertion de force (10) est fixée à une section périphérique latérale (38) du culot (4).
  6. Lampe à diodes électroluminescentes selon l'une des revendications 1 à 5, avec une carte de circuit imprimé à coeur de métal (22) sur laquelle plusieurs diodes électroluminescentes (6) sont fixées, dans laquelle la carte de circuit imprimé à coeur de métal (22) est reliée par l'intermédiaire de deux autres connecteurs à insertion de force (24, 26) à la première carte de circuit imprimé (8).
  7. Lampe à diodes électroluminescentes selon l'une quelconque des revendications 2 à 6, dans laquelle dans le culot (4) une masse de scellement (42) électriquement isolante est reçue.
  8. Lampe à diodes électroluminescentes selon la revendication 7, dans laquelle dans la masse de scellement (42) un composant électrique (44) est reçu.
  9. Lampe à diodes électroluminescentes selon les revendications 4 et 8, dans laquelle le composant électrique (44) est un condensateur électrolytique ou une résistance qui est relié électriquement et mécaniquement aux deux connecteurs à insertion de force (10, 12).
  10. Lampe à diodes électroluminescentes selon l'une quelconque des revendications 7 à 9, avec un boulon de guidage (46) formé à partir de la masse de scellement (42).
  11. Lampe à diodes électroluminescentes selon l'une quelconque des revendications précédentes avec un dissipateur thermique (52) en métal ou en matière plastique thermoconductrice, dans lequel une carte pilote est reçue.
  12. Lampe à diodes électroluminescentes selon les revendications 3 et 11, dans laquelle le dissipateur thermique (52) est à peu près symétrique en rotation, et dans laquelle à peu près au niveau d'un premier bord (54) un bord périphérique (56) d'un piston en matière plastique (2) est fixé, et dans laquelle au niveau d'un deuxième bord (58) un bord périphérique du culot (4) est fixé.
EP10785404.4A 2009-12-10 2010-11-29 Lampe à diodes électroluminescentes Active EP2488789B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009054519A DE102009054519A1 (de) 2009-12-10 2009-12-10 Led-Lampe
PCT/EP2010/068356 WO2011069848A2 (fr) 2009-12-10 2010-11-29 Lampe à diodes électroluminescentes

Publications (2)

Publication Number Publication Date
EP2488789A2 EP2488789A2 (fr) 2012-08-22
EP2488789B1 true EP2488789B1 (fr) 2019-01-09

Family

ID=43602820

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10785404.4A Active EP2488789B1 (fr) 2009-12-10 2010-11-29 Lampe à diodes électroluminescentes

Country Status (5)

Country Link
US (1) US9377185B2 (fr)
EP (1) EP2488789B1 (fr)
CN (1) CN102652242B (fr)
DE (1) DE102009054519A1 (fr)
WO (1) WO2011069848A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012201616A1 (de) * 2012-02-03 2013-08-08 Tridonic Jennersdorf Gmbh Kunststoffträger für LED-Chips zur Verwendung in LED-Modulen und LED-Ketten
DE102012208587A1 (de) * 2012-05-22 2013-11-28 Osram Gmbh Leuchtvorrichtung mit treiber
CN103807623B (zh) * 2012-11-09 2017-11-17 欧司朗有限公司 发光装置和一种包括该发光装置的照明装置
CN103851572A (zh) * 2012-12-05 2014-06-11 王水妹 电灯及其灯座
US20140168978A1 (en) * 2012-12-17 2014-06-19 Wen-Sung Hu Full-Beam-Angle LED Bulb Structure
CN104100851A (zh) 2013-04-08 2014-10-15 赵依军 集成led驱动电源的灯头
DE102014101403A1 (de) * 2013-05-15 2014-11-20 Seidel GmbH & Co. KG Leuchtvorrichtung
JP6467206B2 (ja) * 2014-01-28 2019-02-06 株式会社小糸製作所 光源ユニット
DE102014225486A1 (de) * 2014-12-10 2016-06-16 Osram Gmbh Lampe mit Treiberplatine und Sockel
CN105042366A (zh) * 2015-07-10 2015-11-11 黄新 一种球泡灯的立体电源及led灯丝球泡灯
CN105423152B (zh) * 2015-12-23 2018-11-30 厦门多彩光电子科技有限公司 一种led灯
DE102016202621B4 (de) 2016-02-19 2024-11-21 Ledvance Gmbh Lampe
USD789890S1 (en) * 2016-03-18 2017-06-20 Sky Light Electronic (Shenzhen) Limited Corporation Intelligent lampholder

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028671A1 (fr) * 2005-09-09 2007-03-15 Siemens Aktiengesellschaft Systeme d'emmanchement a la presse pour metallisation electrique et procede de montage dudit systeme d'emmanchement a la presse
DE102008001787A1 (de) * 2008-05-15 2009-11-19 Robert Bosch Gmbh Elektrischer Pressfit-Steckverbinder mit seitlich abgewinkeltem Powerpin

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400358A (en) * 1965-10-21 1968-09-03 Ibm Electrical connector
US3634819A (en) * 1970-03-18 1972-01-11 William Robert Evans Resilient pin and method of production thereof
US4230384A (en) * 1979-03-05 1980-10-28 International Telephone And Telegraph Corporation Electrical contact
US5189339A (en) * 1990-09-05 1993-02-23 Applied Lumens, Ltd. Fluorescent lamp assemblies
KR0117834Y1 (ko) * 1994-10-11 1998-07-15 조성호 컴팩트 형광등용 안정기
CN2217722Y (zh) * 1994-06-23 1996-01-17 晓活有限公司 小型灯泡组合结构
CN2378628Y (zh) * 1999-04-29 2000-05-17 沈亚光 防止灯泡破裂的灯套
US6653770B1 (en) * 1999-07-28 2003-11-25 Matsushita Electric Industrial Co., Ltd. Lamp with internally attached eyelet lead, and method therefor
JP3476736B2 (ja) * 2000-03-27 2003-12-10 松下電器産業株式会社 管球および管球用樹脂ケースの製造方法
JP2002304902A (ja) 2001-04-04 2002-10-18 Matsushita Electric Works Ltd 光源装置
US6462475B1 (en) * 2001-05-31 2002-10-08 Han-Ming Lee Power saving environment protection bulb
DE20115131U1 (de) 2001-09-13 2001-11-29 Lee, Hun Ming, Hsin Chu Leicht austauschbares, energiesparendes und umweltfreundliches Leuchtmittel
US6685339B2 (en) * 2002-02-14 2004-02-03 Polaris Pool Systems, Inc. Sparkle light bulb with controllable memory function
US7318661B2 (en) 2003-09-12 2008-01-15 Anthony Catalano Universal light emitting illumination device and method
US7249981B2 (en) 2005-07-08 2007-07-31 J.S.T. Corporation Press-fit pin
TWI433585B (zh) * 2007-12-03 2014-04-01 Aeon Lighting Technology Inc Three-dimensional miniaturized power supply
US7641379B2 (en) * 2007-05-21 2010-01-05 Cisco Technology, Inc. Press fit electronic component
DE202007009655U1 (de) 2007-07-11 2007-09-06 Aeon Lighting Technology Inc., Chung-Ho City Wärmeableitvorrichtung für LED-Licht emittierendes Modul
US7862203B2 (en) * 2007-08-09 2011-01-04 Edison Opto Corporation Lighting assembly
TWM332793U (en) 2007-11-28 2008-05-21 Cooler Master Co Ltd Heat radiating structure and the lighting apparatus
CN101459162B (zh) * 2007-12-11 2010-12-08 富士迈半导体精密工业（上海）有限公司 固态发光器件
US8018136B2 (en) * 2008-02-28 2011-09-13 Tyco Electronics Corporation Integrated LED driver for LED socket
CN102175000B (zh) 2008-07-30 2013-11-06 东芝照明技术株式会社 灯装置及照明器具
CN201293233Y (zh) * 2008-09-22 2009-08-19 李汉明 简易嵌扣装饰灯串的连体电线灯座
DE102008056923A1 (de) * 2008-11-12 2010-05-27 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit zwei Leiterplatten
US8585251B2 (en) * 2008-12-12 2013-11-19 Bridgelux, Inc. Light emitting diode lamp
DE102009008637B4 (de) * 2009-02-12 2022-05-12 Ledvance Gmbh Leuchtvorrichtung
US8441214B2 (en) * 2009-03-11 2013-05-14 Deloren E. Anderson Light array maintenance system and method
US8434883B2 (en) * 2009-05-11 2013-05-07 SemiOptoelectronics Co., Ltd. LLB bulb having light extracting rough surface pattern (LERSP) and method of fabrication
TWI398594B (zh) * 2009-06-16 2013-06-11 Kwo Ger Metal Technology Inc Transfer module
US9030120B2 (en) * 2009-10-20 2015-05-12 Cree, Inc. Heat sinks and lamp incorporating same
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
US8896005B2 (en) * 2010-07-29 2014-11-25 Cree, Inc. Lighting devices that comprise one or more solid state light emitters
US8449169B2 (en) * 2011-01-17 2013-05-28 Pdc Facilities, Inc. LED replacement bulb for use in low EM room
TWM421457U (en) * 2011-07-06 2012-01-21 Ceramate Technical Co Ltd Non-disposable LED lamp with laminated heat dissipation
CN103378525A (zh) * 2012-04-26 2013-10-30 展晶科技(深圳)有限公司 转换灯座结构
DE102012213573B3 (de) * 2012-08-01 2013-09-26 Infineon Technologies Ag Halbleitermodulanordnung und verfahren zur herstellung und zum betrieb einer halbleitermodulanordnung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007028671A1 (fr) * 2005-09-09 2007-03-15 Siemens Aktiengesellschaft Systeme d'emmanchement a la presse pour metallisation electrique et procede de montage dudit systeme d'emmanchement a la presse
DE102008001787A1 (de) * 2008-05-15 2009-11-19 Robert Bosch Gmbh Elektrischer Pressfit-Steckverbinder mit seitlich abgewinkeltem Powerpin

Also Published As

Publication number Publication date
CN102652242B (zh) 2016-05-11
WO2011069848A3 (fr) 2011-11-10
US9377185B2 (en) 2016-06-28
WO2011069848A2 (fr) 2011-06-16
CN102652242A (zh) 2012-08-29
DE102009054519A1 (de) 2011-06-16
US20120242226A1 (en) 2012-09-27
EP2488789A2 (fr) 2012-08-22

Similar Documents

Publication Publication Date Title
EP2488789B1 (fr) Lampe à diodes électroluminescentes
EP0960037B1 (fr) Element lumineux, notamment pour l'eclairage de symboles de fonction ou pour la signalisation de fonctions dans des vehicules a moteur
EP2959546B1 (fr) Porte-contact comportant un segment de compensation de tolérances
EP2347639B1 (fr) Dispositif d'éclairage avec deux cartes de circuits
DE102017114730B4 (de) Leuchtmittel und Federkontakt zur elektrischen Verbindung zweier Platinen
DE102017125505A1 (de) Steckerbuchse für Leiterplatinen
DE102011119842A1 (de) Elektrisches Verbindungselement und Leiterplattenanordnung
EP3336969B1 (fr) Dispositif de contact pour une transmission d'énergie électrique sur une carte de circuits imprimés et procédé de montage d'un tel dispositif de contacts
DE202006018985U1 (de) Lampe mit einem Sockel und mindestens einem lichtemittierenden Halbleiterbauelement
DE102017208749A1 (de) Anschlussglied und Stecker
EP0854497B1 (fr) Lampe compacte à décharge basse pression
EP2694874B1 (fr) Dispositif de fixation et de mise en contact d'une lampe et/ou d'un module lumineux, ainsi que luminaire
EP2548421B1 (fr) Ensemble comportant un module électrique et/ou électronique et un support de circuit
DE602005002488T2 (de) Verbindung mit hoher Haltekraft
WO2020221606A1 (fr) Dispositif de raccordement avec partie boîtier et éléments de raccordement à apposer dessus, et procédé de fabrication associé
DE102017100165A1 (de) Lichtemittierende Anordnung und lichtemittierendes System
EP2852791B1 (fr) Dispositif d'éclairage à pilote
EP3435488B1 (fr) Agencement d'appareils
DE102018005359B4 (de) Kontaktelement mit einer Leiterplatte
DE102020103454B4 (de) Eine LED-Lampe mit einem Verbindungsmodul mit Antennenfunktion
JP2007103388A (ja) ランプ
DE10000245B4 (de) Lampenfassung
DE102017011473A1 (de) USB-Anschluss zur senkrechten Monatge und USB-Anschluss System
DE102017011472B4 (de) USB-Anschluss zur senkrechten Montage und USB-Anschluss System
DE202016103093U1 (de) Leiterplattenanordnung und Leuchtenanordnung

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120515

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

17Q First examination report despatched

Effective date: 20151125

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502010015723

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: F21V0023060000

Ipc: F21Y0115100000

RIC1 Information provided on ipc code assigned before grant

Ipc: F21V 23/06 20060101ALI20161124BHEP

Ipc: F21Y 101/00 20160101ALI20161124BHEP

Ipc: F21K 9/232 20160101ALI20161124BHEP

Ipc: F21V 3/00 20150101ALI20161124BHEP

Ipc: F21Y 115/10 20160101AFI20161124BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LEDVANCE GMBH

INTG Intention to grant announced

Effective date: 20180611

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAR Information related to intention to grant a patent recorded

Free format text: ORIGINAL CODE: EPIDOSNIGR71

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTC Intention to grant announced (deleted)
INTG Intention to grant announced

Effective date: 20181018

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 1087767

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190115

REG Reference to a national code

Ref country code: CH

Ref legal event code: PK

Free format text: BERICHTIGUNGEN

Ref country code: DE

Ref legal event code: R096

Ref document number: 502010015723

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

RIC2 Information provided on ipc code assigned after grant

Ipc: F21Y 115/10 20160101AFI20161124BHEP

Ipc: F21K 9/232 20160101ALI20161124BHEP

Ipc: F21Y 101/00 20160101ALI20161124BHEP

Ipc: F21V 23/06 20060101ALI20161124BHEP

Ipc: F21V 3/00 20150101ALI20161124BHEP

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20190109

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190509

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190409

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190509

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190409

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190410

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502010015723

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

26N No opposition filed

Effective date: 20191010

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191129

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191130

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191130

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20191130

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20191129

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191129

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191129

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191130

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1087767

Country of ref document: AT

Kind code of ref document: T

Effective date: 20191129

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191129

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20101129

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190109

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20241128

Year of fee payment: 15