EP2309338A1 - Ceinture à fusion en polyimide durci à basse température et rapidement - Google Patents
Ceinture à fusion en polyimide durci à basse température et rapidement Download PDFInfo
- Publication number
- EP2309338A1 EP2309338A1 EP09171837A EP09171837A EP2309338A1 EP 2309338 A1 EP2309338 A1 EP 2309338A1 EP 09171837 A EP09171837 A EP 09171837A EP 09171837 A EP09171837 A EP 09171837A EP 2309338 A1 EP2309338 A1 EP 2309338A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- belt
- polyimide
- belt material
- fuser
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 229920002313 fluoropolymer Polymers 0.000 claims description 9
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 8
- 239000004811 fluoropolymer Substances 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
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- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 5
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- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
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- 150000001412 amines Chemical class 0.000 claims description 3
- 150000004984 aromatic diamines Chemical class 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
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- 239000002253 acid Substances 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
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- 229910052782 aluminium Inorganic materials 0.000 description 2
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2053—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
- G03G15/2057—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating relating to the chemical composition of the heat element and layers thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/20—Details of the fixing device or porcess
- G03G2215/2003—Structural features of the fixing device
- G03G2215/2016—Heating belt
- G03G2215/2035—Heating belt the fixing nip having a stationary belt support member opposing a pressure member
Definitions
- This invention relates generally to a belt material and methods for making and using the belt material and, more particularly, to a fast and low temperature cured belt material used for electrostatographic devices and processes.
- fuser belts In the electrostatographic printing industry, there is a trend of using fuser belts to replace fuser rolls due to the compact structure, low energy consumption and high speed of the fuser belts.
- current fuser belts include polyimide belts made by coating and curing from a polyimide-based solution.
- the curing process is often performed at high temperatures of over 300°C for a long time.
- one conventional curing process includes a bake at about 380°C for 1 hour, which in turn follows one or more pre-bakes for about 1 to 2 hours.
- conventional polyimide materials may be free of curing (e.g., not curable), or may be partially cured at low temperatures.
- such polyimide materials can not provide desired mechanical strength for use as a belt.
- the present teachings include a method for making a belt material.
- the belt material can be formed by first forming a coating dispersion that contains a plurality of thermally conductive species in a liquid polyimide.
- the coating dispersion can then be coated on a support and further cured at a temperature of about 300°C or lower to form the belt material.
- the present teachings also include a belt material.
- the belt material can be formed by first forming a coating dispersion that contains a plurality of thermally conductive species in a liquid polyimide.
- the coating dispersion can then be coated on a support and cured at a low temperature of about 300°C or lower to form the belt material.
- the present teachings further include a fuser belt.
- the fuser belt can include one layer of a fast and low temperature cured polyimide belt material or use the fast and low temperature cured polyimide belt material as a belt substrate. One or more other layers can then be formed over the belt substrate.
- the example value of range stated as "less than 10" can assume values as defined earlier plus negative values, e.g. -1, -1.2, -1.89, -2, - 2.5, -3, -10, -20, -30, etc.
- the belt material can be a fast and low-temperature cured polyimide belt that includes a plurality of thermally-conductive species dispersed in a polyimide resin.
- the belt material can include one or more layers formed over the fast and low-temperature cured polyimide belt substrate that includes a plurality of thermally-conductive species dispersed in the polyimide resin.
- the fast and low-temperature cured polyimide belt or belt substrate can be cured at a temperature of about 300°C or lower for a time length of less than about one hour.
- the disclosed belt material can be used as a "fuser belt” in the electrostatographic printing industry.
- the term “fuser belt” is referred to throughout the description herein, however, it is intended that the term “fuser belt” also encompasses other belt-like structure suitable for use in an electrostatographic printing device or process including, but not limited to, a pressure applying mechanism belt, a release agent donor belt or any fixing belt.
- FIG. 1 depicts a cross sectional view of a belt fuser assembly 100 having a fuser belt in accordance with the present teachings.
- the disclosed fuser belt can be used in other belt fuser assembly scheme known to one of ordinary skill in the art.
- the fuser assembly 100 depicted in FIG. 1 represents a generalized schematic illustration and that other elements/ belts can be added or existing elements/ belts can be removed or modified.
- the fuser assembly 100 can include, e.g., an endless flexible fuser belt 110 formed in accordance with the present teachings.
- the fuser assembly 100 can further include a heater assembly 120 and a backup member in an exemplary form of a roll 130.
- the backup roll 130 can be driven and the fuser belt 110 can be an idler belt.
- the drive scheme can be reversed.
- the fuser belt 110 and the backup roll 130 can define a fuser nip 140 there between.
- Heater assembly 120 can include a high temperature housing 122, e.g., formed from a polymeric material such as a liquid crystal polymer and a ceramic heater 124 can be fixed to the housing 122.
- the heater 124 can further include, e.g., a ceramic substrate formed from alumina, a resistive ink pattern provided on the ceramic substrate, a temperature sensor such as a thermistor, and a glass protective layer provided over the pattern and adjacent the exposed portions of the ceramic substrate.
- a temperature sensor such as a thermistor
- Such heater 124 can be known to one of ordinary skill in the art.
- the backup roll 130 can include, e.g., an inner core 132, an inner polymeric layer 134 and an outer toner release layer or sleeve 136.
- the inner core 132 can be formed from a polymeric material, steel, aluminum or a like material.
- the inner polymeric layer 134 can be formed from, e.g., a silicone foam or rubber material.
- the outer release layer 136 can be formed from, e.g., PFA (polyperfluoroalkoxy-tetrafluoroethylene) or other fluoro resin material.
- a conventional drive mechanism (not shown) can be provided for effecting rotation of the backup roll 130.
- a substrate transport device (not shown), such as a transport belt, can be provided to feed substrates S as shown in FIG. 1 , one a time into the fuser nip 140.
- a toner image can be provided on each substrate via one or more imaging stations. The toner image can then be fused to the substrate S by the fuser belt 110, the ceramic heater 124 and the backup roll 130 applying heat and pressure to the substrate/toner image.
- rotation of the backup roll 130 can effect movement of a substrate S through the fuser nip 140. Movement of the backup roll 130 and substrate S can cause the fuser belt 110 to move relative to the ceramic heater 124.
- FIG. 1A is a cross sectional view of a portion of an exemplary fuser belt 110 illustrated in FIG. 1 in accordance with the present teachings.
- the fuser belt 110 is a polymer belt 110A, e.g., a thermally conductive polymer belt, through which heat is applied.
- the polymer belt 110A can be a smooth sheet or a meshed material.
- the polymer belt 110A can be, e.g., a seamless endless belt, though belts having seams can also be used.
- the thickness of the polymer belt 110A can be, for example, about 50 to about 500 micrometers. In an additional example, the thickness can be about 60 to about 400 micrometers. In a further example, the thickness of the polymer substrate can be about 70 to 300 micrometers.
- the polymer belt 110A includes a polyimide, optionally with a polyester, polycarbonate, polyamide, polyamide-imide or mixtures or combinations thereof.
- a polyimide-based belt for the disclosed fuser belt (e.g., 110 of FIG. 1 and 110A of FIG. 1A ) and the disclosed fuser device (e.g., the assembly 100 of FIG. 1 ).
- the polyimide-based fuser belt shown in FIG. 1A can be made by dispersing thermally conductive species 108 within the polyimide matrices 105.
- the thermally conductive species 108 can include, for example, boron nitride, beryllium oxide, aluminum nitride, silicon carbide, silicon nitride, alumina or silica.
- the thermally conductive species 108 can be dispersed in an amount ranging from about 5 % to about 50 % by weight of the polyimide belt.
- the disclosed polyimide material can possess a number average molecular weight of, for example, from about 5,000 to about 500,000, and in an additional example, from about 10,000 to about 100,000.
- the disclosed polyimide can possess a weight average molecular weight of, for example, from about 50,000 to about 5,000,000, and in an additional example, from about 100,000 to about 1,000,000.
- a coating dispersion (also referred herein as coating solution or coating suspension) can be formed including, for example, a plurality of thermally-conductive species, and a polyamic acid solution using an organic polar solvent, such as N-methyl-2-pyrrolidone (NMP).
- NMP N-methyl-2-pyrrolidone
- the polyamic acid solution can be used to prepare polyimide resins.
- the described polyamic acid solution is also known as a "liquid polyimide".
- the liquid polyimide can be commercially available from Richard Blaine International, Incorporated (RBI), Inc., Reading, PA, having a trade name and product number as VTECTM PI 1388.
- RBI Richard Blaine International, Incorporated
- VTECTM PI 1388 Other product numbers including PI 080-051, 851, 302, 203, 201 or PETI-5 under the designation of VETCTM can also be used.
- VTEC liquid polyimide can provide a stable and long shelf life, while the resulting VTEC polyimide can be defect free with minimal lot-to-lot variation.
- two reactions can occur during the low temperature curing of about 300°C or less.
- the disclosed polyimide material can be different from conventional polyimides.
- conventional polyimide can be cured by a single imidization reaction without any other crosslinking process (e.g., free radical polymerization).
- the disclosed polyimide belts require a curing temperature that is above 300°C in order to obtain a high tensile strength, while the disclosed polyimide belts can be cured at low temperatures for a short period of time.
- the subsequent curing temperature can range from about 150°C to about 260 °C and the subsequent curing can be accomplished in about 10 minutes to about 120 minutes.
- curing can be accomplished in about 40 to about 100 minutes.
- the curing time can range from about 20 minutes to about 60 minutes.
- the liquid polyimide, or the polyamic acid solution can be mixed with the thermally-conductive species to form the coating dispersion.
- the coating dispersion can be prepared via a mechanical processing, e.g., an agitation, sonication or attritor ball milling/ grinding. The prepared coating dispersion can then be coated and cured, in some cases, can be further welded to form a belt.
- the coating dispersion can be coated on a coating support, such as, for example, an outer surface of a metal mandrel, an inner circumference of a cylinder or a plate substrate.
- the resulting polyimide belt can thus include, e.g., a tubular form or non-tubular form such as a belt form depending on the shape of the coating support.
- the term "coat” refers to a technique or a process for applying, forming, or depositing the disclosed dispersion on a material or a surface of the coating support.
- coating or “coating technique” is not particularly limited in the present teachings, and extrusion coating, bar coating, dip coating, mold coating, painting, brush coating, roller coating, pad application, spray coating, spin coating, casting, or flow coating can be employed.
- the coating support can include a material, e.g., a glass, a metal or any other suitable material.
- the coated coating dispersion can then be cured and dried at low temperatures in a short time length to form the polyimide resins.
- the curing temperatures can be lower than the temperature used in the prior art, which still provide desired properties, especially mechanical properties, to the resulting belt.
- temperatures used in the prior art for forming polyimide-based belt can be about 380°C or higher, while the disclosed polyimide-based belt can be cured at a temperature less than about 380°C, for example, about 300°C or lower.
- the curing temperature can be about 250 °C or lower.
- the curing temperature can be about 200°C or lower.
- a step-wise curing at low temperatures can be performed.
- a coated member can be placed in a convection oven at about 50°C to about 150°C for about 20 to about 40 minutes; and the temperature can then be increased to about 150 °C to about 250°C and further curing can take place for about 20 to about 80 minutes.
- the coated member can be placed in the convection oven at about 100°C for about 20 minutes and further cured at about 204°C for about 20 minutes.
- Other curing schedules can be possible. Curing schedules known to those skilled in the art can be within the scope of embodiments herein.
- the cured member following the curing process, can be cooled, e.g., in a water bath and/or at a room temperature of about 20°C to about 25 °C.
- the cured polyimide when the coating dispersion is coated on a non-tubular coating support, the cured polyimide can be further welded to form a fuser belt.
- standard welding process such as an ultrasonication weld, can be used to form a fuser belt or other fixing belt.
- the fuser belt made by the method described herein can provide desired mechanical properties.
- the resulting fuser belt can have a tensile strength ranging from about 200 to about 500 MPa or higher; or a thermal conductivity of about 0.10 to about 0.50 W/m.K or higher.
- the fuser belt 110 can include a layered structure as shown in FIG. 1B and FIG. 1C .
- the layered structures 110B-C can include, e.g., a polymer belt substrate that can be similar to the polymer belt 110A of FIG. 1A including thermally conductive particles dispersed in the exemplary polyimide. That is, the polymer belt 110A can also be used as a belt substrate for a multi-layered fuser belt used in the belt fuser assembly 100 of FIG. 1 .
- the fuser belt 110 can include a top layer 116, such as a silicone rubber layer or a fluoropolymer layer formed on the disclosed polymer belt substrate 110A.
- a top layer 116 such as a silicone rubber layer or a fluoropolymer layer formed on the disclosed polymer belt substrate 110A.
- the fuser belt 110 can have one or more layer disposed between the top layer 116, such as a fluoroplastic layer, and the disclosed polymer belt substrate 110A.
- a compliant layer 114 such as a silicone rubber layer, can be disposed between the top layer 116 and the disclosed polymer belt substrate 110A.
- the top layer 116 of the fuser belt 110 can include e.g., fluoropolymers.
- the fluoropolymers can include, but are not limited to, fluoroplastics including PFA (polyfluoroalkoxypolytetrafluoroethylene), PTFE (polytetrafluoroethylene), or FEP (fluorinated ethylenepropylene copolymer), and/or fluoroelastomers including copolymers of hexafluoropropylene (HFP) and vinylidene fluoride (VDF or VF2); terpolymers of tetrafluoroethylene (TFE), vinylidene fluoride (VDF) and hexafluoropropylene (HFP); or tetrapolymers including TFE, VF2, HFP.
- fluoropolymers can include, but are not limited to, fluoroplastics including PFA (polyfluoroalkoxypolytetrafluoroethylene
- fluoropolymers can be commercially available from various designations as Teflon ® FA, Teflon ® PTFE, Teflon ® FEP, Viton A ®, Viton ®-B, and Viton ®-GF, Viton E ®, Viton E 60C ®, Viton E430 ®, Viton 910 ®, Viton GH ® and Viton GF ®.
- Teflon ® and Viton ® designations are Trademarks of E.I. DuPont de Nemours, Inc.
- fluoropolymers can include, for example, Fluorel 2170 ®, Fluorel 2174 ®, Fluorel 2176 ®, Fluorel 2177 ® and Fluorel LVS 76 ®, Fluorel ® being a Trademark of 3M Company.
- Additional commercially available materials can include Aflas ® a poly(propylene-tetrafluoroethylene) and Fluorel II ® (LI1900) a poly(propylene-tetrafluoroethylenevinylidenefluoride) both also available from 3M Company, as well as the Tecnoflons identified as For-60KIR ®, For-LHF ®, NM ®, For-THF ®, For-TFS ®, TH ®, and TN505 ®, available from Montedison Specialty Chemical Company.
- Aflas ® a poly(propylene-tetrafluoroethylene) and Fluorel II ® (LI1900) a poly(propylene-tetrafluoroethylenevinylidenefluoride) both also available from 3M Company, as well as the Tecnoflons identified as For-60KIR ®, For-LHF ®, NM ®, For-THF ®, For-TFS
- Example 1 Preparation of a polyimide belt or a polyimide belt substrate
- a coating dispersion was prepared via Attritor grinding at about 800 rpm for about 3 hours using stainless shots as media.
- the coating dispersion included the liquid polyimide VTECTM PI 1388, commercially available from RBI, Inc., Reading, PA, in an organic solvent N-methyl-2-pyrrolidone (NMP).
- the dispersion was then coated on a glass via bar-coating, and then first cured at about 100°C for about 20 minutes and then cured at about 204°C for about 20 minutes.
- the cooled sample out of curing oven was immersed into a water bath overnight, and a standalone fuser belt having a thickness of about 60 ⁇ m was automatically peeled off from the glass.
- Example 2 Preparation of a polyimide belt or a polyimide belt substrate
- boron nitride About 5 to about 30 wt% of boron nitride, was dispersed in a polyamic acid solution using the solvent N-methyl-2-pyrrolidone (NMP).
- the polyamic acid solution was a liquid polyimide VTECTM PI 1388, commercially available from RBI, Inc., Reading, PA.
- the liquid polyimide was then extrusion coated, and pre-cured at about 121°C for about 20 minutes, and then fully cured at about 204°C for about 20 minutes.
- the resulting polyimide belt was then welded using standard ultrasonication welding to form a polyimide fuser belt.
- VTECTM PI 1388 liquid polyimide having about 5% to about 30 wt% boron nitride in example 2 was dip-coated on an aluminum tube, and pre-cured at about 121°C for a short period of time, and then fully cured at about 204°C for about 20 minutes. Seamless polyimide belt or the polyimide belt substrate for a multi-layered belt was then obtained.
- Example 4 Properties of the polyimide belt or polyimide belt substrate
- Table 1 compares properties of the disclosed fast and low temperature cured polyimide fuser belt with one of current commercially-available DuPont's KAPTON HN film.
- the KAPTON HN example is not part of the present invention.
- the disclosed polyimide belt/ belt substrate possessed comparable or superior properties, for example, dimensional stability (see the lower elongation percentage), less humidity sensitivity (see the water absorption percentage) and lower surface friction (see the dynamic friction coefficient).
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20090171837 EP2309338B1 (fr) | 2009-09-30 | 2009-09-30 | Ceinture à fusion en polyimide durci à basse température et rapidement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20090171837 EP2309338B1 (fr) | 2009-09-30 | 2009-09-30 | Ceinture à fusion en polyimide durci à basse température et rapidement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2309338A1 true EP2309338A1 (fr) | 2011-04-13 |
| EP2309338B1 EP2309338B1 (fr) | 2012-12-05 |
Family
ID=41809047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20090171837 Not-in-force EP2309338B1 (fr) | 2009-09-30 | 2009-09-30 | Ceinture à fusion en polyimide durci à basse température et rapidement |
Country Status (1)
| Country | Link |
|---|---|
| EP (1) | EP2309338B1 (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112500A (ja) * | 1997-06-23 | 1999-01-19 | Hitachi Chem Co Ltd | 変性ポリアミドイミド樹脂ペースト及びこれを用いた電子部品 |
| JP2005258432A (ja) * | 2004-02-13 | 2005-09-22 | Ist:Kk | 複合管状物 |
| WO2008120787A1 (fr) * | 2007-03-29 | 2008-10-09 | Ube Industries, Ltd. | Polyimide aromatique et son procédé de production |
-
2009
- 2009-09-30 EP EP20090171837 patent/EP2309338B1/fr not_active Not-in-force
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112500A (ja) * | 1997-06-23 | 1999-01-19 | Hitachi Chem Co Ltd | 変性ポリアミドイミド樹脂ペースト及びこれを用いた電子部品 |
| JP2005258432A (ja) * | 2004-02-13 | 2005-09-22 | Ist:Kk | 複合管状物 |
| WO2008120787A1 (fr) * | 2007-03-29 | 2008-10-09 | Ube Industries, Ltd. | Polyimide aromatique et son procédé de production |
| EP2141187A1 (fr) * | 2007-03-29 | 2010-01-06 | Ube Industries, Ltd. | Polyimide aromatique et son procédé de production |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2309338B1 (fr) | 2012-12-05 |
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