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EP2394494A1 - Réseau électronique comprenant une pluralité de modules électroniques - Google Patents

Réseau électronique comprenant une pluralité de modules électroniques

Info

Publication number
EP2394494A1
EP2394494A1 EP09779020A EP09779020A EP2394494A1 EP 2394494 A1 EP2394494 A1 EP 2394494A1 EP 09779020 A EP09779020 A EP 09779020A EP 09779020 A EP09779020 A EP 09779020A EP 2394494 A1 EP2394494 A1 EP 2394494A1
Authority
EP
European Patent Office
Prior art keywords
electronic
unit
glass panel
array
electronic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09779020A
Other languages
German (de)
English (en)
Inventor
Michaël DEMEYERE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Glass Europe SA
Original Assignee
AGC Glass Europe SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Glass Europe SA filed Critical AGC Glass Europe SA
Publication of EP2394494A1 publication Critical patent/EP2394494A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B32B17/10183—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions
    • B32B17/10192—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions patterned in the form of columns or grids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
    • B32B17/10201—Dielectric coatings
    • B32B17/10211—Doped dielectric layer, electrically conductive, e.g. SnO2:F
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/02—Safety devices structurally associated with lighting devices coming into action when lighting device is disturbed, dismounted, or broken
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/54—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a series array of LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs

Definitions

  • the invention relates to the field of electronic arrays comprising a plurality of electronic units being arranged in series to one another, wherein such electronic arrays are preferably adapted for electronic circuit applications especially for lighting and/or displays and signage as well as to methods of manufacturing and operating such arrays and methods of use of lighting.
  • PCB printed circuit boards
  • the physical arrangement of electronic units is not significantly influenced by the connection mode of the electronic units with respect to one another because the resistivity of the conductive tracks, e.g. made of copper, is usually negligible. Therefore, in conventional electronics on PCB' s, such conductive tracks can have any dimensions. In particular, these dimen- sions can be as long as necessary while the system performance is not suffering. The most conventional and effective way to proceed is to connect all electronic units in parallel.
  • a conductive resistive substrate such as glass comprising a resistive con- ductive layer applied to the glass
  • a conventional efficient solution is to arrange an electronic array (also referred to as an electronic matrix in the following) of electronic units such that it is provided in a column, i.e. in a first dimension of such an electronic array arranged in a current direction, a plurality of electronic units that are connected in series to one another. Columns of electronic components are connected in parallel with each other.
  • the conventional solution is illustrated in Fig. 1.
  • This figure shows a DC power supply unit 1 and an electronic array 12 comprising a plurality of electronic units. Conductive areas which are isolated from one another and the link between such areas performed by electronic units are illustrated in this figure.
  • the electronic units are shown as small squares in Fig. 1.
  • Fig. 2 illustrates the implementation of a data bus unit 2 in such an electric array 12 comprising a plurality of electronic units.
  • the electronic units are indicated as squares in Fig. 2.
  • An advantage of embodiments of the present invention is a possibility for realizing a simple, cheap and a steadily ready-to-operate electronic array preferably adapted for electronic circuit applications such as lighting and/or displays and/or signage.
  • the above object is achieved by an electronic array according to independent claim 1.
  • the electronic array comprises a power supply unit, a plurality of electronic units being arranged in series to one another, wherein the plurality of electronic units each comprise a management unit adapted for addressing each electronic unit individually within the plurality of electronic units.
  • the management unit comprises a decoding unit adapted for decoding a command being addressed to the management unit.
  • the management unit further comprises a driving unit adapted for selecting a portion of a physical parameter associated with the plurality of electronic units.
  • the physical parameter comprises at least one of electric current, electric voltage, temperature and impedance.
  • the management unit fur- ther comprises a dissipation unit adapted for dissipating a surplus of a physical parameter, preferably an electric current, being directed to the plurality of electronic units.
  • a physical parameter preferably an electric current
  • the plurality of electronic units is arranged on a conductive resistive substrate.
  • the conductive resistive substrate corresponds to glass comprising a conductive layer adapted for conducting electricity.
  • the plurality of electronic units comprises a plurality of light emitting devices such as organic light emitting diodes and/or a plurality of light emitting diodes.
  • each electronic unit comprises a management unit and each electronic unit is preferably arranged on a conductive resistive substrate.
  • the connection method used is preferably the method described in connection with Fig. 1.
  • the minimum size of electronic array preferably corresponds to two times one, i.e. two lines of two components which are connected in series to each other. All electronic units con- nected in series to one another consume the same electric current.
  • a management unit associated with each electronic unit preferably comprises a decoding unit adapted for decoding a command addressed to it, for instance via a microcontroller.
  • the management unit comprises a control unit adapted for diverting the necessary portion of a physical parameter, preferably the electric current flowing through the electronic unit, in order to fulfil the function of an electronic unit in function of the command addressed to it, preferably via a power driver.
  • the management unit comprises a dissipating unit adapted for dissipating the surplus portion of the physic parameter, preferably the electric current flowing through the given electronic unit, preferably via a variable resistive element, such as a varistor, shunting the basic electronic unit.
  • the present invention also provides a method for use with an electronic array comprising a power supply unit, and a plurality of electronic units being arranged in series to one another, the method comprising: addressing an electronic unit of the plurality of electronic units individually and dissipating a surplus of a physical parameter the electronic unit locally to the electronic unit.
  • the method may further comprise the step of decoding a command being addressed to the electronic unit.
  • the physical parameter preferably comprises at least one of electric current through the electronic unit, electric voltage across the electronic unit, temperature of the electronic unit and impedance of the electronic unit.
  • the step of dissipating a surplus of the physical parameter the electronic unit locally to the electronic unit is preferably a lossy dissipation, e.g. via a variable resistor.
  • the present invention provides a possibility to realize an electronic array and a method for use with this array that allows individual addressing of each electronic unit with commands within the plurality of the electronic units, wherein the electronic units are connected in series to one another and are preferably arranged on a conductive resistive substrate.
  • Fig. 1 depicts a conventional electronic array
  • Fig. 2 depicts the conventional electronic array comprising a data bus unit
  • Fig. 3 depicts a schematic implementation of an electronic array according to an embodiment of the invention.
  • Fig. 4 depicts a schematic implementation of an electronic unit according to an embodiment of the invention.
  • first, second, third and the like in the description and in the claims are used for distinguishing between similar elements and not necessarily for describing a sequence, either temporally, spatially, in ranking or in any other manner. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of op- eration in other sequences than described or illustrated herein.
  • Coupled should not be interpreted as being restricted to direct connections only.
  • the terms “coupled” and “connected”, along with their derivatives, may be used. It should be understood that these terms are not intended as synonyms for each other.
  • the scope of the expression “a device A coupled to a device B” should not be limited to devices or systems wherein an output of device A is directly connected to an input of device B. It means that there exists a path between an output of A and an input of B which may be a path including other devices or means.
  • Coupled may mean that two or more elements are either in direct physical or electrical contact, or that two or more elements are not in direct contact with each other but yet still co-operate or interact with each other.
  • any of the claimed embodiments can be used in any combination.
  • some of the embodiments are described herein as a method or combination of elements of a method that can be implemented by a processor of a computer system or by other means of carrying out the function.
  • a processor with the necessary instructions for carrying out such a method or element of a method forms a means for carrying out the method or element of a method.
  • an element described herein of an apparatus embodiment is an example of a means for carrying out the function performed by the element for the purpose of carrying out the invention.
  • an electronic array comprising at least two dimensions, wherein in each dimension identical or nearly identical electronic units are arranged preferably on a conductive resistive substrate such as glass comprising a conductive layer adapted for conducting electricity.
  • the two dimensions may be defined by Cartesian co-ordinates or polar co-ordinates, for example.
  • the two dimensions may, for instance, be arranged orthogonally within the co-ordinate system chosen.
  • the electronic array comprises a plurality of electronic units being arranged in series to one another wherein each electronic unit comprises a management unit.
  • the present invention is not limited to two dimensions.
  • a lighting scheme in three dimensions is provided by the present invention e.g. an array of a plurality of parallel electronic arrays having two dimensions.
  • each electronic unit comprises a light emitting device such as one single color LED or a mulitcolour LED such as an RGB LED, and a management unit.
  • the management unit preferably comprises a dissipating element which can be a lossy ele- ment, e.g. variable resistive element (such as a variable resistor) arranged in parallel with the light emitting device, e.g. LED.
  • the invention may be applied to a panel of laminated glass, comprising a first panel of glass, a second panel of glass, and a plastics interlayer, wherein the first panel of glass and the second panel of glass are laminated together via the plastics interlayer.
  • One glass panel (the conductive resistive substrate) has a conductive layer, preferably a transparent conductive layer and the conductive layer is patterned to make the conductive paths, e.g. by laser ablation.
  • the electronic units and components are arranged on the conductive layer and connected thereto and are laminated between first and second panels of glass.
  • the invention may also be applied to all kind of panel comprising at least one conductive resistive substrate, for instance in a double glazing panel comprising a glass made conductive resistive substrate (first glass panel) carrying the electronic units, an air gap and a second glass panel, the air gap being sandwiched between the first and the second glass panels.
  • a double glazing panel comprising a glass made conductive resistive substrate (first glass panel) carrying the electronic units, an air gap and a second glass panel, the air gap being sandwiched between the first and the second glass panels.
  • the conductive layer is preferably provided as coplanar and/or thin tin oxide films, e.g. indium tin oxide (ITO) films, and may be applied by any suitable method such as chemical vapour deposition (CVD) coatings or magnetron (sputtered) coatings, thus providing an electrically conductive layer.
  • the conductive layer can also be provided as metallic layer(s) or layer(s) made of any suitable electrically conductive material.
  • the conductive layer can also be applied by other methods such as serigraphy, screen printing, and other suitable method.
  • the conductive layer may comprises an underlying coating comprising a conductive oxide such as silicon oxide carbide and an overlying coating comprising a conductive metal oxide such as SnO 2 IF.
  • the conductive layer may also comprises a substantially color neutral coating stack, e.g. a chemical vapor deposition (CVD) coating stack comprising a silicon oxide carbide undercoat and an overlying SnO 2 IF coating, wherein the coating has preferably a resistance of about 15 ohms per square.
  • a substantially color neutral coating stack e.g. a chemical vapor deposition (CVD) coating stack comprising a silicon oxide carbide undercoat and an overlying SnO 2 IF coating, wherein the coating has preferably a resistance of about 15 ohms per square.
  • CVD chemical vapor deposition
  • Fig. 3 shows a schematic implementation of an electronic array according to an em- bodiment of the invention.
  • An electronic unit 3 is arranged in series with other electronic units 3.
  • the electronic units can be arranged on a conductive layer applied to a glass panel. Insulating stripes and regions can be removed from the conductive layer, e.g. by etching or laser ablation, to provide conductive paths and isolated regions. Alternatively the conductive paths and isolated regions may be provided be depositing a conductive layer in the relevant pattern.
  • the electronic units 3 are deposited and fixed in electrical contact with the conductive paths.
  • the data path 4 shown in Fig. 3 is represented by a bus of differential type.
  • the bus is also provided by paths in the conductive layer on the glass panel.
  • the bus provides signals to each electronic unit in a range of a common mode voltage which is compatible with the characteristics of each respective electronic unit in the chain of the plurality of electronic units. This can be obtained in the following way: On one side of the data path 4, there is a driver which transmits the data in a differential form under a common mode voltage U MCH close to the most positive voltage on the substrate 5, and, on the other hand, there is a driver sending the same data under a common mode voltage U MCL close to the most negative voltage at the substrate 5.
  • the data path 4 comprises the sum of n times the resistance R SD , wherein n indicates the number of electronic units connected in series to one another.
  • the resistance R SD is provided as conductive paths adjacent to the network of electronic units, i.e. the conductive paths in the conductive layer of a glass panel are arranged adjacent to the network of electronic units 3.
  • Fig. 4 shows a schematic implementation of an electronic unit according to a embodiment of the invention.
  • the unit shown in Fig. 4 can be one of the electronic units 3 of Fig. 3.
  • the dynamic impedance of the bipolar unit is practically zero in the range of the operational current (e.g. in comparison with the resistance of the conductive paths formed in the conductive layer on the substrate, e.g. glass substrate).
  • a large range of electric current is admissible through the electronic unit independent of its functionality. This means that the electric current flowing through an electronic unit equals i lin and i lout .
  • Each electronic unit is individually addressable, independently of the operational state or functional state of the other electronic units being connected in series in the chain of the plurality of electronic units.
  • each electronic unit 3 preferably remains insensitive to the electric current flowing through it, as the latter may be substantially larger than the current needed for the electronic unit in its actual operational state. According to other preferred embodiments of the invention, also other physical parameters different from the electric current are used. Furthermore, the functioning of the electronic unit preferably has electrically no influence on the rest of the electronic units in the electronic array.
  • the changing needs in electric current for the functioning of the electronic unit preferably does not allow a variation of the voltage drop at its contacts.
  • This can be achieved, for example, by means of an ideal Zener diode.
  • a conventional Zener diode needs an operational voltage which is important in order to present a small dynamic resistance.
  • this dynamic resistance remains negligible at the optimal operational point.
  • what has to be achieved is a functionality equivalent to a smaller operational electric current, a smaller dynamic resistance and an impor- tant possibility of thermal dissipation.
  • Fig. 4 representing an embodiment of the invention.
  • the principle involves using an integrated circuit ICl which allows regulation of a voltage of a Zener diode and which can be regulated in a more precise way.
  • an amplifier in the form of an external transistor Ql is added.
  • the regulated operational voltage used by the operational part of the electronic unit is defined by the ratio of the resistances (R3 + R4)/R4 multiplied by the internal reference voltage of ICl that corresponds to one or a few Volts.
  • ICl needs an electric current of a few milliamperes or less in order to function properly.
  • the impedance of the electronic unit decreases and, therefore, forces a larger current to flow through it.
  • a part of the electric current flows through the load thereby causing a voltage drop at the contacts of the bipolar unit.
  • the regulating part will consume the electric current i 2 needed to maintain the electric voltage at the contacts of the functional block 11 at a constant level, independent of the electric current i 3 which flows through the electronic unit.
  • i 3 can be decomposed in i 31 which is approximately constant and which is consumed by the control unit 7 or control electronics, respectively, and i 32 which is the electric current consumed by the load unit 9 (for instance one single color LED or a RGB LED) of the electronic unit.
  • i 32 can be excessively variable.
  • i 2 can be decomposed in i 21 which is the variable deviated current, further in i 22 which is quasi constant and small and which supplies ICl, and finally in i 23 which is constant in a resistive dividing bridge.
  • the current i 32 also flows through the driver unit 8 which is connected in parallel to the load unit 9.
  • i 32 is integrally com- pensated by i 21 .
  • Cl is used for stabilizing the entire regulation process.
  • the use of the resistance Rl shows two effects: Firstly, it is used for dissipating the power which is not used by the functional block 11. Indeed, as the electronic unit functions at a constant voltage, the principle applied for the electric currents can be extended to powers as well. In order not to overload Ql, an external resistance of appropriate power distributes the dissipated power. Secondly, it also allows by measuring the voltage at its contacts, to measure the quantity of deviated current which allows the control unit 7 to manage the available extra current.
  • i 21 must always be larger than zero.
  • the value of the resistance Rl must then be selected in an adequate way so that the voltage at its contacts is sufficient for causing a voltage drop which can be used. However, it is not likely that the transistor Ql is brought to saturation.
  • the absolute operational voltages at the contacts of the electronic units will also be constant.
  • the absolute operational voltages will be predictable and linearly increasing in a dimension of the electronic array.
  • the data path can be implemented as described in context with the first embodiment of the invention.
  • the common mode voltage at the places directly adjacent to the electronic units will be rather close to the voltage present at the electronic units.
  • the difference in potential of common mode should also be quasi constant between the connection point of the electronic unit on the data path and the electronic unit itself.
  • a simple differential connection may thus be converted into a conventional digital signal by a receiver which is sufficiently tolerant to the differences in the potential of common mode.
  • the signal may then be sent to a control unit which is comprised by the electronic unit, for instance to a microcontroller through a suitable interface such as a Universal Asynchro- nous Receiver/Transmitter (UART) input.
  • UART Universal Asynchro- nous Receiver/Transmitter
  • each electronic unit shows a unique address information
  • each electronic unit can be addressed in an individual way through an appropriate protocol, whereby each electronic unit receives all the data but filters the data directed to the respective electronic unit.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Abstract

L'invention concerne un réseau électronique comprenant un module d'alimentation (6), une pluralité de modules électroniques étant disposés en série entre eux et chaque module électronique de la pluralité de modules électroniques comportant un module de gestion conçu pour gérer individuellement chacun des modules électroniques composant la pluralité de modules électroniques. On obtient ainsi un réseau électronique simple, bon marché et constamment prêt à l'emploi, adapté, de préférence, aux applications de circuits électroniques.
EP09779020A 2009-02-06 2009-02-06 Réseau électronique comprenant une pluralité de modules électroniques Withdrawn EP2394494A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2009/051362 WO2010088961A1 (fr) 2009-02-06 2009-02-06 Réseau électronique comprenant une pluralité de modules électroniques

Publications (1)

Publication Number Publication Date
EP2394494A1 true EP2394494A1 (fr) 2011-12-14

Family

ID=41211839

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09779020A Withdrawn EP2394494A1 (fr) 2009-02-06 2009-02-06 Réseau électronique comprenant une pluralité de modules électroniques

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