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EP2385447B1 - Appareil électronique à commande tactile et procédé d'assemblage connexe - Google Patents

Appareil électronique à commande tactile et procédé d'assemblage connexe Download PDF

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Publication number
EP2385447B1
EP2385447B1 EP10009652.8A EP10009652A EP2385447B1 EP 2385447 B1 EP2385447 B1 EP 2385447B1 EP 10009652 A EP10009652 A EP 10009652A EP 2385447 B1 EP2385447 B1 EP 2385447B1
Authority
EP
European Patent Office
Prior art keywords
touch
area
plane
flexible pcb
electronic apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP10009652.8A
Other languages
German (de)
English (en)
Other versions
EP2385447A1 (fr
Inventor
Hsin-Hao Lee
Chia-Jun Chia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HTC Corp
Original Assignee
HTC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HTC Corp filed Critical HTC Corp
Publication of EP2385447A1 publication Critical patent/EP2385447A1/fr
Application granted granted Critical
Publication of EP2385447B1 publication Critical patent/EP2385447B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads

Definitions

  • the present invention relates to a touch-controlled electronic apparatus and a related fabricating method according to the pre-characterizing clauses of claims 1 and 8.
  • buttons such as metal dome keypads, hardwire switches, or resistive buttons
  • these mechanical buttons will not only increase the thickness of the electronic products but also cause problems of surface discontinuity. For this reason, designs with flat buttons can be adopted to replace the conventional mechanical buttons.
  • a capacitive touch panel is commonly used for implementing the flat buttons, which can provide touch functions of both a touch display area and a touch button area at the same time.
  • conductive patterns e.g., conductive patterns composed of indium tin oxide (ITO) or indium zinc oxide (IZO)
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • the width of the wire area will be increased if the display touch area gets larger. For this reason, the touch button will be constricted. The smaller touch button area will cause the sensor area to be too small, which leads to a poor sensor sensitivity.
  • US 2010/033443 A1 discloses a display device having a capacitive touch panel with intersecting electrodes formed thereon, wherein signal lines for supplying the electrodes with signals are formed on a flexible printed circuit board, the signal paths are branched into a plurality of lines, and lines that run across a back surface of the printed circuit board can orthogonally intersect with lines that run across a front surface of the printed circuit board.
  • the gaps between the electrodes improve the detecting sensitivity of the touch panel.
  • US 2009/255737 A1 discloses a device having a first sensing layer having a plurality of conductive lines which are electrically isolated from each other and a second sensing layer having a plurality of conductive lines which are electrically isolated from each other.
  • the first sensing layer and the second sensing layer are coupled to a sensing unit by means of outside connection conducting wires coupled to the conductive lines.
  • the electrical isolation of the conductive lines increases the accuracy of each sensing layer.
  • US 2009/0244029 A1 discloses a sensing device which includes an equalizer for equalizing detected sensing values from a capacitive touch panel. This equalization corrects for attenuation resulting from increased distance from sensor pads, and can therefore improve the positioning accuracy for the touch panel.
  • the present invention aims at providing a touch-controlled electronic apparatus and a related fabricating method that solves erroneous sensing problems of touch buttons under considerations of a fixed-scaled touch panel and industrial designs.
  • the claimed a touch-controlled electronic apparatus includes a loading plate, a touch panel, a flexible PCB, a sensor pad, and a control circuit.
  • the loading plate has a display touch area, a wire area, and a first hot bonding area.
  • the touch panel is disposed on the display touch area of the loading plate, for displaying images and receiving a first touch to generate a first touch signal.
  • the flexible PCB has at least a touch button area and a control circuit area.
  • the sensor pad is disposed on the touch button area of the flexible PCB, and is used as a touch button for detecting a second touch to generate a second touch signal.
  • the control circuit is disposed on the control circuit area of the flexible PCB and electronically connected to the touch panel and the sensor pad, for reading the first touch signal as well as the second touch signal to respectively generate a first control signal as well as a second control signal, and for determining a first position of the first touch and a second position of the second touch according to the first control signal and the second control signal, respectively.
  • the flexible PCB is disposed and bonded to the loading plate, and the touch button area is disposed on at least one of the wire area and the first hot bonding area.
  • the claimed method includes the steps of: providing a loading plate having a display touch area, a wire area, and a first hot bonding area; disposing a touch panel on the display touch area of the loading plate; providing a flexible PCB having at least a touch button area and a control circuit area; disposing a sensor pad on the touch button area of the flexible PCB, wherein the sensor pad is used as a touch button; disposing a control circuit on the control circuit area of the flexible PCB, and electronically connecting the control circuit to the touch panel and the sensor pad; and disposing and bonding the flexible PCB to the loading plate, such that the touch button area is disposed on at least one of the wire area and the first hot bonding area.
  • FIG.1 is a diagram illustrating a touch-controlled electronic apparatus 100 according to the prior art.
  • the touch-controlled electronic apparatus 100 includes a loading plate 1100 and a touch panel (in order to clearly present the figure, the touch panel is not marked in FIG.1 ).
  • the loading plate 1100 has a display touch area 1110, a touch button area 1120, a wire area 1130, and a hot bonding area 1140.
  • the touch panel is disposed on both the display touch area 1110 and the touch button area 1120 of the loading board 1100.
  • a part of the touch panel is used for displaying images (i.e., the part of touch panel disposed upon the display touch area 1110), while another part of the touch panel is used as touch buttons (i.e., the part of the touch panel disposed upon the touch button 1120).
  • conductive patterns e.g., conductive patterns composed of ITO or IZO
  • the capacitive sensor differences of the conductive patterns can be calculated by the controller in order to obtain the position of touches.
  • the size of touch button area will cause the obstruction in designing the appearance and the length of the electronic products, as is shown in FIG.1 .
  • the width of the wire area 1130 will be increased if the display touch area 1110 gets larger. For this reason, the touch button area 1120 will be constricted. The smaller touch button area 1120 will cause the sensor area is too small, which leads to a poor sensor sensitivity.
  • FIG.2 is diagram illustrating the architecture and the fabrication of a touch-controlled electronic apparatus 200 according to an embodiment of the present invention.
  • the touch-controlled electronic apparatus 200 includes, but is not limited to, a loading plate 2100, a touch panel 2300, a flexible printed circuit board (PCB) 2200, a sensor pad 240, and a control circuit 250.
  • the loading plate 2100 has a third plane 2100A and a fourth plane 2100B opposite to the third plane 2100A, wherein the third plane 2100A is divided into a display touch area 2110, a wire area 2130, and a first hot bonding area 2140.
  • the touch panel 2300 is disposed on the display touch area 2110 of the loading plate 2100, for displaying images and receiving a first touch to generate a first touch signal.
  • the flexible PCB 2200 has a first plane 2200A and a second plane 2200B opposite to the first plane 2200A. Please also refer to FIG.3.
  • FIG.3 (including 3A and 3B) illustrates a top view and a bottom view of the flexible PCB 2200 shown in FIG.2 .
  • the first plane 2200A of the flexible PCB 2200 is divided into at least a touch button area 2210 and a control circuit area 2220.
  • the sensor pad 240 is disposed on the touch button area 2210 of the flexible PCB 2200, and is used as a touch button for detecting a second touch to generate a second touch signal.
  • the control circuit 250 is disposed on the control circuit area 2220 of the first plane 2200A of the flexible PCB 2200 and electronically connected to the touch panel 2300 and the sensor pad 240, for reading the first touch signal as well as the second touch signal to respectively generate a first control signal as well as a second control signal, and for determining a first position of the first touch and a second position of the second touch according to the first control signal and the second control signal, respectively.
  • the second plane 2200B of the flexible PCB 2200 has a second hot bonding area 2230.
  • the second plane 2200B of the flexible PCB 2200 contacts and bonds to the third plane 2100A of the loading plate 2100 (as is shown in FIG.2 ), such that the second hot bonding area 2230 overlays the first hot bonding area 2140.
  • a first contact pad 260 is disposed on the first hot bonding area 2140 of the loading plate 2100 (as is shown in FIG.2 ), and a second contact pad 270 is disposed on the second hot bonding area 2230 of the flexible PCB 2200 (as is shown in 3B).
  • the first contact pad 260 is hot bonded to the second contact pad 270, such that the control circuit 250 is able to electrically connected to the touch panel 230 via the first contact pad 260 and the second contact pad 270.
  • the flexible PCB 2200 is disposed and bonded to the loading plate 2100
  • the touch button area 2210 of the flexible PCB 2200 is disposed on at least one of the wire area 2130 and the first hot bonding area 2140 of the loading plate 2100.
  • the touch button area 2210 overlays both the wire area 2130 and the first hot bonding area 2140, such that the sensing area of the touch button can be maximized in order to get a better sensor sensitivity.
  • this is not meant to be a limitation of the present invention.
  • the touch button area 2210 may overlay the wire area 2130, the first hot bonding area 2140, and a part of the display touch area 2110, which also belongs to the scope of the present invention.
  • the abovementioned touch-controlled electronic apparatus 200 can be a mobile phone, a personal digital assistant (PDA), a PDA phone or a smart phone. But this should not be considered as limitations of the present invention, and the touch-controlled electronic apparatus 200 can be a touch-controlled electronic apparatus of other types.
  • the sensor pad 240 can be composed of a copper material, and the copper material may include a particular conductive pattern, but the present invention is not limited to this only.
  • the touch-controlled electronic apparatus disclosed in the present invention utilizes the flexible PCB 2200 to design touch buttons on it (i.e., the touch button area 2210). Since the touch button area 2210 overlays at least the wire area 2130 and the first hot bonding area 2140, the display touch area 2110 can be maximized and the sensing area of the touch button area 2210 can be significantly improved under a fixed-scaled touch panel. Besides, the touch buttons disclosed in the present invention adopt a design of flat buttons, which can confirm to considerations of industrial designs and product appearance.
  • FIG.4 is a diagram illustrating exemplary embodiments of the particular conductive patterns of the sensor pad 240 shown in FIG.2 .
  • the particular conductive patterns of the sensor pad 240 can be a square (such as the particular conductive pattern 410 shown in 4A), a triangle (such as the particular conductive pattern 420 shown in 4B), or an irregular shape (such as the particular conductive pattern 430 shown in 4C). That is to say, the particular conductive patterns of the sensor pad 240 are not limited.
  • Those skilled in the art should appreciate that various modifications of the particular conductive patterns of the sensor pad 240 may be made, which can be designed depending upon actual demands.
  • FIG.5 is a flowchart illustrating a method for fabrication a touch-controlled electronic apparatus according to an exemplary embodiment of the present invention. Please note that the following steps are not limited to be performed according to the exact sequence shown in FIG.5 if a roughly identical result can be obtained.
  • the method includes, but is not limited to, the following steps:
  • Step 500 Start.
  • Step 502 Provide a loading plate having a display touch area, a wire area, and a first hot bonding area.
  • Step 504 Dispose a touch panel on the display touch area of the loading plate.
  • Step 506 Provide a flexible PCB having at least a touch button area and a control circuit area.
  • Step 508 Dispose a sensor pad on the touch button area of the flexible PCB, wherein the sensor pad is used as a touch button.
  • Step 510 Dispose a control circuit on the control circuit area of the flexible PCB.
  • Step 512 Dispose and bond the flexible PCB to the loading plate, such that the touch button area is disposed on at least one of the wire area and the first hot bonding area.
  • Step 514 Electronically connect the control circuit to the touch panel and the sensor pad.
  • the loading plate 2100 is provided, and the third plane 2100A of the loading plate 2100 has the display touch area 2110, the wire area 2130, and the first hot bonding area 2140 (the step 502).
  • the touch panel 2300 is disposed on the display touch area 2110 of the loading plate 2100 (the step 504).
  • the flexible PCB 2200 is provided, and the first plane 2200A of the flexible PCB 2200 has at least the touch button area 2210 and the control circuit area 2220 (the step 506).
  • the sensor pad 240 is disposed on the touch button area 2210 of the flexible PCB 2200, and is used as touch buttons (the step 508).
  • the control circuit 250 is disposed on the control circuit area 2220 of the flexible PCB 2200(the step 510).
  • the flexible PCB 2200 is disposed and bonded to the loading plate 2100, such that the touch button area 2210 can be disposed on at least one of the wire area 2130 and the first hot bonding area 2140 (the step 512).
  • the touch button area 2210 overlays both the wire area 2130 and the first hot bonding area 2140.
  • the control circuit 250 is electronically connected to touch panel 2300 (for example, the first contact pad 260 and the second contact pad 270 can be utilized for electronically connecting the control circuit 250 to the touch panel 2300) and the sensor pad 240 (the step 514).
  • the present invention provides a touch-controlled electronic apparatus and a related fabricating method.
  • a flexible PCB is utilized in the touch-controlled electronic apparatus disclosed in the present invention so as to design the touch buttons on it (i.e., the touch button area 2210). Since the touch button area 2210 overlays at least the wire area 2130 and the first hot bonding area 2140 of the loading plate 2100, the display touch area 2110 can be maximized and the sensing area of the touch button area 2210 can be significantly improved to obtain a better sensor sensitivity under a fixed-scaled touch panel. Besides, by collocating the touch-controlled electronic apparatus together with its fabrication disclosed in the present invention, traditional mechanical buttons can be replaced and a design of flat touch buttons can be achieved, which can confirm to considerations of industrial designs and product appearance.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)

Claims (11)

  1. Appareil électronique à commande tactile (200), comprenant :
    une plaque support (2100), comportant une zone tactile d'affichage (2110), une zone de fils (2130) et une première zone de liaison à chaud (2140) ;
    un panneau tactile (2300), disposé sur la zone tactile d'affichage (2110) de la plaque support (2100), pour afficher des images et recevoir une première action tactile pour générer un premier signal tactile ;
    une carte de circuit imprimé souple (PCB) (2200), comportant au moins une zone de bouton tactile (2210) et une zone de circuit de commande (2220) ;
    caractérisé par
    un pavé sensible (240), disposé sur la zone de bouton tactile (2210) du PCB souple (2200), et utilisé comme bouton tactile pour détecter une deuxième action tactile pour générer un deuxième signal tactile ; et
    un circuit de commande (250), disposé sur la zone de circuit de commande (2220) du PCB souple (2200) et connecté électroniquement au panneau tactile (2300) et au pavé sensible (240), pour lire le premier signal tactile ainsi que le deuxième signal tactile pour générer respectivement un premier signal de commande ainsi qu'un deuxième signal de commande, et pour déterminer une première position de la première action tactile et une deuxième position de la deuxième action tactile en fonction du premier signal de commande et du deuxième signal de commande, respectivement ;
    dans lequel le PCB souple (2200) est fixé à la plaque support (2100), et la zone de bouton tactile (2210) est disposée sur au moins l'une des zones de fils (2130) et de la première zone de liaison à chaud (2140).
  2. Appareil électronique à commande tactile (200) selon la revendication 1, caractérisé en ce que le PCB souple (2200) comprend un premier plan (2200A) et un deuxième plan (2200B) opposé au premier plan (2200A), et le premier plan (2200A) est divisé en la zone de bouton tactile (2210) et la zone de circuit de commande (2220).
  3. Appareil électronique à commande tactile (200) selon la revendication 2, caractérisé en ce que la plaque support (2100) comprend un troisième plan (2100A) et un quatrième plan (2100B) opposé au troisième plan (2100A) ; le troisième plan (2100A) est divisé en la zone tactile d'affichage (2110), la zone de fils (2130) et la première zone de liaison à chaud (2140) ; et le deuxième plan (2200B) du PCB souple (2200) contacte et est relié au troisième plan (2100A) de la plaque support (2100).
  4. Appareil électronique à commande tactile (200) selon la revendication 2, caractérisé en ce que le PCB souple (2200) comprend en outre une deuxième zone de liaison à chaud (2230), et la deuxième zone de liaison à chaud (2230) est située sur le deuxième plan (2200B) et recouvre la première zone de liaison à chaud (2140).
  5. Appareil électronique à commande tactile (200) selon la revendication 4, caractérisé en ce que l'appareil électronique à commande tactile (200) comprend en outre :
    un premier pavé de contacts (260), disposé sur la première zone de liaison à chaud (2140) ; et
    un deuxième pavé de contacts (270), disposé sur la deuxième zone de liaison à chaud (2230) ;
    dans lequel le premier pavé de contacts (260) est relié au deuxième pavé de contacts (270), et le circuit de commande (250) est connecté électriquement au panneau tactile (2300) par l'intermédiaire du premier pavé de contacts (260) et du deuxième pavé de contacts (270).
  6. Appareil électronique à commande tactile (200) selon la revendication 1, caractérisé en ce que le pavé sensible (240) est composé d'un matériau de cuivre, et que le matériau de cuivre comprend un motif conducteur particulier.
  7. Appareil électronique à commande tactile (200) selon la revendication 1, caractérisé en ce que l'appareil électronique à commande tactile (200) est un téléphone mobile, un assistant numérique personnel (PDA), un téléphone PDA ou un téléphone intelligent.
  8. Procédé pour fabriquer un appareil électronique à commande tactile (200), comprenant les étapes suivantes :
    prévoir une plaque support (2100) comportant une zone tactile d'affichage (2110), une zone de fils (2130) et une première zone de liaison à chaud (2140) ;
    disposer un panneau tactile (2300) sur la zone tactile d'affichage (2110) de la plaque support (2100) ;
    caractérisé par les étapes suivantes :
    prévoir un PCB souple (2200) comportant au moins une zone de bouton tactile (2210) et une zone de circuit de commande (2220) ;
    disposer un pavé sensible (240) sur la zone de bouton tactile (2210) du PCB souple (2200), le pavé sensible (240) étant utilisé comme bouton tactile ;
    disposer un circuit de commande (250) sur la zone de circuit de commande (2220) du PCB souple (2200), et connecter électroniquement le circuit de commande (250) au panneau tactile (2300) et au pavé sensible (240) ; et
    fixer le PCB souple (2200) à la plaque support (2100), de telle sorte que la zone de bouton tactile (2210) soit disposée sur au moins l'une de la zone de fils (2130) et de la première zone de liaison à chaud (2140).
  9. Procédé selon la revendication 8, caractérisé en ce que le PCB souple (2200) comprend un premier plan (2200A) et un deuxième plan (2200B) opposé au premier plan (2200A), et le premier plan (2200A) est divisé en la zone de bouton tactile (2210) et la zone de circuit de commande (2220) ; la plaque support (2100) comprend un troisième plan (2100A) et un quatrième plan (2100B) opposé au troisième plan (2100A), et le troisième plan (2100A) est divisé en la zone tactile d'affichage (2110), la zone de fils (2130) et la première zone de liaison à chaud (2140) ; et le procédé comprend en outre l'étape suivante :
    mettre le deuxième plan (2200B) du PCB souple (2200) en contact et en liaison avec le troisième plan (2100A) de la plaque support (2100).
  10. Procédé selon la revendication 9, caractérisé en ce que le PCB souple (2200) comprend en outre une deuxième zone de liaison à chaud (2230) située sur le deuxième plan (2200B) ; et le procédé comprend en outre l'étape suivante :
    fixer le PCB souple (2200) à la plaque support (2100) de telle sorte que la deuxième zone de liaison à chaud (2230) recouvre la première zone de liaison à chaud (2140).
  11. Procédé selon la revendication 10, caractérisé en ce que l'appareil électronique à commande tactile (200) comprend en outre un premier pavé de contacts (260) et un deuxième pavé de contacts (270), disposés respectivement sur la première zone de liaison à chaud (2140) et la deuxième zone de liaison à chaud (2230) ; et le procédé comprend en outre l'étape suivante :
    fixer le PCB se souple (2200) sur la plaque support (2100), et relier le premier pavé de contacts (260) et le deuxième pavé de contacts (270) ; et
    connecter électriquement le circuit de commande (250) au panneau tactile (2300) en utilisant le premier pavé de contacts (260) et le deuxième pavé de contacts (270).
EP10009652.8A 2010-05-03 2010-09-15 Appareil électronique à commande tactile et procédé d'assemblage connexe Not-in-force EP2385447B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099114071A TWI420364B (zh) 2010-05-03 2010-05-03 觸控式電子裝置及其相關組裝方法

Publications (2)

Publication Number Publication Date
EP2385447A1 EP2385447A1 (fr) 2011-11-09
EP2385447B1 true EP2385447B1 (fr) 2013-04-24

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US (1) US8866755B2 (fr)
EP (1) EP2385447B1 (fr)
TW (1) TWI420364B (fr)

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EP2385447A1 (fr) 2011-11-09
TWI420364B (zh) 2013-12-21
TW201140388A (en) 2011-11-16
US20110267284A1 (en) 2011-11-03

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