EP2342370A4 - Novel cyanide-free electroplating process for zinc and zinc alloy die-cast components - Google Patents
Novel cyanide-free electroplating process for zinc and zinc alloy die-cast componentsInfo
- Publication number
- EP2342370A4 EP2342370A4 EP09818155.5A EP09818155A EP2342370A4 EP 2342370 A4 EP2342370 A4 EP 2342370A4 EP 09818155 A EP09818155 A EP 09818155A EP 2342370 A4 EP2342370 A4 EP 2342370A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- zinc
- electroplating process
- alloy die
- cast components
- free electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/244,156 US20100084278A1 (en) | 2008-10-02 | 2008-10-02 | Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components |
| PCT/US2009/050937 WO2010039323A1 (en) | 2008-10-02 | 2009-07-17 | Novel cyanide-free electroplating process for zinc and zinc alloy die-cast components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2342370A1 EP2342370A1 (en) | 2011-07-13 |
| EP2342370A4 true EP2342370A4 (en) | 2014-09-10 |
Family
ID=42073800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09818155.5A Withdrawn EP2342370A4 (en) | 2008-10-02 | 2009-07-17 | Novel cyanide-free electroplating process for zinc and zinc alloy die-cast components |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100084278A1 (en) |
| EP (1) | EP2342370A4 (en) |
| JP (1) | JP2012504704A (en) |
| CN (1) | CN102131960A (en) |
| TW (1) | TWI448590B (en) |
| WO (1) | WO2010039323A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI482878B (en) * | 2012-11-09 | 2015-05-01 | Ind Tech Res Inst | Acidic electroless copper plating system and copper plating method using the same |
| CN107142502A (en) * | 2017-05-15 | 2017-09-08 | 佛山市兴中达化工实业有限公司 | A kind of replacement has the direct plating of cyanogen alkali copper in the non-cyanogen electro-plating method of kirsite matrix |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3691027A (en) * | 1970-06-16 | 1972-09-12 | Allied Chem | Method of producing corrosion resistant chromium plated articles |
| US4904354A (en) * | 1987-04-08 | 1990-02-27 | Learonal Inc. | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof |
| JPH03115594A (en) * | 1990-04-25 | 1991-05-16 | Nippon Steel Corp | Restproof steel sheet having superior corrosion resistance |
| US20010015321A1 (en) * | 1998-10-26 | 2001-08-23 | Reid Jonathan D. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| WO2006052310A2 (en) * | 2004-11-10 | 2006-05-18 | Macdermid, Incorporated | Nickel electroplating bath designed to replace monovalent copper strike solutions |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2989446A (en) * | 1956-10-29 | 1961-06-20 | Rockwell Standard Co | Electroplating |
| US3202589A (en) * | 1963-09-12 | 1965-08-24 | Diamond Alkali Co | Electroplating |
| US3928147A (en) * | 1973-10-09 | 1975-12-23 | Monsanto Co | Method for electroplating |
| US4469569A (en) * | 1983-01-03 | 1984-09-04 | Omi International Corporation | Cyanide-free copper plating process |
| US4462874A (en) * | 1983-11-16 | 1984-07-31 | Omi International Corporation | Cyanide-free copper plating process |
| US4488942A (en) * | 1983-08-05 | 1984-12-18 | Omi International Corporation | Zinc and zinc alloy electroplating bath and process |
| US4521282A (en) * | 1984-07-11 | 1985-06-04 | Omi International Corporation | Cyanide-free copper electrolyte and process |
| JPS6353285A (en) * | 1986-08-22 | 1988-03-07 | Nippon Hyomen Kagaku Kk | Zinc-nickel alloy plating solution |
| JPH01219188A (en) * | 1988-02-26 | 1989-09-01 | Okuno Seiyaku Kogyo Kk | Zinc-nickel alloy plating bath |
| US5750018A (en) * | 1997-03-18 | 1998-05-12 | Learonal, Inc. | Cyanide-free monovalent copper electroplating solutions |
| US6054037A (en) * | 1998-11-11 | 2000-04-25 | Enthone-Omi, Inc. | Halogen additives for alkaline copper use for plating zinc die castings |
| JP4864256B2 (en) * | 2001-09-26 | 2012-02-01 | 石原薬品株式会社 | Tin plating bath for preventing whisker and tin plating method |
| US6827834B2 (en) * | 2002-03-12 | 2004-12-07 | Ronald Stewart | Non-cyanide copper plating process for zinc and zinc alloys |
| US20080156652A1 (en) * | 2006-12-28 | 2008-07-03 | Chang Gung University | Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof |
-
2008
- 2008-10-02 US US12/244,156 patent/US20100084278A1/en not_active Abandoned
-
2009
- 2009-07-17 WO PCT/US2009/050937 patent/WO2010039323A1/en not_active Ceased
- 2009-07-17 EP EP09818155.5A patent/EP2342370A4/en not_active Withdrawn
- 2009-07-17 CN CN2009801329507A patent/CN102131960A/en active Pending
- 2009-07-17 JP JP2011530078A patent/JP2012504704A/en active Pending
- 2009-08-12 TW TW098127087A patent/TWI448590B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3691027A (en) * | 1970-06-16 | 1972-09-12 | Allied Chem | Method of producing corrosion resistant chromium plated articles |
| US4904354A (en) * | 1987-04-08 | 1990-02-27 | Learonal Inc. | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof |
| JPH03115594A (en) * | 1990-04-25 | 1991-05-16 | Nippon Steel Corp | Restproof steel sheet having superior corrosion resistance |
| US20010015321A1 (en) * | 1998-10-26 | 2001-08-23 | Reid Jonathan D. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| WO2006052310A2 (en) * | 2004-11-10 | 2006-05-18 | Macdermid, Incorporated | Nickel electroplating bath designed to replace monovalent copper strike solutions |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2010039323A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2342370A1 (en) | 2011-07-13 |
| WO2010039323A1 (en) | 2010-04-08 |
| JP2012504704A (en) | 2012-02-23 |
| US20100084278A1 (en) | 2010-04-08 |
| TW201014934A (en) | 2010-04-16 |
| CN102131960A (en) | 2011-07-20 |
| TWI448590B (en) | 2014-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20110426 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
| AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20140811 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 5/10 20060101ALI20140805BHEP Ipc: C25D 5/14 20060101ALN20140805BHEP Ipc: C25D 5/12 20060101ALI20140805BHEP Ipc: C25D 3/56 20060101AFI20140805BHEP |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20150310 |