EP2101951A4 - Pb-free solder alloy - Google Patents

Pb-free solder alloy

Info

Publication number: EP2101951A4
Authority: EP; European Patent Office
Prior art keywords: free solder; solder alloy; alloy; free; solder
Prior art date: 2006-12-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP07860735A

Other languages

German (de)

French (fr)

Other versions

EP2101951A1 (en

Inventor

Dong-Nyung Lee

Sang-Beom Kim

Kyoo-Sik Kang

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Iljin Copper Foil Co Ltd

Original Assignee

Iljin Copper Foil Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-12-29

Filing date

2007-12-28

Publication date

2010-01-27

2007-12-28 Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd

2009-09-23 Publication of EP2101951A1 publication Critical patent/EP2101951A1/en

2010-01-27 Publication of EP2101951A4 publication Critical patent/EP2101951A4/en

Status Withdrawn legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Manufacture Of Alloys Or Alloy Compounds (AREA)

EP07860735A 2006-12-29 2007-12-28 Pb-free solder alloy Withdrawn EP2101951A4 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
KR20060138548		2006-12-29
PCT/KR2007/006951 WO2008082191A1 (en)	2006-12-29	2007-12-28	Pb-free solder alloy
KR1020070139767A KR101042031B1 (en)	2006-12-29	2007-12-28	Lead free solder alloy

Publications (2)

Publication Number	Publication Date
EP2101951A1 EP2101951A1 (en)	2009-09-23
EP2101951A4 true EP2101951A4 (en)	2010-01-27

Family

ID=39815104

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP07860735A Withdrawn EP2101951A4 (en)	2006-12-29	2007-12-28	Pb-free solder alloy

Country Status (7)

Country	Link
US (1)	US20100092335A1 (en)
EP (1)	EP2101951A4 (en)
JP (1)	JP5210323B2 (en)
KR (2)	KR101042031B1 (en)
CN (1)	CN101588889A (en)
TW (1)	TWI366497B (en)
WO (1)	WO2008082191A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN101588889A (en)	2006-12-29	2009-11-25	日进素材产业株式会社	Pb-free solder alloy
JP5245568B2 (en) *	2008-06-23	2013-07-24	新日鉄住金マテリアルズ株式会社	Electronic member having lead-free solder alloy, solder ball and solder bump
CN103056543B (en) *	2013-01-18	2015-03-25	江苏师范大学	Lead-free nanometer solder containing Yb, A1 and B
CN105149809B (en) *	2015-10-10	2017-09-26	南京青锐风新材料科技有限公司	It is a kind of suitable for antioxidant of SnAgCu or SnCu solders and preparation method thereof
CN105834612B (en) *	2016-05-04	2018-02-23	中南大学	A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging
CN105834611B (en) *	2016-05-04	2018-02-13	中南大学	A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging
CN107877031A (en) *	2017-11-27	2018-04-06	东莞市千岛金属锡品有限公司	A kind of lead-free low-temperature solder and preparation method thereof
KR20240060350A (en)	2022-10-28	2024-05-08	(주)에버텍엔터프라이즈	Silver paste composition for sinter joining
KR20240146476A (en)	2023-03-29	2024-10-08	(주)에버텍엔터프라이즈	Sintering paste composition for drying shrinkage control

Citations (10)

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Publication number	Priority date	Publication date	Assignee	Title
EP0847828A1 (en) *	1996-10-17	1998-06-17	Matsushita Electric Industrial Co., Ltd	Solder material and electronic part using the same
US5837191A (en) *	1996-10-22	1998-11-17	Johnson Manufacturing Company	Lead-free solder
JP2000015479A (en) *	1998-07-07	2000-01-18	Uchihashi Estec Co Ltd	Solder alloy and mounting method of electronic part
JP2002248596A (en) *	2001-02-27	2002-09-03	Toshiba Tungaloy Co Ltd	Lead-free solder balls with excellent oxidation resistance
US20050123784A1 (en) *	2003-12-02	2005-06-09	Fcm Co., Ltd.	Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
JP2005288478A (en) *	2004-03-31	2005-10-20	Toshiba Corp	Lead-free solder joint
JP2005319470A (en) *	2004-05-06	2005-11-17	Katsuaki Suganuma	Lead-free solder material, electronic circuit board, and manufacturing method thereof
JP2006159265A (en) *	2004-12-09	2006-06-22	Nippon Dempa Kogyo Co Ltd	High temperature solder and cream solder
JP2006159266A (en) *	2004-12-09	2006-06-22	Nippon Dempa Kogyo Co Ltd	Electronic component and method for manufacturing electronic component
JP2006167800A (en) *	2004-12-13	2006-06-29	Nanojoin Kk	Solder, edge face electrode material for metallized film capacitor, metallized film capacitor, and brazing material for aluminum

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2024545A (en) *	1933-10-04	1935-12-17	L D Caulk Company	Dental alloy
US3827884A (en) *	1970-07-15	1974-08-06	Daido Metal Co	Tin based white metal bearing alloys producing good bond with backing material
GB2201545B (en) *	1987-01-30	1991-09-11	Tanaka Electronics Ind	Method for connecting semiconductor material
JP2778171B2 (en) *	1990-01-10	1998-07-23	三菱マテリアル株式会社	Pb alloy solder for semiconductor device assembly
JP3306007B2 (en) *	1998-06-30	2002-07-24	株式会社東芝	Solder material
JP2005288544A (en) *	2004-03-09	2005-10-20	Toshiba Corp	Lead-free solder, soldering method and electronic component
JP2008030047A (en) *	2006-07-26	2008-02-14	Eishin Kogyo Kk	Unleaded solder
CN101588889A (en)	2006-12-29	2009-11-25	日进素材产业株式会社	Pb-free solder alloy

2007
- 2007-12-28 CN CNA200780047594XA patent/CN101588889A/en active Pending
- 2007-12-28 WO PCT/KR2007/006951 patent/WO2008082191A1/en not_active Ceased
- 2007-12-28 EP EP07860735A patent/EP2101951A4/en not_active Withdrawn
- 2007-12-28 JP JP2009543954A patent/JP5210323B2/en active Active
- 2007-12-28 KR KR1020070139767A patent/KR101042031B1/en active Active
- 2007-12-28 US US12/521,655 patent/US20100092335A1/en not_active Abandoned
2008
- 2008-06-26 TW TW097123948A patent/TWI366497B/en active
2010
- 2010-11-22 KR KR1020100116460A patent/KR101165426B1/en not_active Expired - Fee Related

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0847828A1 (en) *	1996-10-17	1998-06-17	Matsushita Electric Industrial Co., Ltd	Solder material and electronic part using the same
US5837191A (en) *	1996-10-22	1998-11-17	Johnson Manufacturing Company	Lead-free solder
JP2000015479A (en) *	1998-07-07	2000-01-18	Uchihashi Estec Co Ltd	Solder alloy and mounting method of electronic part
JP2002248596A (en) *	2001-02-27	2002-09-03	Toshiba Tungaloy Co Ltd	Lead-free solder balls with excellent oxidation resistance
US20050123784A1 (en) *	2003-12-02	2005-06-09	Fcm Co., Ltd.	Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same
JP2005288478A (en) *	2004-03-31	2005-10-20	Toshiba Corp	Lead-free solder joint
JP2005319470A (en) *	2004-05-06	2005-11-17	Katsuaki Suganuma	Lead-free solder material, electronic circuit board, and manufacturing method thereof
JP2006159265A (en) *	2004-12-09	2006-06-22	Nippon Dempa Kogyo Co Ltd	High temperature solder and cream solder
JP2006159266A (en) *	2004-12-09	2006-06-22	Nippon Dempa Kogyo Co Ltd	Electronic component and method for manufacturing electronic component
JP2006167800A (en) *	2004-12-13	2006-06-29	Nanojoin Kk	Solder, edge face electrode material for metallized film capacitor, metallized film capacitor, and brazing material for aluminum

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 1999, YE L ET AL: "Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron", XP002560675, Database accession no. 6364429 *
KARL J . PUTTLITZ AND KATHLEEN A . STALTER: "Chapter 8. Sn-Ag and Sn-Ag-X Solders and Properties", 2004, ISBN: 978-0-8247-4870-8, Retrieved from the Internet <URL:http://www.crcnetbase.com/doi/pdfplus/10.1201/9780203021484.ch8> DOI: 10.1201/9780203021484.ch8 *
See also references of WO2008082191A1 *
YE L ET AL: "Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron", PROCEEDINGS INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS. PROCESSES, PROPERTIES AND INTERFACES (IEEE CAT. NO.99TH8405) IMAPS - INT. MICROELECTRON. & PACKAGING SOC RESTON, VA, USA, 1999, pages 262 - 267, XP002560676, ISBN: 0-930815-56-4 *

Also Published As

Publication number	Publication date
JP2010514931A (en)	2010-05-06
EP2101951A1 (en)	2009-09-23
KR20080063176A (en)	2008-07-03
TWI366497B (en)	2012-06-21
US20100092335A1 (en)	2010-04-15
WO2008082191A1 (en)	2008-07-10
CN101588889A (en)	2009-11-25
TW200927358A (en)	2009-07-01
JP5210323B2 (en)	2013-06-12
KR20100132470A (en)	2010-12-17
KR101042031B1 (en)	2011-06-16
KR101165426B1 (en)	2012-07-12

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Legal Events

Date	Code	Title	Description
2009-08-21	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2009-09-23	17P	Request for examination filed	Effective date: 20090615
2009-09-23	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
2010-01-20	RIC1	Information provided on ipc code assigned before grant	Ipc: C22C 13/00 20060101ALI20091217BHEP Ipc: B23K 35/26 20060101ALI20091217BHEP Ipc: B23K 35/28 20060101AFI20080724BHEP
2010-01-27	A4	Supplementary search report drawn up and despatched	Effective date: 20100104
2010-04-07	DAX	Request for extension of the european patent (deleted)
2010-07-21	17Q	First examination report despatched	Effective date: 20100623
2013-05-31	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2013-07-03	18D	Application deemed to be withdrawn	Effective date: 20130108