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EP2198196B1 - Lampe - Google Patents

Lampe Download PDF

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Publication number
EP2198196B1
EP2198196B1 EP08801964.1A EP08801964A EP2198196B1 EP 2198196 B1 EP2198196 B1 EP 2198196B1 EP 08801964 A EP08801964 A EP 08801964A EP 2198196 B1 EP2198196 B1 EP 2198196B1
Authority
EP
European Patent Office
Prior art keywords
lamp
heat
base
socket
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP08801964.1A
Other languages
German (de)
English (en)
Other versions
EP2198196A1 (fr
Inventor
Wolfgang Pabst
Robert Kraus
Thomas Noll
Ulrich Henger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Ledvance GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ledvance GmbH filed Critical Ledvance GmbH
Publication of EP2198196A1 publication Critical patent/EP2198196A1/fr
Application granted granted Critical
Publication of EP2198196B1 publication Critical patent/EP2198196B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lamp, a lamp and a system of lamp and lamp.
  • thermoelectric cooling or air cooling with a fan, such.
  • air cooling with a fan
  • the US 5,214,354 A shows a control module for controlling the illumination functions of a light bulb and a method for manufacturing the control module.
  • the lamp has a housing and at least one directly or indirectly connected heat source.
  • the lamp further has a base for connection or for engagement with a lamp socket, the socket additionally having at least one heat-conducting surface which does not represent electrical contact, and at least one heat source is thermally conductively connected to at least one heat-dissipating surface which does not represent any electrical contact.
  • thermal conductivity is meant in particular a compound which has a coefficient of thermal conductivity of at least 5 W / (m ⁇ K), especially higher than about 15 W / (m ⁇ K), as is typical for Cr-Ni steel. Also included are the thermal conductivities of thermally conductive pastes, films and Glue. The thermal conductivity makes it possible to dissipate a significant amount of heat from the heat source.
  • This device does not require voluminous or complex active elements.
  • the heat source is generally a heat-emitting element and may in particular comprise a light source and / or a driver circuit.
  • the light source may in particular comprise at least one light-emitting diode and / or one discharge lamp.
  • a discharge lamp a compact fluorescent lamp, in particular an electrodeless compact fluorescent lamp (RCFL) or a high intensity discharge lamp (HID) is preferred.
  • RCFL electrodeless compact fluorescent lamp
  • HID high intensity discharge lamp
  • z As single-color or white LEDs, are understood, but also groups or clusters of LEDs, which together give an additive color mixing. Examples of LED clusters are clusters of the primary colors R, G and B, in particular of the type RGGB. Also included are chains of interconnected LEDs.
  • the base of the bayonet type wherein it frontally (ie to the socket facing the (lower) side) protrudes and on which laterally electrical contacts are formed.
  • the electrical contacts are typically electrically isolated from the remainder of the socket.
  • the base can be used outside the electrical contacts completely as a heat dissipation surface.
  • the heat dissipation surface may include one or more localized zones.
  • the electrical contacts are ironing contacts, which are located on laterally extending from the base webs; in particular if the contacts are arranged on the front side.
  • the electrical contacts are preferably arranged radially symmetrically around the base. Two or four electrical contacts are preferred, but the arrangement is not limited thereto.
  • the base can also be designed as a screw base, for example, with a centrally directed downward heat dissipation surface.
  • a lamp may be preferred in which the socket comprises at least one locking piece for a ball detent.
  • a socket which has at least one laterally arranged electrical contact.
  • the base may have at least one end face, in particular center, arranged electrical contact.
  • a lamp is then particularly preferred in which the at least one electrical contact arranged on the underside simultaneously constitutes a heat dissipation surface.
  • the base may be a socket according to the so-called Gardena principle or construction.
  • a lamp in which there is a heat-conducting element for the heat-conductive connection between the at least one heat source and the at least one heat-dissipating surface.
  • the heat-conducting element has a good thermal conductivity A material, in particular one, whose thermal conductivity coefficient is at least about 5 W / (m ⁇ K), in particular more than about 15 W / (m ⁇ K), as is typical for Cr-Ni steel, and more preferably greater than about 50 W / (m ⁇ K), and more preferably greater than 300 W / (m ⁇ K), e.g. B. comprising copper.
  • a heat conducting element comprising a metal line.
  • a heat-conducting element which has a heat pipe may also be preferred.
  • the heat-conducting element comprises the socket, which may have, for example, metallic inner surfaces.
  • At least one heat dissipation surface is an electrical contact at the same time.
  • a lamp may also be preferred in which at least one heat source is applied to a circuit board and the circuit board is mounted directly on the base or on a heat-dissipating housing. This shortens the heat transport path and enhances heat dissipation.
  • the board then preferably has a metal core or a backside metal surface for uniform heat distribution.
  • a lamp may also be preferred, in which at least one heat source, eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.
  • at least one heat source eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.
  • the height of the pedestal is not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.
  • At least one heat dissipation surface is at least partially covered with a thermally conductive film.
  • a lamp according to one of the preceding claims which additionally has a cylindrical extension on the base, in which an electronic and / or electrical circuit, or a part thereof, is housed.
  • the object is also achieved by a lamp socket for receiving a lamp as described above or by a lamp with such a lamp holder.
  • the heat dissipation surfaces with a cooling element for. B. a cooling plate or cooling fins of the lamp, are thermally conductively connected.
  • the object is also achieved by means of a system with a lamp as described above and a lamp as described above.
  • a heat bonding agent is present between the lamp and socket, e.g. Example by means of a thermally conductive paste or in the form of a thermally conductive foil.
  • the film is preferably easily deformable with high elasticity to increase the contact surface or plastically deformable.
  • the heat-bonding agent may be formed as part of the base or as a separate component.
  • a system is preferred in which the base of the lamp and the socket at least partially have a shape deviation.
  • FIG. 1 shows a lamp 1, which is accommodated in a lamp 2.
  • the lamp 1 has a partially translucent housing 14, which comprises a plurality of light-emitting diodes 3, which are mounted on a circuit board 4 (also called lighting module).
  • a base 5 of the lamp 1 is inserted into a socket 6 of the lamp 2 and thus connected to it electrically and mechanically.
  • each of the light-emitting diodes 3 is connected to a heat-conducting element 7, via which the waste heat is dissipated through the base 5 into the socket.
  • the base 5 a plurality of heat dissipation surfaces 7a, which correspond to the outer surfaces or lower sides of the heat-conducting elements 7, optionally with an additional layer, for. B. of thermally conductive paste or foil.
  • the heat dissipation surfaces 7a are in good thermal contact with a corresponding thermally conductive zone or multiple zones of the socket. In or from the version 6, the heat is passed on to a cooling zone 8.
  • the heat-conducting element 7 in each case comprises a heat pipe ("heat pipe"); the socket can have corresponding heat pipes (not shown), which conduct the heat to the cooling zone 8.
  • electrical or electronic control components which emit heat may also be connected to the socket via heat-conducting elements 7.
  • the heat conducting elements are not formed as heat pipes, but have a good heat conducting material, such as copper, silver or gold.
  • a common heat dissipation surface may be provided for some or all of the heat-conducting elements 7.
  • FIG. 2 shows an alternative embodiment of a system of lamp 9 and lamp 10, in which now the lamp 9 has a single light emitting diode 3, which is mounted on the board 4 and whose heat is conducted via a copper bolt 11 to the cooling surface 8 of the lamp 10.
  • the copper bolt 11 is connected to the cooling surface 8, z.
  • B. a cooling plate, connected by spring contact; its bottom corresponds to the heat dissipation surface 11a.
  • the base here comprises a cylindrical extension 12 ("backpack"), in which an electronic and / or electrical circuit, or a part thereof, is housed.
  • a ballast in particular a smoothing capacitor is at least partially included; This also applies when using a fluorescent lamp instead of the LED 3.
  • the version which is not shown here for clarity, in this case has a corresponding recess.
  • the backpack 12 is designed to heat storage thermally conductive.
  • the backpack 12 also has the electrical or electromechanical contacting and a heat-conducting connection to the lamp or its socket 10.
  • FIG. 3 shows one too FIG. 2 similar embodiment of a lamp 13, but in which now several LEDs 3 arranged symmetrically about a longitudinal axis A ("LED ring") and are connected directly to the heat-conducting cooling zone 15 of the lamp.
  • the direct arrangement of the cooling zone 15 at the bottom of the housing 2 results in a particularly large cooling surface and a short distance to the heat sources 3.
  • the backpack 16 has here the electrical or electromechanical contact with the socket 14 of the lamp and can parts of the Driver electronics or an electrical record.
  • the heat-conducting elements are present as prestressed copper bolts 11.
  • FIG. 4 shows a base 17 or the backpack as a base part of a lamp with the matching version 18 of a lamp, which a receptacle 19 for receiving the base 17 and the lamp has.
  • locking balls 20 are present, which hold in fitted socket 17 at this existing locking pieces 21 in the form of protrusions in the socket 18 and in these impressions.
  • fitted socket 17 are also electrical contacts 22 of the socket 18 and electrical contacts 23 of the base 17 in electrical contact, thus supplying the lamp with power.
  • a heat conductor 24 of the lamp is inserted into a recess of a relatively wider heat conductor 25 of the holder 18.
  • the associated contact surface corresponds to the heat dissipation surface 24a.
  • a foil 26 made of heat-conducting metal is present between the heat conductors 24, 25.
  • the heat conductors 24,25 are each formed as heat pipes.
  • the heat conductors 24, 25 may be designed as electrical conductors.
  • the socket may be formed such that a voltage at a first voltage level, for. B. 230 V, is provided and at the bottom or frontal contact, which is formed here by the heat conductor 25, voltage at a second voltage level, for.
  • a voltage at a first voltage level for. B. 230 V
  • the socket 18 without change for lamps with a power supply to the first voltage level with lateral contacts 23 and alternatively for lamps with a power supply to the second voltage level with lower contacts 24 may be suitable.
  • FIG. 5 shows a further, novel lamp 27, which is fitted into a socket 28 of a lamp.
  • a translucent piston 29 is supported by the lamp housing 30.
  • the base 31 of the lamp 27 cooperates with the socket 28 of the lamp.
  • the base 31 is of the bayonet type, which has a height h1 at the region engaging or cooperating with the socket 28 and is equipped with base webs 32 which are lateral with respect to a longitudinal axis A.
  • the base 31 and the socket 28 may differ at least in sections from their, here cylindrical, basic shape at the contact area, z. B. be configured slightly conical or elliptical.
  • the height h1 here is less than 5 mm.
  • FIG. 6 shows the housing 30 and the base 31 from FIG. 5 from diagonally down with higher accuracy.
  • a by the height h1 from the bottom 33 of the actual base 31 protruding bayonet closure element 34 has the webs 32 laterally disposed on its underside.
  • the webs 32 have frontally each have a bracket contact 35 for electrical contacting of the lamp.
  • the bayonet closure element 34 can also be considered as a backpack of height h1.
  • the Bügelessor 35 are electrically isolated from the rest of the base 31.
  • the bottom 33 of the base 31 represents the main heat dissipation surface of the lamp.
  • FIG. 7 shows another novel lamp with bayonet lock.
  • the contacts 36 are no longer arranged on the webs 32 of the bayonet closure element 34, but on the front-side bottom 33 of the base 31.
  • the socket not shown
  • these lamp contacts 36 with corresponding Contacts on the socket in contacting agreement.
  • the underside 33 of the base 31 represents the main heat dissipation surface of the lamp.
  • compact fluorescent lamps and / or light-emitting diodes can be used as light sources; however, other suitable light sources may be used.
  • the driver circuit is not limited to a particular embodiment, and may include any suitable electrical and / or electronic elements. For example, an arrangement of LEDs connected in antiparallel is particularly preferred.
  • the driver circuit can also comprise, for example, a simple rectifier, in which the light-emitting diode, the light-emitting diode cluster or the LED chain are preferably arranged in a branch of the rectifier.
  • the driver preferably includes a current limiter, e.g. B. a resistor or a current regulator.
  • the driver may include a switched-mode power supply, preferably a so-called flyback converter.
  • the board may comprise a substrate of, for example, PCB, FR4 or MC-PCB.
  • the base preferably has a very low overall height for insertion into a corresponding socket. This can preferably, in particular without a backpack measured to 15 mm in height. In the event that a backpack is used, a greater height may be advantageous because the backpack is sunk as a base part in the recess provided for the socket.
  • the number and / or arrangement of the contacts of both the lamp and the socket may be associated with coding information, e.g. B. with respect to the lamp type or a voltage class.
  • heat pipes but also other metallic sauceableitium
  • the heat sinks may also comprise non-metallic conductive elements, e.g. B. electrically conductive ceramics.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (15)

  1. Lampe (1 ; 9 ; 13 ; 27) comprenant au moins un boîtier (14 ; 30) et une source de chaleur reliée à celui-ci ainsi qu'un culot (5 ; 17; 31) pour le raccordement à une douille de lampe (6 ; 18 ; 28),
    - le culot (5 ; 17 ; 31) comprenant au moins un contact électrique (22 ; 35 ; 36),
    caractérisée en ce que
    le culot comprend en outre au moins une surface de dissipation thermique (7a; 11a ; 24a ; 33) qui ne constitue pas un contact électrique et dans laquelle la source de chaleur comprenant au moins une source de lumière (3) et/ou un circuit d'attaque est thermiquement connectée de manière conductrice à au moins une surface de dissipation thermique (7a ; 11a ; 24a ; 24a ; 33) qui ne constitue pas un contact électrique.
  2. Lampe (27) selon la revendication 1, dans laquelle
    - le culot est une douille à baïonnette (31) dans laquelle un élément de verrouillage à baïonnette (34) fait saillie sur la face frontale, sur laquelle des contacts électriques (35) sont formés latéralement, et dans laquelle
    - une face inférieure (33) de la douille à baïonnette (31) qui est isolée électriquement des contacts électriques (35) représente une surface de dissipation thermique.
  3. Lampe selon la revendication 1, dans laquelle
    - la base est une base à baïonnette (31) dans laquelle un élément de verrouillage à baïonnette (34) fait saillie sur la face frontale,
    - des contacts électriques (36) sont formés sur une face inférieure (33) de la base à baïonnette (31) entourant l'élément de verrouillage (34), et
    - la face inférieure (33) de la base à baïonnette (31) représente une surface de dissipation thermique électriquement isolante en relation aux contacts électriques (36) à l'extérieure des contacts (36)
  4. Lampe (27) selon l'une des revendications 2 à 3, le culot à baïonnette (31) servant complètement de surface de dissipation thermique à l'extérieur des contacts électriques (35 ; 36).
  5. Lampe selon la revendication 1, dans laquelle le culot (17) comprend au moins une pièce de verrouillage (21) pour un dispositif de verrouillage à bille, le culot (17) présentant au moins un contact électrique (23) disposé latéralement et une surface de dissipation de thermique qui ne constitue pas un contact électrique (24) et qui est disposée sur la face frontale.
  6. Lampe (1 ; 9 ; 13 ; 27) selon l'une des revendications précédentes, la hauteur (h1) d'au moins la partie du culot (5 ; 17 ; 31) s'engageant avec une douille ne dépassant pas 15 mm, de préférence moins de 9 mm, plus préférablement moins de 5 mm.
  7. Lampe selon l'une des revendications précédentes, dans laquelle au moins une surface de dissipation thermique (24a) est recouverte au moins partiellement d'un film conducteur thermique (26).
  8. Lampe (9 ; 13) selon l'une des revendications précédentes, comprenant en outre une extension cylindrique (12 ; 16) au culot dans laquelle un circuit électronique et/ou électrique, ou une partie de celui-ci, est disposé.
  9. Lampe (9 ; 13) selon l'une des revendications précédentes, dans laquelle la au moins une source lumineuse (3) et/ou le circuit d'attaque est thermiquement connectée à la au moins une surface de dissipation thermique (7a ; 11a ; 24a ; 33) par au moins un élément conducteur thermique (7) sous forme d'au moins un caloduc.
  10. Lampe (9 ; 13) selon l'une des revendications précédentes, dans laquelle la au moins une source lumineuse (3) et/ou le circuit d'attaque est thermiquement connectée à la au moins une surface de dissipation thermique (7a ; 11a ; 24a ; 33) via au moins un élément conducteur thermique (7) en un matériau métallique thermoconducteur de qualité.
  11. Luminaire (2 ; 10) comportant une douille de lampe (6 ; 18 ; 28) pour recevoir une lampe (1 ; 9 ; 13 ; 27) selon l'une des revendications précédentes avec des surfaces de dissipation thermique qui ne constitue pas un contact électrique et qui, lorsque la lampe (1 ; 9 ; 13 ; 27) est introduite, sont en contact thermique avec les surfaces de dissipation thermique (7a ; 11a ; 24a ; 33) de la lampe (1 ; 9 ; 13 ; 27), dont les surfaces de dissipation thermique sont reliées par connexion thermique avec un élément refroidisseur (8).
  12. Luminaire selon la revendication 11, les surfaces de dissipation thermique du luminaire (2 ; 10) étant reliées à l'élément de refroidissement (8) par l'intermédiaire d'au moins un caloduc de manière thermoconductrice.
  13. Système comprenant une lampe (1 ; 9 ; 13 ; 27) selon l'une quelconque des revendications 1 à 10 et une lampe (2 ; 10) selon l'une quelconque des revendications 11 à 12.
  14. Système selon la revendication 13, dans lequel entre le culot (5 ; 17 ; 31) de la lampe (1 ; 9 ; 13 ; 14. 27) et la douille (6 ; 18 ; 28) du luminaire (2 ; 10) il y a un moyen de liaison thermique (26), dans lequel le moyen de liaison thermique comprend une pâte thermoconductrice et/ou un film conducteur thermique (26).
  15. Système selon l'une des revendications 13 à 14, le culot (5 ; 17 ; 31 ; 36) de la lampe (1 ; 9 ; 13 ; 27) et la douille (6 ; 18 ; 28) du luminaire (2 ; 10) présentant un écart de forme au moins par sections.
EP08801964.1A 2007-09-10 2008-09-10 Lampe Not-in-force EP2198196B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007042978A DE102007042978A1 (de) 2007-09-10 2007-09-10 Lampe
PCT/EP2008/007392 WO2009033641A1 (fr) 2007-09-10 2008-09-10 Lampe

Publications (2)

Publication Number Publication Date
EP2198196A1 EP2198196A1 (fr) 2010-06-23
EP2198196B1 true EP2198196B1 (fr) 2019-08-14

Family

ID=40282401

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08801964.1A Not-in-force EP2198196B1 (fr) 2007-09-10 2008-09-10 Lampe

Country Status (7)

Country Link
US (1) US8558437B2 (fr)
EP (1) EP2198196B1 (fr)
KR (1) KR101261096B1 (fr)
CN (1) CN101802481B (fr)
DE (1) DE102007042978A1 (fr)
TW (1) TW200936948A (fr)
WO (1) WO2009033641A1 (fr)

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US8704433B2 (en) * 2011-08-22 2014-04-22 Lg Innotek Co., Ltd. Light emitting device package and light unit
CN103090338B (zh) * 2011-11-03 2018-10-09 欧司朗股份有限公司 驱动器组件及其制造方法
US20180156403A1 (en) * 2016-12-02 2018-06-07 Alan Millan Thermoelectric lamp
DE102017214659A1 (de) * 2017-08-22 2019-02-28 Osram Gmbh Leuchtmodul, beleuchtungssystem; set von leuchtmodulen und scheinwerfer
EP3672363B1 (fr) * 2018-12-17 2021-05-05 Electrolux Appliances Aktiebolag Table de cuisson par induction comportant un équipement d'éclairage

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KR101261096B1 (ko) 2013-05-06
US20100207500A1 (en) 2010-08-19
CN101802481B (zh) 2013-03-27
CN101802481A (zh) 2010-08-11
TW200936948A (en) 2009-09-01
DE102007042978A1 (de) 2009-03-12
WO2009033641A1 (fr) 2009-03-19
KR20100059841A (ko) 2010-06-04
US8558437B2 (en) 2013-10-15
EP2198196A1 (fr) 2010-06-23

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