[go: up one dir, main page]

EP2151149A1 - Chip resistor substrat - Google Patents

Chip resistor substrat

Info

Publication number
EP2151149A1
EP2151149A1 EP08736308A EP08736308A EP2151149A1 EP 2151149 A1 EP2151149 A1 EP 2151149A1 EP 08736308 A EP08736308 A EP 08736308A EP 08736308 A EP08736308 A EP 08736308A EP 2151149 A1 EP2151149 A1 EP 2151149A1
Authority
EP
European Patent Office
Prior art keywords
ceramic substrate
separation
predetermined breaking
breaking lines
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08736308A
Other languages
German (de)
French (fr)
Inventor
Claus Peter Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP2151149A1 publication Critical patent/EP2151149A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Definitions

  • the invention relates to a method for the targeted introduction of separation and / or predetermined breaking lines in ceramic substrates for subsequent separation, in which first in a thermal treatment or process step the separation and / or predetermined breaking line to be created locally and then heated with a Cooling medium is shock-like cooled so that in the ceramic substrate by this temperature change a targeted cracking or weakening material along the separation and / or predetermined breaking line.
  • Metal-ceramic substrates in the form of a multiple substrate are known, in which metallizations (metal areas) are provided on a common, for example large-area ceramic plate or layer, which are each assigned to individual substrates or which form metallizations of individual substrates.
  • metallizations metal areas
  • a common, for example large-area ceramic plate or layer which are each assigned to individual substrates or which form metallizations of individual substrates.
  • predetermined lines forming grooves are introduced by means of lasers, so that the multiple substrate along these predetermined breaking lines can be separated by mechanical breaking into the individual substrates.
  • a disadvantage here is that material, which evaporates when introducing the SoII- breaking lines forming grooves, again deposited on the substrate and so contamination of the multi-substrate, in particular the metal areas occurs, which can interfere with further processing.
  • DE 103 27 360 A1 discloses a method for producing a metal-ceramic substrate, in which (method) at least one metal surface is applied to at least one surface side of a ceramic, and after application of the at least one metal region, the metal-ceramic substrate. Substrate along at least one separation or break line in a thermal treatment or process step is heated and then cooled with a cooling medium shock-like so that in the metal-ceramic substrate by this temperature change targeted cracking or weakening occurs along the separation or predetermined breaking line.
  • the invention has for its object to improve a method according to the preamble of claim 1 so that the material which evaporates when introducing the separation and / or predetermined breaking lines, does not deposit on the multi-substrate, in particular not on the metallized areas or metal areas and so contamination of the multi-substrate, or their metal areas occurs, which would interfere with further processing.
  • a ceramic substrate produced by this method and a preferred use will be described. According to the invention this object is achieved with respect to the method by the features of claim 1.
  • the separation and / or predetermined breaking lines are introduced in the surface of the finished sintered ceramic substrate, i. Before the application of the metallized regions or metal regions, no material which evaporates when introducing the separation and / or predetermined breaking lines can deposit on the multi-substrate, in particular not on its metallized regions or metal regions, thus contaminating the multi-substrate or its metal regions cause.
  • a three-dimensional structure is used for the ceramic substrate.
  • a suitable geometry can be produced for each application.
  • Another inventive embodiment is characterized in that a planar structure is used for the ceramic substrate, preferably with lengths and widths of 1 to 30 cm and thicknesses of less than 2 mm. Especially with these dimensions, high-quality ceramic substrates can be achieved.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines have a same or different Liehe depth of crack.
  • the crack depth By choosing the crack depth, the refractive power required for breaking can be set in a targeted manner.
  • the separation and / or predetermined breaking lines are introduced on at least two sides of the ceramic substrate.
  • the severance and / or break lines may face each other on two sides of the ceramic substrate, thereby enabling breakage from two sides.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but also have targeted interruptions. As a result, the strength of the ceramic substrate is improved before breaking.
  • rods are used for the ceramic substrate, for example, with cylindrical or rectangular or n-cornered structure or profiles with, for example U- or H- or L-shape. It can be so, depending on the application form, produce any three-dimensional ceramic substrates.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines are almost invisible to the human eye and no deformation of the surface, as well as contamination along the separation or break line can be seen.
  • the external appearance of the ceramic substrate is flawless without visible separation and / or break lines.
  • the ceramic substrate according to the invention is a completely sintered ceramic on the entire surface, on the surface of which separation and / or predetermined breaking lines for singling are arranged.
  • the ceramic substrate has a three-dimensional structure, whereby the ceramic substrate is adaptable to all application forms.
  • the separation and / or predetermined breaking lines have the same or different crack depth, as a result of which the required refractive power can be selectively adjusted during break-off.
  • the separation and / or predetermined breaking lines are arranged on several sides of the ceramic substrate. This allows the ceramic substrate to be singulated at all imaginable places.
  • the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but have targeted interruptions.
  • the separation can also be controlled. - A -
  • the ceramic substrate in the form of rods, for example, with cylindrical or rectangular or n-angular structure or profiles with, for example U- or H- or L-shape.
  • the ceramic substrate can be produced in all advantageous geometries.
  • the separation and / or predetermined breaking lines can also consist of a multiplicity of separation or predetermined breaking points arranged one behind the other, which thereby form a separating or predetermined breaking line. If the cutting lines and / or predetermined breaking lines are introduced with a laser, they always consist of a large number of shots, which in their entirety form a "line".
  • the separation and / or predetermined breaking lines are almost invisible to the human eye and there are no deformations of the surface, and to detect contamination along the separation or predetermined breaking line.
  • a preferred ceramic substrate is characterized in that suitable, a resistance defining, consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate, and by breaking along the separation - And / or fracture lines individual components and / or component groups arise, which result in downstream methods chip resistors.
  • a resistive defining consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate and By breaking along the separation and / or predetermined breaking lines, single or multiple contiguous components and / or component groups are produced, which result in chip resistors in downstream methods.
  • the components and / or component groups produced in this way which can be processed into chip resistors in downstream processes, are characterized by a rake-free surface and / or virtually smooth rupture edges.
  • At least one predetermined breaking line and / or perforation in the unsintered state by material displacement for example stamping or embossing or pressing, has been introduced on at least one side of the ceramic substrate on the ceramic substrate.
  • at least one predetermined breaking line and / or perforation for example by laser drilling or laser scribing or water jet cutting or drilling, has been introduced on the ceramic substrate on at least one side in the sintered state.
  • the predetermined breaking line and / or perforation can be introduced in the unsintered as well as in the sintered state with the mentioned methods.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to a method for the targeted introduction of cleavage lines and/or predetermined breaking lines in ceramic substrates for subsequent separation. According to said method, in a thermal treatment step or method step, the cleavage line and/or predetermined breaking line is heated locally and then cooled suddenly by a coolant in such a way that targeted cracking or material weakness occurs along the cleavage line or predetermined breaking lines. The invention also relates to a ceramic substrate and the use thereof. According to the invention, the cleavage lines and/or predetermined breaking lines are introduced into the surface of the fully sintered ceramic substrate.

Description

Chip-Resistor-Substrat Resistor chip substrate
Die Erfindung betrifft ein Verfahren zum gezielten Einbringen von Trenn- und/oder Sollbruchlinien in Keramik-Substrate zur späteren Vereinzelung, bei dem zunächst in einem thermischen Behandlungs- oder Verfahrensschritt die zu schaffende Trenn- und/oder Sollbruchlinie lokal er- hitzt und dann mit einem Kühlmedium schockartig derart abgekühlt wird, dass im Keramik- Substrat durch diesen Temperaturwechsel eine gezielte Rissbildung oder Materialschwächung entlang der Trenn- und/oder Sollbruchlinie erfolgt.The invention relates to a method for the targeted introduction of separation and / or predetermined breaking lines in ceramic substrates for subsequent separation, in which first in a thermal treatment or process step the separation and / or predetermined breaking line to be created locally and then heated with a Cooling medium is shock-like cooled so that in the ceramic substrate by this temperature change a targeted cracking or weakening material along the separation and / or predetermined breaking line.
Bekannt sind Metall-Keramik-Substrate in Form eines Mehrfachsubstrates, bei dem auf einer gemeinsamen, beispielsweise großflächigen Keramikplatte oder -Schicht Metallisierungen (Me- tallbereiche) vorgesehen sind, die jeweils Einzelsubstraten zugeordnet sind bzw. die Metallisierungen von Einzelsubstraten bilden. In der Keramikschicht sind dann beispielsweise durch Lasern Sollbruchlinien bildende Nuten eingebracht, so dass das Mehrfachsubstrat entlang dieser Sollbruchlinien durch mechanisches Brechen in die Einzelsubstrate getrennt werden kann.Metal-ceramic substrates in the form of a multiple substrate are known, in which metallizations (metal areas) are provided on a common, for example large-area ceramic plate or layer, which are each assigned to individual substrates or which form metallizations of individual substrates. In the ceramic layer, for example, predetermined lines forming grooves are introduced by means of lasers, so that the multiple substrate along these predetermined breaking lines can be separated by mechanical breaking into the individual substrates.
Ein Nachteil besteht hierbei darin, dass sich Material, welches beim Einbringen der die SoII- bruchlinien bildenden Nuten verdampft, auf dem Substrat wieder abscheidet und so eine Verschmutzung des Mehrfachsubstrates, insbesondere auch der Metallbereiche eintritt, was sich bei der weiteren Verarbeitung störend auswirken kann.A disadvantage here is that material, which evaporates when introducing the SoII- breaking lines forming grooves, again deposited on the substrate and so contamination of the multi-substrate, in particular the metal areas occurs, which can interfere with further processing.
Aus der DE 103 27 360 A1 ist ein Verfahren zum Herstellen eines Metall-Keramik-Substrates, bei dem (Verfahren) auf wenigstens einer Oberflächenseite einer Keramik mindestens ein Me- tallbereich aufgebracht wird und nach dem Aufbringen des wenigstens einen Metallbereichs das Metall-Keramik-Substrat entlang zumindest einer Trenn- oder Sollbruchlinie in einem thermischen Behandlungs- oder Verfahrensschritt erhitzt und dann mit einem Kühlmedium schockartig derart abgekühlt wird, dass im Metall-Keramik-Substrat durch diesen Temperaturwechsel eine gezielte Rissbildung oder Materialschwächung entlang der Trenn- oder Sollbruchlinie erfolgt.DE 103 27 360 A1 discloses a method for producing a metal-ceramic substrate, in which (method) at least one metal surface is applied to at least one surface side of a ceramic, and after application of the at least one metal region, the metal-ceramic substrate. Substrate along at least one separation or break line in a thermal treatment or process step is heated and then cooled with a cooling medium shock-like so that in the metal-ceramic substrate by this temperature change targeted cracking or weakening occurs along the separation or predetermined breaking line.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren nach dem Oberbegriff des Anspruchs 1 so zu verbessern, dass das Material, welches beim Einbringen der Trenn- und/oder Sollbruchlinien verdampft, sich nicht auf dem Mehrfachsubstrat, insbesondere nicht auf dessen metallisierten Bereiche oder Metallbereiche abscheidet und so eine Verschmutzung des Mehrfachsubstrates, bzw. deren Metallbereiche eintritt, was sich bei der weiteren Verarbeitung störend auswirken würde. Außerdem werden ein nach diesem Verfahren hergestelltes Keramik-Substrat und eine bevorzugte Verwendung beschrieben. Erfindungsgemäß wird diese Aufgabe bezüglich des Verfahrens durch die Merkmale des Anspruchs 1 gelöst.The invention has for its object to improve a method according to the preamble of claim 1 so that the material which evaporates when introducing the separation and / or predetermined breaking lines, does not deposit on the multi-substrate, in particular not on the metallized areas or metal areas and so contamination of the multi-substrate, or their metal areas occurs, which would interfere with further processing. In addition, a ceramic substrate produced by this method and a preferred use will be described. According to the invention this object is achieved with respect to the method by the features of claim 1.
Dadurch, dass die Trenn- und/oder Sollbruchlinien in der Oberfläche des fertig gesinterten Keramik-Substrates eingebracht werden, d.h. vor dem Aufbringen der metallisierten Bereiche oder Metallbereiche, kann kein Material, welches beim Einbringen der Trenn- und/oder Sollbruchlinien verdampft, sich auf dem Mehrfachsubstrat, insbesondere nicht auf dessen metallisierten Bereiche oder Metallbereiche abscheiden und so eine Verschmutzung des Mehrfachsubstrates, bzw. deren Metallbereiche herbeiführen.Characterized in that the separation and / or predetermined breaking lines are introduced in the surface of the finished sintered ceramic substrate, i. Before the application of the metallized regions or metal regions, no material which evaporates when introducing the separation and / or predetermined breaking lines can deposit on the multi-substrate, in particular not on its metallized regions or metal regions, thus contaminating the multi-substrate or its metal regions cause.
Bei diesem Verfahren, bei dem entweder durch die thermische Behandlung ein thermisches Trennen oder Spalten der Keramikschicht entlang der jeweiligen Bearbeitungs- oder Trennlinie erfolgt oder aber durch die thermische Behandlung jeweils wenigstens eine Sollbruchlinie erzeugt wird, die ein späteres Trennen der Keramik durch mechanisches Brechen ermöglicht, erfolgt kein Verschmutzen des Substrates und insbesondere auch keine Ausbildung von Rändern oder Trichtern durch Abscheiden von verdampften Material auf dem Substrat entlang der jeweili- gen Trenn- und/oder Sollbruchlinie, so dass die weitere Verarbeitung des Substrates nicht beeinträchtigt ist.In this method, in which takes place either by the thermal treatment, a thermal separation or splitting of the ceramic layer along the respective processing or separation line or by the thermal treatment in each case at least one predetermined breaking line is created, which allows a later separation of the ceramic by mechanical fracturing, There is no fouling of the substrate and in particular no formation of edges or funnels by depositing evaporated material on the substrate along the respective separation and / or predetermined breaking line, so that the further processing of the substrate is not impaired.
In einer erfinderischen Ausgestaltung wird für das Keramik-Substrat eine dreidimensionale Struktur verwendet. Hierdurch kann für jede Anwendung eine passende Geometrie hergestellt werden.In an inventive embodiment, a three-dimensional structure is used for the ceramic substrate. As a result, a suitable geometry can be produced for each application.
Eine andere erfinderische Ausgestaltung zeichnet sich dadurch aus, dass für das Keramiksub- strat eine flächige Struktur verwendet wird, bevorzugt mit Längen und Breiten von 1 bis 30 cm und Dicken kleiner 2 mm. Gerade mit diesen Maßen sind qualitativ hochwertige Keramiksubstrate zu erreichen.Another inventive embodiment is characterized in that a planar structure is used for the ceramic substrate, preferably with lengths and widths of 1 to 30 cm and thicknesses of less than 2 mm. Especially with these dimensions, high-quality ceramic substrates can be achieved.
Bevorzugt wird die Energieeinbringung während des thermischen Behandlungs- oder Verfahrensschritts so gesteuert, dass die Trenn- und/oder Sollbruchlinien eine gleiche oder unterschied- liehe Risstiefe aufweisen. Durch die Wahl der Risstiefe lässt sich die zum Abbrechen erforderliche Brechkraft gezielt einstellen.Preferably, the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines have a same or different Liehe depth of crack. By choosing the crack depth, the refractive power required for breaking can be set in a targeted manner.
In Weiterbildung der Erfindung werden die Trenn- und/oder Sollbruchlinien auf mindestens zwei Seiten des Keramik-Substrates eingebracht. Zum Beispiel können sich die Trenn- und/oder Sollbruchlinien auf zwei Seiten des Keramik-Substrates gegenüberliegen, wodurch das Abbrechen von zwei Seiten her möglich ist, bzw. erleichtert wird. In Weiterbildung der Erfindung wird die Energieeinbringung während des thermischen Behand- lungs- oder Verfahrensschritts so gesteuert, dass die Trenn- und/oder Sollbruchlinien nicht durchgängig von Rand zu Rand des Keramik-Substrates verlaufen, sondern auch gezielt Unterbrechungen aufweisen. Hierdurch ist die Festigkeit des Keramik-Substrates vor dem Abbrechen verbessert.In a further development of the invention, the separation and / or predetermined breaking lines are introduced on at least two sides of the ceramic substrate. For example, the severance and / or break lines may face each other on two sides of the ceramic substrate, thereby enabling breakage from two sides. In a further development of the invention, the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but also have targeted interruptions. As a result, the strength of the ceramic substrate is improved before breaking.
In einer Ausgestaltung der Erfindung werden für das Keramik-Substrat Stäbchen, beispielsweise mit zylinderförmiger oder rechteckiger oder n-eckiger Struktur oder Profile mit beispielsweise U- oder H- oder L-Form verwendet. Es lassen sich so, je nach Anwendungsform, beliebige dreidimensionale Keramik-Substrate herstellen.In one embodiment of the invention, rods are used for the ceramic substrate, for example, with cylindrical or rectangular or n-cornered structure or profiles with, for example U- or H- or L-shape. It can be so, depending on the application form, produce any three-dimensional ceramic substrates.
Bevorzugt wird die Energieeinbringung während des thermischen Behandlungs- oder Verfahrensschritts so gesteuert, dass die Trenn- und/oder Sollbruchlinien nahezu unsichtbar für das menschliche Auge sind und keine Deformation der Oberfläche, sowie Kontaminationen entlang der Trenn- oder Sollbruchlinie zu erkennen sind. Hierdurch ist das äußere Erscheinungsbild des Keramik-Substrats makellos ohne sichtbare Trenn- und/oder Sollbruchlinien.Preferably, the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines are almost invisible to the human eye and no deformation of the surface, as well as contamination along the separation or break line can be seen. As a result, the external appearance of the ceramic substrate is flawless without visible separation and / or break lines.
Das erfindungsgemäße Keramik-Substrat ist eine auf der gesamten Oberfläche fertig gesinterte Keramik, auf deren Oberfläche Trenn- und/oder Sollbruchlinien zur Vereinzelung angeordnet sind.The ceramic substrate according to the invention is a completely sintered ceramic on the entire surface, on the surface of which separation and / or predetermined breaking lines for singling are arranged.
Bevorzugt weist das Keramik-Substrat eine dreidimensionale Struktur auf, wodurch das Keramik- Substrat an alle Anwendungsformen anpassbar ist.Preferably, the ceramic substrate has a three-dimensional structure, whereby the ceramic substrate is adaptable to all application forms.
In erfinderischer Ausgestaltung weisen die Trenn- und/oder Sollbruchlinien eine gleiche oder unterschiedliche Risstiefe auf, wodurch sich die erforderliche Brechkraft beim Abbrechen gezielt einstellbar ist.In an inventive embodiment, the separation and / or predetermined breaking lines have the same or different crack depth, as a result of which the required refractive power can be selectively adjusted during break-off.
In einer Ausgestaltung der Erfindung sind die Trenn- und/oder Sollbruchlinien auf mehreren Seiten des Keramik-Substrats angeordnet. Damit lässt sich das Keramik-Substrat an allen denkba- ren Stellen vereinzeln.In one embodiment of the invention, the separation and / or predetermined breaking lines are arranged on several sides of the ceramic substrate. This allows the ceramic substrate to be singulated at all imaginable places.
In einer anderen Ausführungsform verlaufen die Trenn- und/oder Sollbruchlinien nicht durchgängig von Rand zu Rand des Keramik-Substrates, sondern weisen gezielt Unterbrechungen auf. Hierdurch kann ebenfalls die Vereinzelung gesteuert werden. - A -In another embodiment, the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but have targeted interruptions. As a result, the separation can also be controlled. - A -
In einer Ausgestaltung weist das Keramik-Substrat die Form von Stäbchen, beispielsweise mit zylinderförmiger oder rechteckiger oder n-eckiger Struktur oder Profile mit beispielsweise U- oder H- oder L-Form auf. Das Keramik-Substrat ist dadurch in allen vorteilhaften Geometrien herstellbar.In one embodiment, the ceramic substrate in the form of rods, for example, with cylindrical or rectangular or n-angular structure or profiles with, for example U- or H- or L-shape. The ceramic substrate can be produced in all advantageous geometries.
Es sei auch betont, dass die Trenn- und/oder Sollbruchlinien auch aus einer Vielzahl an hintereinander angeordneten Trenn- oder Sollbruchstellen bestehen können, die hierdurch eine Trennoder Sollbruchlinie bilden. Werden die Trenn- und/oder Sollbruchlinien mit einem Laser eingebracht, so bestehen sie immer aus einer Vielzahl an Einschüssen, die in ihrer Gesamtheit eine „Linie" bilden.It should also be emphasized that the separation and / or predetermined breaking lines can also consist of a multiplicity of separation or predetermined breaking points arranged one behind the other, which thereby form a separating or predetermined breaking line. If the cutting lines and / or predetermined breaking lines are introduced with a laser, they always consist of a large number of shots, which in their entirety form a "line".
In einer erfinderischen Ausgestaltung sind die Trenn- und/oder Sollbruchlinien nahezu unsichtbar für das menschliche Auge und es sind keine Deformationen der Oberfläche, sowie Kontaminationen entlang der Trenn- oder Sollbruchlinie zu erkennen.In an inventive embodiment, the separation and / or predetermined breaking lines are almost invisible to the human eye and there are no deformations of the surface, and to detect contamination along the separation or predetermined breaking line.
Ein bevorzugtes Keramik-Substrat ist dadurch gekennzeichnet, dass auf das mit Trenn- und/oder Sollbruchlinien versehene Keramik-Substrat geeignete, einen Widerstand definierende, aus min- destens einer Komponente bestehenden Materialbereiche und/oder Bauelemente aufgebracht sind, und durch Abbrechen entlang der Trenn- und/oder Sollbruchlinien einzelne Bauteile und / oder Bauteilgruppen entstehen, welche in nachgeschalteten Verfahren Chip-Resistoren ergeben.A preferred ceramic substrate is characterized in that suitable, a resistance defining, consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate, and by breaking along the separation - And / or fracture lines individual components and / or component groups arise, which result in downstream methods chip resistors.
Bei einer bevorzugten Verwendung eines Keramik-Substrats zur Herstellung eines Chip- Resistor-Substrats, werden auf das mit Trenn- und/oder Sollbruchlinien versehene Keramik- Substrat geeignete, einen Widerstand definierende, aus mindestens einer Komponente bestehende Material bereiche und/oder Bauelemente aufgebracht und durch Abbrechen entlang der Trenn- und/oder Sollbruchlinien entstehen einzelne oder mehrere zusammenhängende Bauteile und / oder Bauteilgruppen, welche in nachgeschalteten Verfahren Chip-Resistoren ergeben.In a preferred use of a ceramic substrate for the production of a chip resistor substrate, suitable, a resistive defining, consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate and By breaking along the separation and / or predetermined breaking lines, single or multiple contiguous components and / or component groups are produced, which result in chip resistors in downstream methods.
Die so hergestellten Bauteile und / oder Bauteilgruppen, welche in nachgeschalteten Verfahren zu Chip-Resistoren verarbeitet werden können, sind durch eine verwerfungsfreie Oberfläche und/oder nahezu glatte Bruchkanten gekennzeichnet.The components and / or component groups produced in this way, which can be processed into chip resistors in downstream processes, are characterized by a rake-free surface and / or virtually smooth rupture edges.
Auf dem Keramik-Substrat ist in einer Ausführungsform auf mindestens einer Seite mindestens eine Sollbruchlinie und/oder Lochung im ungesinterten Zustand durch Materialverdrängung, beispielsweise Stanzen oder Prägen oder Pressen, eingebracht worden. Auf dem Keramik-Substrat ist in einer anderen Ausführungsform auf mindestens einer Seite im gesinterten Zustand mindestens eine Sollbruchlinie und/oder Lochung, beispielsweise durch Laserbohren oder Laserritzen oder Wasserstrahlschneiden oder Bohren eingebracht worden.In one embodiment, at least one predetermined breaking line and / or perforation in the unsintered state by material displacement, for example stamping or embossing or pressing, has been introduced on at least one side of the ceramic substrate on the ceramic substrate. In another embodiment, at least one predetermined breaking line and / or perforation, for example by laser drilling or laser scribing or water jet cutting or drilling, has been introduced on the ceramic substrate on at least one side in the sintered state.
Die Sollbruchlinie und/oder Lochung kann sowohl im ungesinterten als auch im gesinterten Zustand mit den genannten Verfahren eingebracht werden. The predetermined breaking line and / or perforation can be introduced in the unsintered as well as in the sintered state with the mentioned methods.

Claims

Patentansprüche claims
1. Verfahren zum gezielten Einbringen von Trenn- und/oder Sollbruchlinien in Keramik- Substrate zur späteren Vereinzelung, bei dem zunächst in einem thermischen Behandlungsoder Verfahrensschritt die zu schaffende Trenn- und/oder Sollbruchlinie lokal erhitzt und dann mit einem Kühlmedium schockartig derart abgekühlt wird, dass im Keramik-Substrat durch diesen Temperaturwechsel eine gezielte Rissbildung oder Materialschwächung entlang der Trenn- und/oder Sollbruchlinie erfolgt, dadurch gekennzeichnet, dass die Trenn- und/oder Sollbruchlinien in der Oberfläche des fertig gesinterten Keramik-Substrates eingebracht werden.1. A method for the targeted introduction of separation and / or predetermined breaking lines in ceramic substrates for subsequent separation, in which first in a thermal treatment or process step to be created separation and / or predetermined breaking line is locally heated and then cooled in a shock-like manner with a cooling medium, that in the ceramic substrate by this temperature change a targeted cracking or weakening material along the separation and / or predetermined breaking line, characterized in that the separation and / or predetermined breaking lines are introduced into the surface of the finished sintered ceramic substrate.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass für das Keramik-Substrat eine dreidimensionale Struktur verwendet wird.2. The method according to claim 1, characterized in that a three-dimensional structure is used for the ceramic substrate.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass für das Keramiksubstrat eine flächige Struktur verwendet wird, bevorzugt mit Längen und Breiten von 1 bis 30 cm und Dicken kleiner 2 mm.3. The method according to claim 1 or 2, characterized in that a planar structure is used for the ceramic substrate, preferably with lengths and widths of 1 to 30 cm and thicknesses less than 2 mm.
4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Energieeinbringung während des thermischen Behandlungs- oder Verfahrensschritts so gesteuert wird, dass die Trenn- und/oder Sollbruchlinien eine gleiche oder unterschiedliche Risstiefe aufweisen.4. The method according to any one of claims 1 to 3, characterized in that the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines have an equal or different crack depth.
5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Trenn- und/oder Sollbruchlinien auf mindestens zwei Seiten des Keramik-Substrates eingebracht werden.5. The method according to any one of claims 1 to 4, characterized in that the separation and / or predetermined breaking lines are introduced on at least two sides of the ceramic substrate.
6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Energieeinbringung während des thermischen Behandlungs- oder Verfahrensschritts so gesteuert wird, dass die Trenn- und/oder Sollbruchlinien nicht durchgängig von Rand zu Rand des Keramik- Substrates verlaufen, sondern auch gezielt Unterbrechungen aufweisen.6. The method according to any one of claims 1 to 5, characterized in that the energy input is controlled during the thermal treatment or process step so that the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but also have targeted interruptions.
7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass für das Keramik-Substrat Stäbchen, beispielsweise mit zylinderförmiger oder rechteckiger oder n-eckiger Struktur oder Profile mit beispielsweise U- oder H- oder L-Form verwendet werden. 7. The method according to any one of claims 1 to 6, characterized in that are used for the ceramic substrate rods, for example, with cylindrical or rectangular or n-angular structure or profiles with, for example U- or H- or L-shape.
8. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Energieeinbringung während des thermischen Behandlungs- oder Verfahrensschritts so gesteuert wird, dass die Trenn- und/oder Sollbruchlinien nahezu unsichtbar für das menschliche Auge sind und keine Deformation der Oberfläche, sowie Kontaminationen entlang der Trenn- oder SoII- bruchlinie zu erkennen sind.8. The method according to any one of claims 1 to 7, characterized in that the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines are almost invisible to the human eye and no deformation of the surface, as well Contaminations along the separation or SoII- break line can be seen.
9. Keramik-Substrat hergestellt mit dem Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass das Keramik-Substrat eine auf der gesamten Oberfläche, fertig gesinterte Keramik ist, auf deren Oberfläche Trenn- und/oder Sollbruchlinien zur Vereinzelung angeordnet sind.9. ceramic substrate prepared by the method according to any one of claims 1 to 8, characterized in that the ceramic substrate is a sintered on the entire surface, finished ceramic, on the surface of separation and / or predetermined breaking lines are arranged for singulation.
10. Keramik-Substrat nach Anspruch 9, dadurch gekennzeichnet, dass das Keramik-Substrat eine dreidimensionale Struktur aufweist.10. ceramic substrate according to claim 9, characterized in that the ceramic substrate has a three-dimensional structure.
11. Keramik-Substrat nach Anspruch 9 oder 10, dadurch gekennzeichnet, dass die Trenn- und/oder Sollbruchlinien eine gleiche oder unterschiedliche Risstiefe aufweisen.11. ceramic substrate according to claim 9 or 10, characterized in that the separation and / or predetermined breaking lines have an equal or different crack depth.
12. Keramik-Substrat nach einem der Ansprüche 9 bis 11 , dadurch gekennzeichnet, dass Trenn- und/oder Sollbruchlinien auf mehreren Seiten des Keramik-Substrats angeordnet sind.12. ceramic substrate according to one of claims 9 to 11, characterized in that separation and / or predetermined breaking lines are arranged on several sides of the ceramic substrate.
13. Keramik-Substrat nach einem der Ansprüche 9 bis 12, dadurch gekennzeichnet, dass die Trenn- und/oder Sollbruchlinien nicht durchgängig von Rand zu Rand des Keramik- Substrates verlaufen, sondern gezielt Unterbrechungen aufweisen.13. Ceramic substrate according to one of claims 9 to 12, characterized in that the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but have targeted interruptions.
14. Keramik-Substrat nach einem der Ansprüche 9 bis 13, dadurch gekennzeichnet, dass das Keramik-Substrat die Form von Stäbchen, beispielsweise mit zylinderförmiger oder rechteckiger oder n-eckiger Struktur oder Profile mit beispielsweise U- oder H- oder L-Form aufweist.14. Ceramic substrate according to one of claims 9 to 13, characterized in that the ceramic substrate has the shape of rods, for example with cylindrical or rectangular or n-angular structure or profiles with, for example U- or H- or L-shape ,
15. Keramik-Substrat nach einem der Ansprüche 9 bis 14, dadurch gekennzeichnet, dass die Trenn- und/oder Sollbruchlinien nahezu unsichtbar für das menschliche Auge sind und keine Deformationen der Oberfläche, sowie Kontaminationen entlang der Trenn- oder Sollbruchlinie zu erkennen sind.15. Ceramic substrate according to one of claims 9 to 14, characterized in that the separation and / or predetermined breaking lines are almost invisible to the human eye and no deformation of the surface, as well as contamination along the separation or break line can be seen.
16. Keramik-Substrat nach einem der Ansprüche 9 bis 15, dadurch gekennzeichnet, dass auf das mit Trenn- und/oder Sollbruchlinien versehene Keramik-Substrat geeignete, einen Widerstand definierende, aus mindestens einer Komponente bestehenden Materialbereiche und/oder Bauelemente aufgebracht sind, und durch Abbrechen entlang der Trenn- und/oder Sollbruchlinien einzelne Bauteile und / oder Bauteilgruppen entstehen, welche in nachgeschalteten Verfahren Chip-Resistoren ergeben.16. Ceramic substrate according to one of claims 9 to 15, characterized in that on the provided with separation and / or predetermined breaking lines ceramic substrate, a resistance defining, consisting of at least one component material areas and / or components are applied, and by breaking along the separation and / or predetermined breaking lines individual components and / or component groups arise, which result in downstream methods chip resistors.
17. Verwendung eines Keramik-Substrats nach einem der Ansprüche 9 bis 15, zur Herstellung eines Chip-Resistor-Substrats, wobei auf das mit Trenn- und/oder Sollbruchlinien versehene17. Use of a ceramic substrate according to one of claims 9 to 15, for the production of a chip-resistor substrate, wherein provided on the with separation and / or predetermined breaking lines
Keramik-Substrat geeignete, einen Widerstand definierende aus mindestens einer Komponente bestehenden Materialbereiche und/oder Bauelemente aufgebracht werden, und durch Abbrechen entlang der Trenn- und/oder Sollbruchlinien einzelne oder mehrere zusammenhängende Bauteile und / oder Bauteilgruppen entstehen, welche in nachgeschalteten Verfah- ren Chip-Resistoren ergeben.Ceramic substrate suitable, a resistance defining consisting of at least one component material areas and / or components are applied, and by breaking along the separation and / or break lines single or more contiguous components and / or component groups arise, which chip in downstream processes chip Resistors result.
18. Bauteile und / oder Bauteilgruppen, welche in nachgeschalteten Verfahren zu Chip- Resistoren verarbeitet werden nach Anspruch 16 oder 17, gekennzeichnet durch eine verwerfungsfreie Oberfläche und/oder nahezu glatten Bruchkanten.18. components and / or component groups, which are processed in downstream processes to chip resistors according to claim 16 or 17, characterized by a warpage-free surface and / or almost smooth edges breakage.
19. Keramik-Substrat nach einem der Ansprüche 1 bis 18, dadurch gekennzeichnet, dass auf mindestens einer Seite mindestens eine Sollbruchlinie und/oder Lochung im ungesinterten19. Ceramic substrate according to one of claims 1 to 18, characterized in that on at least one side at least one predetermined breaking line and / or perforation in the unsintered
Zustand durch Materialverdrängung, beispielsweise Stanzen oder Prägen oder Pressen, eingebracht worden ist.Condition by material displacement, such as punching or embossing or pressing, has been introduced.
20. Keramik-Substrat nach einem der Ansprüche 1 bis 19, dadurch gekennzeichnet, dass auf mindestens einer Seite im gesinterten Zustand mindestens eine Sollbruchlinie und oder Lo- chung beispielsweise durch Laserbohren oder Laserritzen oder Wasserstrahlschneiden oder20. ceramic substrate according to one of claims 1 to 19, characterized in that on at least one side in the sintered state, at least one predetermined breaking line and / or perforation, for example by laser drilling or laser scribing or water jet cutting or
Bohren eingebracht worden ist.Drilling has been introduced.
21. Keramik-Substrat nach einem der Ansprüche 1 bis 20, dadurch gekennzeichnet dass, auf einem Keramiksubstrat auch die Kombination der Merkmale von Anspruch 19 und Anspruch 20 vorkommen kann. 21. Ceramic substrate according to one of claims 1 to 20, characterized in that on a ceramic substrate and the combination of the features of claim 19 and claim 20 may occur.
EP08736308A 2007-04-25 2008-04-17 Chip resistor substrat Ceased EP2151149A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019875 2007-04-25
PCT/EP2008/054638 WO2008132055A1 (en) 2007-04-25 2008-04-17 Chip resistor substrat

Publications (1)

Publication Number Publication Date
EP2151149A1 true EP2151149A1 (en) 2010-02-10

Family

ID=39731440

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08736308A Ceased EP2151149A1 (en) 2007-04-25 2008-04-17 Chip resistor substrat

Country Status (7)

Country Link
US (1) US8496866B2 (en)
EP (1) EP2151149A1 (en)
JP (1) JP5637845B2 (en)
KR (1) KR101534124B1 (en)
CN (1) CN101690428B (en)
DE (1) DE102008001229A1 (en)
WO (1) WO2008132055A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101383254B1 (en) * 2012-07-18 2014-04-10 삼화콘덴서공업주식회사 Method for manufacturing thin film capacitor
CN105592994B (en) * 2013-08-07 2018-10-12 通快激光与系统工程有限公司 Method and apparatus for machining plate-like workpieces and the product made of this kind of workpiece
US20180061536A1 (en) * 2016-08-26 2018-03-01 E I Du Pont De Nemours And Company Chip resistor
CN112863793B (en) * 2021-01-12 2022-07-12 南充三环电子有限公司 Large-size ceramic substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082648A1 (en) * 2002-11-25 2005-04-21 Junya Naito Ceramic package and chip resistor, and method for manufacture thereof
US20050099835A1 (en) * 2003-11-04 2005-05-12 Electro Scientific Industries, Inc. Laser-based termination of passive electronic components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610645Y2 (en) * 1990-01-19 1994-03-16 コーア株式会社 Sheet ceramic substrate
DE4319944C2 (en) * 1993-06-03 1998-07-23 Schulz Harder Juergen Multiple substrate and process for its manufacture
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
JP2001167902A (en) * 1999-12-10 2001-06-22 Matsushita Electric Ind Co Ltd Resistor and manufacturing method thereof
WO2003004210A1 (en) * 2001-07-02 2003-01-16 Virtek Laser Systems, Inc. Method of ablating an opening in a hard, non-metallic substrate
US7015118B2 (en) * 2001-10-31 2006-03-21 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
DE10327360B4 (en) * 2003-06-16 2012-05-24 Curamik Electronics Gmbh Method for producing a ceramic-metal substrate
DE10330179A1 (en) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Method for separating flat workpieces made of ceramic
US7726532B2 (en) * 2004-10-25 2010-06-01 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for forming cracks

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082648A1 (en) * 2002-11-25 2005-04-21 Junya Naito Ceramic package and chip resistor, and method for manufacture thereof
US20050099835A1 (en) * 2003-11-04 2005-05-12 Electro Scientific Industries, Inc. Laser-based termination of passive electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008132055A1 *

Also Published As

Publication number Publication date
US20100221478A1 (en) 2010-09-02
CN101690428A (en) 2010-03-31
JP5637845B2 (en) 2014-12-10
KR101534124B1 (en) 2015-07-06
CN101690428B (en) 2012-09-05
WO2008132055A1 (en) 2008-11-06
US8496866B2 (en) 2013-07-30
JP2010527141A (en) 2010-08-05
DE102008001229A1 (en) 2008-10-30
KR20100017353A (en) 2010-02-16

Similar Documents

Publication Publication Date Title
DE102013223637B4 (en) A method of treating a laser transparent substrate for subsequently separating the substrate
DE102015120950B4 (en) Method for laser-assisted detachment of a section from a flat glass or glass-ceramic element, flat at least partially ceramized glass element or glass-ceramic element and cooking surface comprising a flat glass or glass-ceramic element
EP3562790B1 (en) Method for separating substrates and associated substrates
EP3322675A1 (en) Method and device for the laser-supported detachment of a section from a planar glass element
EP1924392B1 (en) Method for severing brittle flat materials by laser beam, with traces produced prior to separation
WO2017140394A1 (en) Method for machining the edges of glass elements and glass element machined according to the method
WO2009036743A1 (en) Method for the production of small cutting wheels
EP2978561B1 (en) Method for removing brittle-hard material by means of laser radiation
EP2151149A1 (en) Chip resistor substrat
EP3854515A1 (en) Method for processing brittle materials
AT513190A1 (en) Apparatus and method for plasma coating a substrate, in particular a press plate
DE102012213071A1 (en) Method for producing toughened substrate e.g. pre-stressed glass substrate used in e.g. smart phone, involves separating substrate along trench provided on two sides of substrate
DE102010032029A1 (en) Method for separating round wafer into rectangular chips for display panel of mobile telephone, involves forming horizontal parting lines vertical to vertical parting lines, from one edge to other edge of platen
DE102009028259A1 (en) Process for the production of piezoelectric workpieces
EP4263449A1 (en) Method of processing, especially predividing, a two-dimensional substrate
EP2626895B1 (en) Method and device for singulating in parallel a workpiece into several segments
DE102020123928A1 (en) Process and device for cutting glass foils
DE102009000073A1 (en) Method and device for the electrochemical processing of substrates
EP3738937B1 (en) Method of manufacturing a watch glass with at least one recess and tool for such a method
DE1903840A1 (en) Method and device for making saws
EP2843713B1 (en) Device and method for the manufacture of a wafer with influence of a crack line
DE102008042855A1 (en) Method for breaking closed notched brittle profiles made from glass or glass-ceramic comprises crazing the required closed profiles in the brittle material, placing the brittle material on an elastic material and further processing
DE102010001474A1 (en) Method for manufacturing chromatometer of color box of rotary printing machine, involves partially disconnecting slugs of chromatometer by sound pulse separation process for formation of chromatometer slats
EP2865463A1 (en) Method for manufacturing letters or numbers from metal and corresponding letters and numbers
EP1741517A1 (en) Vacuum clamping device for fixing a sheet and method for machining the sheet

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20091125

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20101027

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: CERAMTEC GMBH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20151214