EP2033982A4 - Composition de résine pour stéréolithographie - Google Patents

Composition de résine pour stéréolithographie

Info

Publication number: EP2033982A4
Authority: EP; European Patent Office
Prior art keywords: stereolithography; resin composition; resin; composition
Prior art date: 2006-06-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP07745340A

Other languages

German (de)

English (en)

Other versions

EP2033982B1 (fr

EP2033982A1 (fr

Inventor

Takashi Ito

Tsuneo Hagiwara

Kenji Hirotsu

Tadashi Murakami

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

CMET Inc

Original Assignee

CMET Inc

Ube Industries Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-06-16

Filing date

2007-06-15

Publication date

2012-02-29

2007-06-15 Application filed by CMET Inc, Ube Industries Ltd filed Critical CMET Inc

2009-03-11 Publication of EP2033982A1 publication Critical patent/EP2033982A1/fr

2012-02-29 Publication of EP2033982A4 publication Critical patent/EP2033982A4/fr

2017-10-04 Application granted granted Critical

2017-10-04 Publication of EP2033982B1 publication Critical patent/EP2033982B1/fr

Status Not-in-force legal-status Critical Current

2027-06-15 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Organic Chemistry (AREA)
Polymers & Plastics (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
General Physics & Mathematics (AREA)
Materials Engineering (AREA)
Manufacturing & Machinery (AREA)
Engineering & Computer Science (AREA)
Spectroscopy & Molecular Physics (AREA)
Polymerisation Methods In General (AREA)
Epoxy Resins (AREA)
Polyethers (AREA)

EP07745340.5A 2006-06-16 2007-06-15 Composition de résine pour stéréolithographie Not-in-force EP2033982B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2006166853A JP5280615B2 (ja)	2006-06-16	2006-06-16	光学的立体造形用樹脂組成物
PCT/JP2007/062085 WO2007145309A1 (fr)	2006-06-16	2007-06-15	Composition de résine pour stéréolithographie

Publications (3)

Publication Number	Publication Date
EP2033982A1 EP2033982A1 (fr)	2009-03-11
EP2033982A4 true EP2033982A4 (fr)	2012-02-29
EP2033982B1 EP2033982B1 (fr)	2017-10-04

Family

ID=38831822

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP07745340.5A Not-in-force EP2033982B1 (fr)	2006-06-16	2007-06-15	Composition de résine pour stéréolithographie

Country Status (5)

Country	Link
US (1)	US8293448B2 (fr)
EP (1)	EP2033982B1 (fr)
JP (1)	JP5280615B2 (fr)
CN (1)	CN101466767B (fr)
WO (1)	WO2007145309A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5302022B2 (ja) *	2009-01-28	2013-10-02	シーメット株式会社	光学的立体造形用樹脂組成物
US8991211B1 (en)	2009-11-01	2015-03-31	The Exone Company	Three-dimensional printing glass articles
KR101768732B1 (ko) *	2009-11-17	2017-08-16	주식회사 다이셀	옥세탄 환 함유 (메트)아크릴산에스테르 화합물
JP5415370B2 (ja) *	2010-07-12	2014-02-12	日東電工株式会社	光硬化型樹脂組成物およびそれを用いた光学部品
JP5415371B2 (ja) *	2010-07-12	2014-02-12	日東電工株式会社	光学レンズ用光硬化型樹脂組成物およびそれを用いた光学レンズ
DE102012224005B4 (de) *	2012-12-20	2015-07-23	Heraeus Kulzer Gmbh	Verfahren zur Herstellung einer homogenen Lichtverteilung
US20180046076A1 (en) *	2015-03-23	2018-02-15	Dow Global Technologies Llc	Photocurable Compositions for Three-Dimensional Printing
JP6967336B2 (ja) *	2016-03-30	2021-11-17	株式会社Adeka	硬化性組成物、その硬化物、および硬化物の製造方法
EP3685989B1 (fr) *	2017-09-22	2023-03-15	Konica Minolta, Inc.	Accessoire de saisie d'objets et robot industriel utilisant un accessoire de saisie d'objets
CN115368550B (zh) *	2021-05-20	2024-01-26	常州强力先端电子材料有限公司	一种氧杂环丁烷类含氟聚合物及其制备方法
EP4206820A1 (fr) *	2021-12-30	2023-07-05	Arkema France	Composition photodurcissable hybride
CN114957168A (zh) *	2022-05-17	2022-08-30	大连天源基化学有限公司	一种3，3′-（氧基双亚甲基）双（3-乙基）氧杂环丁烷及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6166101A (en) *	1997-11-21	2000-12-26	Kansai Paint Co., Ltd.	Ultraviolet-curing coating composition for cans
WO2001022165A1 (fr) *	1999-09-17	2001-03-29	Hitachi Chemical Co., Ltd.	Compositions a base de resine photosensibles, element photosensible contenant ces compositions, procede de production d'un motif de reserve et procede de production de carte a circuit imprime
WO2004113396A1 (fr) *	2003-06-25	2004-12-29	Cmet Inc.	Composition de resine stereolithographique durcissable par rayons actiniques, presentant une stabilite amelioree
JP2005015739A (ja) *	2003-06-24	2005-01-20	Cmet Inc	靱性に優れた光学的立体造形用樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07103218B2 (ja)	1988-09-13	1995-11-08	旭電化工業株式会社	光学的造形用樹脂組成物
JP3913350B2 (ja) *	1998-01-13	2007-05-09	ナブテスコ株式会社	光学的造形用樹脂組成物
JP3800858B2 (ja) *	1999-04-26	2006-07-26	宇部興産株式会社	ビスオキセタンエーテル化合物類の製造方法
JP2001181385A (ja) *	1999-12-24	2001-07-03	Kansai Paint Co Ltd	カチオン重合性着色組成物
ES2405107T3 (es) *	2002-05-03	2013-05-30	Dsm Ip Assets B.V.	Composición de resina curable por radiación y procedimiento para la formación rápida de prototipos utilizando la misma
JP2004051556A (ja) *	2002-07-19	2004-02-19	Mitsubishi Chemicals Corp	オキセタン誘導体の製造方法
WO2004113056A1 (fr) *	2003-06-24	2004-12-29	Cmet Inc.	Structure tridimensionnelle et son procede de production
JP4744200B2 (ja) *	2005-06-20	2011-08-10	シーメット株式会社	平滑化した造形端面を有する立体造形物
EP1939234B2 (fr) *	2005-09-29	2018-04-11	Cmet Inc.	Composition de résine pour objet optique moulé tridimensionnel

2006
- 2006-06-16 JP JP2006166853A patent/JP5280615B2/ja active Active
2007
- 2007-06-15 WO PCT/JP2007/062085 patent/WO2007145309A1/fr not_active Ceased
- 2007-06-15 EP EP07745340.5A patent/EP2033982B1/fr not_active Not-in-force
- 2007-06-15 US US12/304,962 patent/US8293448B2/en active Active
- 2007-06-15 CN CN2007800221727A patent/CN101466767B/zh active Active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6166101A (en) *	1997-11-21	2000-12-26	Kansai Paint Co., Ltd.	Ultraviolet-curing coating composition for cans
WO2001022165A1 (fr) *	1999-09-17	2001-03-29	Hitachi Chemical Co., Ltd.	Compositions a base de resine photosensibles, element photosensible contenant ces compositions, procede de production d'un motif de reserve et procede de production de carte a circuit imprime
JP2005015739A (ja) *	2003-06-24	2005-01-20	Cmet Inc	靱性に優れた光学的立体造形用樹脂組成物
WO2004113396A1 (fr) *	2003-06-25	2004-12-29	Cmet Inc.	Composition de resine stereolithographique durcissable par rayons actiniques, presentant une stabilite amelioree

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007145309A1 *

Also Published As

Publication number	Publication date
US20090209674A1 (en)	2009-08-20
JP2007332294A (ja)	2007-12-27
EP2033982B1 (fr)	2017-10-04
CN101466767A (zh)	2009-06-24
US8293448B2 (en)	2012-10-23
JP5280615B2 (ja)	2013-09-04
EP2033982A1 (fr)	2009-03-11
CN101466767B (zh)	2011-12-07
WO2007145309A1 (fr)	2007-12-21

Publication	Publication Date	Title
EP2033982A4 (fr)	2012-02-29	Composition de résine pour stéréolithographie
EP2088170A4 (fr)	2011-04-27	Composition de résine
EP2246371A4 (fr)	2012-06-06	Composition de résine durcissable pour nano-empreinte
EP2089048A4 (fr)	2011-02-23	Composition pour cartilage
EP2221326A4 (fr)	2011-04-13	Composition de résine photosensible
EP2060405A4 (fr)	2011-04-13	Composition de résine photosensible
EP2246377A4 (fr)	2012-07-18	Composition de résine
GB2438715B (en)	2011-07-20	Moulding materials
FR2924330B1 (fr)	2009-11-20	Implant pour hernie parastomiale
ATE477312T1 (de)	2010-08-15	Flüssigkeitshärtung
EP2048201A4 (fr)	2012-09-05	Composition de résine
BRPI0716094A2 (pt)	2013-09-17	composiÇço de resina.
PL2532712T3 (pl)	2014-04-30	Kompozycja żywicy poliamidowej
EP2067822A4 (fr)	2011-05-18	Composition de résine biodégradable
EP2040273A4 (fr)	2012-08-01	Transformateur pour vehicules
EP2161292A4 (fr)	2010-09-22	Composition de résine époxy
EP2024114A4 (fr)	2013-01-23	Remplissage séquentiel de moules
DE602006009810D1 (de)	2009-11-26	Harzzusammensetzung
BRPI0721402A2 (pt)	2014-03-04	Composições de moldagem para moldar esteiras de polimetacrilimida
EP2077298A4 (fr)	2011-05-11	Composition de résine de polyester
BRPI0716458A2 (pt)	2014-03-04	Composição de vulcanizado
EP2471898A4 (fr)	2016-01-06	Composition de résine thermoplastique pour le nettoyage
IL192815A0 (en)	2009-02-11	Curing agents for epoxy-functional compounds
EP2213275A4 (fr)	2014-04-30	Composition durcissable pour des applications dentaires
FR2902830B1 (fr)	2008-08-08	Turboreacteur pour aeronef

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2012-02-29	RIC1	Information provided on ipc code assigned before grant	Ipc: C08G 59/18 20060101ALI20120120BHEP Ipc: C08F 2/50 20060101ALI20120120BHEP Ipc: C08G 65/18 20060101AFI20120120BHEP
2012-08-08	DAX	Request for extension of the european patent (deleted)
2015-03-04	RAP1	Party data changed (applicant data changed or rights of an application transferred)	Owner name: CMET INC.
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