[go: up one dir, main page]

EP1993135A3 - Heat conducter - Google Patents

Heat conducter Download PDF

Info

Publication number
EP1993135A3
EP1993135A3 EP08251584A EP08251584A EP1993135A3 EP 1993135 A3 EP1993135 A3 EP 1993135A3 EP 08251584 A EP08251584 A EP 08251584A EP 08251584 A EP08251584 A EP 08251584A EP 1993135 A3 EP1993135 A3 EP 1993135A3
Authority
EP
European Patent Office
Prior art keywords
heat
conductive region
heat conductive
metal member
conducter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08251584A
Other languages
German (de)
French (fr)
Other versions
EP1993135A2 (en
EP1993135B1 (en
Inventor
Tsuyoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP1993135A2 publication Critical patent/EP1993135A2/en
Publication of EP1993135A3 publication Critical patent/EP1993135A3/en
Application granted granted Critical
Publication of EP1993135B1 publication Critical patent/EP1993135B1/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat conductor that improves heat conductivity is provided. The heat conductor has a first heat conductive region and a second heat conductive region. The first heat conductive region is configured by lamination of a first metal member and a graphite member. The second heat conductive region is configured by lamination of the first metal member and a second metal member.
EP08251584.2A 2007-05-16 2008-04-30 Heat conducter Ceased EP1993135B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007130968A JP5025328B2 (en) 2007-05-16 2007-05-16 Thermal conductor

Publications (3)

Publication Number Publication Date
EP1993135A2 EP1993135A2 (en) 2008-11-19
EP1993135A3 true EP1993135A3 (en) 2010-09-08
EP1993135B1 EP1993135B1 (en) 2014-07-30

Family

ID=39642638

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08251584.2A Ceased EP1993135B1 (en) 2007-05-16 2008-04-30 Heat conducter

Country Status (5)

Country Link
US (1) US20080286602A1 (en)
EP (1) EP1993135B1 (en)
JP (1) JP5025328B2 (en)
KR (1) KR100981480B1 (en)
TW (1) TWI474446B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5112101B2 (en) * 2007-02-15 2013-01-09 株式会社東芝 Semiconductor package
US20100091477A1 (en) * 2008-10-14 2010-04-15 Kabushiki Kaisha Toshiba Package, and fabrication method for the package
JP4643703B2 (en) * 2008-11-21 2011-03-02 株式会社東芝 Semiconductor device fixture and mounting structure thereof
JP5806464B2 (en) * 2010-02-03 2015-11-10 株式会社東芝 Semiconductor element storage package and semiconductor device using the same
JP5978457B2 (en) * 2012-03-19 2016-08-24 パナソニックＩｐマネジメント株式会社 Thermal conductor
KR102071921B1 (en) * 2013-08-27 2020-01-31 엘지전자 주식회사 Heat spreading frame with high heat dissipating function
CN104754913B (en) * 2013-12-27 2018-06-05 华为技术有限公司 Heat-conductive composite material piece and preparation method thereof
JP6233151B2 (en) * 2014-04-02 2017-11-22 株式会社豊田中央研究所 Modules that use overlapping blocks
JP2018046125A (en) * 2016-09-14 2018-03-22 日産自動車株式会社 Semiconductor module
JP6754973B2 (en) * 2017-02-02 2020-09-16 パナソニックＩｐマネジメント株式会社 Graphite radiator plate
CN107953616A (en) * 2017-09-23 2018-04-24 世星科技股份有限公司 The composite construction and its preparation process of a kind of conduction graphite film
EP3627002B1 (en) 2018-09-20 2021-06-30 Flender GmbH Transmission and method for manufacturing such a transmission
JP7497621B2 (en) * 2020-06-04 2024-06-11 セイコーエプソン株式会社 LAMINATED HEAT DISLIPPER, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING LAMINATED HEAT DISLIPPER
US12108563B2 (en) * 2022-07-27 2024-10-01 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having embedded power electronics devices
US11869760B1 (en) * 2022-07-27 2024-01-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating layer
US12165954B2 (en) * 2022-08-19 2024-12-10 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating S-cells

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
WO1999014805A1 (en) * 1997-09-19 1999-03-25 Advanced Ceramics Corporation Flexible heat transfer device and method
US20070289730A1 (en) * 2006-06-06 2007-12-20 Chang-Hsin Wu Combination heat-transfer plate member
US20080067673A1 (en) * 2006-08-29 2008-03-20 Kabushiki Kaisha Toshiba Semiconductor device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US349615A (en) * 1886-09-21 Signor to george westing house
US325921A (en) * 1885-09-08 Pen-holder
US346421A (en) * 1886-07-27 Brush
JPH03122382U (en) * 1990-03-23 1991-12-13
DE19804283B4 (en) * 1998-02-04 2006-10-12 Sgl Carbon Ag Metal reinforced graphite laminate
JP2001144237A (en) 1999-11-18 2001-05-25 Matsushita Electric Ind Co Ltd Graphite sheet laminated thermal conductor
JP2003168882A (en) 2001-11-30 2003-06-13 Sony Corp Thermal conductive sheet
JP2005229100A (en) * 2004-01-13 2005-08-25 Japan Matekkusu Kk Heat dissipation sheet and heat sink
EP1731002A4 (en) * 2004-03-30 2010-05-26 Honeywell Int Inc THERMAL DISSIPATOR, INTEGRATED CIRCUIT, METHODS OF MANUFACTURING THERMAL DISSIPATOR AND METHODS OF MAKING THE INTEGRATED CIRCUIT
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock
JP4440838B2 (en) 2005-06-30 2010-03-24 ポリマテック株式会社 Thermally conductive member and cooling structure using the thermally conductive member
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
JP4831305B2 (en) 2005-11-14 2011-12-07 ブラザー工業株式会社 Inkjet head
TWM299457U (en) * 2006-03-22 2006-10-11 Lin Li Na Heat dissipating apparatus of LCD display

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
WO1999014805A1 (en) * 1997-09-19 1999-03-25 Advanced Ceramics Corporation Flexible heat transfer device and method
US20070289730A1 (en) * 2006-06-06 2007-12-20 Chang-Hsin Wu Combination heat-transfer plate member
US20080067673A1 (en) * 2006-08-29 2008-03-20 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
US20080286602A1 (en) 2008-11-20
JP2008288337A (en) 2008-11-27
EP1993135A2 (en) 2008-11-19
KR100981480B1 (en) 2010-09-10
TW200921871A (en) 2009-05-16
KR20080101716A (en) 2008-11-21
TWI474446B (en) 2015-02-21
JP5025328B2 (en) 2012-09-12
EP1993135B1 (en) 2014-07-30

Similar Documents

Publication Publication Date Title
EP1993135A3 (en) Heat conducter
EP2390946A3 (en) Conductor-connecting washer, connection mechanism using the same, and method of manufacturing conductor-connecting washer
EP2086056A3 (en) Crimping terminal
EP2607662A3 (en) Electrical Connectors
EP2456294A3 (en) Inverter
EP2605392A3 (en) Electric power converter
EP3157265A3 (en) Wireless earbuds with electronic contacts
EP2256767A3 (en) Heatpipe for terminal of circuit breaker
EP2204885A3 (en) Contact terminal for conductors
EP1986279A3 (en) Connector and connector connecting body
EP2075811A3 (en) Improved terminal, particularly for automatic circuit breakers
EP2293351A3 (en) Solar cell
EP2618337A3 (en) Conductor insulation with micro oxide particles
EP2395827A3 (en) Substrate unit and electronic device
EP2450908A3 (en) Conductive paste, electrode and electronic device and solar cell including an electrode formed using the conductive paste
EP1903637A3 (en) Electrical interconnection having magnetic conductive elements
EP2403075A3 (en) Connector for interconnecting conductors of circuit boards
EP2629370A3 (en) Slot antenna having broad bandwidth and high radiation efficiency
EP2819158A3 (en) Thermally conductive dielectric interface
EP2444297A3 (en) Electric power steering system
EP2388439A3 (en) Airfoil component having electrochemically insulating layer
EP2339592A3 (en) Cable, cable connector and cable assembly
EP2592371A3 (en) Cooling appliance
EP2043128A3 (en) Fuse puller and electric junction box
EP3145034A3 (en) Housing arrangement, electrical connector comprising a housing arrangement and electrical connection arrangement comprising an electrical connector

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080507

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

AKX Designation fees paid

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 20130531

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140210

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602008033546

Country of ref document: DE

Effective date: 20140911

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602008033546

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20150504

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20170313

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20170426

Year of fee payment: 10

Ref country code: DE

Payment date: 20170426

Year of fee payment: 10

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602008033546

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20180430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180430