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EP1988181A1 - Method and device for processing molten metal - Google Patents

Method and device for processing molten metal Download PDF

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Publication number
EP1988181A1
EP1988181A1 EP08001357A EP08001357A EP1988181A1 EP 1988181 A1 EP1988181 A1 EP 1988181A1 EP 08001357 A EP08001357 A EP 08001357A EP 08001357 A EP08001357 A EP 08001357A EP 1988181 A1 EP1988181 A1 EP 1988181A1
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EP
European Patent Office
Prior art keywords
plasma
molten metal
hood
atmospheric pressure
pressure plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08001357A
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German (de)
French (fr)
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EP1988181B1 (en
Inventor
Klaus W. Dr. Gerstenberg
Ernst Dr. Wandke
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Linde GmbH
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Linde GmbH
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Publication date
Application filed by Linde GmbH filed Critical Linde GmbH
Priority to EP20080001357 priority Critical patent/EP1988181B1/en
Publication of EP1988181A1 publication Critical patent/EP1988181A1/en
Application granted granted Critical
Publication of EP1988181B1 publication Critical patent/EP1988181B1/en
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/006—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals with use of an inert protective material including the use of an inert gas
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/16—Remelting metals
    • C22B9/22—Remelting metals with heating by wave energy or particle radiation
    • C22B9/226—Remelting metals with heating by wave energy or particle radiation by electric discharge, e.g. plasma
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B3/00—Hearth-type furnaces, e.g. of reverberatory type; Electric arc furnaces ; Tank furnaces
    • F27B3/08—Hearth-type furnaces, e.g. of reverberatory type; Electric arc furnaces ; Tank furnaces heated electrically, with or without any other source of heat
    • F27B3/085—Arc furnaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
    • C22B9/05—Refining by treating with gases, e.g. gas flushing also refining by means of a material generating gas in situ

Definitions

  • the present invention relates to an apparatus for treating molten metals comprising a melting vessel containing the molten metal and a method for treating molten metals.
  • oxide formation on the surface of the molten metal is known to occur, which leads to manifold problems.
  • the oxides formed are also called dross.
  • the usual procedure envisages to mechanically skim off the herbs in metal melts on a regular basis. This causes an increased material consumption and maintenance and increased environmental impact and leads to high error rates especially in solder melting.
  • the plasma generator is designed to generate a low-temperature atmospheric pressure plasma suitable. Under low temperature in this context, temperatures below 300 ° C, preferably in the range between room temperature and 250 ° C.
  • the plasma apparatus is particularly preferably suitable for producing a reducing-acting atmospheric-pressure plasma educated.
  • a corresponding process gas for example the use of forming gas (N 2 : H 2 in the ratio 95: 5)
  • N 2 : H 2 in the ratio 95: 5 is provided to produce a reducing-acting low-temperature atmospheric-pressure plasma. It can thereby be achieved that the ions and radicals formed in the plasma reduce the metal oxides without the energy level (temperature) required under normal conditions being required.
  • the plasma significantly reduces the technically usable reduction temperature.
  • a cover over the melt container is provided.
  • the cover is designed as a hood.
  • the hood is designed to be vertically displaceable. The cover or hood serves to shield from the environment and simplifies the exposure to the plasma or with protective and active gas for certain applications.
  • the plasma device is mounted in the region of the cover.
  • a connection is provided, via which the plasma device is connected to the cover.
  • a plasma device is e.g. connected to the cover via a flexible hose.
  • a remote plasma is thus used uncoupled from the plasma generator as a generator.
  • fittings are provided in the region of the molten metal.
  • here are the typical installations in the soldering a Wellenlötstrom called.
  • the object is achieved in that the surface of the molten metal is subjected to a low-temperature atmospheric pressure plasma.
  • the surface of the molten metal is subjected to a reducing atmospheric pressure plasma.
  • a molten solder is used as molten metal in the invention.
  • the hood 2 is completely closed on five sides, only in the direction of solder bath 1, it is open and designed so that it dips after lowering with its side walls 4 about 30 mm deep into the solder bath 1. With e.g. after lowering the hood 2 under the hood 2 no pressure is built up, ventilation devices 10 are provided on the hood 2, which allow pressure equalization.
  • two plasma devices 5 are attached, which serve to generate the plasma plasma 6 shown as plasma.
  • the plasma is while the hood 2 is in the lowered position 7 (working position 7), injected between the hood 2 and the surface 8 of the Lotbads 1 and thus reducing the scabies 9 effective or contributes to the prevention or reduction of dross.
  • connection 12 to at least one plasma device 5 is provided via a flexible hose 12.
  • the reduction of the oxides or the avoidance or reduction of oxide formation can thus take place via a so-called remote plasma.
  • the connection 12 can also be configured differently, for example as a pipeline or as a branching connection to a plurality of plasma devices and / or multiple feed points above the solder bath or generally via a molten metal.
  • the connection 12 always separates the generation of the plasma and the place of use of the plasma spatially from each other.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

Plasma units (5) are positioned on the bath (B) of molten metal (1), such that its surface (8) is treated by a low-temperature, atmospheric-pressure plasma. The units are designed to produce a reducing plasma at atmospheric pressure. A cover, especially a hood (2), is located above the melt vessel (B). It is constructed for vertical movement and the plasma units are fastened at or near its rear. The bath contains molten solder (1). An independent claim IS INCLUDED FOR the corresponding method.

Description

Die vorliegende Erfindung betrifft eine Vorrichtung zur Behandlung von Metallschmelzen aufweisend einen Schmelzenbehälter, der die Metallschmelze enthält, sowie ein Verfahren zur Behandlung von Metallschmelzen.The present invention relates to an apparatus for treating molten metals comprising a melting vessel containing the molten metal and a method for treating molten metals.

Beim Schmelzen von Metallen und beim Umgang mit Metallschmelzen tritt an der Oberfläche der Metallschmelze bekanntermaßen eine Oxidbildung auf, die zu mannigfaltigen Problemen führt. Die gebildeten Oxide werden auch als Krätze bezeichnet. Die übliche Vorgehensweise sieht vor, bei Metallschmelzen die Kräzte regelmäßig mechanisch abzuschöpfen. Dies verursacht einen erhöhten Materialverbrauch und Wartungsaufwand sowie eine erhöhte Umweltbelastung und führt speziell bei Lotschmelzen zu hohen Fehlerraten.In the melting of metals and in the handling of molten metals, oxide formation on the surface of the molten metal is known to occur, which leads to manifold problems. The oxides formed are also called dross. The usual procedure envisages to mechanically skim off the herbs in metal melts on a regular basis. This causes an increased material consumption and maintenance and increased environmental impact and leads to high error rates especially in solder melting.

Aufgabe der vorliegenden Erfindung ist es, den Anfall von Krätze auf der Oberfläche von Metallschmelzen zu vermindern bzw. zu verhindern.The object of the present invention is to reduce or prevent the onset of dross on the surface of metal melts.

Vorrichtungsseitig wird die gestellte Aufgabe dadurch gelöst, dass ein Plasmagerät vorgesehen und so in Bezug auf den Schmelzenbehälter positioniert ist, dass die Oberfläche der Metallschmelze mit einem Niedertemperatur-Atmosphärendruck-Plasma beaufschlagbar ist. Es wurde gefunden, dass die Wirkungsweise auf einem Zusammenspiel zwischen den im Plasma gebildeten Ionen und Radikalen und den Metalloxiden bzw. deren Vorprodukte beruht. Unter Atmosphärendruckplasma soll im Folgenden ein Plasma verstanden werden, welches bei einem Druck, der höchstens 200 mbar vom Umgebungsdruck abweicht, d.h. Umgebungsdruck ±200 mbar, vorliegt. Insbesondere wird das Atmosphärendruckplasma in einem Druckbereich zwischen 800 mbar und 1200 mbar erzeugt.On the device side, the stated object is achieved in that a plasma device is provided and positioned with respect to the melt container, that the surface of the molten metal is acted upon by a low-temperature atmospheric pressure plasma. It has been found that the mode of action is based on an interaction between the ions and radicals formed in the plasma and the metal oxides or their precursors. Under atmospheric pressure plasma is to be understood in the following, a plasma which at a pressure which deviates at most 200 mbar from the ambient pressure, i. Ambient pressure ± 200 mbar, is present. In particular, the atmospheric pressure plasma is generated in a pressure range between 800 mbar and 1200 mbar.

Bevorzugt ist das Plasmagerät zur Erzeugung eines Niedertemperatur-Atmosphärendruck-Plasmas geeignet ausgebildet. Unter Niedertemperatur werden in diesem Zusammenhang Temperaturen unterhalb von 300 °C, vorzugsweise im Bereich zwischen Raumtemperatur und 250 °C. Besonders bevorzugt ist das Plasmagerät zur Erzeugung eines reduzierend wirkenden Atmosphärendruck-Plasmas geeignet ausgebildet. Beispielsweise ist zur Erzeugung eines reduzierend wirkenden Niedertemperatur-Atmosphärendruck-Plasmas der Einsatz eines entsprechenden Prozessgases, z.B. der Einsatz von Formiergas (N2 : H2 im Verhältnis 95 : 5), vorgesehen. Dadurch kann erreicht werden, dass die im Plasma gebildeten Ionen und Radikale die Metalloxide reduzieren, ohne dass die unter Normalbedingungen erforderliche Energiestufe (Temperatur) erforderlich ist. Mit dem Plasma wird die technisch nutzbare Reduktionstemperatur wesentlich verringert.Preferably, the plasma generator is designed to generate a low-temperature atmospheric pressure plasma suitable. Under low temperature in this context, temperatures below 300 ° C, preferably in the range between room temperature and 250 ° C. The plasma apparatus is particularly preferably suitable for producing a reducing-acting atmospheric-pressure plasma educated. For example, the use of a corresponding process gas, for example the use of forming gas (N 2 : H 2 in the ratio 95: 5), is provided to produce a reducing-acting low-temperature atmospheric-pressure plasma. It can thereby be achieved that the ions and radicals formed in the plasma reduce the metal oxides without the energy level (temperature) required under normal conditions being required. The plasma significantly reduces the technically usable reduction temperature.

Zweckmäßigerweise ist eine Abdeckung über dem Schmelzenbehälter vorgesehen. Bevorzugt ist die Abdeckung als Haube ausgebildet. Besonders bevorzugt ist die Haube vertikal verschiebbar ausgebildet. Die Abdeckung oder Haube dient der Abschirmung von der Umgebung und vereinfacht die Beaufschlagung mit dem Plasma oder auch mit Schutz- und Aktivgas für bestimmte Anwendungsfälle.Conveniently, a cover over the melt container is provided. Preferably, the cover is designed as a hood. Particularly preferably, the hood is designed to be vertically displaceable. The cover or hood serves to shield from the environment and simplifies the exposure to the plasma or with protective and active gas for certain applications.

Gemäß einer vorteilhaften Ausgestaltung der Erfindung sind zwei oder mehr Plasmageräte vorgesehen. Ziel ist es hierbei eine gleichmäßige Beaufschlagung der gesamten Oberfläche zu erreichen.According to an advantageous embodiment of the invention, two or more plasma devices are provided. The goal here is to achieve a uniform application of the entire surface.

Vorteilhafterweise ist das Plasmagerät im Bereich der Abdeckung befestigt.Advantageously, the plasma device is mounted in the region of the cover.

Gemäß einer anderen vorteilhaften Ausgestaltung der Erfindung ist eine Verbindung vorgesehen, über die das Plasmagerät mit der Abdeckung verbunden ist. Dies ermöglicht, ein sog. Remote-Plasma für die Anwendung vorzusehen. Bei einem Remote-Plasma ist ein Plasmagerät z.B. über einen flexiblen Schlauch mit der Abdeckung verbunden. Ein Remote-Plasma kommt also abgekoppelt vom Plasmagerät als Erzeuger zum Einsatz.According to another advantageous embodiment of the invention, a connection is provided, via which the plasma device is connected to the cover. This makes it possible to provide a so-called remote plasma for the application. In a remote plasma, a plasma device is e.g. connected to the cover via a flexible hose. A remote plasma is thus used uncoupled from the plasma generator as a generator.

Eine Ausgestaltung der Erfindung, die besondere Vorteile aufweist, sieht vor, dass der Schmelzenbehälter ein Lotbad enthält. Es wurde gefunden, dass die vorliegende Erfindung sehr vorteilhaft bei Löteinrichtungen und -anlagen zum Einsatz kommt. Die Krätzebildung auf der Oberfläche des flüssigen Lots oder Lotbads soll effektiv vermindert bzw. verhindert werden. Z.B. liegt mit einer erfindungsgemäßen Vorrichtung mit Plasmaeinsatz die erforderliche Temperatur für eine erfolgreiche Reduktion von Zinn durch Wasserstoff deutlich unter den unter Normalbedingungen erforderlichen 380°C.An embodiment of the invention, which has particular advantages, provides that the melt container contains a solder bath. It has been found that the present invention is used very advantageously in soldering devices and systems. The dross on the surface of the liquid solder or Lotbads should be effectively reduced or prevented. For example, with a device according to the invention having a plasma insert, the required temperature for a successful reduction of tin by hydrogen is clearly below the 380 ° C. required under normal conditions.

Gemäß einer weiteren vorteilhaften Ausgestaltung der Erfindung sind Einbauten im Bereich der Metallschmelze vorgesehen. Als Beispiel seien hier die typischen Einbauten im Lötbereich einer Wellenlötanlage genannt.According to a further advantageous embodiment of the invention, fittings are provided in the region of the molten metal. As an example, here are the typical installations in the soldering a Wellenlötanlage called.

Verfahrensseitig wird die gestellte Aufgabe dadurch gelöst, dass die Oberfläche der Metallschmelze mit einem Niedertemperatur-Atmosphärendruck-Plasma beaufschlagt wird. Besonders bevorzugt wird die Oberfläche der Metallschmelze mit einem reduzierend wirkenden Atmosphärendruck-Plasma beaufschlagt. Die Vorteile dieser Beaufschlagung wurden bei der Beschreibung der entsprechenden Vorrichtungsansprüche bereits diskutiert.The method, the object is achieved in that the surface of the molten metal is subjected to a low-temperature atmospheric pressure plasma. Particularly preferably, the surface of the molten metal is subjected to a reducing atmospheric pressure plasma. The advantages of this loading have already been discussed in the description of the corresponding device claims.

Mit besonderem Vorteil wird bei der Erfindung eine Lotschmelze als Metallschmelze eingesetzt.With particular advantage, a molten solder is used as molten metal in the invention.

Die Erfindung bietet eine Reihe von Vorteilen, von denen im Folgenden einige beispielhaft genannt werden:

  • Die Verminderung oder Vermeidung des Anfalls von Krätze oder Metalloxiden auf der Oberfläche von Metallschmelzen führt zu einer Verminderung des Materialverbrauchs, des Reinigungs- und Wartungsaufwands sowie der Umweltbelastung. Bei Lötanlagen kann durch eine erfindungsgemäße Beaufschlagung des Lotbads zusätzlich die Lötqualität verbessert werden. Für alle Metallschmelzen gilt, dass die Produktqualität verbessert wird.
  • Die Erfindung sowie weitere Ausgestaltungen der Erfindung werden im Folgenden anhand der in den Figuren dargestellten Ausführungsbeispiele näher erläutert. Die Figuren zeigen:
    Figur 1
    eine erfindungsgemäße Vorrichtung für das Lotbad einer Wellenlötanlage,
    Figur
    2eine erfindungsgemäße Vorrichtung für das Lotbad einer Wellenlötanlage mit einer Verbindung für ein Remote-Plasma.
The invention offers a number of advantages, some of which are mentioned below by way of example:
  • Reducing or preventing the onset of scabies or metal oxides on the surface of molten metals results in a reduction in material consumption, cleaning and maintenance efforts, and environmental impact. In soldering systems, the soldering quality can additionally be improved by applying the soldering bath according to the invention. For all metal melts, the product quality is improved.
  • The invention and further embodiments of the invention are explained in more detail below with reference to the exemplary embodiments illustrated in the figures. The figures show:
    FIG. 1
    a device according to the invention for the solder bath of a wave soldering machine,
    figure
    2 shows a device according to the invention for the solder bath of a wave soldering system with a connection for a remote plasma.

In der Figur 1 ist eine über dem Lotbad 1 installierte Haube 2 zu sehen, die senkrecht verschiebbar und arretierbar ausgebildet ist. Die Bezugsziffer 3 zeigt die Richtung der Verschiebbarkeit an. Die mit der Bezugsziffer 7 versehene Darstellung in gestrichelten Linien zeigt die Haube 2 in ihrer abgesenkten Position 7, die auch als Arbeitsposition 7 bezeichnet werden kann.In the FIG. 1 is an installed over the solder bath 1 hood 2, which is designed to be vertically displaceable and lockable. Reference numeral 3 indicates the direction of displaceability. The representation indicated by the reference numeral 7 in dashed lines shows the hood 2 in its lowered position 7, which can also be referred to as working position 7.

Die Haube 2 ist an fünf Seiten vollständig geschlossen, nur in Richtung Lotbad 1 ist sie offen und so gestaltet, dass sie nach dem Absenken mit ihren Seitenwänden 4 etwa 30 mm tief in das Lotbad 1 eintaucht. Damit z.B. nach dem Absenken der Haube 2 unter der Haube 2 kein Überdruck aufgebaut wird, sind Be- und Entlüftungseinrichtungen 10 an der Haube 2 vorgesehen, die einen Druckausgleich ermöglichen.The hood 2 is completely closed on five sides, only in the direction of solder bath 1, it is open and designed so that it dips after lowering with its side walls 4 about 30 mm deep into the solder bath 1. With e.g. after lowering the hood 2 under the hood 2 no pressure is built up, ventilation devices 10 are provided on the hood 2, which allow pressure equalization.

Auf bzw. an der Haube 2 sind zwei Plasmageräte 5 angebracht, die zur Erzeugung des als Plasmawolken 6 abgebildeten Plasmas dienen. Das Plasma wird während die Haube 2 sich in der abgesenkten Position 7 (Arbeitsposition 7) befindet, zwischen die Haube 2 und der Oberfläche 8 des Lotbads 1 eingeblasen und so reduzierend auf die Krätze 9 wirksam bzw. trägt zur Vermeidung oder Verminderung von Krätzebildung bei.On or on the hood 2, two plasma devices 5 are attached, which serve to generate the plasma plasma 6 shown as plasma. The plasma is while the hood 2 is in the lowered position 7 (working position 7), injected between the hood 2 and the surface 8 of the Lotbads 1 and thus reducing the scabies 9 effective or contributes to the prevention or reduction of dross.

In der Figur 2 ist statt der Anbringung der Plasmageräte an der Haube 2 mindestens eine Verbindung 12 zu mindestens einem Plasmagerät 5 über einen flexiblen Schlauch 12 vorgesehen. Die Reduktion der Oxide bzw. die Vermeidung oder Verminderung der Oxidbildung kann damit über ein sog. Remote-Plasma erfolgen. Die Verbindung 12 kann selbstverständlich auch anders ausgestaltet sein, z.B. als Rohrleitung oder als sich verzweigende Verbindung zu mehreren Plasmageräten und/oder mehreren Zufuhrstellen über dem Lotbad oder allg. über einer Metallschmelze. Die Verbindung 12 trennt jedoch immer die Erzeugung des Plasmas und den Einsatzort des Plasmas räumlich voneinander.In the FIG. 2 instead of attaching the plasma devices to the hood 2, at least one connection 12 to at least one plasma device 5 is provided via a flexible hose 12. The reduction of the oxides or the avoidance or reduction of oxide formation can thus take place via a so-called remote plasma. Of course, the connection 12 can also be configured differently, for example as a pipeline or as a branching connection to a plurality of plasma devices and / or multiple feed points above the solder bath or generally via a molten metal. However, the connection 12 always separates the generation of the plasma and the place of use of the plasma spatially from each other.

Claims (10)

Vorrichtung zur Behandlung von Metallschmelzen (1) aufweisend einen Schmelzenbehälter (B), der die Metallschmelze (1) enthält, dadurch gekennzeichnet, dass mindestens ein Plasmagerät (5) vorgesehen und so in Bezug auf den Schmelzenbehälter (B) positioniert ist, dass die Oberfläche (8) der Metallschmelze (1) mit einem Niedertemperatur-Atmosphärendruck-Plasma beaufschlagbar ist.Device for the treatment of molten metal (1) comprising a melting vessel (B) containing the molten metal (1), characterized in that at least one plasma device (5) is provided and positioned with respect to the melting vessel (B) such that the surface (8) of the molten metal (1) can be acted upon by a low-temperature atmospheric pressure plasma. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass das Plasmagerät (5) zur Erzeugung eines reduzierend wirkenden Atmosphärendruck-Plasmas geeignet ausgebildet ist.Apparatus according to claim 1, characterized in that the plasma device (5) is designed to generate a reducing acting atmospheric pressure plasma suitable. Vorrichtung nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass eine Abdeckung (2), insbesondere eine Haube, über dem Schmelzenbehälter (B) vorgesehen ist.Device according to one of claims 1 or 2, characterized in that a cover (2), in particular a hood, over the melt container (B) is provided. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, dass die Haube (2) vertikal verschiebbar ausgebildet ist.Apparatus according to claim 3, characterized in that the hood (2) is designed to be vertically displaceable. Vorrichtung nach einem der Ansprüche 3 oder 4, dadurch gekennzeichnet, dass das Plasmagerät (5) im Bereich der Abdeckung (2) befestigt ist.Device according to one of claims 3 or 4, characterized in that the plasma device (5) in the region of the cover (2) is fixed. Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Schmelzenbehälter (B) ein Lotbad (1) enthält.Device according to one of claims 1 to 5, characterized in that the melt container (B) contains a solder bath (1). Verfahren zur Behandlung von Metallschmelzen (1), dadurch gekennzeichnet, dass die Oberfläche (8) der Metallschmelze (1) mit einem Niedertemperatur-Atmosphärendruck-Plasma beaufschlagt wird.Process for the treatment of molten metals (1), characterized in that the surface (8) of the molten metal (1) is subjected to a low-temperature atmospheric-pressure plasma. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass die Oberfläche (8) der Metallschmelze (1) mit einem Niedertemperatur-Atmosphärendruck-Plasma beaufschlagt wird.A method according to claim 7, characterized in that the surface (8) of the molten metal (1) is subjected to a low-temperature atmospheric pressure plasma. Verfahren nach Anspruch 7 oder 8, dadurch gekennzeichnet, dass die Oberfläche (8) der Metallschmelze (1) mit einem reduzierend wirkenden Atmosphärendruck-Plasma beaufschlagt wird.Method according to claim 7 or 8, characterized in that the surface (8) the molten metal (1) is subjected to a reducing atmospheric pressure plasma. Verfahren nach Anspruch 9, dadurch gekennzeichnet, dass als Metallschmelze eine Lotschmelze eingesetzt wird.A method according to claim 9, characterized in that a molten solder is used as the molten metal.
EP20080001357 2007-04-03 2008-01-24 Method for processing molten metal Not-in-force EP1988181B1 (en)

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DE200710016102 DE102007016102A1 (en) 2007-04-03 2007-04-03 Apparatus and method for treating molten metals
EP07012518 2007-06-26
EP20080001357 EP1988181B1 (en) 2007-04-03 2008-01-24 Method for processing molten metal

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EP1988181B1 EP1988181B1 (en) 2010-09-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426223A (en) * 1981-10-19 1984-01-17 Council For Mineral Technology Refining of ferrochromium metal
EP0517430A1 (en) * 1991-06-03 1992-12-09 Motorola, Inc. Plasma based soldering
WO1993019575A1 (en) * 1992-03-20 1993-09-30 Linde Aktiengesellschaft Process for soldering printed circuit boards under low pressure
US5368627A (en) * 1990-08-22 1994-11-29 Cowx; Peter M. Treatment of oxide-containing dusts
US6391081B1 (en) * 1999-03-25 2002-05-21 Sony Corporation Metal purification method and metal refinement method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4426223A (en) * 1981-10-19 1984-01-17 Council For Mineral Technology Refining of ferrochromium metal
US5368627A (en) * 1990-08-22 1994-11-29 Cowx; Peter M. Treatment of oxide-containing dusts
EP0517430A1 (en) * 1991-06-03 1992-12-09 Motorola, Inc. Plasma based soldering
WO1993019575A1 (en) * 1992-03-20 1993-09-30 Linde Aktiengesellschaft Process for soldering printed circuit boards under low pressure
US6391081B1 (en) * 1999-03-25 2002-05-21 Sony Corporation Metal purification method and metal refinement method

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EP1988181B1 (en) 2010-09-01

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