EP1824638A4 - Alliage de soudure sans plomb - Google Patents

Alliage de soudure sans plomb

Info

Publication number: EP1824638A4
Authority: EP; European Patent Office
Prior art keywords: alloy; lead; lot; free lot; free
Prior art date: 2004-11-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP05726536A

Other languages

German (de)

English (en)

Other versions

EP1824638A1 (fr

Inventor

Back Ki Sung

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Samsung Electronics Co Ltd

Original Assignee

Samsung Electronics Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-11-13

Filing date

2005-02-02

Publication date

2009-07-08

2005-02-02 Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd

2007-08-29 Publication of EP1824638A1 publication Critical patent/EP1824638A1/fr

2009-07-08 Publication of EP1824638A4 publication Critical patent/EP1824638A4/fr

Status Withdrawn legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

EP05726536A 2004-11-13 2005-02-02 Alliage de soudure sans plomb Withdrawn EP1824638A4 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020040092857A KR20050030237A (ko)	2004-11-13	2004-11-13	무연 솔더 합금
PCT/KR2005/000305 WO2006052049A1 (fr)	2004-11-13	2005-02-02	Alliage de soudure sans plomb

Publications (2)

Publication Number	Publication Date
EP1824638A1 EP1824638A1 (fr)	2007-08-29
EP1824638A4 true EP1824638A4 (fr)	2009-07-08

Family

ID=36336697

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP05726536A Withdrawn EP1824638A4 (fr)	2004-11-13	2005-02-02	Alliage de soudure sans plomb

Country Status (6)

Country	Link
US (1)	US20090129970A1 (fr)
EP (1)	EP1824638A4 (fr)
JP (1)	JP2008518791A (fr)
KR (1)	KR20050030237A (fr)
CN (1)	CN101048258A (fr)
WO (1)	WO2006052049A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI465312B (zh) *	2005-07-19	2014-12-21	Nihon Superior Co Ltd	追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
CN101356293B (zh) *	2006-01-10	2010-12-29	伊利诺斯工具制品有限公司	低铜溶解的无铅焊料
CN1803381A (zh) *	2006-01-11	2006-07-19	黄守友	无铅焊料及其制备方法
TWI311087B (en) *	2006-01-16	2009-06-21	Hitachi Metals Ltd	Solder alloy, solder-ball and solder joint with use of the same
JP5376553B2 (ja) *	2006-06-26	2013-12-25	日立金属株式会社	配線用導体及び端末接続部
JP5051633B2 (ja) *	2006-10-12	2012-10-17	富士電機株式会社	はんだ合金
JP5249958B2 (ja) *	2008-02-22	2013-07-31	株式会社日本スペリア社	Ｎｉを含む無鉛はんだのＮｉ濃度調整法
JP2011044571A (ja) *	2009-08-20	2011-03-03	Renesas Electronics Corp	半導体装置、外部接続端子、半導体装置の製造方法、及び外部接続端子の製造方法
EP2405469B1 (fr) *	2010-07-05	2016-09-21	ATOTECH Deutschland GmbH	Procédé pour la formation de dépôts d'alliage de soudure sur des substrats
KR101455967B1 (ko) *	2012-06-30	2014-10-31	센주긴조쿠고교 가부시키가이샤	납프리 땜납 볼
CN103624415A (zh) *	2012-08-22	2014-03-12	北京有色金属研究总院	一种含硼锡基无铅焊料及其制备方法
CN105290640A (zh) *	2015-11-30	2016-02-03	苏州龙腾万里化工科技有限公司	一种无铅焊锡条
JP7068370B2 (ja) *	2020-03-19	2022-05-16	千住金属工業株式会社	はんだ合金、はんだボールおよびはんだ継手

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0847829A1 (fr) *	1996-12-16	1998-06-17	Ford Motor Company	Composition pour soudure tendre sans plomb
WO1998034755A1 (fr) *	1997-02-10	1998-08-13	Iowa State University Research Foundation, Inc.	Soudure sans plomb
EP1088615A2 (fr) *	1999-09-29	2001-04-04	Nec Corporation	Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08215880A (ja) *	1995-02-14	1996-08-27	Ishikawa Kinzoku Kk	無鉛はんだ
US6179935B1 (en) *	1997-04-16	2001-01-30	Fuji Electric Co., Ltd.	Solder alloys
JP3296289B2 (ja) *	1997-07-16	2002-06-24	富士電機株式会社	はんだ合金
JP3575311B2 (ja) *	1998-01-28	2004-10-13	株式会社村田製作所	Ｐｂフリー半田および半田付け物品
JP3786251B2 (ja) *	2000-06-30	2006-06-14	日本アルミット株式会社	無鉛半田合金
JP3796181B2 (ja) *	2002-02-14	2006-07-12	新日本製鐵株式会社	無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
KR100445350B1 (ko) *	2003-04-17	2004-08-26	희성금속 주식회사	납땜용 무연합금

2004
- 2004-11-13 KR KR1020040092857A patent/KR20050030237A/ko not_active Withdrawn
2005
- 2005-02-02 CN CNA2005800372893A patent/CN101048258A/zh active Pending
- 2005-02-02 US US11/577,927 patent/US20090129970A1/en not_active Abandoned
- 2005-02-02 WO PCT/KR2005/000305 patent/WO2006052049A1/fr not_active Ceased
- 2005-02-02 JP JP2007540243A patent/JP2008518791A/ja active Pending
- 2005-02-02 EP EP05726536A patent/EP1824638A4/fr not_active Withdrawn

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0847829A1 (fr) *	1996-12-16	1998-06-17	Ford Motor Company	Composition pour soudure tendre sans plomb
WO1998034755A1 (fr) *	1997-02-10	1998-08-13	Iowa State University Research Foundation, Inc.	Soudure sans plomb
EP1088615A2 (fr) *	1999-09-29	2001-04-04	Nec Corporation	Brasure Sn-Ag-Cu et méthodes de traitement de surface et de montage de pièces l'utilisant

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KIM K S ET AL: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", MICROELECTRONICS AND RELIABILITY, ELSEVIER SCIENCE LTD, GB, vol. 43, no. 2, 1 January 2003 (2003-01-01), pages 259 - 267, XP008067189, ISSN: 0026-2714 *
See also references of WO2006052049A1 *

Also Published As

Publication number	Publication date
WO2006052049A1 (fr)	2006-05-18
US20090129970A1 (en)	2009-05-21
EP1824638A1 (fr)	2007-08-29
KR20050030237A (ko)	2005-03-29
JP2008518791A (ja)	2008-06-05
CN101048258A (zh)	2007-10-03

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Legal Events

Date	Code	Title	Description
2007-07-27	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2007-08-29	17P	Request for examination filed	Effective date: 20070605
2007-08-29	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE GB NL
2008-02-20	DAX	Request for extension of the european patent (deleted)
2008-02-20	RBV	Designated contracting states (corrected)	Designated state(s): DE GB NL
2008-04-23	RBV	Designated contracting states (corrected)	Designated state(s): DE GB NL
2009-07-08	A4	Supplementary search report drawn up and despatched	Effective date: 20090608
2009-07-08	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/34 20060101ALI20090602BHEP Ipc: C22C 13/00 20060101ALI20090602BHEP Ipc: B23K 35/22 20060101AFI20060529BHEP
2010-02-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2010-03-24	18D	Application deemed to be withdrawn	Effective date: 20090908