EP1817500A4 - Preconditionnement pour pompes a vide - Google Patents
Preconditionnement pour pompes a videInfo
- Publication number
- EP1817500A4 EP1817500A4 EP05852187A EP05852187A EP1817500A4 EP 1817500 A4 EP1817500 A4 EP 1817500A4 EP 05852187 A EP05852187 A EP 05852187A EP 05852187 A EP05852187 A EP 05852187A EP 1817500 A4 EP1817500 A4 EP 1817500A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- preconditioning
- vacuum pumps
- pumps
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B25/00—Multi-stage pumps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
- F04D19/046—Combinations of two or more different types of pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Treating Waste Gases (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/003,125 US7021903B2 (en) | 2003-12-31 | 2004-12-03 | Fore-line preconditioning for vacuum pumps |
| PCT/US2005/042730 WO2006060275A2 (fr) | 2004-12-03 | 2005-11-23 | Preconditionnement pour pompes a vide |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1817500A2 EP1817500A2 (fr) | 2007-08-15 |
| EP1817500A4 true EP1817500A4 (fr) | 2012-09-12 |
| EP1817500B1 EP1817500B1 (fr) | 2014-07-30 |
Family
ID=36565566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05852187.3A Expired - Lifetime EP1817500B1 (fr) | 2004-12-03 | 2005-11-23 | Preconditionnement pour pompes a vide |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7021903B2 (fr) |
| EP (1) | EP1817500B1 (fr) |
| JP (1) | JP5996834B2 (fr) |
| KR (1) | KR101194511B1 (fr) |
| CN (1) | CN100587264C (fr) |
| TW (1) | TWI388729B (fr) |
| WO (1) | WO2006060275A2 (fr) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7278831B2 (en) * | 2003-12-31 | 2007-10-09 | The Boc Group, Inc. | Apparatus and method for control, pumping and abatement for vacuum process chambers |
| EP1761706B1 (fr) * | 2004-06-24 | 2013-05-15 | ixetic Hückeswagen GmbH | Pompe |
| CN100468629C (zh) * | 2005-07-20 | 2009-03-11 | 台达电子工业股份有限公司 | 真空控制系统 |
| KR100749739B1 (ko) * | 2006-02-10 | 2007-08-16 | 삼성전자주식회사 | 반도체 제조장치 |
| GB0617498D0 (en) * | 2006-09-06 | 2006-10-18 | Boc Group Plc | Method of pumping gas |
| US8500382B2 (en) * | 2007-05-22 | 2013-08-06 | Axcelis Technologies Inc. | Airflow management for particle abatement in semiconductor manufacturing equipment |
| US9997325B2 (en) * | 2008-07-17 | 2018-06-12 | Verity Instruments, Inc. | Electron beam exciter for use in chemical analysis in processing systems |
| US8657584B2 (en) * | 2010-02-16 | 2014-02-25 | Edwards Limited | Apparatus and method for tuning pump speed |
| US8408013B2 (en) | 2010-06-30 | 2013-04-02 | Instrotek, Inc. | Lightweight portable moisture traps for use with vacuum pumps |
| JP6368458B2 (ja) * | 2013-05-24 | 2018-08-01 | 株式会社荏原製作所 | 除害機能付真空ポンプ |
| US9240308B2 (en) * | 2014-03-06 | 2016-01-19 | Applied Materials, Inc. | Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system |
| JP5808454B1 (ja) * | 2014-04-25 | 2015-11-10 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体 |
| JP6418838B2 (ja) * | 2014-07-31 | 2018-11-07 | エドワーズ株式会社 | ドライポンプ及び排ガス処理方法 |
| JP6391171B2 (ja) * | 2015-09-07 | 2018-09-19 | 東芝メモリ株式会社 | 半導体製造システムおよびその運転方法 |
| KR102477302B1 (ko) | 2015-10-05 | 2022-12-13 | 주성엔지니어링(주) | 배기가스 분해기를 가지는 기판처리장치 및 그 배기가스 처리방법 |
| GB201613794D0 (en) * | 2016-08-11 | 2016-09-28 | Edwards Ltd | Enclosure system including wire mesh and thin non-porous membrane panels |
| JP6595148B2 (ja) * | 2017-05-29 | 2019-10-23 | カンケンテクノ株式会社 | 排ガスの減圧除害装置 |
| CN108678973A (zh) * | 2018-05-04 | 2018-10-19 | 重庆冲能动力机械有限公司 | 一种用于vpsa气体分离系统的高速直驱双级离心真空泵机组 |
| US11077401B2 (en) * | 2018-05-16 | 2021-08-03 | Highvac Corporation | Separated gas stream point of use abatement device |
| GB201810916D0 (en) * | 2018-07-03 | 2018-08-15 | Edwards Ltd | Gas abatement apparatus |
| GB2579360A (en) * | 2018-11-28 | 2020-06-24 | Edwards Ltd | Multiple chamber vacuum exhaust system |
| GB2584881B (en) * | 2019-06-19 | 2022-01-05 | Edwards Vacuum Llc | Multiple vacuum chamber exhaust system and method of evacuating multiple chambers |
| KR102300561B1 (ko) * | 2020-07-31 | 2021-09-13 | 삼성전자주식회사 | 증착 시스템 및 공정 시스템 |
| US12060637B2 (en) | 2020-12-01 | 2024-08-13 | Applied Materials, Inc. | Actively cooled foreline trap to reduce throttle valve drift |
| KR102583557B1 (ko) * | 2021-05-26 | 2023-10-10 | 세메스 주식회사 | 기판 처리 설비의 배기 장치 및 배기 방법 |
| KR20230025590A (ko) * | 2021-08-13 | 2023-02-22 | 삼성디스플레이 주식회사 | 배출 방법, 배출 시스템 및 이를 포함하는 기판 처리 장치 |
| KR20230068788A (ko) * | 2021-11-11 | 2023-05-18 | 세메스 주식회사 | 기판 처리 장치 |
| CN114975183B (zh) * | 2022-05-31 | 2025-09-16 | 北京北方华创微电子装备有限公司 | 半导体工艺设备的补水控制方法和半导体工艺设备 |
| US12473637B2 (en) * | 2022-08-08 | 2025-11-18 | Applied Materials, Inc. | Interlock system for processing chamber exhaust assembly |
| US12442074B2 (en) * | 2022-08-25 | 2025-10-14 | Applied Materials, Inc. | System and method for controlling foreline pressure |
| KR102657614B1 (ko) * | 2023-02-17 | 2024-04-15 | 주식회사 트리플코어스테크놀러지 | 다수 개의 반응챔버를 가진 모듈타입 폐가스 저감 장치 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636401A (en) * | 1984-02-15 | 1987-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for chemical vapor deposition and method of film deposition using such deposition |
| US4725204A (en) * | 1986-11-05 | 1988-02-16 | Pennwalt Corporation | Vacuum manifold pumping system |
| EP0819779A1 (fr) * | 1996-07-15 | 1998-01-21 | The BOC Group plc | Procédé pour épurer des substances nocives d'un gaz d'échappement |
| JPH11168067A (ja) * | 1997-12-02 | 1999-06-22 | Kanken Techno Kk | 半導体製造排ガスの除害装置及び除害方法 |
| US6635228B1 (en) * | 1999-11-01 | 2003-10-21 | Robert R. Moore | Falling film plasma reactor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US478483A (en) * | 1892-07-05 | I Traube | Bottle stopper | |
| JPS5949822A (ja) | 1982-09-14 | 1984-03-22 | Nippon Sanso Kk | 揮発性無機水素化物等を含有するガスの処理方法 |
| US5616208A (en) | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
| US5795399A (en) | 1994-06-30 | 1998-08-18 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product |
| KR0183912B1 (ko) | 1996-08-08 | 1999-05-01 | 김광호 | 다중 반응 챔버에 연결된 펌핑 설비 및 이를 사용하는 방법 |
| JP3991375B2 (ja) | 1996-11-13 | 2007-10-17 | 東京エレクトロン株式会社 | トラップ装置 |
| US6156107A (en) | 1996-11-13 | 2000-12-05 | Tokyo Electron Limited | Trap apparatus |
| US5944049A (en) | 1997-07-15 | 1999-08-31 | Applied Materials, Inc. | Apparatus and method for regulating a pressure in a chamber |
| JPH11204508A (ja) | 1998-01-09 | 1999-07-30 | Toshiba Corp | 半導体装置の製造方法及び半導体製造装置 |
| US7077159B1 (en) | 1998-12-23 | 2006-07-18 | Applied Materials, Inc. | Processing apparatus having integrated pumping system |
| DE60015003T2 (de) | 1999-04-07 | 2005-06-02 | Alcatel | Druckregelvorrichtung für eine Vakuumkammer, und eine mit einer solchen Vorrichtung versehenen Vakuumpumpeinheit |
| KR100875090B1 (ko) | 2000-08-04 | 2008-12-22 | 아치 스페셜티 케미칼즈, 인코포레이티드 | 초고순도 화학약품 또는 오염에 민감한 화학약품을 위한자동 재충전 시스템 |
| US6689699B2 (en) | 2000-09-21 | 2004-02-10 | Kabushiki Kaisha Toshiba | Method for manufacturing a semiconductor device using recirculation of a process gas |
| US6602323B2 (en) * | 2001-03-21 | 2003-08-05 | Samsung Electronics Co., Ltd. | Method and apparatus for reducing PFC emission during semiconductor manufacture |
| CN1198319C (zh) * | 2001-11-19 | 2005-04-20 | 旺宏电子股份有限公司 | 调整半导体反应室真空系统的排气压力的装置及方法 |
| US7105037B2 (en) * | 2002-10-31 | 2006-09-12 | Advanced Technology Materials, Inc. | Semiconductor manufacturing facility utilizing exhaust recirculation |
-
2004
- 2004-12-03 US US11/003,125 patent/US7021903B2/en not_active Expired - Lifetime
-
2005
- 2005-11-23 WO PCT/US2005/042730 patent/WO2006060275A2/fr not_active Ceased
- 2005-11-23 CN CN200580041324A patent/CN100587264C/zh not_active Expired - Lifetime
- 2005-11-23 EP EP05852187.3A patent/EP1817500B1/fr not_active Expired - Lifetime
- 2005-11-23 JP JP2007544406A patent/JP5996834B2/ja not_active Expired - Lifetime
- 2005-11-23 KR KR1020077012414A patent/KR101194511B1/ko not_active Expired - Lifetime
- 2005-12-02 TW TW094142673A patent/TWI388729B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636401A (en) * | 1984-02-15 | 1987-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for chemical vapor deposition and method of film deposition using such deposition |
| US4725204A (en) * | 1986-11-05 | 1988-02-16 | Pennwalt Corporation | Vacuum manifold pumping system |
| EP0819779A1 (fr) * | 1996-07-15 | 1998-01-21 | The BOC Group plc | Procédé pour épurer des substances nocives d'un gaz d'échappement |
| JPH11168067A (ja) * | 1997-12-02 | 1999-06-22 | Kanken Techno Kk | 半導体製造排ガスの除害装置及び除害方法 |
| US6635228B1 (en) * | 1999-11-01 | 2003-10-21 | Robert R. Moore | Falling film plasma reactor |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI388729B (zh) | 2013-03-11 |
| CN100587264C (zh) | 2010-02-03 |
| US7021903B2 (en) | 2006-04-04 |
| US20050142010A1 (en) | 2005-06-30 |
| WO2006060275A3 (fr) | 2006-08-17 |
| KR20070085630A (ko) | 2007-08-27 |
| TW200632219A (en) | 2006-09-16 |
| JP5996834B2 (ja) | 2016-09-21 |
| EP1817500A2 (fr) | 2007-08-15 |
| EP1817500B1 (fr) | 2014-07-30 |
| KR101194511B1 (ko) | 2012-10-25 |
| JP2010504847A (ja) | 2010-02-18 |
| CN101069017A (zh) | 2007-11-07 |
| WO2006060275A2 (fr) | 2006-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Owner name: BOC EDWARDS, INC. |
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| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: EDWARDS VACUUM, INC. |
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| DAX | Request for extension of the european patent (deleted) | ||
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