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EP1871925A2 - Procede d'electroformage d'une plaque a crampons et d'une matrice de reproduction, matrice d'electroformage pour mise en oeuvre de ce procede et matrice de reproduction - Google Patents

Procede d'electroformage d'une plaque a crampons et d'une matrice de reproduction, matrice d'electroformage pour mise en oeuvre de ce procede et matrice de reproduction

Info

Publication number
EP1871925A2
EP1871925A2 EP06732990A EP06732990A EP1871925A2 EP 1871925 A2 EP1871925 A2 EP 1871925A2 EP 06732990 A EP06732990 A EP 06732990A EP 06732990 A EP06732990 A EP 06732990A EP 1871925 A2 EP1871925 A2 EP 1871925A2
Authority
EP
European Patent Office
Prior art keywords
elevations
die
plate
electroforming
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06732990A
Other languages
German (de)
English (en)
Other versions
EP1871925B1 (fr
Inventor
Harm Gerrit Knol
Lars Cristian Herzbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heidelberger Druckmaschinen AG
Stork Veco BV
Original Assignee
Heidelberger Druckmaschinen AG
Stork Veco BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heidelberger Druckmaschinen AG, Stork Veco BV filed Critical Heidelberger Druckmaschinen AG
Publication of EP1871925A2 publication Critical patent/EP1871925A2/fr
Application granted granted Critical
Publication of EP1871925B1 publication Critical patent/EP1871925B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/52—Stationary guides or smoothers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2404/00—Parts for transporting or guiding the handled material
    • B65H2404/50—Surface of the elements in contact with the forwarded or guided material

Definitions

  • a plate with a working side which is provided with separate elevations are known.
  • a plate of this type is generally produced by machining or deforming a surface of a flat plate so as to form the elevations.
  • One significant drawback of the studded plate produced in this way is that the elevations are not all of the same height with respect to the surface of the plate obtained by machining, which is undesirable.
  • a first object of the present invention is to satisfy this demand.
  • the method for electroforming a plate having a working side which is provided with separate elevations comprises the steps of: providing a flat conductive electroforming die with insulating regions that are separated from one another; electrolytically depositing a screen layer, which comprises a network of dykes, which dykes delimit screen openings, of metal on the electroforming die, the dykes, as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer; electrolytically depositing a continuous metal layer on the passivated surface of the screen layer, in such a manner that at least the screen openings of the screen layer are filled and the passivated surface of the screen layer is completely covered, separating the continuous metal layer having a working side provided with separate elevations, which elevations, when seen in section, have at least one concave surface part, as the studded plate from the screen layer.
  • the first two steps correspond to a standard electroforming method for the production of flat screen material.
  • An electroforming die with insulating regions of this type can be produced, for example, by applying insulating regions to a flat conductive electroforming die, so that the insulating regions form small elevations with respect to the conductive surface of the die. Insulating regions of this type are often formed by applying a photosensitive resist material to the flat die, followed by exposing it through a film, which film is provided with a generally regular pattern of the insulating regions to be formed.
  • the unexposed photoresist parts are removed, so that insulating regions of photoresist material remain behind on the electroforming die. Insulating regions of this type are also known as resist islands. Another possible option is for insulating regions to be arranged in recesses (for example etched recesses) formed in the surface of the electroforming die, so that the latter has a flat surface without elevations.
  • the electroforming die is placed in an electroplating bath of an electroformable metal or metal alloy and connected as electrode (cathode) . In this way, metal from the electroplating bath is deposited on the conductive parts of the electroforming die. This deposition of the screen layer is continued until the screen layer deposited in this way has reached the desired thickness.
  • the result is a screen layer of metal which comprises dykes that delimit screen openings. Consequently, the dykes, as seen in section, have at least one convex surface part which delimits the screen openings.
  • the term "in section” means a section taken in the thickness direction of the plate, corresponding to the height direction of the elevations or recesses .
  • the screen layer is not removed from the electroforming die, but rather a passivation layer is provided on the uncovered surface of the screen layer.
  • suitable passivating agents include potassium dichromate, potassium permanganate, chromium or gold.
  • the metal parts of the continuous metal layer which have filled the screen openings form the elevations of the studded plate, which on the one hand are of a uniform height and on the other hand have a characteristic surface.
  • this characteristic surface comprises a concave surface part, as seen in section. This may be a continuous surface without sharp transitions at one or more corners, primarily depending on the shape and dimensions of the insulating regions.
  • the elevations of the studded plate form a direct reproduction of the recesses or screen openings in the screen layer.
  • the studded plate obtained in this way has a working side with elevations, the tops of which are at the same height.
  • the regions of the studded plate between the elevations are planar.
  • the fourth and fifth steps of the method according to the invention described above can be repeated in order to produce a subsequent studded plate.
  • the electroforming die with the screen layer of which the surface has been passivated is, however, fragile, and consequently there is a not inconsiderable risk of it being damaged.
  • a method for electroforming a studded plate of this type in accordance with a third aspect of the invention comprises the following steps: passivation of the surface of the copy die obtained in accordance with the second aspect of the invention, followed by electrolytic deposition of a further metal layer on the passivated surface of the copy die, in such a manner that at least the recesses are filled and the passivated surface is completely covered, and separating the further metal layer, as the said studded plate, from the copy die.
  • passivation of the surface of the copy die obtained in accordance with the second aspect of the invention followed by electrolytic deposition of a further metal layer on the passivated surface of the copy die, in such a manner that at least the recesses are filled and the passivated surface is completely covered, and separating the further metal layer, as the said studded plate, from the copy die.
  • the metal from which the screen layer, the continuous metal layer and the further metal layer are obtained may be any electroformable metal or metal alloy, in particular copper and preferably nickel.
  • Suitable galvanic baths comprise nickel-containing or copper-containing baths. Controlling the bath composition allows the studded plate to be produced with a smooth surface or a rougher surface.
  • an undoped nickel bath i.e. a nickel bath without brightener, can produce a rougher product compared to a product produced from a nickel bath doped with brightener.
  • a further aspect of the invention provides an electroforming die for producing a copy die, which comprises an electrically conductive plate having a top side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, and preferably a planar underside.
  • the products are electroformed from an electroformable metal or metal alloy.
  • the separate elevations or separate recesses are of virtually uniform height or depth, with a tolerance of the order of magnitude of one micrometre.
  • the elevations or recesses can be arranged in a regular pattern, although an irregular (stochastic) pattern can also be used.
  • the insulating regions are circular in cross section. The result of this is that the elevations are of virtually ideal circular cross section at any height. Other cross sections, such as rectangular, triangular, hexagonal, elliptical, are also conceivable.
  • the separate elevations are dots, advantageously dots having dimensions in the order of magnitude of e.g. about one to several tens of micrometres, more preferably spaced apart at a regular distance.
  • the relatively small dots spaced apart at regular intervals provide a small contact area in comparison with for example linear ridges extending over the whole surface of a plate.
  • the invention also relates to the use of a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, as conveyor surface for conveying substrates, such as sheets of paper.
  • a conveyor surface for conveying substrates, such as sheets of paper the conveyor surface comprising a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part.
  • Figure 1 shows an example of an electroforming die with a regular pattern of insulating regions of photoresist
  • Figure 2 shows an insulating photoresist island in detail
  • Figure 3 shows an embodiment of a studded plate obtained using the electroforming die shown in Figure 1;
  • Figure 1 shows a planar electroforming die 10 on which insulating photoresist islands 12 with a circular cross section are arranged.
  • the photoresist islands 12 are arranged in an orthogonal pattern.
  • the section through the photoresist islands is, for example, in the range from 75 to 100 micrometres, for example 85 micrometres.
  • the height of the photoresist islands is in the range from a few micrometres to about ten micrometres, for example 5 micrometres, while the distance between two adjacent photoresist islands of a basic form of the orthogonal pattern is of the order of magnitude of 150 to a few hundred micrometres, for example 200 micrometres.
  • Figure 2 shows a detail of a photoresist island 12 of this type, having a diameter d r and a height h r .
  • Figure 3 shows a plan view of the studded plate 20 which can be produced with the aid of the electroforming die 10 illustrated in Figures 1 and 2, as will be explained in more detail below.
  • the elevations 22, indicated by dots in Figure 3 are arranged in a pattern which corresponds to the orthogonal pattern of the insulating regions 12 of the electroforming die 10 used.
  • FIG 4 shows an elevation 22 in detail.
  • the elevation 22 has a circular base 24 and, as seen in section, a concave outer surface 26.
  • This concave outer surface 26 describes part of a circle of constant radius r p .
  • the diameter d t of the planar top 28 of the elevation 22 is, for example, 15 micrometres, for a base diameter of 85 micrometres and a height of 35 micrometres. In other words, growth radius r p is likewise 35 micrometres.
  • Figures 5-10 show the steps involved in the production of a studded plate of this type by means of a preferred method according to the invention.
  • FIG. 5 shows a plan view of part of an embodiment of an electroforming die 10.
  • the electroforming die 10 comprises a planar plate 14 of electrically conductive material, on which circular regions 12 of insulating material, such as photoresist, are provided, i.e. in this embodiment the regions 12 form elevations of a low height on the plate 14.
  • Figure 6 shows the electroforming die 10 from Figure 5 in section.
  • the electroforming die 10 is connected as cathode in an electroplating bath, for example of nickel.
  • an electroplating bath for example of nickel.
  • Figure 7 shows the electroforming die 10 with resist islands 12 and screen layer 18 deposited thereon.
  • the screen layer 18 comprises a network of dykes 30 which delimit screen openings 32.
  • the dykes 30 have partly grown over the insulating regions 12.
  • metal such as nickel
  • metal is once again deposited on top of the screen layer 18, with the electroforming die 10 with screen layer 18 being placed in an electroplating bath and connected as cathode .
  • a continuous metal layer is formed as studded plate 20 on the screen layer 18, filling the screen openings 32 and covering the entire surface. This deposition is continued until the desired thickness has been reached, and generally a flat growth front has been formed.
  • Fig. 9 shows this continuous metal layer in section as studded plate 20 with a planar underside 50, and with a working side 52 after it has been separated from the screen layer 18, while Figure 10 shows a plan view of this product.
  • the elevations 22 are of the shape shown in detail in Fig. 4, with a concave surface 26.
  • Figures 11-13 show steps involved in producing a copy die using the product of Figure 9.
  • metal is deposited in an galvanic bath, so that the recesses 38 between the elevations 22 in the product 20 are completely filled and also the elevations 22 themselves are covered.
  • an electrically conductive copy die 40 is obtained, the shape of the deposition surface 42 of this copy die 40, with recesses 44, corresponding to the deposition surface of the assembly of electroforming die, photoresist islands and screen layer, as illustrated in Figure 7.
  • This copy die 40 can be used in the same way as the above-described assembly for the production of studded plates.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

La présente invention concerne un procédé d'électroformage d'une plaque (20) comportant une surface de travail pourvue de protubérances séparées (22), lequel procédé comprend les étapes consistant: à utiliser une matrice d'électroformage conductrice plate (10) pourvue de zones isolantes (12) qui sont séparées les unes des autres; à déposer par électrolyse une couche de tamis (18) qui comprend un réseau de nervures (30), lesdites nervures (30) délimitant des ouvertures de tamis (32), de métal sur la matrice d'électroformage (10), lesquelles nervures (30), telles qu'observées en coupe, présentent au moins une partie de surface convexe; à passiver la surface non couverte de la couche de tamis (18), à déposer par électrolyse une couche de métal continue (20) sur la surface passivée de la couche de tamis (18) de façon qu'au moins les ouvertures de tamis (32) soient remplies et que la surface passivée soit complètement recouverte; puis à séparer la couche de métal continue (20) comportant une surface de travail (52) pourvue de protubérances séparées (22), lesdites protubérances, telles qu'observées en coupe, présentant au moins une partie de surface concave (26), comme ladite plaque, de la couche de tamis (18).
EP06732990A 2005-04-21 2006-04-07 Procede d'electroformage d'une plaque a crampons Active EP1871925B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028835A NL1028835C2 (nl) 2005-04-21 2005-04-21 Werkwijze voor het elektroformeren van een noppenplaat en een kopiematrijs, elektroformeringsmatrijs daarvoor, alsmede kopiematrijs.
PCT/NL2006/000183 WO2006112696A2 (fr) 2005-04-21 2006-04-07 Procede d'electroformage d'une plaque a crampons et d'une matrice de reproduction, matrice d'electroformage pour mise en oeuvre de ce procede et matrice de reproduction

Publications (2)

Publication Number Publication Date
EP1871925A2 true EP1871925A2 (fr) 2008-01-02
EP1871925B1 EP1871925B1 (fr) 2012-07-18

Family

ID=34975037

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06732990A Active EP1871925B1 (fr) 2005-04-21 2006-04-07 Procede d'electroformage d'une plaque a crampons

Country Status (3)

Country Link
EP (1) EP1871925B1 (fr)
NL (1) NL1028835C2 (fr)
WO (1) WO2006112696A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013322A1 (de) 2007-03-30 2008-10-02 Heidelberger Druckmaschinen Ag Druckwerk einer Bedruckstoff verarbeitenden Maschine
DE102008019254B4 (de) 2007-05-16 2015-06-25 Heidelberger Druckmaschinen Ag Bedruckstoff kontaktierende Fläche mit einer Oberflächenstrukturierung
US8462391B2 (en) 2009-03-13 2013-06-11 Heidelberger Druckmaschinen Ag Method for producing a pseudo-stochastic master surface, master surface, method for producing a cylinder cover, cylinder cover, machine processing printing material, method for producing printed products and method for microstamping printing products
CN114043798A (zh) * 2021-11-23 2022-02-15 昆山良品丝印器材有限公司 一种丝印网版的加工工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1299492B (de) * 1966-04-06 1969-07-17 Steding Richard Duenne, auf eine Unterlage aufzuklebende metallische Feile und Verfahren zu ihrer Herstellung
FR2559021B1 (fr) 1984-02-07 1986-11-28 Kuhn Sa Perfectionnement aux machines pour le prelevement de blocs de fourrage dans un silo.
US4564423A (en) * 1984-11-28 1986-01-14 General Dynamics Pomona Division Permanent mandrel for making bumped tapes and methods of forming
DE19708213A1 (de) 1996-04-09 1997-10-30 Heidelberger Druckmasch Ag Verfahren und Vorrichtung zur Produktführung in einem Falzbildungsbereich eines Falzapparates
JP3554228B2 (ja) * 1998-07-29 2004-08-18 キヤノン株式会社 マイクロレンズ金型又は金型マスター、及びそれらの作製方法
JP2002166425A (ja) * 2000-11-30 2002-06-11 Dainippon Printing Co Ltd 金型の複製方法および性状判定方法
JP2002173239A (ja) 2000-12-07 2002-06-21 Brother Ind Ltd 給紙装置
US6523820B2 (en) * 2001-02-23 2003-02-25 Hewlett-Packard Company Non-planar single sheet separator wall and apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006112696A2 *

Also Published As

Publication number Publication date
WO2006112696A3 (fr) 2007-06-07
WO2006112696A2 (fr) 2006-10-26
NL1028835C2 (nl) 2006-10-24
EP1871925B1 (fr) 2012-07-18

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