EP1844629B1 - Heating device with temperature sensor and hob with heating devices - Google Patents
Heating device with temperature sensor and hob with heating devices Download PDFInfo
- Publication number
- EP1844629B1 EP1844629B1 EP06701480A EP06701480A EP1844629B1 EP 1844629 B1 EP1844629 B1 EP 1844629B1 EP 06701480 A EP06701480 A EP 06701480A EP 06701480 A EP06701480 A EP 06701480A EP 1844629 B1 EP1844629 B1 EP 1844629B1
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- EP
- European Patent Office
- Prior art keywords
- temperature sensor
- support
- heating device
- heating
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/032—Heaters specially adapted for heating by radiation heating
Definitions
- the invention relates to a heating device, as it is advantageously used for hobs with a cover made of glass or glass ceramic, and a hob with a plurality of heaters.
- this over-temperature fuse serves not to exceed a maximum permissible temperature at a glass-ceramic plate of a hob which extends above the heating device. It is attached with its housing outside of the radiant heater to a receiving tray.
- the rod-shaped expansion element protrudes into the interior of the radiant heater and can, for example by staples or upstanding hook-like holder, are fixed.
- the attachment of the housing to the outside of the receptacle with effort, in particular installation effort provided.
- the US 4,447,711 shows a temperature sensor, which runs under heat conductors or a plane in which heat conductor lie. There, the temperature sensor is attached in one embodiment to a controller housing, where he hangs there in the air, so to speak. According to another embodiment, the temperature sensor is not held on the support on which run the heating conductors, but on an underlying lower support. In this version, the temperature sensor runs well below the heating conductors.
- the DE 2729930 A shows in one embodiment a temperature sensor which is attached to a housing of a temperature controller. There it runs under an upper carrier layer of a carrier, on which the heating conductor is arranged. According to another embodiment, it is in turn attached to a temperature controller housing, but runs well above the heating conductors. He is only attached to its ends.
- the FR 2261695 A describes the course of a temperature sensor in a channel on a carrier for heating conductors. None is carried out for the exact fixing of the temperature sensor. The temperature sensor runs well below the heating element.
- the invention has for its object to provide an aforementioned heating device and a hob, with which the disadvantages of the prior art can be avoided and in particular the arrangement of a temperature sensor can be simplified to a heater.
- the heating device has both a temperature sensor and a carrier, wherein an elongate heating conductor is arranged on or on or above the upper side of the carrier.
- the heating conductor is in particular designed and arranged such that it forms a substantial part of the surface the carrier covered, for example, spiral, meandering or a mixture thereof.
- the temperature sensor is predominantly or even exclusively fastened or held on the carrier only, whereby it is also arranged on the carrier, that is to say it touches it. This means that it is advantageously arranged with a substantial part of its length or extension on the carrier or bears against it. In this way, especially in comparison to the aforementioned prior art to a mounting on a receiving tray odgl. the carrier be waived.
- a pre-assembly of the carrier and temperature sensor can be made into a structural unit, regardless of the type of a receiving tray used, and in particular as well as training without receiving tray are possible.
- the temperature sensor is advantageously elongated.
- it has a kind of simple or double, in particular bent tube.
- a sensitive element can be arranged.
- the temperature sensor is advantageously designed for temperature detection via electrical evaluation, that is not via mechanical expansion behavior due to temperature change or the like.
- the temperature sensor may be at least partially embedded in the carrier or run in a channel in the carrier.
- it is in substantially complete contact with the material of the carrier and may rest against the carrier along a substantial part of its length.
- a substantially complete support or storage on the carrier can be made for the best possible support.
- An embedding of the temperature sensor in the carrier or the carrier material also allows a determination against lateral movements. It should be noted in particular that a holder of the temperature sensor on the support on the one hand in the lateral direction and on the other hand in the vertical direction can be realized in each case independently or in combination with each other in an advantageous manner. A channel or a recess in which the temperature sensor runs can be provided for this purpose.
- the carrier has a recess or a channel to accommodate electrical leads for the heating conductor on the carrier or lead.
- the temperature sensor can be introduced at the same time or the recess can have a double function. It is also possible to produce the recess for the temperature sensor by a sandwich construction with correspondingly preformed support parts. One of them then has the recess, overlying parts can cover the recess at least partially again, although windows can be provided upwards.
- the carrier has a substantially flat or uniform surface, at least in some or in essential areas.
- the temperature sensor something survive, so to speak not completely embedded in the carrier.
- the supernatant can either be only a small piece, for example, to make especially in this area the temperature detection.
- the aforementioned carrier having a substantially planar surface or flat shape has a survey or elevation, in which the temperature sensor extends.
- An embedding of the temperature sensor in such a survey can be advantageously designed so that a substantial part, in particular the largest, of the temperature sensor is embedded in the carrier or is covered by the carrier material of the survey.
- the temperature sensor can extend laterally free of the survey with substantial length ranges while resting on the support, but largely free to make undisturbed by effects of the wearer temperature detection. In this case, such a survey acts as a mechanical support of the temperature sensor.
- An elevation can also run at a distance and be designed as a lateral protection.
- the temperature sensor substantially below the plane or top of the flat carrier, so to speak, under the heating conductors.
- the temperature sensor can either be exposed upwards or be largely covered with carrier material.
- the temperature at the heating conductors or in an area above the heating conductors can not be detected directly by embedding in the carrier material. Either correction factors can be used here.
- the temperature of the carrier are very well detected, if so desired.
- the temperature sensor can be arranged on the carrier, wherein it is substantially free or not embedded in the carrier. In any case, it is not embedded with functionally important parts or parts whose embedding means an effect on the temperature detection, for example because such a sensitive element of the temperature sensor is shielded from the carrier material.
- An attachment can be made by holding means which, for example, cross-brackets, protruding attachment members or the like. include.
- the temperature sensor is shielded from direct irradiation by the heat conductors lying laterally next to it. This can be done advantageously by a shield, for example in the form of a layer of carrier material. However, it is not necessary to embed the temperature sensor particularly deep in the carrier, but it can also be provided relatively narrow walls or webs. Above all, the temperature sensor should be exposed obliquely upwards to the side and directly upwards for the best possible detection of the temperature at, for example, a glass-ceramic hob plate extending above it.
- the temperature sensor advantageously has a sensitive element for the measurement.
- This is advantageously metallic or a piece of metal or metal wire.
- a sensitive element is advantageously elongated, in particular in order to be able to detect a temperature over a relatively large area.
- the sensitive element should be arranged in an envelope, which preferably consists of temperature- and / or radiation-permeable material.
- glass for example as a glass tube.
- the glass can eg by coloring, doping or the like. be changed or optimized in its transmission properties.
- the sensitive element can advantageously be contacted electrically via connection wires of the temperature sensor to the outside. If it is arranged in a glass envelope, then the connecting wires must be inserted here, whereby they are usually melted down. It is advantageous if these melts are outside the heater or outside the carrier and especially outside the direct heating effect of the heater to avoid excessive thermal stress or destruction.
- the temperature sensor generally protrudes laterally beyond the heating device with one end, in particular a covering end with electrical connections. So a contact is possible, for example by welding or soldering or with a detachable connection.
- a sensitive element may be guided in an elongated form parallel to an aforementioned connecting wire, advantageously within the envelope. So it can be connected to this, advantageously welded.
- the enclosure in which the sensitive element extends.
- it can at least partially touch a wall of the capillary, wherein it can also rest in larger areas or on a longer section, in particular it can be supported.
- the temperature sensor can advantageously be arranged on the carrier in such a way that heating conductors, viewed in the plane of the carrier, are located only laterally next to the temperature sensor. However, they are not heat conductors present, which are higher or lower. In particular, all the heating conductors of the heating device run approximately in one plane or define such a plane.
- the temperature sensor may also be at an angle to the plane of the otherwise substantially flat carrier or its upper side. In this case, it is advantageously covered in a longitudinal region by a layer of the carrier material. In another longitudinal area it is exposed, for example at the end. There he can record the temperature very well.
- a compound of metal and ceramic can be used as a sensitive element.
- the ceramic may have PTC properties, wherein it may contain, for example, at least one high-temperature superconductor.
- the sensitive element can advantageously have a low heat capacity, whereby, above all, a rapid response of the temperature sensor is possible. It may have a temperature coefficient of resistivity greater than that of platinum, such as silver or tungsten. It can also be designed so that the temperature dependence of its electrical resistance compensates or reduces the deviation between the temperature of a glass ceramic plate extending above the heating device and that which detects the sensitive element itself within certain temperature ranges.
- Another possibility for a sensitive element is an optical temperature sensor.
- a sensitive element on its own sensor carrier, for example made of ceramic.
- it may be enveloped to the outside with a ceramic cladding, for example, consisting of several parts.
- the carrier may also be the sensor element itself.
- Such a sensitive element can be advantageously produced by conventional thick film or thin film processes. In particular, it can be applied to a sensor carrier.
- the temperature sensor can be placed on the support or even a piece embedded in it, it is possible to bring the heater or the heat conductor closer to the underside of an overlying hob plate.
- the size can be reduced and the transmission of heat output via radiation can be increased by reduced distance.
- the heating wire can radiate freely and be exposed or open at the top. So its heating effect is best.
- An inventive hob can have one or more heating devices, wherein these are formed as described above. Furthermore, it has a cooktop plate, below which the one or more heating devices are arranged. In this case, the distance between the bottom of the hob plate and the heaters is reduced or very low in relation to known hobs. Advantageously, it is less than 2 cm, more advantageously even only 1 cm or even less. Thus, an aforementioned reduction of the overall height is possible. Furthermore, a higher power input of the heater through the hob plate can be made possible in a standing thereon cookware. In this case, all the heating devices are preferably constructed according to the same principle or each have, as it were, lowered temperature sensors.
- a heat conductor can then be attached over the insulating layer.
- a temperature sensor 11 is shown as an exemplary embodiment.
- the temperature sensor 11 is generally elongated, wherein it has a U-shaped glass tube 13 as a shell.
- the upper part 14a and the lower part 14b of the glass tube 13 run very close to each other. Alternatively, the two parts could have more distance. It is also possible to construct the temperature sensor with only one and substantially straight or elongated tube, preferably made of quartz glass.
- a schematically illustrated elongated sensitive element 15 This can be very diverse and be both a kind of metal wire of the corresponding metal as well as a sensitive layer which is applied to a support.
- fuses 17a and 17b are provided.
- FIG. 2 is a basically first embodiment of the invention shown.
- a heater 20 has a disk-shaped or plate-shaped carrier 22, which consists of thermal insulation material, such as in the DE 2551137 A or the EP 750 444 A is described.
- a heating conductor 26 in the example shown, an upright Schuleitererband. This may be partially embedded in the carrier 22 or have holding members which extend into it.
- the carrier 22 is substantially flat at its top and all heating conductors 26 also extend in a plane.
- Fig. 2 The difference in Fig. 2 between the left example and the right example is in the elongated elevation 23 in the right hand example.
- the temperature sensor 11 is indeed completely embedded in the carrier 22 with the lower part 14b.
- the upper part 14a looks out about halfway or over the thermal insulation material of the carrier 22 via.
- the survey 23 in addition to a mechanical stabilizing effect bring a certain shield to the side. In particular, this is advantageous if it is not possible to embed the temperature sensor 11 deeper in the carrier 22.
- the shape of the survey 23 may vary. In addition to a shown, relatively gentle increase, the increase may also be steeper. Furthermore, the elevation 23 may also be wider or longer than shown. However, it advantageously extends only in the immediate area around the temperature sensor 11, since otherwise it could adversely affect the attachment of the heating conductors 26. So the production cost is low.
- Fig. 2 is the basic principle to recognize that in this embodiment, the temperature sensor 11, although embedded in the carrier 22 and in its material, but still protrudes a piece beyond it or. Above all, it is not covered at the top, so that it can detect, for example, heat radiation from a cooktop panel located above it.
- Fig. 3 is again shown in a split representation of a heater 120 according to the invention according to a second basic embodiment.
- the carrier 122 each has elongated, approximately U-shaped channels 124. While in the presentation after Fig. 2 For example, if the temperature sensor can already be compressed together with the loose thermal insulation material in the initial state to form the carrier 22, here the channel 124 is present even before the temperature sensor 111 is introduced.
- the attachment of the temperature sensor 111 in the channel 124 can be done by tailor-made training with pushing. Likewise, sticking or retaining clips or the like. possible.
- the ends of the upper part 114a and the lower part 114b or the connecting wires 116 should be easily accessible or a piece over the side edge of the carrier 122 projecting.
- a supply line 127 to the heating conductor 126 at least partially extends in the channel 124 and is guided to the outside.
- the channel 124 or a part thereof may also be led up to the heating conductor 126.
- the temperature sensor 111 occupies only a part of the entire length of the channel 124.
- the upper part 114a of the temperature sensor 111 projects over the upper side of the otherwise flat carrier 122.
- a survey 123 is provided on both sides of the channel 124. This causes the same depth of embedding of the temperature sensor in the carrier this is also completely shielded to the side by the thermal insulation material.
- the temperature sensor 111 is not above the carrier 122 or its material at any point. However, as can be seen, it is completely open at the top, ie in the direction in which it is to measure a temperature, or it can detect heat radiation very well.
- Fig. 4 is again shown in a third embodiment in a split representation, as the temperature sensor 211 is completely embedded in the carrier 222 and its material. In both cases it is not over or free at any point. Only the ends look out at the side again.
- the temperature sensor 211 may be crimped together with either the thermal barrier material to the finished carrier.
- recesses could be provided, similar to the channels in Fig. 3 , in which the temperature sensor is inserted. These are then not open at the top.
- a fourth basic version is shown.
- the temperature sensor 311 is placed on top of the carrier 322 and is completely on this on or above her.
- An attachment is made by the retaining clip 325, which surrounds it like a bow and is anchored in a manner not shown on the support 322. For this purpose, it can either be glued or extending into or protruding into it, for example, with protruding projections.
- heating elements On the representation of heating elements is omitted here.
- the temperature sensor 311 surveys similar to those of the Fig. 2 to 4 provide that project upwardly from the carrier and either fix the temperature sensor 311 laterally or cover at least partially laterally.
- the retaining clip 325 can then either extend into the survey or this project beyond the side.
- a fifth basic embodiment is shown, in which the temperature sensor 411 extends obliquely to the surface of the carrier 422. With one end 411 'he protrudes from the carrier and can make the temperature measurement in this area, for example. The ends of the tubes 414 with the terminals 416 in turn protrude laterally and are accessible for contacting.
- FIG. 6 an inventive hob 30 is shown with a hob plate 31, preferably made of glass ceramic.
- a heater 20 is similar to that in the left half in FIG Fig. 2 arranged.
- Shown here is also a receiving tray 29, in which the heater 20 is.
- the receiving tray 29 is pressed against the underside of the hob plate 31.
- the heating conductors 26 project beyond the upper part 14a of the temperature sensor. They have a certain distance to the underside of the hob plate 31, which is determined by the side edge of the receiving tray. However, this distance is in the range of a few millimeters or about one centimeter and is thus considerably smaller than in previous radiant heaters. For some of these, the temperature sensor still has to run between the heating conductors and the hob plate and must maintain a certain minimum distance.
- the connecting wires 16a and 16b of the temperature sensor 11 are guided to an evaluation or control, not shown. This evaluates together with the temperature sensor 11 and the sensitive element 15, the detected temperature.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
- Electric Stoves And Ranges (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- General Induction Heating (AREA)
- Cookers (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Die Erfindung betrifft eine Heizeinrichtung, wie sie vorteilhaft für Kochfelder mit einer Abdeckung aus Glas oder Glaskeramik verwendet wird, sowie ein Kochfeld mit mehreren Heizeinrichtungen.The invention relates to a heating device, as it is advantageously used for hobs with a cover made of glass or glass ceramic, and a hob with a plurality of heaters.
Es ist beispielsweise aus der
Die
Die
Die
Der Erfindung liegt die Aufgabe zugrunde, eine eingangs genannte Heizeinrichtung sowie ein Kochfeld zu schaffen, mit denen die Nachteile des Standes der Technik vermieden werden können und insbesondere die Anordnung eines Temperatursensors an einer Heizeinrichtung vereinfacht werden kann.The invention has for its object to provide an aforementioned heating device and a hob, with which the disadvantages of the prior art can be avoided and in particular the arrangement of a temperature sensor can be simplified to a heater.
Gelöst wird diese Aufgabe durch eine Heizeinrichtung mit den Merkmalen des Anspruchs 1 sowie ein Kochfeld mit den Merkmalen des Anspruchs 13. Vorteilhafte sowie bevorzugte Ausgestaltungen der Erfindung sind in den weiteren Ansprüchen angegeben und werden im folgenden näher erläutert. Der Wortlaut der Ansprüche wird durch ausdrückliche Bezugnahme zum Inhalt der Beschreibung gemacht.This object is achieved by a heating device with the features of claim 1 and a hob with the features of
Die Heizeinrichtung weist sowohl einen Temperatursensor auf als auch einen Träger, wobei an bzw. auf oder über der Oberseite des Trägers ein länglicher Heizleiter angeordnet ist. Der Heizleiter ist insbesondere so ausgebildet und angeordnet, dass er einen wesentlichen Teil der Fläche des Trägers bedeckt, beispielsweise spiralartig, mäanderförmig oder eine Mischung daraus. Der Temperatursensor ist erfindungsgemäß überwiegend oder sogar ausschließlich nur an dem Träger befestigt bzw. daran gehaltert, wobei er auch an dem Träger angeordnet ist, ihn also berührt. Dies bedeutet, dass er vorteilhaft mit einem wesentlichen Teil seiner Länge bzw. Ausdehnung an dem Träger angeordnet ist bzw. an ihm anliegt. Auf diese Art und Weise kann vor allem im Vergleich zu dem vorgenannten Stand der Technik auf eine Befestigung an einer Aufnahmeschale odgl. des Trägers verzichtet werden. Des weiteren kann beispielsweise eine Vormontage von Träger und Temperatursensor zu einer Baueinheit erfolgen, unabhängig von der Art einer verwendeten Aufnahmeschale und insbesondere sind so auch Ausbildungen ohne Aufnahmeschale möglich.The heating device has both a temperature sensor and a carrier, wherein an elongate heating conductor is arranged on or on or above the upper side of the carrier. The heating conductor is in particular designed and arranged such that it forms a substantial part of the surface the carrier covered, for example, spiral, meandering or a mixture thereof. According to the invention, the temperature sensor is predominantly or even exclusively fastened or held on the carrier only, whereby it is also arranged on the carrier, that is to say it touches it. This means that it is advantageously arranged with a substantial part of its length or extension on the carrier or bears against it. In this way, especially in comparison to the aforementioned prior art to a mounting on a receiving tray odgl. the carrier be waived. Furthermore, for example, a pre-assembly of the carrier and temperature sensor can be made into a structural unit, regardless of the type of a receiving tray used, and in particular as well as training without receiving tray are possible.
Der Temperatursensor ist vorteilhaft länglich ausgebildet. Insbesondere weist er eine Art einfaches oder doppeltes, insbesondere gebogenes Rohr auf. Darin kann ein sensitives Element angeordnet werden.The temperature sensor is advantageously elongated. In particular, it has a kind of simple or double, in particular bent tube. Therein a sensitive element can be arranged.
Des weiteren ist der Temperatursensor vorteilhaft für eine Temperaturerfassung über elektrische Auswertung ausgebildet, also nicht über mechanisches Ausdehnungsverhalten infolge Temperaturänderung odgl.Furthermore, the temperature sensor is advantageously designed for temperature detection via electrical evaluation, that is not via mechanical expansion behavior due to temperature change or the like.
Somit ist es möglich, ihn sowohl kleiner als auch ohne bewegte Teile auszubilden, da vor allem keine Ausdehnungskräfte odgl. auf ihn einwirken bzw. erfasst werden müssen.Thus, it is possible to make it both smaller and without moving parts, especially since no expansion forces or the like. have to act on him or be recorded.
Bei einer Ausbildung der Erfindung kann der Temperatursensor zumindest teilweise in den Träger eingebettet sein bzw. in einem Kanal in dem Träger verlaufen. Vorteilhaft befindet er sich in weitgehend vollständigem Kontakt mit dem Material des Trägers und kann entlang eines wesentlichen Teils seiner Länge an dem Träger anliegen. So kann eine im wesentlichen vollständige Abstützung bzw. Lagerung an dem Träger erfolgen zur möglichst guten Halterung. Eine Einbettung des Temperatursensors in den Träger bzw. das Träger-Material ermöglicht auch eine Festlegung gegen seitliche Bewegungen. Dabei ist vor allem zu beachten, dass eine Halterung des Temperatursensors an dem Träger einerseits in seitliche Richtung und andererseits in vertikaler Richtung jeweils unabhängig voneinander oder auch in Kombination miteinander auf vorteilhafte Weise realisiert werden kann. Ein Kanal bzw. eine Ausnehmung, in der der Temperatursensor verläuft, kann extra dafür vorgesehen sein. Es ist auch möglich, dass der Träger eine Ausnehmung oder einen Kanal aufweist, um elektrische Zuleitungen für den Heizleiter auf dem Träger unterzubringen bzw. zu führen. Hier kann gleichzeitig der Temperatursensor eingebracht werden bzw. die Ausnehmung kann eine Doppelfunktion aufweisen. Es ist auch möglich, die Ausnehmung für den Temperatursensor durch einen Sandwichaufbau mit entsprechend vorgeformten Trägerteilen herzustellen. Davon weist eines dann die Ausnehmung auf, darüber liegende Teile können die Ausnehmung zumindest teilweise wieder verdecken, wobei auch Fenster nach oben vorgesehen sein können.In one embodiment of the invention, the temperature sensor may be at least partially embedded in the carrier or run in a channel in the carrier. Advantageously, it is in substantially complete contact with the material of the carrier and may rest against the carrier along a substantial part of its length. Thus, a substantially complete support or storage on the carrier can be made for the best possible support. An embedding of the temperature sensor in the carrier or the carrier material also allows a determination against lateral movements. It should be noted in particular that a holder of the temperature sensor on the support on the one hand in the lateral direction and on the other hand in the vertical direction can be realized in each case independently or in combination with each other in an advantageous manner. A channel or a recess in which the temperature sensor runs can be provided for this purpose. It is also possible that the carrier has a recess or a channel to accommodate electrical leads for the heating conductor on the carrier or lead. Here, the temperature sensor can be introduced at the same time or the recess can have a double function. It is also possible to produce the recess for the temperature sensor by a sandwich construction with correspondingly preformed support parts. One of them then has the recess, overlying parts can cover the recess at least partially again, although windows can be provided upwards.
Es kann vorgesehen sein, dass der Träger eine im wesentliche ebene oder gleichmäßige Oberfläche aufweist, zumindest in einigen oder in wesentlichen Bereichen. Über diese kann der Temperatursensor etwas überstehen, also sozusagen nicht vollständig in den Träger eingebettet sein. Der Überstand kann entweder nur ein kleines Stück betragen, beispielsweise um vor allem auch in diesem Bereich die Temperaturerfassung vorzunehmen.It can be provided that the carrier has a substantially flat or uniform surface, at least in some or in essential areas. About this, the temperature sensor something survive, so to speak not completely embedded in the carrier. The supernatant can either be only a small piece, for example, to make especially in this area the temperature detection.
Alternativ ist es auch möglich, dass der vorgenannte Träger mit im wesentlichen ebener Oberfläche bzw. flacher Form eine Erhebung oder Erhöhung aufweist, in welcher der Temperatursensor verläuft. Eine Einbettung des Temperatursensors in eine derartige Erhebung kann vorteilhaft so ausgebildet sein, dass ein wesentlicher Teil, insbesondere der größte, des Temperatursensors in den Träger eingebettet ist bzw. von dem Träger-Material der Erhebung bedeckt ist. In Fortführung dieses Gedankens ist es auch möglich, an einem im wesentlichen flachen Träger eine vorgenannte Erhebung vorzusehen, in welche der Temperatursensor weitgehend eingebettet ist oder dadurch gehaltert ist. Allerdings kann der Temperatursensor mit wesentlichen Längenbereichen seitlich frei von der Erhebung verlaufen und dabei zwar auf dem Träger aufliegen, aber weitgehend frei verlaufen um so ungestört von Auswirkungen des Trägers die Temperaturerfassung vorzunehmen. In diesem Fall wirkt eine solche Erhebung als mechanische Halterung des Temperatursensors. Eine Erhebung kann auch mit Abstand verlaufen und als seitlicher Schutz ausgebildet sein.Alternatively, it is also possible that the aforementioned carrier having a substantially planar surface or flat shape has a survey or elevation, in which the temperature sensor extends. An embedding of the temperature sensor in such a survey can be advantageously designed so that a substantial part, in particular the largest, of the temperature sensor is embedded in the carrier or is covered by the carrier material of the survey. In continuation of this idea, it is also possible to provide on a substantially flat support an aforementioned survey, in which the temperature sensor is largely embedded or is supported by it. However, the temperature sensor can extend laterally free of the survey with substantial length ranges while resting on the support, but largely free to make undisturbed by effects of the wearer temperature detection. In this case, such a survey acts as a mechanical support of the temperature sensor. An elevation can also run at a distance and be designed as a lateral protection.
Des weiteren ist es auch möglich, den Temperatursensor im wesentlichen unterhalb der Ebene oder Oberseite des flachen Trägers anzuordnen, also sozusagen unter den Heizleitern. Hierbei kann der Temperatursensor entweder nach oben frei liegen oder weitgehend mit Träger-Material bedeckt sein. Bei der Auswertung eines solchen Temperatursensors ist zu beachten, dass durch die Einbettung in das Träger-Material nicht direkt die Temperatur an den Heizleitern oder in einem Bereich oberhalb der Heizleiter erfasst werden kann. Hier können entweder Korrekturfaktoren verwendet werden. Alternativ kann mit einer solchen Anordnung die Temperatur des Trägers sehr gut erfasst werden, falls dieses gewünscht ist.Furthermore, it is also possible to arrange the temperature sensor substantially below the plane or top of the flat carrier, so to speak, under the heating conductors. In this case, the temperature sensor can either be exposed upwards or be largely covered with carrier material. When evaluating such a temperature sensor, it should be noted that the temperature at the heating conductors or in an area above the heating conductors can not be detected directly by embedding in the carrier material. Either correction factors can be used here. Alternatively, with a such arrangement, the temperature of the carrier are very well detected, if so desired.
In einer grundsätzlich anderen Ausbildung kann der Temperatursensor auf dem Träger angeordnet sein, wobei er im wesentlichen frei liegt bzw. nicht in den Träger eingebettet ist. Jedenfalls ist er nicht mit funktional bedeutenden Teilen eingebettet bzw. mit Teilen, deren Einbettung eine Auswirkung auf die Temperaturerfassung bedeutet, beispielsweise weil so ein sensitives Element des Temperatursensors von dem Träger-Material abgeschirmt ist. Eine Befestigung kann durch Haltermittel erfolgen, welche beispielsweise übergreifende Klammern, abstehende Befestigungsglieder odgl. umfassen.In a fundamentally different embodiment, the temperature sensor can be arranged on the carrier, wherein it is substantially free or not embedded in the carrier. In any case, it is not embedded with functionally important parts or parts whose embedding means an effect on the temperature detection, for example because such a sensitive element of the temperature sensor is shielded from the carrier material. An attachment can be made by holding means which, for example, cross-brackets, protruding attachment members or the like. include.
In weiterer Ausgestaltung der Erfindung kann es sogar vorgesehen bzw. gewünscht sein, dass der Temperatursensor gegenüber einer direkten Bestrahlung durch die seitlich daneben liegenden Heizleiter abgeschirmt ist. Dies kann vorteilhaft durch eine Abschirmung beispielsweise in Form einer Schicht von Träger-Material erfolgen. Dabei ist es jedoch nicht notwendig, den Temperatursensor besonders tief in den Träger einzubetten, sondern es können auch relativ schmale Wände oder Stege vorgesehen sein. Vor allem sollte hier der Temperatursensor schräg nach oben zur Seite und direkt nach oben frei liegen zur möglichst guten Erfassung der Temperatur an beispielsweise einer darüber verlaufenden Glaskeramik-Kochfeldplatte.In a further embodiment of the invention, it may even be provided or desired that the temperature sensor is shielded from direct irradiation by the heat conductors lying laterally next to it. This can be done advantageously by a shield, for example in the form of a layer of carrier material. However, it is not necessary to embed the temperature sensor particularly deep in the carrier, but it can also be provided relatively narrow walls or webs. Above all, the temperature sensor should be exposed obliquely upwards to the side and directly upwards for the best possible detection of the temperature at, for example, a glass-ceramic hob plate extending above it.
Wie zuvor bereits erwähnt, weist der Temperatursensor vorteilhaft ein sensitives Element zur Messung auf. Dies ist vorteilhaft metallisch bzw. ein Metallstück oder Metalldraht. Ein sensitives Element ist vorteilhaft länglich ausgebildet, insbesondere um über einen größeren Bereich hinweg eine Temperatur erfassen zu können. Das sensitive Element sollte in einer Umhüllung angeordnet sein, welche bevorzugt aus Temperatur-und/oder strahlungsdurchlässigem Material besteht. Besonders bevorzugt wird hier Glas, beispielsweise als Glasrohr. Das Glas kann z.B. durch Einfärben, Dotieren odgl. in seinen Transmissionseigenschaften verändert oder optimiert sein. Es sind auch Umhüllungen aus Metall möglich.As already mentioned above, the temperature sensor advantageously has a sensitive element for the measurement. This is advantageously metallic or a piece of metal or metal wire. A sensitive element is advantageously elongated, in particular in order to be able to detect a temperature over a relatively large area. The sensitive element should be arranged in an envelope, which preferably consists of temperature- and / or radiation-permeable material. Especially preferred here is glass, for example as a glass tube. The glass can eg by coloring, doping or the like. be changed or optimized in its transmission properties. There are also covers made of metal possible.
Das sensitive Element kann vorteilhaft über Anschlussdrähte des Temperatursensors nach außen elektrisch kontaktiert werden. Ist es in einer Glasumhüllung angeordnet, so müssen die Anschlussdrähte hier eingeführt werden, wobei sie in der Regel eingeschmolzen werden. Dabei ist es vorteilhaft, wenn diese Einschmelzungen außerhalb der Heizeinrichtung bzw. außerhalb des Trägers und vor allem außerhalb der direkten Heizwirkung der Heizeinrichtung liegen, um übergroße thermische Belastungen oder eine Zerstörung zu vermeiden. Vorteilhaft ragt dabei allgemein der Temperatursensor mit einem Ende, insbesondere einem Umhüllungsende mit elektrischen Anschlüssen, seitlich über die Heizeinrichtung hinaus. So ist auch eine Kontaktierung möglich, beispielsweise durch Schweißen oder Löten oder mit einer lösbaren Verbindung.The sensitive element can advantageously be contacted electrically via connection wires of the temperature sensor to the outside. If it is arranged in a glass envelope, then the connecting wires must be inserted here, whereby they are usually melted down. It is advantageous if these melts are outside the heater or outside the carrier and especially outside the direct heating effect of the heater to avoid excessive thermal stress or destruction. Advantageously, the temperature sensor generally protrudes laterally beyond the heating device with one end, in particular a covering end with electrical connections. So a contact is possible, for example by welding or soldering or with a detachable connection.
In weiterer Ausgestaltung des Temperatursensors kann ein sensitives Element in länglicher Form parallel zu einem vorgenannten Anschlussdraht geführt sein, vorteilhaft innerhalb der Umhüllung. So kann es mit diesem verbunden sein, vorteilhaft verschweißt sein.In a further embodiment of the temperature sensor, a sensitive element may be guided in an elongated form parallel to an aforementioned connecting wire, advantageously within the envelope. So it can be connected to this, advantageously welded.
In weiterer Ausgestaltung der Erfindung ist es möglich, die Umhüllung als Kapillare auszubilden, in welcher das sensitive Element verläuft. Dabei kann es eine Wandung der Kapillare zumindest teilweise berühren, wobei es auch in größeren Bereichen bzw. auch auf einem längeren Abschnitt daran anliegen kann, insbesondere abgestützt sein kann.In a further embodiment of the invention, it is possible to form the enclosure as a capillary, in which the sensitive element extends. In this case, it can at least partially touch a wall of the capillary, wherein it can also rest in larger areas or on a longer section, in particular it can be supported.
Der Temperatursensor kann vorteilhaft derart an dem Träger angeordnet sein, dass sich in Ebene des Trägers gesehen Heizleiter nur seitlich neben dem Temperatursensor befinden. Es sind jedoch keine Heizleiter vorhanden, die höher oder tiefer liegen. Insbesondere verlaufen dabei sämtliche Heizleiter der Heizeinrichtung in etwa in einer Ebene bzw. definieren eine solche Ebene.The temperature sensor can advantageously be arranged on the carrier in such a way that heating conductors, viewed in the plane of the carrier, are located only laterally next to the temperature sensor. However, they are not heat conductors present, which are higher or lower. In particular, all the heating conductors of the heating device run approximately in one plane or define such a plane.
Der Temperatursensor kann in einer weiteren Ausführung auch schräg zur Ebene des ansonsten im wesentlichen flachen Trägers bzw. seiner Oberseite liegen. Dabei ist er vorteilhaft in einem Längsbereich von einer Schicht des Träger-Materials überdeckt. In einem anderen Längsbereich liegt er frei, beispielsweise am Ende. Dort kann er dann besonders gut die Temperatur erfassen.In another embodiment, the temperature sensor may also be at an angle to the plane of the otherwise substantially flat carrier or its upper side. In this case, it is advantageously covered in a longitudinal region by a layer of the carrier material. In another longitudinal area it is exposed, for example at the end. There he can record the temperature very well.
Als sensitives Element kann eine Verbindung aus Metall und Keramik verwendet werden. Die Keramik kann dabei PTC-Eigenschaften aufweisen, wobei sie beispielsweise mindestens einen Hochtemperatur-Supraleiter enthalten kann. Des weiteren kann das sensitive Element vorteilhaft eine geringe Wärmekapazität aufweisen, wodurch vor allem ein schnelles Ansprechen des Temperatursensors möglich ist. Es kann einen Temperaturkoeffizienten des spezifischen elektrischen Widerstandes aufweisen, der größer ist als derjenige von Platin, beispielsweise Silber oder Wolfram. Es kann auch so ausgelegt sein, dass die Temperaturabhängigkeit seines elektrischen Widerstandes die Abweichung zwischen der Temperatur einer über der Heizeinrichtung verlaufenden Glaskeramik-Platte und derjenigen, die das sensitive Element selber erfasst, innerhalb bestimmter Temperaturbereiche kompensiert oder verringert.As a sensitive element, a compound of metal and ceramic can be used. The ceramic may have PTC properties, wherein it may contain, for example, at least one high-temperature superconductor. Furthermore, the sensitive element can advantageously have a low heat capacity, whereby, above all, a rapid response of the temperature sensor is possible. It may have a temperature coefficient of resistivity greater than that of platinum, such as silver or tungsten. It can also be designed so that the temperature dependence of its electrical resistance compensates or reduces the deviation between the temperature of a glass ceramic plate extending above the heating device and that which detects the sensitive element itself within certain temperature ranges.
Eine andere Möglichkeit für ein sensitives Element ist ein optischer Temperatursensor.Another possibility for a sensitive element is an optical temperature sensor.
Weiter ist es möglich, ein solches sensitive Element auf einem eigenen Sensorträger, beispielsweise aus Keramik, anzuordnen. Insbesondere kann es dabei nach außen umhüllt sein mit einer keramischen Umhüllung, beispielsweise aus mehreren Teilen bestehend. Der Träger kann auch selbst das Sensorelement sein.Furthermore, it is possible to arrange such a sensitive element on its own sensor carrier, for example made of ceramic. In particular, it may be enveloped to the outside with a ceramic cladding, for example, consisting of several parts. The carrier may also be the sensor element itself.
Hergestellt werden kann ein solches sensitives Element vorteilhaft mit herkömmlichen Dickschicht- oder Dünnschicht-Verfahren. Insbesondere kann es so auf einen Sensorträger aufgebracht werden.Such a sensitive element can be advantageously produced by conventional thick film or thin film processes. In particular, it can be applied to a sensor carrier.
Dadurch, dass der Temperatursensor auf den Träger aufgelegt oder sogar ein Stück in ihn eingebettet werden kann, ist es möglich, die Heizeinrichtung bzw. die Heizleiter näher an die Unterseite einer darüber verlaufenden Kochfeld-Platte zu bringen. So kann die Baugröße verringert werden und die Übertragung von Heizleistung über Strahlung kann vergrößert werden durch verringerte Distanz. Insbesondere kann der Heizdraht frei abstrahlen und freiliegen bzw. nach oben offen sein. So ist seine Heizwirkung am besten.The fact that the temperature sensor can be placed on the support or even a piece embedded in it, it is possible to bring the heater or the heat conductor closer to the underside of an overlying hob plate. Thus, the size can be reduced and the transmission of heat output via radiation can be increased by reduced distance. In particular, the heating wire can radiate freely and be exposed or open at the top. So its heating effect is best.
Ein erfindungsgemäßes Kochfeld kann eine oder mehrere Heizeinrichtungen aufweisen, wobei diese wie zuvor beschrieben ausgebildet sind. Des weiteren weist es eine Kochfeld-Platte auf, unterhalb derer die eine oder mehreren Heizeinrichtungen angeordnet sind. Dabei ist im Verhältnis zu bekannten Kochfeldern der Abstand zwischen der Unterseite der Kochfeld-Platte und den Heizeinrichtungen reduziert bzw. sehr gering. Vorteilhaft beträgt er weniger als 2cm, besonders vorteilhaft sogar nur 1 cm oder noch weniger. So ist eine vorgenannte Reduzierung der gesamten Bauhöhe möglich. Des weiteren kann ein höherer Leistungseintrag der Heizeinrichtung durch die Kochfeld-Platte hindurch in ein darauf stehendes Kochgeschirr ermöglicht werden. Bevorzugt sind dabei sämtliche Heizeinrichtungen nach dem gleichen Prinzip aufgebaut bzw. weisen jeweils sozusagen abgesenkte Temperatursensoren auf.An inventive hob can have one or more heating devices, wherein these are formed as described above. Furthermore, it has a cooktop plate, below which the one or more heating devices are arranged. In this case, the distance between the bottom of the hob plate and the heaters is reduced or very low in relation to known hobs. Advantageously, it is less than 2 cm, more advantageously even only 1 cm or even less. Thus, an aforementioned reduction of the overall height is possible. Furthermore, a higher power input of the heater through the hob plate can be made possible in a standing thereon cookware. In this case, all the heating devices are preferably constructed according to the same principle or each have, as it were, lowered temperature sensors.
Weiterhin ist es möglich einen separaten Anschlußstein einzusparen.Furthermore, it is possible to save a separate connection block.
Bei Beibehaltung der gesamten Bauhöhe oder bei Nutzung eines Anteils der gewonnenen Bauhöhe kann die Wärmedämmung verstärkt bzw. kostengünstiger gestaltet werden. Die Wärmedämmung kann beispielsweise vollständig oder teilweise durch ein Schaumglas oder sandwichartige Aufbauten ersetzt werden. So kann die Erwärmung des Kochgeräts, das den Heizkörper enthält, verringert werden. Eine solche Heizeinrichtung beispielsweise hergestellt werden durch die folgenden Schritte:
- a) einfaches Füllmaterial, wie beispielsweise Glaspudermehl oder Schaumglas, in eine Aufnahmeschale wie einen Blechteller einlegen,
- b) den Temperatursensor einbringen und
- c) eine Dämm-Schicht mit pyrogener Kieselsäure darüber einbringen.
- a) insert a simple filler material, such as glass powder or foam glass, into a receiving tray such as a sheet metal plate,
- b) insert the temperature sensor and
- c) introduce an insulating layer with fumed silica over it.
Über der Dämm-Schicht kann dann ein Heizleiter befestigt werden.A heat conductor can then be attached over the insulating layer.
Diese und weitere Merkmale gehen außer aus den Ansprüchen auch aus der Beschreibung und den Zeichnungen hervor, wobei die einzelnen Merkmale jeweils für sich allein oder zu mehreren in Form von Unterkombinationen bei einer Ausführungsform der Erfindung und auf anderen Gebieten verwirklicht sein und vorteilhafte sowie für sich schutzfähige Ausführungen darstellen können, für die hier Schutz beansprucht wird. Die Unterteilung der Anmeldung in einzelne Abschnitte sowie Zwischen-Überschriften beschränken die unter diesen gemachten Aussagen nicht in ihrer Allgemeingültigkeit.These and other features will become apparent from the claims but also from the description and drawings, wherein the individual features each alone or more in the form of sub-combinations in an embodiment of the invention and in other fields be realized and advantageous and protectable Represent embodiments for which protection is claimed here. The subdivision of the application into individual sections as well as intermediate headings does not restrict the general validity of the statements made thereunder.
Ausführungsbeispiele der Erfindung sind in den Zeichnungen schematisch dargestellt und werden im folgenden näher erläutert. In den Zeichnungen zeigt:
- Fig. 1
- eine vergrößerte Darstellung einer Ausführungsform eines U-förmigen Temperatursensors mit Glasrohr,
- Fig. 2
- eine Darstellung zweier Möglichkeiten, wie an einer erfindungsgemäßen Heizeinrichtung ein Temperatursensor aus
Fig. 1 teileingebettet angeordnet ist, - Fig. 3
- eine Variation der Heizeinrichtung aus
Fig. 2 , bei der der Temperatursensor jeweils in einem vorgefertigten Kanal angeordnet ist, - Fig. 4
- eine weitere Variation der Heizeinrichtung aus
Fig. 2 , bei der der Temperatursensor vollständig in einen Träger der Heizeinrichtung eingebettet ist, - Fig. 5
- zwei weitere Variationen der Heizeinrichtung aus
Fig. 2 , bei der der Temperatursensor einerseits vollständig auf den Träger der Heizeinrichtung aufgesetzt ist und andererseits teilweise herausragt und - Fig. 6
- ein erfindungsgemäßes Kochfeld im Seitenschnitt.
- Fig. 1
- an enlarged view of an embodiment of a U-shaped temperature sensor with glass tube,
- Fig. 2
- an illustration of two ways, such as on a heater according to the invention, a temperature sensor
Fig. 1 is arranged partially embedded, - Fig. 3
- a variation of the heater
Fig. 2 in which the temperature sensor is arranged in each case in a prefabricated channel, - Fig. 4
- another variation of the heater
Fig. 2 in which the temperature sensor is completely embedded in a support of the heating device, - Fig. 5
- two more variations of the heater off
Fig. 2 in which the temperature sensor on the one hand completely placed on the support of the heater and on the other hand partially protruding and - Fig. 6
- an inventive hob in side section.
In
In dem Glasrohr 13 befindet sich ein schematisch dargestelltes längliches sensitives Element 15. Dieses kann sehr vielfältig ausgebildet sein und sowohl eine Art Metalldraht aus entsprechendem Metall sein als auch eine sensitive Schicht, die auf einem Träger aufgebracht ist. Eine elektrische Kontaktierung an das sensitive Element 15 erfolgt über Anschlussdrähte 16a und 16b, die daran festgeschweißt sind. An der Stelle, an der die Anschlussdrähte 16 aus dem Glasrohr 13 austreten, sind Einschmelzungen 17a und 17b vorgesehen. Somit ist es beispielsweise auch möglich, im Inneren des Glasrohrs 13 eine Schutzgasatmosphäre vorzusehen oder auch ein Vakuum.In the
In
Der Unterschied in
Es ist in
Die Form der Erhebung 23 kann variieren. Neben einem dargestellten, relativ sanften Anstieg kann der Anstieg auch steiler sein. Des weiteren kann die Erhebung 23 auch breiter oder länger sein als dargestellt. Vorteilhaft verläuft sie jedoch nur im unmittelbaren Bereich um den Temperatursensor 11, da sie ansonsten die Befestigung der Heizleiter 26 negativ beeinträchtigen könnte. So ist auch der Herstellungsaufwand gering.The shape of the
Aus
In
Des weiteren ist zu erkennen, wie eine Zuleitung 127 zu dem Heizleiter 126 zumindest teilweise in dem Kanal 124 verläuft und nach außen geführt ist. Um den Heizleiter 126 leichter zu erreichen, kann der Kanal 124 oder ein Teil davon auch bis an den Heizleiter 126 heran geführt sein. In diesem Fall nimmt der Temperatursensor 111 nur einen Teil der gesamten Länge des Kanals 124 ein.Furthermore, it can be seen how a
In der linken Hälfte der
In
Dabei ist auch zu beachten, ähnlich wie in
Ähnlich wie zu
In
Auch hier ist es wiederum möglich, zu einer oder zu beiden Seiten des Temperatursensors 311 Erhebungen ähnlich denjenigen aus den
In
In
Es ist zu erkennen, dass die Heizleiter 26 über den Oberteil 14a des Temperatursensors überstehen. Sie weisen einen gewissen Abstand zu der Unterseite der Kochfeld-Platte 31 auf, der durch den Seitenrand der Aufnahmeschale bestimmt ist. Allerdings liegt dieser Abstand im Bereich weniger Millimeter bzw. ungefähr eines Zentimeters und ist damit erheblich kleiner als bei bisherigen Strahlungsheizeinrichtungen. Bei diesen muss nämlich teilweise noch der Temperatursensor zwischen Heizleitern und Kochfeld-Platte verlaufen und einen gewissen Mindestabstand einhalten.It can be seen that the
Die Anschlussdrähte 16a und 16b des Temperatursensors 11 sind zu einer nicht dargestellten Auswertung bzw. Steuerung geführt. Diese wertet zusammen mit dem Temperatursensor 11 bzw. dem sensitiven Element 15 die erfasste Temperatur aus.The connecting
Claims (14)
- Heating device preferably for hobs (30) with a cover (31) of glass or glass ceramic, the heating device having a temperature sensor (11, 111, 211, 311) and a support (22, 122, 222, 322) on whose upper side a heat conductor (26) is arranged, the temperature sensor being fastened/mounted exclusively on the support and arranged thereon, the temperature sensor (11, 111, 211) being at least partially embedded inside the support (22, 122, 222) or running inside a channel (124) therein, wherein the temperature sensor (11, 111, 211) runs inside an elevation (23, 123, 223) of the otherwise substantially flat support (22, 122, 222) and is substantially covered by the support material, the major part of the temperature sensor being embedded in the support and an arrangement of the temperature sensor (11, 111, 311) on the support (22, 122, 322) being designed such that heat conductors (26, 126, 326) are only located laterally next to the temperature sensor and not higher or lower when seen in a plane of the support.
- Heating device according to Claim 1, wherein the temperature sensor (11, 111, 211, 311) is designed elongated, preferably tubular, being in particular bent in a U-shape.
- Heating device according to Claim 1 or 2, wherein the temperature sensor (11, 111, 211, 311) is designed for temperature recording via electrical evaluation.
- Heating device according to one of the preceding claims, wherein the temperature sensor (11, 111, 211) is in largely full contact with the support material or is directly embedded therein.
- Heating device according to one of the preceding claims, wherein the support (122) has a recess (124) in which run the temperature sensor (111) and an electrical lead (127) for the heat conductor (126).
- Heating device according to Claim 4 or 5, wherein the temperature sensor (11, 111, 211) projects towards the side on which the heat conductor (26, 126, 226) is arranged somewhat beyond the otherwise substantially flat surface of the support (22, 122, 222), preferably by a maximum of one third.
- Heating device according to one of the preceding claims, wherein the temperature sensor (11, 111, 211) is shielded from direct radiation from the heat conductor (26, 126, 226) preferably by a layer of the support material, in particular by embedding the temperature sensor in the support (22, 122, 222) or by lateral elevations (23, 123, 223) of the support over the temperature sensor.
- Heating device according to Claim 4 or 5, wherein the temperature sensor (411) is arranged obliquely to the plane of the otherwise substantially flat support (422) or the upper side on which the heat conductor (426) is arranged, preferably being covered in one longitudinal area by a layer of the support material and exposed in another longitudinal area.
- Heating device according to one of the preceding claims, wherein the temperature sensor (11, 111, 211, 311) has a sensitive element (15), in particular in elongated form, the sensitive element being arranged in an envelope (13, 14) preferably of electrically insulating material such as glass, and wherein in particular fused enclosures of the connecting wires of the temperature sensor (11, 111, 211, 311) to the sensitive element (15) are in the glass (13, 14) outside the heating device (20, 120, 220, 320) or outside the support (22, 122, 222, 322).
- Heating device according to Claim 9, wherein the sensitive element (15) has a bond between metal and ceramic, the metal and/or ceramic having PTC properties and in particular at least one high-temperature superconductor.
- Heating device according to Claim 9 or 10, wherein the sensitive element (15) is made using a thick-film and/or thin-film manufacturing method.
- Heating device according to one of the preceding claims, wherein the temperature sensor (11, 111, 211, 311) projects with one end (17) having electrical connections (16) beyond the heating device (20, 120, 220, 320) or the lateral edge of the support (22, 122, 222, 322).
- Hob with several heating devices (20) according to one of the preceding claims, the hob (30) having a hob plate (31) and the heating devices being arranged underneath, wherein the distance between the underside of the hob plate and the heating devices (20) is very small.
- Hob according to Claim 13, wherein the heating devices (20) have a heat conductor (26), in particular a heating wire freely radiating and exposed/open to the top, and the distance between the underside of the hob plate (31) and the heat conductor is less than 2 cm, preferably less than 1 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL06701480T PL1844629T3 (en) | 2005-02-01 | 2006-01-27 | Heating device with temperature sensor and hob with heating devices |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005005520A DE102005005520A1 (en) | 2005-02-01 | 2005-02-01 | Heating device with temperature sensor and hob with heaters |
| PCT/EP2006/000699 WO2006081982A1 (en) | 2005-02-01 | 2006-01-27 | Heating device with temperature sensor and hob with heating devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1844629A1 EP1844629A1 (en) | 2007-10-17 |
| EP1844629B1 true EP1844629B1 (en) | 2009-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06701480A Not-in-force EP1844629B1 (en) | 2005-02-01 | 2006-01-27 | Heating device with temperature sensor and hob with heating devices |
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| Country | Link |
|---|---|
| US (1) | US7417207B2 (en) |
| EP (1) | EP1844629B1 (en) |
| JP (1) | JP5021500B2 (en) |
| KR (1) | KR101246012B1 (en) |
| CN (1) | CN101124851B (en) |
| AT (1) | ATE437552T1 (en) |
| DE (2) | DE102005005520A1 (en) |
| ES (1) | ES2330041T3 (en) |
| PL (1) | PL1844629T3 (en) |
| WO (1) | WO2006081982A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005046703A1 (en) | 2005-09-29 | 2007-04-05 | Wacker Chemie Ag | Hydrogenation of chlorosilane comprises contacting silicon-containing compound and hydrogen with surface of reaction chamber and surface of heater such that silicon carbide coating is formed in situ on the surfaces in first process step |
| DE102007012379A1 (en) * | 2007-03-14 | 2008-09-18 | BSH Bosch und Siemens Hausgeräte GmbH | Hob device |
| EP2728322A1 (en) * | 2012-10-31 | 2014-05-07 | ams AG | Light sensor arrangement and method for temperature compensation in a light sensor arrangement |
| JPWO2014073545A1 (en) * | 2012-11-06 | 2016-09-08 | 貞徳舎株式会社 | Electric heater, heating apparatus and semiconductor manufacturing apparatus provided with the same |
| DE202015104723U1 (en) | 2015-09-04 | 2015-09-18 | Türk & Hillinger GmbH | Electric heating cartridge with temperature monitoring and electric heating with temperature monitoring |
| DE102017222958A1 (en) * | 2017-09-04 | 2019-03-07 | E.G.O. Elektro-Gerätebau GmbH | Heating device and method for producing a heating device |
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-
2005
- 2005-02-01 DE DE102005005520A patent/DE102005005520A1/en not_active Withdrawn
-
2006
- 2006-01-27 PL PL06701480T patent/PL1844629T3/en unknown
- 2006-01-27 AT AT06701480T patent/ATE437552T1/en not_active IP Right Cessation
- 2006-01-27 ES ES06701480T patent/ES2330041T3/en active Active
- 2006-01-27 WO PCT/EP2006/000699 patent/WO2006081982A1/en not_active Ceased
- 2006-01-27 DE DE502006004300T patent/DE502006004300D1/en active Active
- 2006-01-27 CN CN200680003732XA patent/CN101124851B/en not_active Expired - Fee Related
- 2006-01-27 KR KR1020077019906A patent/KR101246012B1/en not_active Expired - Fee Related
- 2006-01-27 JP JP2007552580A patent/JP5021500B2/en not_active Expired - Fee Related
- 2006-01-27 EP EP06701480A patent/EP1844629B1/en not_active Not-in-force
-
2007
- 2007-07-31 US US11/831,141 patent/US7417207B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070114730A (en) | 2007-12-04 |
| JP5021500B2 (en) | 2012-09-05 |
| ATE437552T1 (en) | 2009-08-15 |
| DE102005005520A1 (en) | 2006-08-10 |
| CN101124851A (en) | 2008-02-13 |
| US7417207B2 (en) | 2008-08-26 |
| DE502006004300D1 (en) | 2009-09-03 |
| PL1844629T3 (en) | 2009-12-31 |
| ES2330041T3 (en) | 2009-12-03 |
| EP1844629A1 (en) | 2007-10-17 |
| JP2008529225A (en) | 2008-07-31 |
| WO2006081982A1 (en) | 2006-08-10 |
| CN101124851B (en) | 2011-03-09 |
| US20080000893A1 (en) | 2008-01-03 |
| KR101246012B1 (en) | 2013-03-20 |
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