EP1727685B1 - Stamp for hot or cold stamping - Google Patents
Stamp for hot or cold stamping Download PDFInfo
- Publication number
- EP1727685B1 EP1727685B1 EP05733564.8A EP05733564A EP1727685B1 EP 1727685 B1 EP1727685 B1 EP 1727685B1 EP 05733564 A EP05733564 A EP 05733564A EP 1727685 B1 EP1727685 B1 EP 1727685B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- embossing
- embossing stamp
- stamp
- surface structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000010410 layer Substances 0.000 claims description 81
- 238000004049 embossing Methods 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000806 elastomer Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
- B41F19/02—Apparatus or machines for carrying out printing operations combined with other operations with embossing
- B41F19/06—Printing and embossing between a negative and a positive forme after inking and wiping the negative forme; Printing from an ink band treated with colour or "gold"
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/0052—Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/02—Dies; Accessories
- B44B5/026—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/02—Dies; Accessories
- B44B5/028—Heated dies
Definitions
- the invention relates to a die with a surface structure for hot stamping or cold stamping.
- hot stamping foils are processed to produce e.g. to refine graphic products or plastic parts.
- cold stamping dies are used without foil. This embossing is also referred to as blind embossing.
- the surface structure may be an engraving or similar. act.
- the known embossing dies used in the graphic art are usually compact, ie. formed in one piece, which make so-called adjustments necessary to compensate for tolerances of the substrate to be embossed, to compensate for tolerances of the embossing machine and / or to compensate for tolerances of the embossing die.
- Said dressings are in practice by submitting appropriate material - in the required, i. E. different thicknesses-realized under the substrate or embossing stamp to be embossed. This underlay is time consuming. Another shortcoming is that this dressing depends on the experience of the operator and thus difficult or hardly reproducible.
- embossing stamps for hot stamping or stamping for stamping of label paper or the like which have a base layer on the a Nutzlage is provided.
- the useful layer consists, for example, of brass, copper or a photopolymer and is engravable, etchable, washable or structurable by means of a laser.
- the base layer consists of a ferritic material to magnetically clamp this known stamp on a machine table or a rotating body. In these known stamps, it is therefore only about a motif, ie the surface structure, to bring in an easily editable Nutzlage, and then simply clamp the stamp magnetically on a machine table or a rotating body can.
- the Nutzlage is mechanically rigid in these known dies with the base layer, for example, by rolling, connected. Another possibility is to galvanically apply the useful layer to the base layer. This also results in a mechanically rigid connection of the Nutzlage with the base layer.
- the surface-structured Nutzlage is mechanically bonded firmly to the base layer. A tolerance compensation is not given in such a two-ply design of the stamp, consisting of the base layer and a surface-structured use position.
- the stamp is known with a stamp body having an elastic layer.
- the elastic layer forming the useful layer of the embossing stamp may be formed with a surface structure (FIG. 5 and associated description), or it may be provided with a flexible metal surface (FIG. 1 and associated description).
- the elastic layer can also have inserts, for example in the form of metal foils (FIG. 3 and associated description).
- An embossing stamp with a Nutzlage of a hard material having a surface structure is known from DE 1 161 568 B neither is it known nor suggested by this prior art.
- the DE 38 29 279 C2 discloses an embossing die for hot stamping which has a useful layer.
- the Nutzlage consists of a rubber compound and is heated by means of an electrical resistance heater.
- a heat insulating layer may be provided on the back of the resistance heating element.
- the heat insulating layer includes Pressure pad on. The pressure pad is capable of shaping to the surface of a workpiece to be printed.
- DE 198 35 993 A1 describes a die for applying marks on workpieces.
- This known die has a letter holder between side shells, which serves to receive letters.
- a rubber plate is arranged as a pressure compensation means and a mold plate.
- the EP 0 326 819 A2 describes an embossing punch, wherein in the embossing die of the punch body is so thin-walled that he applies when applying to the workpiece to be printed locally elastically deforming on the surface.
- the punch body has on its side facing away from the stamp surface on a positive force transfer relief, which corresponds to the stamp surface and is similar to this formed.
- an elastic pressure pad is provided for the local elastic deformation of the stamp body.
- the invention has for its object to provide an embossing die of the type mentioned for hot or cold embossing, in which a dressing is unnecessary.
- the embossing stamp according to the invention has such a flexibility that it can advantageously be dispensed with a dressing with the aid of suitable materials under the respective substrate or embossing stamp to be embossed.
- This adhesive is preferably an epoxy resin adhesive.
- the wall thickness of the useful layer is 2 mm and the wall thickness of the at least one intermediate layer is 1.5 mm.
- the wall thickness of the useful layer, the wall thickness of the at least one intermediate layer and the wall thickness of the base layer are preferably dimensioned adapted to the respective intended use of the embossing stamp according to the invention.
- the flexibility of the embossing stamp according to the invention can also by the number of layers and the wall thickness thereof as desired be set.
- the desired properties of the embossing stamp according to the invention are thus adjustable as desired by the selection and the dimensioning of the layers, ie adaptable to the respective application and application.
- the surface structure of the wear layer can have a maximum depth which corresponds at most to the wall thickness of the wear layer or is smaller than this.
- the surface structure of the useful layer has a maximum depth which is greater than the wall thickness of the useful layer, so that the surface structure extends into the at least one intermediate layer.
- the use position and the at least one intermediate layer and the base layer of the embossing stamp according to the invention consist either of the same metals or metal alloys.
- the useful layer and the at least one intermediate layer and the base layer consist of different metals or metal alloys.
- brass, copper, steel or the like can be used for the useful layer, the at least one intermediate layer and the base layer.
- the figure shows an embossing die 10 with a use layer 12, which is formed with a surface structure 14, 16.
- the surface structure 14 is a recessed surface structure and the surface structure 16 it is an alternately recessed and raised surface structure.
- the surface structures 14 and 16 have a maximum depth that is smaller than the wall thickness of the wear layer 12. This is, for example, 2 mm.
- the die 10 also has a base layer 18, the wall thickness, for example, is also 2 mm.
- the use layer 12 the intermediate layers 20 and the base layer 18 are connected to each other by means of temperature-resistant flexible connecting layers 22, so that a total of a limited flexible die 10 results, so that in its application to a dressing by lining of suitable materials - in the respective required thicknesses - Can be dispensed under the substrate to be embossed or the die.
- the flexible interconnect layers 22 are preferably thin adhesive layers of an epoxy resin adhesive.
- the surface-structured useful layer 12, the intermediate layers 20, which for example each have a wall thickness of 1.5 mm, and the base layer 18 may consist of the same or of different materials. These materials may be, for example, brass, copper, steel or the like.
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Laminated Bodies (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Die Erfindung betrifft einen Prägestempel mit einer Oberflächenstruktur zum Heißprägen oder zum Kaltprägen.The invention relates to a die with a surface structure for hot stamping or cold stamping.
Beim Heißprägen werden bspw. Heißprägefolien verarbeitet, um z.B. grafische Produkte oder Kunststoffteile zu veredeln. Zum Kaltprägen kommen Prägestempel ohne Folie zur Anwendung. Dieses Prägen wird auch als Blindprägen bezeichnet.In hot stamping, for example, hot stamping foils are processed to produce e.g. to refine graphic products or plastic parts. For cold stamping dies are used without foil. This embossing is also referred to as blind embossing.
Bei der Oberflächenstruktur kann es sich um eine Gravur o.ä. handeln.The surface structure may be an engraving or similar. act.
Die bekannten, im graphischen Gewerbe zur Anwendung gelangenden Prägestempel sind üblicherweise kompakt d.h. einteilig ausgebildet, die zum Ausgleich von Toleranzen des zu beprägenden Substrates, zum Ausgleich von Toleranzen der Prägemaschine und/oder zum Ausgleich von Toleranzen des Prägestempels sogenannte Zurichtungen erforderlich machen.The known embossing dies used in the graphic art are usually compact, ie. formed in one piece, which make so-called adjustments necessary to compensate for tolerances of the substrate to be embossed, to compensate for tolerances of the embossing machine and / or to compensate for tolerances of the embossing die.
Der Ausgleich der besagten Toleranzen mit Hilfe der Zurichtungen ist sehr aufwändig und resultiert in einem hohen Kostenanteil an den Gesamtkosten des jeweiligen Prägevorgangs.The compensation of said tolerances with the help of the dressings is very complex and results in a high cost of the total cost of the respective embossing process.
Die besagten Zurichtungen werden in der betrieblichen Praxis durch Unterlegen geeigneten Materials - in den jeweils erforderlichen, d.h. verschiedenen Dicken-unter dem zu beprägenden Substrat oder Prägestempel verwirklicht. Dieses Unterlegen ist zeitaufwändig. Ein weiterer Mangel besteht darin, dass dieses Zurichten von der Erfahrung des Bedienpersonals abhängig und folglich schwer bzw. kaum reproduzierbar ist.Said dressings are in practice by submitting appropriate material - in the required, i. E. different thicknesses-realized under the substrate or embossing stamp to be embossed. This underlay is time consuming. Another shortcoming is that this dressing depends on the experience of the operator and thus difficult or hardly reproducible.
Es sind Prägestempel zum Heißprägen oder Stempel zum Stanzen von Etikettenpapier oder dergleichen bekannt, die eine Basislage aufweisen, an der eine Nutzlage vorgesehen ist. Die Nutzlage besteht bspw. aus Messing, Kupfer oder einem Fotopolymer und ist gravierbar, ätzbar, auswaschbar oder mittels eines Lasers strukturierbar. Die Basislage besteht aus einem ferritischen Material, um diesen bekannten Stempel magnetisch auf einen Maschinentisch oder einen Rotationskörper spannen zu können. Bei diesen bekannten Stempeln geht es also nur darum, in eine leicht bearbeitbare Nutzlage ein Motiv, d.h. die Oberflächenstruktur, einbringen zu können, und den Stempel dann einfach magnetisch auf einen Maschinentisch oder einen Rotationskörper festspannen zu können. Die Nutzlage ist bei diesen bekannten Prägestempel mit der Basislage mechanisch starr, beispielsweise durch Aufwalzen, verbunden. Eine andere Möglichkeit besteht dort darin, die Nutzlage auf die Basislage galvanisch aufzubringen. Auch hierdurch ergibt sich eine mechanisch starre Verbindung der Nutzlage mit der Basislage. Gegebenenfalls ist es auch möglich, dass die oberflächenstrukturierte Nutzlage mit der Basislage mechanisch fest verklebt ist. Ein Toleranzausgleich ist bei einer solchen zweilagigen Ausbildung des Stempels, bestehend aus der Basislage und einer oberflächenstrukturierten Nutzlage, nicht gegeben.There are embossing stamps for hot stamping or stamping for stamping of label paper or the like are known, which have a base layer on the a Nutzlage is provided. The useful layer consists, for example, of brass, copper or a photopolymer and is engravable, etchable, washable or structurable by means of a laser. The base layer consists of a ferritic material to magnetically clamp this known stamp on a machine table or a rotating body. In these known stamps, it is therefore only about a motif, ie the surface structure, to bring in an easily editable Nutzlage, and then simply clamp the stamp magnetically on a machine table or a rotating body can. The Nutzlage is mechanically rigid in these known dies with the base layer, for example, by rolling, connected. Another possibility is to galvanically apply the useful layer to the base layer. This also results in a mechanically rigid connection of the Nutzlage with the base layer. Optionally, it is also possible that the surface-structured Nutzlage is mechanically bonded firmly to the base layer. A tolerance compensation is not given in such a two-ply design of the stamp, consisting of the base layer and a surface-structured use position.
Aus der
Die
Auch die
Der Erfindung liegt die Aufgabe zugrunde, einen Prägestempel der eingangs genannten Art zum Heiß- oder Kaltprägen zu schaffen, bei welchem eine Zurichtung entbehrlich ist.The invention has for its object to provide an embossing die of the type mentioned for hot or cold embossing, in which a dressing is unnecessary.
Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruches 1 gelöst. Bevorzugte Aus- bzw. Weiterbildungen des erfindungsgemäßen Prägestempels sind in den Unteransprüchen gekennzeichnet.This object is achieved by the features of claim 1. Preferred embodiments or further developments of the embossing stamp according to the invention are characterized in the subclaims.
Durch den mehrlagigen Aufbau weist der erfindungsgemäße Prägestempel eine derartige Flexibilität auf, dass auf eine Zurichtung mit Hilfe geeigneter Materialien unter dem jeweils zu beprägenden Substrat oder Prägestempel in vorteilhafter Weise verzichtet werden kann.Due to the multi-layered structure, the embossing stamp according to the invention has such a flexibility that it can advantageously be dispensed with a dressing with the aid of suitable materials under the respective substrate or embossing stamp to be embossed.
Bei diesem Kleber handelt es sich vorzugsweise um einen Epoxidharzkleber.This adhesive is preferably an epoxy resin adhesive.
Beispielsweise beträgt die Wanddicke der Nutzlage 2 mm und die Wanddicke der mindestens einen Zwischenlage 1,5 mm. Selbstverständlich ist es auch möglich, dass die Nutzlage und die mindestens eine Zwischenlage andere Wanddicken besitzen. Die Wanddicke der Nutzlage, die Wanddicke der mindestens einen Zwischenlage und die Wanddicke der Basislage werden vorzugsweise an den jeweiligen Verwendungszweck des erfindungsgemäßen Prägestempels angepasst dimensioniert. Entsprechendes gilt für die Dicke der Verbindungsschichten zwischen den jeweils benachbarten Lagen des erfindungsgemäßen flexiblen Prägestempels. Die Flexibilität des erfindungsgemäßen Prägestempels kann auch durch die Anzahl der Lagen und die Wanddicke derselben wunschgemäß eingestellt werden. Die gewünschten Eigenschaften des erfindungsgemäßen Prägestempels sind also durch die Auswahl und die Dimensionierung der Lagen wunschgemäß einstellbar, d.h. an den jeweiligen Einsatz- und Anwendungsbereich anpassbar.For example, the wall thickness of the useful layer is 2 mm and the wall thickness of the at least one intermediate layer is 1.5 mm. Of course, it is also possible that the useful layer and the at least one intermediate layer have different wall thicknesses. The wall thickness of the useful layer, the wall thickness of the at least one intermediate layer and the wall thickness of the base layer are preferably dimensioned adapted to the respective intended use of the embossing stamp according to the invention. The same applies to the thickness of the connecting layers between the respectively adjacent layers of the flexible embossing stamp according to the invention. The flexibility of the embossing stamp according to the invention can also by the number of layers and the wall thickness thereof as desired be set. The desired properties of the embossing stamp according to the invention are thus adjustable as desired by the selection and the dimensioning of the layers, ie adaptable to the respective application and application.
Bei dem erfindungsgemäßen Prägestempel kann die Oberflächenstruktur der Nutzschicht eine maximale Tiefe besitzen, die maximal der Wanddicke der Nutzschicht entspricht, oder kleiner als diese ist. Desgleichen ist es möglich, dass die Oberflächenstruktur der Nutzlage eine maximale Tiefe besitzt, die größer ist als die Wanddicke der Nutzlage, so dass die Oberflächenstruktur in die mindestens eine Zwischenlage hineinreicht.In the case of the embossing stamp according to the invention, the surface structure of the wear layer can have a maximum depth which corresponds at most to the wall thickness of the wear layer or is smaller than this. Likewise, it is possible that the surface structure of the useful layer has a maximum depth which is greater than the wall thickness of the useful layer, so that the surface structure extends into the at least one intermediate layer.
Bei einem erfindungsgemäßen Prägestempel mit den üblichen Dimensionen bekannter kompakter einteiliger Prägestempel hat es sich als vorteilhaft erwiesen, wenn zwischen der Nutzlage und der Basislage zwei oder mehr als zwei Zwischenlagen vorgesehen sind.In the case of an embossing stamp according to the invention with the usual dimensions of a known compact one-part embossing stamp, it has proved to be advantageous if two or more than two intermediate layers are provided between the useful layer and the base layer.
Die Nutzlage und die mindestens eine Zwischenlage sowie die Basislage des erfindungsgemäßen Prägestempels bestehen entweder aus den gleichen Metallen oder Metalllegierungen. Desgleichen ist es möglich, dass die Nutzlage und die mindestens eine Zwischenlage sowie die Basislage aus unterschiedlichen Metallen oder Metalllegierungen bestehen. Bei dem erfindungsgemäßen Prägestempel können für die Nutzlage, die mindestens eine Zwischenlage und die Basislage beispielsweise Messing, Kupfer, Stahl oder dergleichen zur Anwendung gelangen.The use position and the at least one intermediate layer and the base layer of the embossing stamp according to the invention consist either of the same metals or metal alloys. Likewise, it is possible that the useful layer and the at least one intermediate layer and the base layer consist of different metals or metal alloys. In the case of the stamping die according to the invention, for example, brass, copper, steel or the like can be used for the useful layer, the at least one intermediate layer and the base layer.
Weitere Einzelheiten ergeben sich aus der nachfolgenden Beschreibung eines in der Zeichnung schematisch und nicht maßstabgetreu geschnitten dargestellten Ausführungsbeispieles des erfindungsgemäßen Prägestempels.Further details emerge from the following description of a drawing in the drawing schematically and not to scale shown embodiment of the embossing stamp according to the invention.
Die Figur zeigt einen Prägestempel 10 mit einer Nutzlage 12, die mit einer Oberflächenstruktur 14, 16 ausgebildet ist. Bei der Oberflächenstruktur 14 handelt es sich um eine vertiefte Oberflächenstruktur und bei der Oberflächenstruktur 16 handelt es sich um eine abwechselnd vertiefte und erhabene Oberflächenstruktur. Die Oberflächenstrukturen 14 und 16 besitzen eine maximale Tiefe, die kleiner ist als die Wanddicke der Nutzschicht 12. Diese beträgt beispielsweise 2 mm.The figure shows an
Der Prägestempel 10 weist außerdem eine Basislage 18 auf, deren Wanddicke beispielsweise ebenfalls 2 mm beträgt.The die 10 also has a
Zwischen der Basislage 18 und der Nutzlage 12 sind zwei Zwischenlagen 20 vorgesehen. Die Nutzlage 12, die Zwischenlagen 20 und die Basislage 18 sind miteinander mittels temperaturbeständiger flexibler Verbindungsschichten 22 verbunden, so dass sich insgesamt ein begrenzt flexibler Prägestempel 10 ergibt, so dass bei seiner Anwendung auf eine Zurichtung durch Unterlegen von geeigneten Materialien - in den jeweils erforderlichen Dicken - unter dem zu beprägenden Substrat oder dem Prägestempel verzichtet werden kann.Between the
Bei den flexiblen Verbindungsschichten 22 handelt es sich vorzugsweise um dünne Kleberschichten aus einem Epoxidharzkleber.The
Die oberflächenstrukturierte Nutzlage 12, die Zwischenlagen 20, die beispielsweise jeweils eine Wanddicke von 1,5 mm besitzen, und die Basislage 18 können aus den gleichen oder aus verschiedenen Materialien bestehen. Bei diesen Materialien kann es sich zum Beispiel um Messing, Kupfer, Stahl oder dergleichen handeln.The surface-structured
Claims (7)
- Embossing stamp having a surface structure for hot or cold embossing, wherein the embossing stamp (10) has a use layer (12) having the surface structure (14, 16), a base layer (18) and at least one intermediate layer (20) between the use and the base layer (12 and 18), wherein the layers (12, 20, 18) are connected to one another respectively by means of a temperature-resistant, flexible adhesive or elastomer layer (22),
characterised in that,
the use layer (12) has a wall thickness which is greater than the wall thickness of the at least one intermediate layer (20), and that the use layer (12), the at least one intermediate layer (20) and the base layer (18) consist of metals or metal alloys. - Embossing stamp according to claim 1,
characterised in that,
the adhesive layer (22) is formed from an epoxy resin adhesive. - Embossing stamp according to claim 1 or 2,
characterised in that,
the surface structure (14, 16) of the use layer (12) has a maximum depth which corresponds to the maximum wall thickness of the use layer (12). - Embossing stamp according to claim 1 or 2,
characterised in that,
the surface structure (14, 16) of the use layer (12) has a maximum depth which is greater than the wall thickness of the use layer (12) and extends into the at least one intermediate layer (20). - Embossing stamp according to one of claims 1 to 4,
characterised in that,
two or more than two intermediate layers (20) are provided between the use layer (12) and the base layer (18). - Embossing stamp according to one of claims 1 to 5,
characterised in that,
the use layer (12) and the at least one intermediate layer (20) as well as the base layer (18) consist of the same metals or metal alloys. - Embossing stamp according to one of claims 1 to 5,
characterised in that,
the use layer (12) and the at least one intermediate layer (20) as well as the base layer (18) consist of different metals or metal alloys.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004014373A DE102004014373B4 (en) | 2004-03-24 | 2004-03-24 | Embossing stamp for hot or cold stamping |
| PCT/DE2005/000439 WO2005095122A2 (en) | 2004-03-24 | 2005-03-11 | Stamp for hot or cold stamping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1727685A2 EP1727685A2 (en) | 2006-12-06 |
| EP1727685B1 true EP1727685B1 (en) | 2014-05-07 |
Family
ID=34965472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05733564.8A Ceased EP1727685B1 (en) | 2004-03-24 | 2005-03-11 | Stamp for hot or cold stamping |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20080245249A1 (en) |
| EP (1) | EP1727685B1 (en) |
| DE (1) | DE102004014373B4 (en) |
| WO (1) | WO2005095122A2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080016916A1 (en) * | 2006-04-28 | 2008-01-24 | Yang Wei Y | Stamped glass |
| DE102006056701B4 (en) | 2006-11-30 | 2008-08-28 | Leonhard Kurz Gmbh & Co. Kg | embosser |
| DE102010012734B3 (en) * | 2010-03-24 | 2011-10-06 | Hinderer + Mühlich Kg | Hot embossing and stamping |
| EP2724864B1 (en) | 2012-10-24 | 2018-12-26 | Heidelberger Druckmaschinen AG | Method and device for creating and transferring diffractive microstructures on a printable material |
| DE202017006182U1 (en) | 2017-12-01 | 2018-02-16 | Augenstein Gmbh | Apparatus for thermal hot stamping of products, preferably of foodstuffs |
| DE102018102638A1 (en) | 2018-02-06 | 2019-08-08 | Hinderer + Mühlich Gmbh & Co. Kg | Method and device for rotatively blind embossing a substrate, a die and / or male part for use in a device and a method for producing a female mold and / or male |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1161568B (en) * | 1958-04-03 | 1964-01-23 | Dr Elmar Messerschmitt | Embossing stamp |
| US3271151A (en) * | 1965-02-08 | 1966-09-06 | Eastman Kodak Co | Photographic relief printing plate |
| CA1309298C (en) * | 1987-12-24 | 1992-10-27 | Kureha Rubber Industry Co., Ltd. | Corrugated board printing plate |
| DE3829297A1 (en) * | 1988-02-01 | 1989-08-24 | Walter Mathis | DEVICE FOR DRYING PRINTING OF A WORKPIECE USING A HOT-IMAGING FILM AND A STAMP |
| EP0340318A1 (en) * | 1988-05-02 | 1989-11-08 | Kinaros Anstalt | Die-stamping apparatus for personal documents |
| DE19835993A1 (en) * | 1998-08-08 | 2000-02-10 | Volkswagen Ag | Press stamp for applying marks on non-even surface area of component to be labeled, especially workpiece, supporting individual letters, independently of each other movable |
-
2004
- 2004-03-24 DE DE102004014373A patent/DE102004014373B4/en not_active Expired - Fee Related
-
2005
- 2005-03-11 EP EP05733564.8A patent/EP1727685B1/en not_active Ceased
- 2005-03-11 US US10/593,363 patent/US20080245249A1/en not_active Abandoned
- 2005-03-11 WO PCT/DE2005/000439 patent/WO2005095122A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE102004014373A1 (en) | 2005-10-13 |
| DE102004014373B4 (en) | 2006-09-21 |
| WO2005095122A3 (en) | 2005-11-17 |
| US20080245249A1 (en) | 2008-10-09 |
| EP1727685A2 (en) | 2006-12-06 |
| WO2005095122A2 (en) | 2005-10-13 |
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