EP1716580A1 - Method for producing coated electrical wires - Google Patents
Method for producing coated electrical wiresInfo
- Publication number
- EP1716580A1 EP1716580A1 EP05707891A EP05707891A EP1716580A1 EP 1716580 A1 EP1716580 A1 EP 1716580A1 EP 05707891 A EP05707891 A EP 05707891A EP 05707891 A EP05707891 A EP 05707891A EP 1716580 A1 EP1716580 A1 EP 1716580A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- oxirane
- baked
- component
- radical
- following form
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 210000003298 dental enamel Anatomy 0.000 claims abstract description 28
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- 238000004132 cross linking Methods 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 18
- -1 oxirane compound Chemical class 0.000 claims description 16
- QCGKUFZYSPBMAY-UHFFFAOYSA-N methyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)OC)CCC2OC21 QCGKUFZYSPBMAY-UHFFFAOYSA-N 0.000 claims description 8
- 150000002924 oxiranes Chemical class 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 5
- 229920005906 polyester polyol Polymers 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000012986 chain transfer agent Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 150000002921 oxetanes Chemical class 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- WPWHSFAFEBZWBB-UHFFFAOYSA-N 1-butyl radical Chemical compound [CH2]CCC WPWHSFAFEBZWBB-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 238000012663 cationic photopolymerization Methods 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims description 2
- JECYNCQXXKQDJN-UHFFFAOYSA-N 2-(2-methylhexan-2-yloxymethyl)oxirane Chemical compound CCCCC(C)(C)OCC1CO1 JECYNCQXXKQDJN-UHFFFAOYSA-N 0.000 claims 2
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 1
- 150000007942 carboxylates Chemical class 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- ASQQEOXYFGEFKQ-UHFFFAOYSA-N dioxirane Chemical compound C1OO1 ASQQEOXYFGEFKQ-UHFFFAOYSA-N 0.000 description 11
- 239000004922 lacquer Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000004804 winding Methods 0.000 description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000004844 dioxiranes Chemical class 0.000 description 2
- 150000002081 enamines Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920003055 poly(ester-imide) Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- JGJWEXOAAXEJMW-UHFFFAOYSA-N dimethyl naphthalene-1,2-dicarboxylate Chemical compound C1=CC=CC2=C(C(=O)OC)C(C(=O)OC)=CC=C21 JGJWEXOAAXEJMW-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/308—Wires with resins
Definitions
- the present invention relates to a process for producing coated electric wires.
- winding carriers used for the production of motors, solenoids, solenoids and generators are often exposed to strong mechanical loads. Especially with high-speed rotors, the resulting centrifugal and centripetal forces, which act on the windings of the moving components, quite considerable.
- windings are fixed at an early stage. This is done by impregnation with impregnating varnishes or impregnating resins.
- the impregnating varnishes or impregnating resins must be hardened. This is usually achieved by oven hardening the component at elevated temperatures over an extended period of time.
- the principle of the baked coatings is based on the thermoplastic property, which allows bonding of the finished painted wires after winding the coil.
- the baked enamel layer which is expediently applied over an existing base insulation of the enameled wire, is first melted, wherein the interwinding spaces are partially filled with the molten thermoplastic and thus glue the individual windings over the thermoplastic.
- all windings are fixed to one another, deformation of the winding, which would cause a change in the inductance, in particular in the case of self-supporting coils, can thus be prevented.
- the melting of the baked enamel is thermally, on the one hand on the tempering of prefabricated components in the heater and the other electrically by power surge.
- baked enamels in the production of reels of all kinds caused the designers to develop new devices for the winding technology.
- baked enamels are used in almost all areas of enamelled wire processing for winding fixation, even with high thermal requirements.
- Different classes of substances are used as a basis for baked enamels, depending on the field of application.
- EP 1 096 510 describes the use of polyvinyl acetals (PVA). The thermal and mechanical property level of these baked coatings is modest.
- EP 0 331 823 describes polyvinyl butyrals and formals. Due to a relatively high average water absorption and a relatively low softening point of the polyvinyl butyrals, these materials are reluctantly used.
- EP 0 399 396 describes polyamides for use as baked enamels.
- polyamides which are suitable for use as a baked-on binder, there are far more possibilities for variation than in the other substance classes.
- a wide range of copolyamides of aromatic and / or aliphatic dicarboxylic acid, aromatic and / or aliphatic diamines and predominantly aromatic diisocyanates are known and are optionally used modified with blocked polyisocyanates.
- the object of the present invention is to provide a baked enamel which is solvent-free and curable by UV light.
- UV-curable baked enamels which comprise a) one or more oxirane-based binders, b) one or more UV crosslinking catalysts, c) optionally reactive diluents, d) optionally chain transfer agents, and e) others contain usual additives.
- the baked coatings according to the invention are free from solvents of any kind, with water also counting as solvent.
- the described UV-curable baked enamels contain:
- oxirane-based binders b) 1-10% UV crosslinking catalysts, c) 0-80% reactive diluents, d) 0-40% chain transfer agents, and e) 1-8% additives, stabilizers, etc.
- UV-curable baked enamels preferred according to the invention contain: a) 60-93% oxirane-based binder b) 2-6% UV crosslinking catalysts, c) 0-70% reactive diluents, d) 0-35% chain transfer agents, and e) 1-3% additives, stabilizers, etc.
- the binders a) preferably contain cycloaliphatic Oxiranvepressiveen the general form
- Ri is a hydrogen, a carboxylate radical of the stated form
- R 2 is a methyl, ethyl, propyl or butyl radical or another oxirane ring, or another oxirane compound of the type
- R 3 is a hydroxyethyl radical or an oxirane compound of the following form
- R and R5 is an aliphatic hydrocarbon chain of 2-6
- Suitable for the production of baked enamels is 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, which is available under the name "Cyracure UVR 6110" from Union Carbide Corporation.
- Suitable aromatic dicarboxylic acids and / or dicarboxylic acid dimethyl esters are, for example, isophthalic acid, terephthalic acid, terephthalic acid dimethyl ester, naphthalenedicarboxylic acid dimethyl ester. Particularly preferred are isophthalic acid and dimethyl terephthalate.
- Suitable aliphatic dicarboxylic acids are, for example, adipic acid, azelaic acid and decanedicarboxylic acid, with adipic acid being particularly preferred.
- polyols inter alia ethylene glycol, propylene glycol, neopentyl glycol and butanediol-1, 4 use. Mixtures of ethylene glycol and neopentyl glycol have proven particularly advantageous for the described application.
- Suitable UV crosslinking catalyst b) is preferably a photoinitiator suitable for cationic photopolymerization, or an initiator mixture.
- Preferred for the baked enamines of the present invention is the mixed arylsulfonium hexafluorophosphate salt of the following form
- component b) may also contain other customary UV crosslinking catalysts.
- reactive diluents c preference is given to low molecular weight oxiranes, oxetanes and the like. into consideration with the oxiranes according to the invention copolymerizable compounds.
- polyester polyols having molecular weights between 500 and 2000 g / mol are advantageous, preferably polyester polyols having an average molecular weight between 500 and 1000 g / mol.
- leveling agents e) it is possible to use surface-modified polydisiloxanes, for example the "Byk 306" from Byk Chemie GmbH.
- Example 1 Preparation of a dioxirane from polyethylene glycol 400 and methyl 3,4-epoxycyclohexanecarboxylate (dioxirane I)
- 31.2 g of methyl 3,4-epoxycyclohexanecarboxylats are mixed with 97 g of dimethyl terephthalate, 15.5 g of ethylene glycol and 26.0 g of neopentyl glycol, with nitrogen as a protective gas, mixed with 0.2 g of tetrabutyl titanate and with elimination of 38, 4 g of methanol transesterified at 180-200 ° C. 131.5 g of a waxy polyester dioxirane are obtained.
- 31.2 g of methyl 3,4-epoxycyclohexanecarboxylate are mixed with 73 g of adipic acid, 15.5 g of ethylene glycol and 26.0 g of neopentyl glycol, with nitrogen as inert gas, mixed with 0.2 g of tetrabutyl titanate and with elimination of 6, 4 g of methanol and 18 g of water at 180 - 200 ° C esterified. 121.5 g of a waxy polyester dioxirane are obtained.
- UV-curable baked enamels were formulated from the oxiranes prepared:
- Example 4 Baking lacquer 1
- a UV-curable lacquer is prepared from 32.5 g of Cyracure UVR 6110, 30 g of dioxirane III, 5 g of photoinitiator, 30 g of methyl 3,4-epoxy-cyclohexanecarboxylate and 2.5 g of flow additive.
- the components are homogeneously mixed to a colorless transparent varnish with 790 mPa s.
- a UV-curable lacquer is prepared from 52.5 g of Cyracure UVR 6110, 40 g of dioxirane I, 5 g of photoinitiator and 2.5 g of flow additive. The components are mixed homogeneously to form a colorless transparent paint with 670 mPa s.
- a UV-curable lacquer is prepared from 67.5 g Cyracure UVR 6110, 25 g Desmophen 670 polyester polyol, 5 g photoinitiator and 2.5 g leveling additive. The components are homogeneously mixed to a colorless transparent lacquer with 2340 mPa s.
- the baked enamines according to the invention were prepared by means of Düsenabstreifclar on a copper wire with 0.30 mm bare wire diameter, conventionally coated with a commercially available polyesterimide wire enamel with a
- the UV source used was a microwave-excited high-pressure mercury vapor radiator.
- the power of the spotlight was between 25 and 100 watts per cm. Reflector and radiator form a resonator unit.
- Backlack 1 With a lacquer layer of 10 ⁇ m, an enameled wire with a smooth surface and good caking properties at 200 ° C. and a bonding force of 0.7 N are obtained.
- Back lacquer 2 With a lacquer layer of 10 ⁇ m, an enamelled wire with a smooth surface and good caking properties at 200 ° C is obtained.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Polyethers (AREA)
- Insulated Conductors (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL05707891T PL1716580T3 (en) | 2004-02-20 | 2005-01-24 | Method for producing coated electrical wires |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004008365A DE102004008365A1 (en) | 2004-02-20 | 2004-02-20 | Process for producing coated electrical wires |
| PCT/EP2005/050384 WO2005081266A1 (en) | 2004-02-20 | 2005-01-24 | Method for producing coated electrical wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1716580A1 true EP1716580A1 (en) | 2006-11-02 |
| EP1716580B1 EP1716580B1 (en) | 2008-01-16 |
Family
ID=34832861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05707891A Expired - Lifetime EP1716580B1 (en) | 2004-02-20 | 2005-01-24 | Method for producing coated electrical wires |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20070243318A1 (en) |
| EP (1) | EP1716580B1 (en) |
| JP (1) | JP5424532B2 (en) |
| AT (1) | ATE384332T1 (en) |
| BR (1) | BRPI0507803B1 (en) |
| DE (2) | DE102004008365A1 (en) |
| ES (1) | ES2299004T3 (en) |
| MX (1) | MXPA06009426A (en) |
| PL (1) | PL1716580T3 (en) |
| PT (1) | PT1716580E (en) |
| WO (1) | WO2005081266A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005040126A1 (en) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | coating composition |
| US10186924B2 (en) | 2011-12-15 | 2019-01-22 | Siemens Aktiengesellschaft | Method for producing a corona shield, fast-curing corona shield system, and electric machine |
| EP2645540A1 (en) * | 2012-03-28 | 2013-10-02 | Siemens Aktiengesellschaft | Corona shielding material for an electric machine |
| DE102014221715A1 (en) * | 2014-10-24 | 2016-04-28 | Siemens Aktiengesellschaft | Impregnating resin, conductor arrangement, electric coil and electric machine |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4090936A (en) * | 1976-10-28 | 1978-05-23 | Minnesota Mining And Manufacturing Company | Photohardenable compositions |
| DE2843895C3 (en) * | 1978-10-07 | 1981-11-26 | Felten & Guilleaume Carlswerk AG, 5000 Köln | Process for the production of electrical conductor wires insulated with lacquer |
| JPS56130013A (en) * | 1980-03-17 | 1981-10-12 | Furukawa Electric Co Ltd | Method of producing self-adhesive insulated wire |
| US4362263A (en) * | 1980-04-24 | 1982-12-07 | Westinghouse Electric Corp. | Solderable solventless UV curable enamel |
| US4357219A (en) * | 1980-06-27 | 1982-11-02 | Westinghouse Electric Corp. | Solventless UV cured thermosetting cement coat |
| US4629779A (en) * | 1983-10-27 | 1986-12-16 | Union Carbide Corporation | Low viscosity adducts of a polycaprolactone polyol and a polyepoxide |
| US4554730A (en) * | 1984-01-09 | 1985-11-26 | Westinghouse Electric Corp. | Method of making a void-free non-cellulose electrical winding |
| JPS61101917A (en) * | 1984-10-24 | 1986-05-20 | 日立化成工業株式会社 | Manufacture of self-bonding insulated wire |
| EP0221559A3 (en) * | 1985-11-07 | 1988-09-14 | Union Carbide Corporation | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
| CA1312040C (en) * | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
| US4929305A (en) * | 1987-01-30 | 1990-05-29 | General Electric Company | Method of bonding using UV curable epoxy resin compositions with delayed cure |
| US4857562A (en) * | 1987-01-30 | 1989-08-15 | General Electric Company | UV curable epoxy resin compositions with delayed cure |
| US5290602A (en) * | 1992-10-19 | 1994-03-01 | Union Carbide Chemicals & Plastics Technology Corporation | Hindered-hydroxyl functional (meth) acrylate-containing copolymers particularly suitable for use in coating compositions which are sprayed with compressed fluids as viscosity reducing diluents |
| JPH0812924A (en) * | 1994-06-29 | 1996-01-16 | Hitachi Cable Ltd | Self-fusing paint and self-fusing insulated wire |
| JP3786480B2 (en) * | 1996-10-14 | 2006-06-14 | Jsr株式会社 | Photocurable resin composition |
| CO4790198A1 (en) * | 1997-08-04 | 1999-05-31 | Abb Power T And D Company Inc | METHOD AND APPARATUS FOR THE MANUFACTURE OF A HELICALLY COILED ELECTRIC COIL WITH VARIABLE INSULATION |
| JPH11323095A (en) * | 1998-05-21 | 1999-11-26 | Nippon Kayaku Co Ltd | Photocationic-polymerizable epoxy resin-based solid composition and article made therefrom |
| JPH11335442A (en) * | 1998-05-25 | 1999-12-07 | Nippon Kayaku Co Ltd | Photocation-polymerizable epoxy resin-based solid composition and article |
| DE19951709A1 (en) * | 1999-10-27 | 2001-05-03 | Alcatel Sa | Electrical conductor with a rectangular or quadratic cross section |
| US6350792B1 (en) * | 2000-07-13 | 2002-02-26 | Suncolor Corporation | Radiation-curable compositions and cured articles |
| JP2002050249A (en) * | 2000-08-01 | 2002-02-15 | Sekisui Chem Co Ltd | Method for manufacturing surface-coated wire material and surface-coating composition |
-
2004
- 2004-02-20 DE DE102004008365A patent/DE102004008365A1/en not_active Ceased
-
2005
- 2005-01-24 WO PCT/EP2005/050384 patent/WO2005081266A1/en not_active Ceased
- 2005-01-24 AT AT05707891T patent/ATE384332T1/en active
- 2005-01-24 ES ES05707891T patent/ES2299004T3/en not_active Expired - Lifetime
- 2005-01-24 BR BRPI0507803-2A patent/BRPI0507803B1/en not_active IP Right Cessation
- 2005-01-24 US US10/590,126 patent/US20070243318A1/en not_active Abandoned
- 2005-01-24 PL PL05707891T patent/PL1716580T3/en unknown
- 2005-01-24 JP JP2006553577A patent/JP5424532B2/en not_active Expired - Fee Related
- 2005-01-24 MX MXPA06009426A patent/MXPA06009426A/en active IP Right Grant
- 2005-01-24 DE DE502005002569T patent/DE502005002569D1/en not_active Expired - Lifetime
- 2005-01-24 EP EP05707891A patent/EP1716580B1/en not_active Expired - Lifetime
- 2005-01-24 PT PT05707891T patent/PT1716580E/en unknown
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2005081266A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5424532B2 (en) | 2014-02-26 |
| US20070243318A1 (en) | 2007-10-18 |
| BRPI0507803B1 (en) | 2012-12-25 |
| MXPA06009426A (en) | 2007-03-23 |
| PL1716580T3 (en) | 2008-06-30 |
| EP1716580B1 (en) | 2008-01-16 |
| JP2007523455A (en) | 2007-08-16 |
| BRPI0507803A (en) | 2007-07-31 |
| PT1716580E (en) | 2008-03-28 |
| DE502005002569D1 (en) | 2008-03-06 |
| ES2299004T3 (en) | 2008-05-16 |
| DE102004008365A1 (en) | 2005-09-08 |
| WO2005081266A1 (en) | 2005-09-01 |
| ATE384332T1 (en) | 2008-02-15 |
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