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EP1786004B1 - Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement - Google Patents

Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement Download PDF

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Publication number
EP1786004B1
EP1786004B1 EP20060122211 EP06122211A EP1786004B1 EP 1786004 B1 EP1786004 B1 EP 1786004B1 EP 20060122211 EP20060122211 EP 20060122211 EP 06122211 A EP06122211 A EP 06122211A EP 1786004 B1 EP1786004 B1 EP 1786004B1
Authority
EP
European Patent Office
Prior art keywords
core
integrated circuit
adhesive substance
wire
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP20060122211
Other languages
German (de)
English (en)
Other versions
EP1786004A3 (fr
EP1786004A2 (fr
Inventor
Frank Bajahr
Ruprecht Wiskott
Markus Spreng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartrac Technology Germany GmbH
Original Assignee
Smartrac Technology Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05110652A external-priority patent/EP1793395A1/fr
Application filed by Smartrac Technology Germany GmbH filed Critical Smartrac Technology Germany GmbH
Priority to EP20060122211 priority Critical patent/EP1786004B1/fr
Publication of EP1786004A2 publication Critical patent/EP1786004A2/fr
Publication of EP1786004A3 publication Critical patent/EP1786004A3/fr
Application granted granted Critical
Publication of EP1786004B1 publication Critical patent/EP1786004B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core

Definitions

  • the present invention is directed to a method of manufacturing an electronic component comprising an integrated circuit and a winding assembly according to the preamble of claim 1.
  • the invention is further directed to an electronic component comprising an integrated circuit and a winding assembly according to the preamble of claim 5.
  • integrated circuit is to be understood in this invention as an integrated circuit in form of an electronic chip, a printed circuit or another discrete electronic element. These electronic elements have very small dimensions and it is usually difficult to assemble such an integrated circuit and a core with a winding around a core and finally bonding the ends of the winding wire to the integrated circuit.
  • US 4 860 433 A discloses a method of manufacturing an inductance element comprising a circuit board serving as a support substrate for arranging a core which core is mechanically connected to the circuit board by an adhesive substance.
  • a winding wire is bonded to a first conductive path of the circuit board then wound around the core and subsequently bonded to a second conductive path of the circuit board.
  • JP 2005-130055 A discloses an antenna unit which is provided with a core and an antenna coil formed by a winding wire wound around the core.
  • the wire ends of the winding wire are connected to conductive paths of a circuit board which circuit board is mechanically connected to the core by an adhesive substance.
  • Arranged onto the circuit board is an IC forming a tuning circuit together with the antenna coil.
  • US 2002/0180602 A1 discloses a method of forming an overmolded transponder which transponder comprises a core having a winding wire wound around the core and having wire ends which are connected to a circuit board which is arranged on top of one end face of the core. Arranged on the circuit board is an IC which is connected to the wire ends of the winding wire via the circuit board. The whole transponder is overmolded with a thermoplastic material.
  • the first object is achieved by the method of manufacturing an electronic component as defined in claim 1.
  • the method comprises the steps of providing the integrated circuit having at least two accessible contacts, providing the core, assembling the integrated circuit and the core together by means of an adhesive substance, and subsequently winding a wire on the core in order to produce a winding, bonding or soldering a first end of the wire to a first one of said contacts and bonding or soldering a second end of the wire to a second one of said contacts.
  • the step of assembling the integrated circuit and the core together by means of an adhesive substance is performed before the wire is wound around the core and before the ends of the wire are bonded or soldered to the contacts of the integrated circuit. This ensures that the mechanical forces holding the integrated circuit and the core together are supported by the adhesive substance and not by the very thin wires.
  • the integrated circuit is placed on a holding tool, then, a predetermined volume of the adhesive substance is applied to at least one end face of the core and the core is then placed on the holding tool in such a manner that the adhesive substance on the core gets into contact with an end face of the integrated circuit.
  • the end face of the core to which the adhesive substance has been applied is kept in a distance from the opposite end face of the integrated circuit so that a gap is provided between both opposing end faces, wherein adhesive substance is provided in the gap.
  • winding and bonding or soldering steps are carried out while the electronic circuit and the core assembled together are carried in the holding tool.
  • the electronic circuit and the core assembled together by means of said adhesive substance are held and fixed in the holding tool during the process of winding the wire around the core and bonding or soldering the ends of the wire to the contacts of the electronic circuit the mechanical forces acting on the electronic component during theses steps are supported by the holding tool so that the adhesive substance can cure and the curing process is not disturbed by external mechanical influences.
  • the method uses an adhesive substance having such a pot life that the adhesive joint between the integrated circuit and the core is sufficiently hardened after the bonding or soldering step has been finished so that no mechanical holding forces between the integrated circuit and the winding assembly act on the wires when the electronic component is released from the holding tool.
  • the invention is further defined by an electronic component comprising an integrating circuit having at least two accessible contacts and a core, wherein a wire is wound on the core in order to define a winding assembling, wherein a first end of the wire is bonded or soldered to a first one of said contacts and wherein a second end of the wire is bonded or soldered to a second one of said contacts, and wherein the integrated circuit and the core are mounted together by means of an adhesive substance.
  • This electronic component has a strong mechanical connection between the integrated circuit and the core so that no holding forces between the winding assembly and the integrated circuit act on the wires.
  • the integrated circuit and the core are mounted together in such a manner that the adhesive substance on the core gets into contact with an end face of the integrated circuit which adhesive substance merely covers the end face of the core.
  • the adhesive substance is a glue.
  • the integrated circuit and the core are spaced apart and the hardened adhesive substance is provided in the gap between the integrated circuit and the core.
  • Such an electronic component has the advantage that during the assembling of this electronic component the adhesive substance is not squeezed out of the gap between the integrated circuit and the core so that the holding tool is not polluted by the adhesive substance.
  • Fig. 1 shows an electronic component 5 that has been manufactured according to the method of the present invention.
  • An integrated circuit 1 and a core 2 for a winding 3 are assembled together by means of an adhesive substance 4.
  • the adhesive substance 4 has been applied to an end face 20 of core 2 and an end face 10 of the integrated circuit 1 facing the end face 20 of the core 2 has been brought into contact with the adhesive substance 4.
  • a gap 40 is provided between the opposing end faces 10 and 20 wherein the gap 40 is at least partly filled with the adhesive substance 4.
  • the winding 3 on the core 2 comprises an electrically conducting wire 30 wound on the core 2.
  • the winding 3 wound on core 2 defines a winding assembly.
  • the first end 31 of the wire 30 and the second end 32 of the wire 30 are connected to electric contacts 12, 14 provided on the upper side of the integrated circuit 1.
  • the adhesive substance 4 is a fast hardening glue which quickly establishes a considerable strong connection between the core 2 and the electronic component 1 after the electronic circuit 1 and the core 2 have been assembled together and while they are accommodated in the holding tool.
  • the invention is not restricted to the above-described exemplary embodiment, which only serves for a general explanation of the core concept of the invention. Rather more, it is within the scope of protection that the method of manufacturing an electronic component in accordance with the invention could also adopt different forms than those of the embodiments described above. In particular thereby, the device may comprise features which represent a combination of the respective individual features of the claims.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Claims (7)

  1. Procédé de fabrication d'un composant (5) électronique, comprenant un circuit (1) intégré et un noyau (2), avec les étapes consistant à:
    - fournir le circuit (1) intégré ayant au moins deux contacts (12, 14) accessibles, et
    - fournir le noyau (2),
    le procédé étant caractérisé en ce qu'il présente les étapes suivantes successives consistant à:
    - assembler le circuit (1) intégré et le noyau (2) au moyen d'une substance (4) adhésive,
    - et ensuite enrouler un fil (30) sur le noyau pour produire un enroulement (3),
    - joindre ou souder une première extrémité (31) du fil à un premier contact desdits contacts (12), et
    - joindre ou souder une deuxième extrémité (32) du fil à un deuxième contact desdits contacts (14),
    dans lequel l'assemblage du circuit intégré et du noyau comprend les étapes consistant à placer le circuit intégré sur un outil de maintien, appliquer une quantité prédéterminée de la substance adhésive à un front (20) du noyau et ensuite placer le noyau sur l'outil de maintien, tellement que la substance adhésive sur le noyau entre en contact avec un front du circuit intégré.
  2. Procédé selon la revendication 1, dans lequel les étapes d'enrouler et de joindre ou souder sont exécutées pendant que le circuit (1) intégré et le noyau (2) qui sont assemblés sont tenus dans l'outil de maintien.
  3. Procédé selon l'une quelconque des revendications 1 ou 2, dans lequel une substance (4) adhésive est utilisée qui a un tel temps de séchage que la liaison collée entre le circuit (1) intégré et le noyau (2) a durcie suffisamment après la fin de l'étape de joindre ou souder, de façon qu'aucunes forces de maintien entre le circuit intégré et le noyau n'agissent sur les fils.
  4. Procédé selon l'une quelconque des revendications 1 á 3, dans lequel le front (20) du noyau (2) auquel la substance (4) adhésive a été appliquée est maintenu à une certaine distance du front (10) opposé du circuit (1) intégré, de façon qu'une fissure (40) est fournie entre les deux fronts opposés, dans lequel la substance adhésive est fournie dans la fissure.
  5. Composant électronique réalisé par le procédé de fabrication selon l'une quelconque des revendications 1 à 4, ledit composant électronique comprenant un circuit (1) intégré ayant au moins deux contacts (12, 14) accessibles et un noyau (2), dans lequel un fil (30) est enroulé sur le noyau (2) pour définir un enroulement, dans lequel une première extrémité (31) du fil (30) a été jointe ou soudée à un premier contact (12) desdits contacts et dans lequel une deuxième extrémité (32) du fil (30) a été jointe ou soudée à un deuxième contact (14) desdits contacts, caractérisé en ce que le circuit (1) intégré et le noyau (2) sont montés sur leurs fronts au moyen d'une substance (4) adhésive, tellement que la substance adhésive sur le noyau qui seulement couvre un front du noyau est en contact avec un front (10) du circuit intégré.
  6. Composant électronique selon la revendication 5, caractérisé en ce que la substance (4) adhésive est une colle durcie.
  7. Composant électronique selon l'une quelconque des revendications 5 et 6, caractérisé en ce que le circuit (1) intégré et le noyau (2) sont espacés l'un de l'autre et en ce que la substance (4) adhésive est fournie dans la fissure (40) entre le circuit (1) intégré et le noyau (2).
EP20060122211 2005-11-11 2006-10-12 Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement Not-in-force EP1786004B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20060122211 EP1786004B1 (fr) 2005-11-11 2006-10-12 Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05110652A EP1793395A1 (fr) 2005-11-11 2005-11-11 Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement
EP20060122211 EP1786004B1 (fr) 2005-11-11 2006-10-12 Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement

Publications (3)

Publication Number Publication Date
EP1786004A2 EP1786004A2 (fr) 2007-05-16
EP1786004A3 EP1786004A3 (fr) 2012-07-11
EP1786004B1 true EP1786004B1 (fr) 2015-05-20

Family

ID=37946050

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20060122211 Not-in-force EP1786004B1 (fr) 2005-11-11 2006-10-12 Procédé de fabrication d'un composant électronique comportant un circuit intégré et un ensemble d'enroulement

Country Status (1)

Country Link
EP (1) EP1786004B1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3536908A1 (de) 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
NL8901663A (nl) 1989-06-30 1991-01-16 Philips Nv Wikkelingsdrager en werkwijze voor het met behulp daarvan vormen van een samenstel bevattende een elektrische spoel en een elektronisch onderdeel.
WO1992015105A1 (fr) 1991-02-25 1992-09-03 Ake Gustafson Procede de fixation d'un bobinage a un circuit electronique
SE9700908L (sv) * 1997-03-11 1998-09-12 Fyrtech Microelectronics Ab Förfarande vid tillverkning av en transponder samt en genom förfarandet tillverkad transponder
US6441741B1 (en) 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
US6400338B1 (en) * 2000-01-11 2002-06-04 Destron-Fearing Corporation Passive integrated transponder tag with unitary antenna core
JP2005130055A (ja) 2003-10-22 2005-05-19 Citizen Watch Co Ltd アンテナユニット及びそれを用いた電波修正時計

Also Published As

Publication number Publication date
EP1786004A3 (fr) 2012-07-11
EP1786004A2 (fr) 2007-05-16

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