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EP1766305A4 - Systeme de refroidissement par pulverisation d'azeotrope - Google Patents

Systeme de refroidissement par pulverisation d'azeotrope

Info

Publication number
EP1766305A4
EP1766305A4 EP05773675A EP05773675A EP1766305A4 EP 1766305 A4 EP1766305 A4 EP 1766305A4 EP 05773675 A EP05773675 A EP 05773675A EP 05773675 A EP05773675 A EP 05773675A EP 1766305 A4 EP1766305 A4 EP 1766305A4
Authority
EP
European Patent Office
Prior art keywords
azeotropic
cooling system
spray cooling
spray
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05773675A
Other languages
German (de)
English (en)
Other versions
EP1766305A1 (fr
Inventor
Donald E Tilton
Bruce A Smetana
Angela R Maehren
Philip W Appel
Randall T Palmer
Charles L Tilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isothermal Systems Research Inc
Original Assignee
Isothermal Systems Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isothermal Systems Research Inc filed Critical Isothermal Systems Research Inc
Publication of EP1766305A1 publication Critical patent/EP1766305A1/fr
Publication of EP1766305A4 publication Critical patent/EP1766305A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735Jet impingement
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02Materials undergoing a change of physical state when used
    • C09K5/04Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP05773675A 2004-07-15 2005-07-15 Systeme de refroidissement par pulverisation d'azeotrope Withdrawn EP1766305A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58886204P 2004-07-15 2004-07-15
PCT/US2005/024770 WO2006019767A1 (fr) 2004-07-15 2005-07-15 Systeme de refroidissement par pulverisation d'azeotrope

Publications (2)

Publication Number Publication Date
EP1766305A1 EP1766305A1 (fr) 2007-03-28
EP1766305A4 true EP1766305A4 (fr) 2010-01-13

Family

ID=35907706

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05773675A Withdrawn EP1766305A4 (fr) 2004-07-15 2005-07-15 Systeme de refroidissement par pulverisation d'azeotrope

Country Status (4)

Country Link
EP (1) EP1766305A4 (fr)
JP (1) JP2008507136A (fr)
CA (1) CA2572629A1 (fr)
WO (1) WO2006019767A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102580069B1 (ko) * 2014-10-31 2023-09-19 다우 글로벌 테크놀로지스 엘엘씨 압력 변동 증류를 사용한 메탄올/메틸 메타크릴레이트 공비혼합물의 파괴
US11252847B2 (en) 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965971A (en) * 1974-06-27 1976-06-29 Eaton Corporation Cooling system for semiconductors
EP0072145A1 (fr) * 1981-07-29 1983-02-16 The British Petroleum Company p.l.c. Fluides de travail pour réfrigérateur et/ou pompe à chaleur
JPS6114282A (ja) * 1984-06-29 1986-01-22 Mitsubishi Heavy Ind Ltd 吸収冷凍機用媒体
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
US20020009585A1 (en) * 2000-04-06 2002-01-24 Albert Donald F. Organic, low density microcellular materials, their carbonized derivatives, and methods for producing same
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
EP1380799A2 (fr) * 2002-07-11 2004-01-14 Raytheon Company Procédé et dispositif pour refroidir avec un fluide réfrigérant à pression sous-ambiante

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552910A (en) * 1983-03-11 1985-11-12 Wacker-Chemie Gmbh Aqueous compositions containing an organosilicon compound
US5089070A (en) * 1989-12-07 1992-02-18 Pac Polymers Inc. Poly(propylene carbonate)-containing ceramic tape formulations and the green tapes resulting therefrom
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
JP2933014B2 (ja) * 1996-01-23 1999-08-09 ダイキン工業株式会社 ペンタフルオロプロパンとフッ化水素の共沸混合物およびペンタフルオロプロパンの分離精製方法
WO2000017927A1 (fr) * 1998-09-18 2000-03-30 Mitsubishi Denki Kabushiki Kaisha Convertisseur de puissance a semi-conducteur et dispositif de mise en application correspondante
JP2000252671A (ja) * 1999-02-26 2000-09-14 Sony Corp 冷却装置及び電子機器
KR100317829B1 (ko) * 1999-03-05 2001-12-22 윤종용 반도체 제조 공정설비용 열전냉각 온도조절장치
US7005181B2 (en) * 2000-04-06 2006-02-28 American Aerogel Corporation Organic, open cell foam materials, their carbonized derivatives, and methods for producing same
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965971A (en) * 1974-06-27 1976-06-29 Eaton Corporation Cooling system for semiconductors
EP0072145A1 (fr) * 1981-07-29 1983-02-16 The British Petroleum Company p.l.c. Fluides de travail pour réfrigérateur et/ou pompe à chaleur
JPS6114282A (ja) * 1984-06-29 1986-01-22 Mitsubishi Heavy Ind Ltd 吸収冷凍機用媒体
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
US20020009585A1 (en) * 2000-04-06 2002-01-24 Albert Donald F. Organic, low density microcellular materials, their carbonized derivatives, and methods for producing same
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
EP1380799A2 (fr) * 2002-07-11 2004-01-14 Raytheon Company Procédé et dispositif pour refroidir avec un fluide réfrigérant à pression sous-ambiante

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006019767A1 *

Also Published As

Publication number Publication date
JP2008507136A (ja) 2008-03-06
CA2572629A1 (fr) 2006-02-23
EP1766305A1 (fr) 2007-03-28
WO2006019767A1 (fr) 2006-02-23

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20061227

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: TILTON, CHARLES, L.

Inventor name: APPEL, PHILIP, W.

Inventor name: SMETANA, BRUCE, A.

Inventor name: PALMER, RANDALL, T.

Inventor name: TILTON, DONALD, E.

Inventor name: MAEHREN, ANGELA, R.

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20091216

17Q First examination report despatched

Effective date: 20100414

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100825