EP1766305A4 - Systeme de refroidissement par pulverisation d'azeotrope - Google Patents
Systeme de refroidissement par pulverisation d'azeotropeInfo
- Publication number
- EP1766305A4 EP1766305A4 EP05773675A EP05773675A EP1766305A4 EP 1766305 A4 EP1766305 A4 EP 1766305A4 EP 05773675 A EP05773675 A EP 05773675A EP 05773675 A EP05773675 A EP 05773675A EP 1766305 A4 EP1766305 A4 EP 1766305A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- azeotropic
- cooling system
- spray cooling
- spray
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58886204P | 2004-07-15 | 2004-07-15 | |
| PCT/US2005/024770 WO2006019767A1 (fr) | 2004-07-15 | 2005-07-15 | Systeme de refroidissement par pulverisation d'azeotrope |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1766305A1 EP1766305A1 (fr) | 2007-03-28 |
| EP1766305A4 true EP1766305A4 (fr) | 2010-01-13 |
Family
ID=35907706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05773675A Withdrawn EP1766305A4 (fr) | 2004-07-15 | 2005-07-15 | Systeme de refroidissement par pulverisation d'azeotrope |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1766305A4 (fr) |
| JP (1) | JP2008507136A (fr) |
| CA (1) | CA2572629A1 (fr) |
| WO (1) | WO2006019767A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102580069B1 (ko) * | 2014-10-31 | 2023-09-19 | 다우 글로벌 테크놀로지스 엘엘씨 | 압력 변동 증류를 사용한 메탄올/메틸 메타크릴레이트 공비혼합물의 파괴 |
| US11252847B2 (en) | 2017-06-30 | 2022-02-15 | General Electric Company | Heat dissipation system and an associated method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3965971A (en) * | 1974-06-27 | 1976-06-29 | Eaton Corporation | Cooling system for semiconductors |
| EP0072145A1 (fr) * | 1981-07-29 | 1983-02-16 | The British Petroleum Company p.l.c. | Fluides de travail pour réfrigérateur et/ou pompe à chaleur |
| JPS6114282A (ja) * | 1984-06-29 | 1986-01-22 | Mitsubishi Heavy Ind Ltd | 吸収冷凍機用媒体 |
| US6152215A (en) * | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
| US20020009585A1 (en) * | 2000-04-06 | 2002-01-24 | Albert Donald F. | Organic, low density microcellular materials, their carbonized derivatives, and methods for producing same |
| US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
| EP1380799A2 (fr) * | 2002-07-11 | 2004-01-14 | Raytheon Company | Procédé et dispositif pour refroidir avec un fluide réfrigérant à pression sous-ambiante |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4552910A (en) * | 1983-03-11 | 1985-11-12 | Wacker-Chemie Gmbh | Aqueous compositions containing an organosilicon compound |
| US5089070A (en) * | 1989-12-07 | 1992-02-18 | Pac Polymers Inc. | Poly(propylene carbonate)-containing ceramic tape formulations and the green tapes resulting therefrom |
| JPH05136305A (ja) * | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 発熱体の冷却装置 |
| JP2933014B2 (ja) * | 1996-01-23 | 1999-08-09 | ダイキン工業株式会社 | ペンタフルオロプロパンとフッ化水素の共沸混合物およびペンタフルオロプロパンの分離精製方法 |
| WO2000017927A1 (fr) * | 1998-09-18 | 2000-03-30 | Mitsubishi Denki Kabushiki Kaisha | Convertisseur de puissance a semi-conducteur et dispositif de mise en application correspondante |
| JP2000252671A (ja) * | 1999-02-26 | 2000-09-14 | Sony Corp | 冷却装置及び電子機器 |
| KR100317829B1 (ko) * | 1999-03-05 | 2001-12-22 | 윤종용 | 반도체 제조 공정설비용 열전냉각 온도조절장치 |
| US7005181B2 (en) * | 2000-04-06 | 2006-02-28 | American Aerogel Corporation | Organic, open cell foam materials, their carbonized derivatives, and methods for producing same |
| US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
-
2005
- 2005-07-15 JP JP2007521588A patent/JP2008507136A/ja active Pending
- 2005-07-15 EP EP05773675A patent/EP1766305A4/fr not_active Withdrawn
- 2005-07-15 WO PCT/US2005/024770 patent/WO2006019767A1/fr not_active Ceased
- 2005-07-15 CA CA002572629A patent/CA2572629A1/fr not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3965971A (en) * | 1974-06-27 | 1976-06-29 | Eaton Corporation | Cooling system for semiconductors |
| EP0072145A1 (fr) * | 1981-07-29 | 1983-02-16 | The British Petroleum Company p.l.c. | Fluides de travail pour réfrigérateur et/ou pompe à chaleur |
| JPS6114282A (ja) * | 1984-06-29 | 1986-01-22 | Mitsubishi Heavy Ind Ltd | 吸収冷凍機用媒体 |
| US6152215A (en) * | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
| US20020009585A1 (en) * | 2000-04-06 | 2002-01-24 | Albert Donald F. | Organic, low density microcellular materials, their carbonized derivatives, and methods for producing same |
| US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
| EP1380799A2 (fr) * | 2002-07-11 | 2004-01-14 | Raytheon Company | Procédé et dispositif pour refroidir avec un fluide réfrigérant à pression sous-ambiante |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2006019767A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008507136A (ja) | 2008-03-06 |
| CA2572629A1 (fr) | 2006-02-23 |
| EP1766305A1 (fr) | 2007-03-28 |
| WO2006019767A1 (fr) | 2006-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20061227 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: TILTON, CHARLES, L. Inventor name: APPEL, PHILIP, W. Inventor name: SMETANA, BRUCE, A. Inventor name: PALMER, RANDALL, T. Inventor name: TILTON, DONALD, E. Inventor name: MAEHREN, ANGELA, R. |
|
| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20091216 |
|
| 17Q | First examination report despatched |
Effective date: 20100414 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20100825 |